Positioning clamp for silicon wafer thinning

Abstract

The utility model discloses a positioning clamp for thinning a silicon wafer, and belongs to the technical field of silicon wafer positioning clamps. Comprising a fixing assembly, a positioning assembly and an adjusting assembly, the fixing assembly comprises a bottom plate and a connecting frame, a fixing plate is arranged at the bottom of the connecting frame, the positioning assembly comprises lower supporting legs arranged above the bottom plate, lower supporting legs are arranged above the lower supporting legs, a first sliding frame is arranged above the connecting frame, and a second sliding frame is arranged on one side wall of the first sliding frame. The adjusting assembly comprises a sliding block arranged on the side wall of the sliding groove, a fixing rod is arranged on the side wall of the sliding block, and a silicon wafer fixing plate is arranged at the tail end of the fixing rod. The device can be adjusted up and down by sliding the upper supporting leg on the inner wall of the lower supporting leg, the second sliding frame is transversely adjusted in the sliding groove in one side wall of the sliding frame, the positioning effect is good, the sliding block is transversely adjusted on the second sliding frame, and the first sliding frame and the second sliding frame can adjust the distance between the multiple silicon wafer fixing plates, so that the positioning effect is good. Silicon wafers of different sizes can be fixed, and the fixing effect is good.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer positioning jigs, and more specifically, to a positioning jig for silicon wafer thinning. Background Technique

[0002] In the current method of producing thinned polysilicon wafers, it is often necessary to transfer the polysilicon wafers during production for further processing. However, the current jigs for transferring polysilicon wafers are too rough, and only mechanical clamping parts are used for clamping and transferring. This will cause further damage to the internal structure of the polysilicon wafers, with a high damage rate. Moreover, the jig needs to position the silicon wafer before thinning. The existing silicon wafer jigs are not easy to quickly position, and a positioning jig for silicon wafer thinning is needed. Therefore, a positioning jig for silicon wafer thinning is proposed to solve the above problems.

[0003] The patent document with the publication number CN216303978U in the prior art provides a silicon wafer jig structure. This silicon wafer jig structure places the silicon wafer on the third tabletop, supports the silicon wafer through the support plate surface, and then processes the silicon wafer.

[0004] Although this silicon wafer jig structure has many beneficial effects, there are still the following problems: after the silicon wafer is placed on the third tabletop by this silicon wafer jig structure, the silicon wafer will be fixed. To adjust the position of the silicon wafer, the entire device needs to be moved, and it is not easy to adjust the position of the silicon wafer. When thinning, it is not easy to position the silicon wafer before thinning, and the positioning effect is poor and needs to be improved; secondly, this silicon wafer jig structure is in a ring structure, and the size of the ring hole is fixed, and it cannot adjust the jig to fix the silicon wafer according to the size of the silicon wafer, and the fixing effect is poor. Content of the Utility Model

[0005] 1. Technical Problems to be Solved

[0006] The purpose of the utility model is to provide a positioning jig for silicon wafer thinning to solve the problems mentioned in the above background technique, that is, the existing positioning jig for silicon wafer thinning needs to move the entire device to adjust the position of the silicon wafer, it is not easy to adjust the position of the silicon wafer, it is not easy to position the silicon wafer before thinning, the positioning effect is poor, and it cannot adjust the jig to fix the silicon wafer according to the size of the silicon wafer, and the fixing effect is poor.

[0007] 2. Technical Solution

[0008] A positioning jig for silicon wafer thinning includes a fixing component, a positioning component, and an adjusting component;

[0009] Among them,

[0010] The fixing component includes a bottom plate and a connecting frame, and a fixing plate is arranged at the bottom of the connecting frame;

[0011] The positioning component includes lower legs disposed above the base plate, upper legs disposed above the lower legs, a sliding frame I disposed above the connecting frame, a chute disposed on a side wall of the sliding frame I, and a sliding frame II disposed on a side wall of the sliding frame I;

[0012] The adjusting component includes a slider disposed on a side wall of the sliding frame II, a fixing rod disposed on a side wall of the slider, a silicon wafer fixing plate disposed at an end of the fixing rod, and a silicon wafer disposed above the silicon wafer fixing plate.

[0013] Preferably, fixing holes are disposed above the base plate, and a fixing frame is disposed on a side wall of the lower legs.

[0014] Preferably, a buckle is disposed on a side wall of the lower legs, and a buckle hole is disposed on the side wall of the lower legs.

[0015] Preferably, a fixing block I is disposed at an end of the sliding frame I, and a fixing bolt I is disposed on a side wall of the fixing block I.

[0016] Preferably, a rubber pad is disposed on an inner circumferential wall of the silicon wafer fixing plate, a fixing block II is disposed at an end of the sliding frame II, and a fixing bolt II is disposed on a side wall of the fixing block II.

[0017] 3. Beneficial effects

[0018] Compared with the prior art, the advantages of the present utility model are as follows:

[0019] The present utility model can adjust the device up and down by sliding the upper legs on the inner wall of the lower legs, and the sliding frame I and the chute can laterally adjust the sliding frame II in the chute on the side wall of the sliding frame I, facilitating multi-directional adjustment of the device and having a good positioning effect;

[0020] Secondly, the slider is laterally adjusted on the sliding frame II, and then the fixing rod connects the slider and the silicon wafer fixing plate. Cooperating with the sliding frame I and the sliding frame II in the positioning component, the distance between multiple silicon wafer fixing plates can be adjusted, and silicon wafers of different sizes can be fixed, with a good fixing effect. Description of the drawings

[0021] Figure 1 is a schematic right-side view of the overall structure of the present utility model;

[0022] Figure 2 is a schematic detailed view of the positioning component of the present utility model;

[0023] Figure 3 is a schematic detailed view of the adjusting component of the present utility model;

[0024] Figure 4 is a schematic partial detailed view of the adjusting component of the present utility model.

[0025] Description of reference numerals in the figure: 1. Fixed component; 2. Positioning component; 3. Adjusting component; 110. Bottom plate; 120. Fixed hole; 130. Fixed plate; 140. Connecting frame; 150. Fixed frame; 210. Lower leg; 220. Upper leg; 230. Buckle; 240. Buckle hole; 250. First sliding frame; 260. Chute; 270. Second sliding frame; 280. First fixed block; 290. First fixing bolt; 310. Slider; 320. Fixed rod; 330. Wafer fixing plate; 340. Rubber pad; 350. Wafer; 360. Second fixed block; 370. Second fixing bolt. Detailed implementation

[0026] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0027] In the description of the present invention, the meaning of "a plurality of" is two or more, unless otherwise specifically defined.

[0028] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "provided with", "sheathed / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] Please refer to Figures 1-4 , the present invention provides a technical solution:

[0030] A positioning fixture for wafer thinning, the fixed component 1 includes a bottom plate 110 and a connecting frame 140. The bottom of the connecting frame 140 is welded with a fixed plate 130. The bottom plate 110 can fix the device in cooperation with the fixed hole 120 and bolts. A plurality of connecting frames 140 can connect the fixed plate 130 and the first sliding frame 250 to make the device more stable.

[0031] The positioning component 2 includes a lower leg 210 above the welding base plate 110. The upper leg 220 is slidably connected above the lower leg 210. The sliding frame one 250 is welded above the connecting frame 140. A chute 260 is formed on the side wall of the sliding frame one 250, and the sliding frame two 270 is slidably connected to the side wall of the sliding frame one 250. The upper leg 220 and the lower leg 210 can cooperate to adjust the height of the device. The sliding frame one 250 and the chute 260 can cooperate to slide the sliding frame two 270 for lateral adjustment of the adjusting component 3, and the positioning effect is good.

[0032] The adjusting component 3 includes a slider 310 slidably connected to the side wall of the sliding frame two 270. A fixing rod 320 is welded to the side wall of the slider 310. A silicon wafer fixing plate 330 is installed at the end of the fixing rod 320. A silicon wafer is installed above the silicon wafer fixing plate. The slider 310 can cooperate with the sliding frame two 270 and the chute reserved inside the sliding frame two 270 to slide the fixing rod 320. The fixing rod 320 is used to connect the slider 310 and the silicon wafer fixing plate 330, and multiple silicon wafer fixing plates 330 can fix the silicon wafer 350.

[0033] Specifically, fixing holes 120 are formed above the base plate 110. A fixing frame 150 is welded to the side wall of the lower leg 210. The base plate 110 can be fixed by bolts through the fixing holes 120. Multiple fixing frames 150 welded to the side wall of the lower leg 210 can stabilize the lower leg 210.

[0034] Furthermore, a buckle 230 is installed on the side wall of the lower leg 210, and a buckle hole 240 is formed on the side wall of the lower leg 210. The device is adjusted to a certain height through the upper leg 220 and the lower leg 210, and the buckle 230 and the buckle hole 240 can cooperate to fix the upper leg 220 and the lower leg 210.

[0035] It should be noted that the end of the sliding frame one 250 is threadedly connected to a fixing block one 280, and a fixing bolt one 290 is threadedly connected to the side wall of the fixing block one 280. The fixing block one 280 and the fixing bolt one 290 can cooperate to fix the sliding frame two 270 to the side wall of the sliding frame one 250, which is convenient for fixing the device after positioning the silicon wafer 350.

[0036] It should be noted that a rubber pad 340 is provided on the inner circumferential wall of the silicon wafer fixing plate 330. The end of the sliding frame two 270 is threadedly connected to a fixing block two 360, and a fixing bolt two 370 is threadedly connected to the side wall of the fixing block two 360. The rubber pad 340 can protect the silicon wafer 350. The material of the rubber pad 340 is relatively soft, which can avoid damage to the silicon wafer 350. The fixing block two 360 and the fixing bolt two 370 can cooperate to fix the fixing plate 330 to the side wall of the sliding frame two 270.

[0037] In addition, the accessory materials and modules involved in the present utility model are all prior arts, and those skilled in the art can fully implement them without further elaboration. The content protected by the present utility model does not involve improvements to the internal structure and method either;

[0038] Working principle: Before thinning the silicon wafer 350, the bottom plate 110 is fixed to the lower part of the thinning device by using the fixing holes 120 and bolts. Then, the upper leg 220 slides inside the inner wall of the lower leg 210 to adjust the adjusting component 3 to an appropriate height. The buckle 230 cooperates with the buckle hole 240 to fix the upper leg 220 and the lower leg 210. Multiple fixing frames 150 stabilize the lower leg 210. Then, the connecting frame 140 is used to connect the fixing plate 130 and the first sliding frame 250. The first sliding frame 250 adjusts the distance between multiple silicon wafer fixing plates 330 in cooperation with the sliding groove 260. Then, the silicon wafer 350 is placed on the silicon wafer fixing plate 330. Then, the second sliding frame 270 and the adjusting component 3 are fixed to the side wall of the first sliding frame 250 by the first fixing block 280 and the first fixing bolt 290. Then, the second sliding frame 270 cooperates with the slider 310 and the fixing rod 320 to horizontally adjust the position of the silicon wafer fixing plate 330, and the silicon wafer 350 is adjusted to directly below the thinning device. The device can adjust the silicon wafer fixing plate 330 in multiple directions, which is convenient for positioning the silicon wafer 350 and subsequent thinning work on the silicon wafer 350.

[0039] The above shows and describes the basic principle, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and the descriptions in the specification are only the preferred examples of the present invention and are not used to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A positioning fixture for silicon wafer thinning, characterized in that: It includes a fixing component (1), a positioning component (2) and an adjusting component (3); Among them, the fixing component (1) includes a bottom plate (110) and a connecting frame (140), and a fixing plate (130) is arranged at the bottom of the connecting frame (140); the positioning component (2) includes a lower leg (210) arranged above the bottom plate (110), an upper leg (220) is arranged above the lower leg (210), a first sliding frame (250) is arranged above the connecting frame (140), a chute (260) is arranged on the side wall of the first sliding frame (250), and a second sliding frame (270) is arranged on the side wall of the first sliding frame (250); the adjusting component (3) includes a slider (310) arranged on the side wall of the second sliding frame (270), a fixing rod (320) is arranged on the side wall of the slider (310), a silicon wafer fixing plate (330) is arranged at the end of the fixing rod (320), and a silicon wafer (350) is arranged above the silicon wafer fixing plate (330).

2. The positioning fixture for silicon wafer thinning according to claim 1, characterized in that : A fixing hole (120) is arranged above the bottom plate (110), and a fixing frame (150) is arranged on the side wall of the lower leg (210).

3. The positioning fixture for silicon wafer thinning according to claim 2, characterized in that : A buckle (230) is arranged on the side wall of the lower leg (210), and a buckle hole (240) is arranged on the side wall of the lower leg (210).

4. The positioning fixture for silicon wafer thinning according to claim 3, wherein : A first fixing block (280) is arranged at the end of the first sliding frame (250), and a first fixing bolt (290) is arranged on the side wall of the first fixing block (280).

5. The positioning fixture for silicon wafer thinning according to claim 4, characterized in that : A rubber pad (340) is arranged on the inner circumferential wall of the silicon wafer fixing plate (330), a second fixing block (360) is arranged at the end of the second sliding frame (270), and a second fixing bolt (370) is arranged on the side wall of the second fixing block (360).

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