Industrial computer with heat dissipation structure

Abstract

The utility model discloses an industrial computer with a heat dissipation structure. The industrial computer comprises a base body; the heat dissipation part is fixedly connected to the base body, the heat dissipation part is provided with a heat dissipation plate and a fan, and the surface formed by the heat dissipation plate is a first surface; the main board is fixedly connected to the base body, and when observed in the direction parallel to the first surface, the main board is located on the side, away from the fan, of the heat dissipation plate; wherein a heat conduction channel is integrally formed in the heat dissipation plate, and the heat conduction channel is in an S shape so as to guide airflow formed by the fan. The industrial computer is provided with the heat dissipation part, and the heat dissipation part is provided with the fan, so that the industrial computer can effectively dissipate heat, the S-shaped heat conduction channel is integrally formed through the heat dissipation plate, and the heat conduction channel guides air flow formed by the fan, so that the heat dissipation effect of the industrial computer is improved, and the heat dissipation effect of the industrial computer is improved. Therefore, the air flow formed by the fan uniformly flows to the mainboard, and the uniformity of heat dissipation is improved.

Description

Technical Field

[0001] The utility model relates to the field of electronic hardware, in particular to an industrial computer with a heat dissipation structure. Background Art

[0002] With the advancement of industrial automation, the environment and control systems in the production process have become increasingly complex. At this time, a computing device with high system performance, strong reliability, and hardware that can adapt to harsh conditions such as high temperature, low temperature, dust, and electromagnetic interference is required to perform real-time data processing, system monitoring, and control tasks. Traditional computer systems often cannot meet these requirements in industrial environments, so the demand for industrial computers has emerged.

[0003] When the industrial computer may face the problem of insufficient heat dissipation in a high-load or high-temperature environment, which may lead to performance degradation or system failure. Currently, industrial computers on the market usually dissipate heat through air cooling, water cooling, and heat conduction. Water cooling and heat conduction cooling respectively require adding water cooling components and heat conduction components to the industrial computer, so the cost is higher than that of air cooling. Although air cooling is the most common, it is also accompanied by many other problems. Among them, when the industrial computer has only one fan, it is easy to have the problem of uneven heat dissipation, because the fan heat dissipation is often concentrated in a certain part, which easily leads to good local heat dissipation effect while poor heat dissipation in other areas, forming uneven temperature and causing hot spot problems. Hot spot problems may cause some electronic components to have too high temperature, reduce their lifespan, or cause local performance degradation, and even electronic component failure.

[0004] Therefore, it is necessary to provide an industrial computer with a heat dissipation structure that can effectively dissipate heat and improve heat dissipation uniformity. Summary of the Utility Model

[0005] The purpose of the utility model is to provide an industrial computer with a heat dissipation structure that can effectively dissipate heat and improve heat dissipation uniformity.

[0006] According to one aspect of the present application, there is provided an industrial computer with a heat dissipation structure, the industrial computer comprising:

[0007] A base;

[0008] A heat dissipation part, fixedly connected to the base, the heat dissipation part is provided with a heat dissipation plate and a fan, and the surface formed by the heat dissipation plate is the first surface;

[0009] A main board, fixedly connected to the base, and when observed in a direction parallel to the first surface, the main board is located on the side of the heat dissipation plate away from the fan;

[0010] Wherein, the heat dissipation plate is integrally formed with a heat conduction channel, and the heat conduction channel is S-shaped to guide the airflow formed by the fan.

[0011] More preferably, the heat dissipation unit further includes:

[0012] A heat dissipation bracket, integrally formed with the heat dissipation portion and located on a side of the heat dissipation plate away from the main board;

[0013] A heat sink is integrally formed with the heat sink, and when viewed along a direction parallel to the first surface, the heat sink is perpendicular to the heat dissipation bracket.

[0014] More preferably, the heat dissipation unit further includes:

[0015] A fixed cover, fixedly connected to the heat dissipation portion and abutting against the heat dissipation bracket;

[0016] A heat dissipation net, fixedly connected to the fixed cover, and when viewed in a direction parallel to the first surface, the heat dissipation net is located between the fixed cover and the fan;

[0017] The airflow formed by the fan passes through the fixed cover, the heat dissipation net and the heat dissipation bracket in sequence to reach the heat dissipation plate.

[0018] Preferably, the industrial computer further comprises:

[0019] The interface board is fixedly connected to the base body, and when viewed in a direction parallel to the first surface, the interface board is located on a side of the main board facing away from the heat sink.

[0020] Preferably, the industrial computer further comprises:

[0021] A power button, integrally formed on the surface of the substrate;

[0022] The power button is electrically connected to the mainboard, and the industrial computer is turned on or off by pressing the power button.

[0023] Preferably, the industrial computer further comprises:

[0024] The sound cavity is integrally formed on the surface of the substrate, and the surface is located on a side of the substrate away from the power button.

[0025] Preferably, the industrial computer further comprises:

[0026] The interface slot is integrally formed on the surface of the base, and the power button is integrally formed on the surface.

[0027] Preferably, the industrial computer further comprises:

[0028] The fixing frame is fixedly connected to the base and is located at a side of the base away from the heat dissipation portion.

[0029] More preferably, the fixing frame is provided with fixing holes, and the industrial computer is fixed to other structures through the fixing holes.

[0030] More preferably, when viewed along a direction perpendicular to the first surface, the plurality of heat sinks are parallel to each other.

[0031] The utility model has the following beneficial effects:

[0032] The industrial computer is provided with the heat dissipation part, and the heat dissipation part is provided with the fan, so that the industrial computer can effectively dissipate heat, and the heat dissipation plate is integrally formed with the S-shaped heat conduction channel, and the heat conduction channel guides the airflow formed by the fan, so that the airflow formed by the fan flows evenly to the mainboard, thereby improving the uniformity of heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0034] Figure 1 It is a three-dimensional structural schematic diagram of an industrial computer according to an embodiment of the utility model;

[0035] Figure 2 Another three-dimensional structural schematic diagram of an industrial computer according to an embodiment of the utility model;

[0036] Figure 3 This is a schematic diagram of the exploded structure of an industrial computer according to one embodiment of the utility model;

[0037] Figure 4 It is a cross-sectional schematic diagram of an industrial computer according to one embodiment of the utility model;

[0038] Description of the accompanying drawings: 100, industrial computer; 10, base; 20, heat dissipation part; 21, heat sink; 22, fan; 23, heat dissipation bracket; 24, heat sink; 25, fixing cover; 26, heat dissipation net; 30, main board; 40, interface board; 50, power button; 60, acoustic cavity; 70, fixing frame; 71, fixing hole; 80, interface slot; S1, first surface. DETAILED DESCRIPTION

[0039] To facilitate the understanding of the present application, the present application will be described more comprehensively below with reference to the relevant drawings. Preferred embodiments of the present application are shown in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0040] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs. The terms used in the description of the present application in this specification are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0042] Please refer to Figure 1 - Figure 4 , an embodiment of the present utility model provides an industrial computer 100 with a heat dissipation structure. The industrial computer 100 includes: a base 10, a heat dissipation part 20 and a main board 30.

[0043] The heat dissipation part 20 is fixedly connected to the base 10, and the heat dissipation part 20 is provided with a heat dissipation plate 21 and a fan 22, and the surface formed by the heat dissipation plate 21 is a first surface S1. The main board 30 is fixedly connected to the base 10, and when observed in a direction parallel to the first surface S1, the main board 30 is located on the side of the heat dissipation plate 21 away from the fan 22. The heat dissipation plate 21 is integrally formed with a heat conduction channel, and the heat conduction channel is S-shaped to guide the airflow formed by the fan 22. The design of the S-shaped heat conduction channel can guide the airflow generated by the fan 22 to flow in an orderly manner, so that the airflow passes through the entire surface of the heat dissipation plate 21 more evenly. This can avoid stagnation or aggregation of airflow in certain areas, thereby improving heat dissipation efficiency. The S-shaped structure allows the airflow to pass through more heat dissipation channel areas, increases the contact area between the air and the heat dissipation plate 21, and enables heat to be conducted away from the surface of the heat dissipation plate 21 faster and more evenly. The airflow is guided through the heat conduction channel to flow through the area between the heat dissipation plate 21 and the main board 30, ensuring that the heat on the main board 30 can be taken away in time by air convection. This structure helps prevent heat accumulation and ensures that the core components of the device (such as the motherboard 30) always operate at an appropriate temperature. Since the industrial computer 100 usually operates in a high temperature environment, the S-shaped heat conduction channel can ensure a more uniform temperature distribution inside the device, reduce the risk of local overheating, thereby extending the service life of the device and improving reliability.

[0044] More preferably, the heat dissipation unit 20 further includes a heat dissipation bracket 23 and a heat sink 24 .

[0045] The heat dissipation bracket 23 is integrally formed on the heat dissipation portion 20 and is located on a side of the heat dissipation plate 21 away from the mainboard 30. The heat sink 24 is integrally formed on the heat sink 24 and is perpendicular to the heat dissipation bracket 23 when viewed along a direction parallel to the first surface S1.

[0046] Among them, the heat dissipation bracket 23 is integrally formed on the heat dissipation part 20, which can provide a stable support for the entire heat dissipation structure, ensuring that components such as the heat sink 24 can be tightly connected to the base body 10, preventing loosening or displacement, and guaranteeing the long-term stability of the heat dissipation effect. The heat dissipation bracket 23 helps to fix the positions of the heat dissipation plate 21 and the heat sink 24 in an ideal heat exchange area, enabling the heat sink 24 to fully contact the air flow area, improving the air convection efficiency, and accelerating the dissipation of heat. The heat sinks 24 are arranged perpendicular to the heat dissipation bracket 23, which can maximize the surface area of the heat sinks 24 within a limited space. A larger surface area helps to enhance the contact between the air and the heat sinks 24, allowing more heat to be transferred from the heat sinks 24 to the surrounding air, thus significantly improving the heat dissipation effect. The perpendicular arrangement of the heat sinks 24 to the heat dissipation bracket 23 also helps to guide the air flow, ensuring that the air flow generated by the fan 22 can effectively pass through the surface of the heat sinks 24, achieving rapid heat dissipation. This can avoid the formation of a "heat island" phenomenon inside the device, further optimizing the heat dissipation effect. Both the heat dissipation bracket 23 and the heat sinks 24 are integrally formed. This design reduces additional connecting parts, lowers the installation difficulty and structural complexity, while improving the overall stability, and avoiding problems such as a decrease in heat dissipation efficiency or component loosening that may be caused by multiple connecting parts.

[0047] Preferably, the heat dissipation part 20 further includes: a fixing cover 25 and a heat dissipation mesh 26.

[0048] The fixing cover 25 is fixedly connected to the heat dissipation part 20 and abuts against the heat dissipation bracket 23. The heat dissipation mesh 26 is fixedly connected to the fixing cover 25, and when observed in a direction parallel to the first surface S1, the heat dissipation mesh 26 is located between the fixing cover 25 and the fan 22. The air flow formed by the fan 22 sequentially passes through the fixing cover 25, the heat dissipation mesh 26, and the heat dissipation bracket 23 to reach the heat dissipation plate 21.

[0049] Among them, the fixed cover 25 is connected by abutting against the heat dissipation part 20 and the heat dissipation bracket 23 to form a stable external protective layer, preventing dust, foreign objects or moisture in the external environment from entering the heat dissipation structure, prolonging the service life of the internal components of the industrial computer 100 and maintaining its efficient working state. The fixed cover 25 can also play a role in guiding the air flow, enabling the air flow generated by the fan 22 to pass through the heat dissipation mesh 26, the heat dissipation bracket 23 and the heat sink 24 in a more concentrated manner, ensuring that the air flow flows along a predetermined path, thereby optimizing the heat dissipation effect and avoiding the decrease in heat dissipation efficiency caused by the dispersion of the air flow. The heat dissipation mesh 26 is installed between the fan 22 and the fixed cover 25, and can filter dust and impurities in the air, preventing these particulate matters from entering the equipment and accumulating on the heat dissipation part 20, resulting in a decrease in heat dissipation performance or equipment damage. This design is particularly suitable for use in industrial environments because the air quality in industrial environments is usually poor and contains more dust or particles. The heat dissipation mesh 26 can adjust the air flow generated by the fan 22 to make the air flow more evenly distributed over the entire heat dissipation structure. The uniform air flow can ensure that the surfaces of the heat sink 24 and the heat dissipation plate 21 are fully cooled, avoiding local overheating problems. The air flow generated by the fan 22 passes through the fixed cover 25, the heat dissipation mesh 26 and the heat dissipation bracket 23 in sequence, and finally reaches the heat dissipation plate 21. This design ensures that the air flow has been preliminarily filtered and guided before entering the heat dissipation channel, and can more effectively complete the heat transfer and dissipation process on the heat dissipation plate 21, maximizing the heat dissipation effect. Through the double guidance of the heat dissipation mesh 26 and the fixed cover 25, the air flow backflow or the formation of eddy currents of the air flow inside the equipment can be avoided, thereby improving the air flow efficiency during the heat dissipation process, reducing the heat dissipation dead angle, and ensuring the uniform cooling of the entire main board 30.

[0050] Preferably, the industrial computer 100 further includes: an interface board 40. The interface board 40 is fixedly connected to the base body 10, and when observed in a direction parallel to the first surface S1, the interface board 40 is located on a side of the main board 30 away from the heat dissipation plate 21.

[0051] Among them, the interface board 40 is located on the back of the main board 30 and on the side away from the heat dissipation board 21. In this way, the main board 30 and the interface board 40 can be separated, avoiding interference between the interface connection area and other components on the main board 30. This design helps to improve the modularity of the device, facilitating subsequent maintenance and upgrade. Separating the interface board 40 from the main board 30 can make more efficient use of the internal space, keep the air flow path between the heat dissipation board 21 and the main board 30 unobstructed, and enhance the heat dissipation effect. This structure avoids the interface cables and connectors from blocking the air flow, ensuring that the air flows smoothly over the surface of the main board 30 and is taken away by the heat dissipation system. The interface board 40 is located on the side of the main board 30 away from the heat dissipation board 21, which can prevent the local heat generated by the interface connection part (such as USB interface, HDMI interface, etc.) from directly affecting the heat dissipation area of the main board 30. This separated layout can avoid excessive heat concentration in one area, making the heat distribution of the entire device more uniform and reducing the risk of local overheating. Since the interface board 40 is arranged away from the heat dissipation board 21, the air flow can flow unobstructedly through the space between the main board 30 and the heat dissipation board 21, improving the efficiency of heat exchange and making the operation of the fan 22 and the heat dissipation board 21 more efficient.

[0052] More preferably, the industrial computer 100 further includes: a power button 50. The power button 50 is integrally formed on the surface of the base body 10. The power button 50 is electrically connected to the main board 30. By pressing the power button 50, the industrial computer 100 is turned on or off.

[0053] Among them, the power button 50 is electrically connected to the main board 30. Users can directly turn on or off the industrial computer 100 by pressing the power button 50, simplifying the operation process. This intuitive design is convenient for users to get started quickly. Especially in industrial scenarios where the device needs to be frequently turned on and off, it can save operation time. The power button 50 is integrally formed on the surface of the base body 10. This design avoids installing the power button 50 as a separate component, reducing the installation complexity, making the appearance of the industrial computer 100 more concise, with stronger integrity and more convenient operation. The power button 50 is integrally formed on the base body 10. This design can effectively prevent the power button 50 from shifting or being damaged due to external force or improper operation. Compared with an external or independently installed power button 50, the integrated design can increase the firmness of the power button 50 and improve its durability. Especially in industrial environments where the device may withstand greater impact or vibration, the integrated design is more reliable. In industrial application scenarios, the simplicity of operation and the reliability of the device are crucial. By integrating the power button 50 and electrically connecting it to the main board 30, this design can quickly respond to user instructions, meet the needs of frequent on and off, and can operate stably for a long time, meeting the high requirements of the industrial environment for the device.

[0054] Preferably, the industrial computer 100 further includes: a sound cavity 60. The sound cavity 60 is integrally formed on the surface of the base body 10, and the surface is located on the side of the base body 10 away from the power button 50.

[0055] Among them, by forming the sound cavity 60 on the base body 10, the sound emitted by internal components can be effectively concentrated and amplified. For example, when the industrial computer 100 needs to emit an alarm sound or operation feedback, the sound cavity 60 can enhance the sound effect, ensuring that the sound is transmitted more clearly and loudly. This is particularly important in a noisy industrial environment, which can improve the recognition and reliability of alarm signals. The integrally formed sound cavity 60 structure has stable acoustic performance, avoiding vibration or loosening problems caused by the installation of an independent sound cavity 60. Compared with external speakers or other audio devices, the sound cavity 60 is built into the base body 10, which can transmit sound more effectively, while reducing the attenuation and interference of sound waves and ensuring the sound quality. In industrial applications, the device needs to provide sound prompts or alarm signals, such as high temperature, operation error, etc. The sound cavity 60 can enhance these sound feedbacks, enabling the operator to respond quickly and ensuring the safety and efficiency of the device. Especially in a complex industrial environment, sound prompts are more direct and effective than visual signals.

[0056] Preferably, the industrial computer 100 further includes: an interface slot 80. The interface slot 80 is integrally formed on the surface of the base body 10, and the power button 50 is integrally formed on the surface.

[0057] Among them, the internal space of the industrial computer 100 is usually relatively limited. The integrated design means that no additional fixing devices are required to separately install the interface slot 80, reducing the complexity of the external structure, making the overall appearance more concise, the shell design more unified, and at the same time improving the production efficiency of the device. The interface slot 80 is integrally formed, reducing the number of openings on the external surface of the device. This design helps to enhance the sealing performance of the device, thereby improving the dust-proof, waterproof, and moisture-proof capabilities to a certain extent. This is particularly important in the working environment of the industrial computer 100, because industrial equipment is usually exposed to dusty, humid or other harsh environmental conditions. The unified layout and the design with fewer openings enable the heat dissipation channels to be more concentrated, thereby forming a more efficient heat dissipation path. The absence of redundant openings means that hot air can be discharged more orderly, effectively avoiding air flow interference problems during the heat dissipation process, and thus improving the heat dissipation efficiency of the device.

[0058] Preferably, the industrial computer 100 further includes: a fixing bracket 70. The fixing bracket 70 is fixedly connected to the base body 10 and is located on the side of the base body 10 away from the heat dissipation part 20.

[0059] Among them, there are usually external forces such as vibration and impact in the industrial environment, and the equipment needs to have good vibration resistance. Setting the fixing frame 70 can effectively enhance the stability of the equipment and prevent displacement, looseness or damage caused by vibration. By setting the fixing frame 70 on the side away from the heat dissipation unit 20, the industrial computer 100 can be installed more firmly in the working environment, reducing the shaking caused by changes in the external environment, thereby protecting the key components inside (such as the motherboard 30 and the heat dissipation unit 20) and extending its service life. Setting the fixing frame 70 on the side away from the heat dissipation unit 20 can balance the stress of the entire device and prevent the heat dissipation unit 20 from bearing too much load pressure. In this way, it can be ensured that the heat dissipation unit 20 maintains its structural integrity and heat dissipation efficiency during continuous operation, and avoids damage caused by uneven force. The design of the fixing frame 70 can provide more installation methods, and the industrial computer 100 can be firmly connected to other equipment, walls, brackets or workbenches through the fixing frame 70 to adapt to different installation requirements. For example, the fixing frame 70 can be connected to the external structure by bolts, clamps or hooks to ensure that the industrial computer 100 remains stable during operation. By setting a fixing bracket 70 on the side of the base 10 away from the heat dissipation unit 20, the industrial computer 100 can be easily installed and disassembled, reducing the impact on the heat dissipation unit 20 or internal components during installation. This design is conducive to improving installation efficiency, especially in industrial environments that require rapid deployment. The fixing bracket 70 is set on the side of the base 10 away from the heat dissipation unit 20, which can effectively avoid interference with the heat dissipation airflow, ensure smooth airflow of the fan 22 and the heat dissipation plate 21, and thus improve the heat dissipation efficiency. If the fixing bracket 70 is set in an area close to the heat dissipation unit 20, the airflow may be blocked, reducing the heat dissipation performance.

[0060] More preferably, the fixing frame 70 is provided with a fixing hole 71 , and the industrial computer 100 is fixed to other structures through the fixing hole 71 .

[0061] Among them, the design of the fixing holes 71 provides a flexible installation method for the industrial computer 100, enabling it to be connected to various external structures (such as walls, equipment frames, support frames, etc.) through bolts, screws or other fasteners. This allows the industrial computer 100 to adapt to different installation environments, whether it is fixed on a vertical wall, a horizontal workbench, or other complex industrial installation sites. Industrial equipment often needs to meet specific installation standards or requirements. The design of the fixing holes 71 enables the equipment to be configured with fasteners of different diameters or positions according to needs, ensuring that the equipment can adapt to various standardized installation requirements and improving its applicability. By connecting to other structures through the fixing holes 71, the industrial computer 100 can be more firmly fixed in the working environment, preventing the equipment from shifting, loosening or falling off due to vibration or external forces during operation. Especially in an industrial environment where the equipment often faces various external impacts and vibrations, a stable fixing structure can effectively ensure the long-term stable operation of the equipment. By firmly connecting the industrial computer 100 to the support structure through the fixing holes 71, it can effectively reduce the safety hazards caused by equipment dropping or moving, especially in an environment with high-altitude installation or many moving parts, to avoid accidents. Another advantage of the design of the fixing holes 71 is the convenience of quick disassembly and assembly of the equipment. When the industrial computer 100 needs to be repaired, maintained or replaced, the staff can quickly loosen the fasteners and easily remove the equipment. Compared with other fixing methods, the design of the fixing holes 71 is simpler and more efficient, which is beneficial to shortening the maintenance time and improving work efficiency.

[0062] Preferably, when observed in a direction perpendicular to the first surface S1, the plurality of heat sinks 24 are parallel to each other.

[0063] Among them, the parallel arranged heat sinks 24 can increase the total surface area for heat dissipation, enabling heat to be more effectively conducted from the interior of the device to the surface of the heat sinks 24. The larger the surface area of the heat sinks 24, the more heat can be dissipated per unit time, thereby enhancing the heat dissipation efficiency. The parallel arranged heat sinks 24 can orderly guide the air flow to pass through the surface of each heat sink 24, ensuring that the air flow can be evenly distributed on the heat sinks 24 and effectively taking away the heat absorbed by the surface of the heat sinks 24. This can reduce the phenomenon of air flow stagnation or dead corners and improve the heat dissipation effect. By arranging the heat sinks 24 in parallel, the problem of uneven heat distribution among the heat sinks 24 can be avoided. The parallel arrangement ensures that all the heat sinks 24 can uniformly receive the air flow blown out by the fan 22, thereby reducing the phenomenon of local overheating and maintaining the stable operation of the device. The design of the parallel arranged heat sinks 24 is relatively simple, and the manufacturing and assembly processes are more efficient. This design can reduce the complexity of the production process, thereby reducing the production cost and time. The parallel arranged heat sinks 24 make the heat dissipation system of the device more regular, facilitating cleaning and maintenance. The staff can more conveniently remove the dust or debris on the heat sinks 24 and keep the heat dissipation system in good working condition. The parallel heat sinks 24 can effectively promote air convection, enabling a good convection effect to be formed in the air flow between the heat sinks 24. The air flow can evenly pass through the gaps between the heat sinks 24, take away the heat, and enhance the overall heat dissipation performance. The design of the parallel arranged heat sinks 24 reduces the resistance of the air flow between the heat sinks 24, enabling the air flow to flow more smoothly. This can improve the efficiency of the fan 22, ensure that more heat is taken away, and reduce the operating temperature of the device. The structure of the parallel arranged heat sinks 24 is relatively stable and can provide good mechanical strength. The arrangement of the heat sinks 24 can enhance the overall stability of the heat dissipation component, reducing the structural deformation or damage caused by mechanical vibration or external force. The design of the parallel heat sinks 24 can balance the load of the heat dissipation system, making the force distribution among the heat sinks 24 more uniform, reducing the problem of excessive local force, and improving the durability and reliability of the heat dissipation system.

[0064] Thereby, by the industrial computer 100 being provided with the heat dissipation part 20 and the heat dissipation part 20 being provided with the fan 22, the industrial computer 100 can effectively dissipate heat. And the heat conduction channel in the shape of an S is integrally formed by the heat dissipation plate 21, and the heat conduction channel guides the air flow formed by the fan 22, enabling the air flow formed by the fan 22 to evenly flow to the main board 30, improving the uniformity of heat dissipation.

[0065] The above-described embodiments merely represent several embodiments of the present application. The description thereof is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all fall within the protection scope of the present application.

Claims

1. An industrial computer with a heat dissipation structure, characterized in that, The industrial computer includes: A substrate; A heat dissipation part, fixedly connected to the substrate. The heat dissipation part is provided with a heat dissipation plate and a fan, and the surface formed by the heat dissipation plate is the first surface; A main board, fixedly connected to the substrate, and when observed in a direction parallel to the first surface, the main board is located on the side of the heat dissipation plate away from the fan; Wherein, the heat dissipation plate is integrally formed with a heat conduction channel, and the heat conduction channel is in an S shape to guide the airflow formed by the fan.

2. The industrial computer with a heat dissipation structure according to claim 1, wherein The heat dissipation part further includes: A heat dissipation bracket, integrally formed on the heat dissipation part and located on the side of the heat dissipation plate away from the main board; Heat dissipation fins, integrally formed on the heat dissipation fins, and when observed in a direction parallel to the first surface, the heat dissipation fins are perpendicular to the heat dissipation bracket.

3. The industrial computer with a heat dissipation structure according to claim 2, characterized in that, The heat dissipation part further includes: A fixing cover, fixedly connected to the heat dissipation part and abutted against the heat dissipation bracket; A heat dissipation net, fixedly connected to the fixing cover, and when observed in a direction parallel to the first surface, the heat dissipation net is located between the fixing cover and the fan; Wherein, the airflow formed by the fan sequentially passes through the fixing cover, the heat dissipation net and the heat dissipation bracket to reach the heat dissipation plate.

4. An industrial computer with a heat dissipation structure according to claim 1, characterized in that, The industrial computer further includes: An interface board, fixedly connected to the substrate, and when observed in a direction parallel to the first surface, the interface board is located on the side of the main board away from the heat dissipation plate.

5. An industrial computer with a heat dissipation structure according to claim 1, characterized in that, The industrial computer further includes: A power button, integrally formed on the surface of the substrate; Wherein, the power button is electrically connected to the main board, and by pressing the power button, the industrial computer is turned on or off.

6. The industrial computer with a heat dissipation structure according to claim 5, characterized in that, The industrial computer further includes: An acoustic cavity, integrally formed on the surface of the substrate, and the surface is located on the side of the substrate away from the power button.

7. The industrial computer with a heat dissipation structure according to claim 5, characterized in that, The industrial computer further includes: An interface slot, integrally formed on the surface of the substrate, and the power button is integrally formed on the surface.

8. An industrial computer with a heat dissipation structure according to claim 1, characterized in that, The industrial computer further includes: A fixing frame, fixedly connected to the substrate and located on the side of the substrate away from the heat dissipation part.

9. The industrial computer with a heat dissipation structure according to claim 8, wherein, The fixing frame is provided with fixing holes, and the industrial computer is fixed to other structures through the fixing holes.

10. An industrial computer with a heat dissipation structure according to claim 2, characterized in that, When observed in a direction perpendicular to the first surface, the plurality of heat dissipation fins are parallel to each other.

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