Flower basket device

Abstract

The utility model discloses a flower basket device. The flower basket device comprises a supporting piece, a limiting piece and positioning pieces, the limiting piece is installed on the supporting piece, the limiting piece is provided with a containing area used for containing a silicon wafer or a measuring wafer, the positioning pieces are arranged on the supporting piece or the limiting piece, a plurality of numbers are arranged on the positioning pieces, and the positioning pieces are arranged on the supporting piece or the limiting piece. And the plurality of numbers are sequentially distributed along the silicon wafer placement direction of the accommodating area. The flower basket device can quickly and accurately position the position of the measuring sheet, the placing range of the measuring sheet is increased, more comprehensive and accurate data are obtained, and monitoring of a production line SPC and analysis of experimental data are remarkably improved.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaics, and particularly to a flower basket device. Background Art

[0002] In the field of photovoltaics, during the preparation process of HJT solar cells, silicon wafers need to go through processes such as rough polishing → ozone cleaning → pre-cleaning → texturing → post-cleaning → rounding treatment → hydrofluoric acid passivation → slow lifting → drying, etc. On the basis of removing the mechanical damage layer and dirt foreign matters on the surface of the incoming silicon wafers, a small and uniform "pyramid" textured surface structure is prepared, and then an intrinsic amorphous silicon thin film and N-type and P-type amorphous silicon thin films are deposited on the front and back sides of the silicon wafers respectively. Therefore, in the process of producing HJT solar cell wafers, the cleaning and texturing process is particularly important for the monitoring of the production line SPC (Statistical Process Control). During the production and experiment processes of texturing and cleaning, data is usually measured by placing measurement wafers, so as to monitor the production line SPC and obtain experimental data. The existing measurement methods mainly involve placing measurement wafers and measuring after texturing is completed, so as to monitor the production line SPC. To facilitate positioning the position of the measurement wafers, measurement personnel usually place the measurement wafers at the edge of the flower basket. However, there will be a certain degree of difference in the reaction degree of the silicon wafers at different positions in the flower basket with the chemical solution, resulting in incomplete measurement data and inability to effectively control the process. Summary of the Utility Model

[0003] Based on this, it is necessary to provide a flower basket device. The flower basket device of the utility model can quickly and accurately locate the position of the measurement wafer, increase the placement range of the measurement wafer, obtain more comprehensive and accurate data, and significantly improve the monitoring of the production line SPC and the analysis of experimental data.

[0004] An embodiment of the present application provides a flower basket device.

[0005] A flower basket device includes a support member, a limiting member, and a positioning member. The limiting member is installed on the support member. A receiving area for placing silicon wafers or measurement wafers is provided on the limiting member. The positioning member is arranged on the support member or the limiting member. The positioning member includes a plurality of numbers, and the plurality of numbers are sequentially distributed along the silicon wafer placement direction. The numbers are used to identify the positions of the silicon wafers and the measurement wafers.

[0006] In some of the embodiments, the support member includes a first bracket and a second bracket. The first bracket and the second bracket are opposite and spaced apart, and the limiting member is connected between the first bracket and the second bracket.

[0007] In some of these embodiments, the limiting member includes a plurality of limiting bars, and a plurality of limiting teeth are provided on the limiting bars. The plurality of limiting bars are connected between the first bracket and the second bracket, and an accommodating area is defined between the plurality of limiting bars. The limiting teeth on each of the limiting bars face the accommodating area, and the plurality of limiting teeth on each of the limiting bars correspond one by one. A limiting groove for accommodating a single silicon wafer or a measuring piece is formed between two adjacent limiting teeth.

[0008] In some of these embodiments, at least one pair of the limiting bars is connected to the first bracket and the second bracket to limit the silicon wafer or the measuring piece from both sides of the silicon wafer or the measuring piece, and at least one of the limiting bars is connected to the bottom positions of the first bracket and the second bracket to limit the silicon wafer or the measuring piece from the bottom of the silicon wafer or the measuring piece.

[0009] In some of these embodiments, in the height direction of the first bracket and the second bracket, at least two pairs of the limiting bars are distributed. A positioning member is connected to one of the limiting bars, and the numbers on the positioning member are distributed in sequence along the length direction of the limiting bar.

[0010] In some of these embodiments, the distance between each pair of the limiting bars is greater than or equal to the width of the silicon wafer.

[0011] In some of these embodiments, the width of the limiting groove formed between two adjacent limiting teeth is greater than the thickness of a single silicon wafer and less than the sum of the thicknesses of two silicon wafers.

[0012] In some of these embodiments, the end of the limiting tooth away from the limiting bar has a pointed structure.

[0013] In some of these embodiments, the flower basket device further includes a pressing member, which is detachably connected to the supporting member, and the pressing member is used to limit the silicon wafer or the measuring piece from the top of the accommodating area.

[0014] In some of these embodiments, a clamping groove for placing the pressing member is provided on the supporting member;

[0015] And / or, a plurality of pressing teeth are provided on the pressing member and are distributed in sequence along its length direction.

[0016] The above-mentioned flower basket device can quickly and accurately locate the position of the measurement piece, increase the range of the placement position of the measurement piece, obtain more comprehensive and accurate data, and significantly improve the monitoring of the production line SPC and the analysis of experimental data. When the above-mentioned flower basket device is in use, the silicon wafer is placed in the accommodating area inside the flower basket, and the placed measurement piece is accurately positioned through the numbers on the positioning piece. After the texturing is completed, by measuring the differences before and after texturing of the measurement pieces at different positions, data is summarized to implement good control over the process, effectively monitor the production line SPC, and improve the production quality. The above-mentioned flower basket device has a simple structure, is easy to use, has high positioning accuracy and high efficiency, can meet the large-scale production requirements of photovoltaic modules, has closer process control over the production of silicon wafers, strengthens the monitoring of the production line SPC, and improves the production efficiency and production quality. Description of the Drawings

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0018] In order to more completely understand the present application and its beneficial effects, the following will be described in conjunction with the drawings. Among them, the same reference numerals in the following description represent the same parts.

[0019] Figure 1 Schematic diagram of the flower basket device according to an embodiment of the present utility model;

[0020] Figure 2 Partial structural schematic diagram of the flower basket device according to an embodiment of the present utility model after placing the silicon wafer and the measurement piece.

[0021] Description of the Reference Numerals

[0022] 10. Flower basket device; 100. Support member; 110. First bracket; 120. Second bracket; 130. Card slot; 200. Limit strip; 210. Limit teeth; 300. Number; 400. Pressing member; 410. Pressing teeth; 500. Accommodating area; 20. Silicon wafer; 30. Measurement piece. Detailed Embodiments

[0023] To make the above objects, features, and advantages of the present utility model more obvious and understandable, the following describes the specific embodiments of the present utility model in detail with reference to the accompanying drawings. Many specific details are set forth in the following description to fully understand the present utility model. However, the present utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present utility model. Therefore, the present utility model is not limited by the specific embodiments disclosed below.

[0024] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model.

[0025] In the present utility model, unless otherwise clearly defined and limited, the terms "installed", "connected", "connected to", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0026] In the present utility model, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over", and "on top of" the second feature can be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath", and "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0027] In the description of the present utility model, "several" means more than one, "many" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used to distinguish the technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0029] The embodiment of the present application provides a basket device 10 to solve the problem that in the traditional technology, when measuring data by placing a measuring piece 30 during the production and experiment of the texturing cleaning, the measuring piece 30 is placed at the edge of the basket. Because the reaction degree between the silicon wafer 20 at different positions in the basket and the liquid medicine will be different to a certain extent, the measured data is not comprehensive enough and the process cannot be effectively controlled. The basket device 10 will be described below in conjunction with the accompanying drawings.

[0030] The flower basket device 10 provided in the embodiment of the present application is exemplary, see Figure 1 As shown, Figure 1 The structure diagram of the basket device 10 provided in the embodiment of the present application is shown in FIG. The basket device 10 of the present application can be used to measure data of the texturing and cleaning process during production and experiments to monitor the SPC of the production line and obtain experimental data.

[0031] It should be noted that the size (length, width, and thickness) of the measuring piece 30 in the present application is substantially consistent with the size (length, width, and thickness) of the silicon wafer 20 , the structure of the measuring piece 30 is consistent with the structure of the silicon wafer 20 , and the measuring piece 30 is used for measurement.

[0032] In order to more clearly illustrate the structure of the flower basket device 10, the flower basket device 10 will be introduced below with reference to the accompanying drawings. Figure 1 As shown, Figure 1 This is a schematic diagram of the structure of a flower basket device 10 provided in an embodiment of the present application.

[0033] A flower basket device 10, comprising a support member 100, a limiting member and a positioning member. The limiting member is installed on the support member 100. A receiving area 500 for placing a silicon wafer 20 or a measuring wafer 30 is provided on the limiting member. The positioning member is disposed on the support member 100 or the limiting member. The positioning member includes a plurality of numbers 300. The plurality of numbers 300 are sequentially distributed along the placing direction of the silicon wafer 20. It should be noted that the placing direction of the silicon wafer 20 refers to the distribution direction when a plurality of silicon wafers are spaced apart. The number 300 is used to identify the position of the silicon wafer 20 and the position of the measuring wafer 30.

[0034] In some embodiments, the support member 100 includes a first bracket 110 and a second bracket 120. The first bracket 110 and the second bracket 120 are opposite and spaced apart. The limiting member is connected between the first bracket 110 and the second bracket 120.

[0035] In some embodiments, the limiting member includes a plurality of limiting bars 200. A plurality of limiting teeth 210 are provided on the limiting bars 200. The plurality of limiting bars 200 are connected between the first bracket 110 and the second bracket 120. The receiving area 500 is defined by the plurality of limiting bars 200. The limiting teeth 210 on each limiting bar 200 face the receiving area 500. The plurality of limiting teeth 210 on each limiting bar 200 correspond one by one. A limiting groove for receiving a single silicon wafer 20 or a measuring wafer 30 is formed between two adjacent limiting teeth 210.

[0036] In some embodiments, the positioning member can be disposed on one of the limiting bars 200, or the positioning member can be a separate structure.

[0037] In some embodiments, it should be noted that the number 300 of the positioning member can be formed by laser printing, or by printing, or by etching, or by welding, bonding and other methods.

[0038] The distance between the first bracket 110 and the second bracket 120 can be set as required. Correspondingly, since the limiting bar 200 is connected between the first bracket 110 and the second bracket 120, the number of the limiting teeth 210 on the limiting bar 200 is set according to the distance between the first bracket 110 and the second bracket 120. Or, conversely, the distance between the first bracket 110 and the second bracket 120 can be set according to the number of the limiting teeth 210 on the limiting bar 200.

[0039] In some of these embodiments, at least one pair of limiting bars 200 are connected to the first support 110 and the second support 120 for limiting the silicon wafer 20 or the measurement wafer 30 from both sides of the silicon wafer 20 or the measurement wafer 30, that is, limiting the silicon wafer 20 or the measurement wafer 30 in the horizontal direction. At least one limiting bar 200 is connected to the bottom positions of the first support 110 and the second support 120 for limiting the silicon wafer 20 or the measurement wafer 30 from the bottom of the silicon wafer 20 or the measurement wafer 30, that is, limiting the silicon wafer 20 or the measurement wafer 30 in the vertical direction. It should be noted that the "both sides" in limiting the silicon wafer 20 or the measurement wafer 30 from both sides of the silicon wafer 20 or the measurement wafer 30 refers to the two side positions of the silicon wafer 20 or the measurement wafer 30 after being vertically placed perpendicular to the horizontal direction along the Figure 1 indicated angle. The "bottom" in limiting the silicon wafer 20 or the measurement wafer 30 from the bottom of the silicon wafer 20 or the measurement wafer 30 refers to the bottom position of the silicon wafer 20 or the measurement wafer 30 after being vertically placed perpendicular to the horizontal direction along the Figure 1 indicated angle.

[0040] In some of these embodiments, at least two pairs of limiting bars 200 are distributed in the height direction of the first support 110 and the second support 120. A positioning member is connected to one of the limiting bars 200, and the numbers 300 on the positioning member are sequentially distributed along the length direction of the limiting bar 200.

[0041] In some of these embodiments, the distance between each pair of limiting bars 200 is greater than or equal to the width of the silicon wafer 20. With such a setting, it can be ensured that the silicon wafer 20 or the measurement wafer 30 is placed into the accommodating area 500.

[0042] In some of these embodiments, the width of the limiting groove formed between two adjacent limiting teeth 210 is greater than the thickness of a single silicon wafer 20 and less than the sum of the thicknesses of two silicon wafers 20. With such a setting, it is ensured that a single silicon wafer 20 or a single measurement wafer 30 is placed in each limiting groove.

[0043] In some of these embodiments, the end of the limiting tooth 210 away from the limiting bar 200 has a pointed structure.

[0044] In some of these embodiments, the flower basket device 10 further includes a pressing member 400. The pressing member 400 is detachably connected to the support member 100. The pressing member 400 is used for limiting the silicon wafer 20 or the measurement wafer 30 from the top of the accommodating area 500, that is, the pressing member 400 limits the silicon wafer 20 or the measurement wafer 30 in the vertical direction.

[0045] In some of these embodiments, a card slot 130 for placing the pressing member 400 is provided on the support member 100.

[0046] In some of these embodiments, referring to Figure 1 as shown, a plurality of pressing teeth 410 are arranged on the pressing member 400 in sequence along its length direction.

[0047] Referring to Figure 1 as shown, two pairs of limiting bars 200 are arranged in an up-and-down position distribution, and a limiting bar 200 is arranged at the bottom of the two pairs of limiting bars 200. In Figure 1 , the limiting bar 200 at the bottom is used to limit the silicon wafer 20 from the bottom, and the pressing member 400 is arranged on the tops of the first bracket 110 and the second bracket 120. The number of the limiting teeth 210 on each limiting bar 200 is the same as the number of the pressing teeth 410 on the pressing member 400, and the multiple limiting teeth 210 on each limiting bar 200 and the multiple pressing teeth 410 on the pressing member 400 correspond to each other one by one. With such an arrangement, it is ensured that each silicon wafer 20 or measurement wafer 30 is arranged in a limiting groove.

[0048] Referring to Figure 2 as shown, Figure 2 is a partial structural schematic diagram of the carrier device 10 of the present utility model after placing the silicon wafers 20 and the measurement wafers 30. After placing the silicon wafers 20 and the measurement wafers 30, there is a number 300 corresponding to the position of the measurement wafer 30. The position of the measurement wafer 30 can be located according to the number 300, avoiding confusion between the measurement wafer 30 and the silicon wafer 20, which is easy for the operator to locate. The measurement wafer 30 can be arranged in the limiting grooves at various positions such as the edge position and the middle position of the accommodating area 500, improving the measurement accuracy.

[0049] In summary, the carrier device 10 of the present application can quickly and accurately locate the position of the measurement wafer 30, increase the placement range of the measurement wafer 30, obtain more comprehensive and accurate data, and significantly improve the monitoring of the production line SPC and the analysis of experimental data. When the above-mentioned carrier device 10 is in use, the silicon wafers 20 and at least one measurement wafer 30 are placed in the respective limiting grooves of the silicon wafer placement area inside the carrier, that is, the accommodating area 500. The placed measurement wafer 30 is accurately positioned through the number 300 on the positioning member. After the texturing is completed, by measuring the differences before and after texturing of the measurement wafers 30 at different positions, data is summarized to implement good control over the process, effectively monitor the production line SPC, and improve the production quality. The above-mentioned carrier device 10 has a simple structure, is convenient to use, has high positioning accuracy and high efficiency, can meet the requirements of large-scale production, has a closer control over the process of silicon wafer 20 production, strengthens the monitoring of the production line SPC, and improves the production efficiency and production quality.

[0050] In the above embodiments, the descriptions of the respective embodiments have their own emphases. For the parts not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0051] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

[0052] The above-described embodiments only represent several implementation manners of the present utility model. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent of the present utility model. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several modifications and improvements can still be made, and these all belong to the protection scope of the present utility model. Therefore, the protection scope of the patent of the present utility model shall be subject to the appended claims.

Claims

1. A flower basket device (10), characterized in that, It includes a support member (100), a limiting member, and a positioning member. The limiting member is installed on the support member (100). A receiving area (500) for placing a silicon wafer (20) or a measuring wafer (30) is provided on the limiting member. The positioning member is arranged on the support member (100) or the limiting member. The positioning member includes a plurality of numbers (300), and the plurality of numbers (300) are sequentially distributed along the placing direction of the silicon wafer (20). The numbers (300) are used to identify the positions of the silicon wafer (20) and the measuring wafer (30).

2. The flower basket device (10) according to claim 1, characterized in that, The support member (100) includes a first bracket (110) and a second bracket (120). The first bracket (110) and the second bracket (120) are opposite and spaced apart. The limiting member is connected between the first bracket (110) and the second bracket (120).

3. The flower basket device (10) according to claim 2, characterized in that, The limiting member includes a plurality of limiting bars (200). A plurality of limiting teeth (210) are provided on the limiting bars (200). The plurality of limiting bars (200) are connected between the first bracket (110) and the second bracket (120). The plurality of limiting bars (200) enclose the receiving area (500). The limiting teeth (210) on each limiting bar (200) face the receiving area (500). The plurality of limiting teeth (210) on each limiting bar (200) correspond one by one. A limiting groove for receiving a single silicon wafer (20) or a measuring wafer (30) is formed between two adjacent limiting teeth (210).

4. The flower basket device (10) according to claim 3, characterized in that, At least one pair of the limiting bars (200) are connected to the first bracket (110) and the second bracket (120) to limit the silicon wafer (20) or the measuring wafer (30) from both sides of the silicon wafer (20) or the measuring wafer (30). At least one of the limiting bars (200) is connected to the bottom positions of the first bracket (110) and the second bracket (120) to limit the silicon wafer (20) or the measuring wafer (30) from the bottom of the silicon wafer (20) or the measuring wafer (30).

5. The flower basket device (10) according to claim 4, characterized in that, In the height direction of the first bracket (110) and the second bracket (120), at least two pairs of the limiting bars (200) are distributed. The positioning member is connected to one of the limiting bars (200). The numbers (300) on the positioning member are sequentially distributed along the length direction of the limiting bar (200).

6. The flower basket device (10) according to any one of claims 4 to 5, characterized in that, The distance between each pair of the limiting bars (200) is greater than or equal to the width of the silicon wafer (20).

7. The flower basket device (10) according to any one of claims 3 to 5, characterized in that, The width of the limiting groove formed between two adjacent limiting teeth (210) is greater than the thickness of a single silicon wafer (20) and less than the sum of the thicknesses of two silicon wafers (20).

8. The flower basket device (10) according to any one of claims 3 to 5, characterized in that, One end of the limiting tooth (210) away from the limiting bar (200) is in a pointed structure.

9. The flower basket device (10) according to any one of claims 1 to 5, characterized in that, The flower basket device (10) further includes a material pressing member (400). The material pressing member (400) is detachably connected to the support member (100), and the material pressing member (400) is configured to limit the silicon wafer (20) or the measurement wafer (30) from the top of the accommodation area (500).

10. The flower basket device (10) according to claim 9, characterized in that, A card slot (130) for placing the material pressing member (400) is provided on the support member (100); And / or, a plurality of material pressing teeth (410) are provided on the material pressing member (400) and are sequentially distributed along its length direction.

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