Novel heat dissipation base for silicon controlled rectifier

Abstract

The novel heat dissipation base comprises a supporting seat, a groove is formed in the bottom of the supporting seat, a refrigeration assembly is fixedly installed on the inner top wall of the groove, two symmetrical through grooves are formed in the two sides of the supporting seat and located in the two sides of the groove, and a transverse plate penetrates through the through grooves and is in sliding connection with the interiors of the through grooves. According to the utility model, the supporting seat, the heat conduction silica gel pad and the refrigeration assembly are arranged, the bottom of the supporting seat is provided with the groove, the refrigeration assembly comprises the semiconductor refrigeration sheet and the heat dissipation fins, the refrigeration assembly is installed in the groove, the supporting seat is cooled through the refrigeration side of the semiconductor refrigeration sheet, and then low temperature is transmitted to the silicon controlled rectifier through the heat conduction silica gel pad. And the plurality of heat dissipation fins arranged at the bottom of the semiconductor chilling plate form an air flowing channel in the groove, so that heat dissipation of the heat dissipation side of the semiconductor chilling plate can be realized, the refrigeration effect of the refrigeration side of the semiconductor chilling plate is improved, and the cooling effect of the silicon controlled rectifier is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of thyristors, in particular to a heat dissipation base for a new type of thyristor. Background Technique

[0002] The thyristor, abbreviated as SCR, is a high-power electrical component, also known as a thyristor. It has the advantages of small volume, high efficiency, long service life, etc. In an automatic control system, it can be used as a high-power drive device to realize the control of high-power equipment with low-power devices. It has been widely used in AC and DC motor speed regulation systems, power regulation systems and servo systems.

[0003] Since the power of the thyristor is relatively large, the heat generated by the thyristor during operation is relatively large. Usually, in order to ensure the heat dissipation of the thyristor, a heat dissipation base is arranged at the bottom of the thyristor. The base is generally composed of an aluminum heat sink and thermal conductive silicone. After the heat is transferred to the aluminum heat sink through the thermal conductive silicone, the contact area between the aluminum heat sink and the air is larger, so that the heat is dissipated through the aluminum heat sink. However, the heat dissipation efficiency of this heat dissipation base is relatively low, and the thyristor will still generate serious heat during long-term operation. Moreover, this base is not simple and fast enough for the installation of the thyristor, and cannot install thyristors with different sizes. The installation flexibility and versatility are relatively poor. Therefore, in view of the above shortcomings, the utility model proposes a heat dissipation base for a new type of thyristor. Summary of the Utility Model

[0004] The purpose of the utility model is to solve the shortcomings existing in the prior art, and to propose a heat dissipation base for a new type of thyristor.

[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme: A heat dissipation base for a new type of thyristor, including a support seat, a groove is opened at the bottom of the support seat, a refrigeration component is fixedly installed on the inner top wall of the groove, two symmetrical through grooves are opened on both sides of the support seat and located on both sides of the groove, a cross plate is penetrated and slidably connected inside the through groove, a telescopic component is fixed on the surface of the end of the cross plate located outside the groove, and a fixing component for fixing the thyristor is installed at the top of the telescopic component.

[0006] Furthermore, both sides of the bottom end of the support seat are fixedly connected with side plates, and mounting holes are opened on the side plates.

[0007] Furthermore, the refrigeration component includes a semiconductor refrigeration sheet fixed on the inner top wall of the groove, and the refrigeration side of the semiconductor refrigeration sheet is attached to the top wall of the groove, and a plurality of heat dissipation fins are fixed to the bottom heat dissipation side of the semiconductor refrigeration sheet.

[0008] Furthermore, a thermal conductive silicone pad is fixedly connected to the upper surface of the support seat.

[0009] Further, the telescopic component includes a square tube fixed to the upper surface of the cross plate, and a through hole is provided at the top end of the square tube. A movable rod passes through and is slidably connected inside the through hole. A locking bolt passes through and is threadedly connected to the side wall at the top end of the square tube. The fixing component includes a top plate fixed to the top end of the movable rod, and one end of the top plate away from the movable rod is located above the support seat. A pressing screw passes through and is threadedly connected to the end of the top plate located above the support seat. Rubber heads and knobs are respectively fixed to the bottom end and the top end of the pressing screw.

[0010] Further, a sliding plate is fixedly connected to the bottom end of the movable rod, and the sliding plate is slidably connected to the inner wall of the square tube. The size of the sliding plate is larger than that of the through hole.

[0011] Further, an anti - detachment plate is fixedly connected to one end of the cross plate located inside the groove, and the size of the anti - detachment plate is larger than that of the through groove.

[0012] The beneficial effects of the present utility model:

[0013] 1. When the present utility model is in use, for a novel heat dissipation base for thyristors, a support seat, a thermal conductive silicone pad and a refrigeration component are provided. A groove is provided at the bottom of the support seat. The refrigeration component includes a semiconductor refrigeration sheet and heat dissipation fins, and the refrigeration component is installed inside the groove. The support seat is cooled by the refrigeration side of the semiconductor refrigeration sheet, and then the low temperature is transferred to the thyristor through the thermal conductive silicone pad, realizing the cooling of the thyristor. A plurality of heat dissipation fins provided at the bottom of the semiconductor refrigeration sheet form an air flow channel inside the groove, which can realize the heat dissipation of the heat dissipation side of the semiconductor refrigeration sheet, thereby improving the refrigeration effect of the refrigeration side of the semiconductor refrigeration sheet, and further improving the cooling effect on the thyristor.

[0014] 2. When the present utility model is in use, for a novel heat dissipation base for thyristors, a support seat, two cross plates, a telescopic component and a fixing component are provided. The two cross bars can slide along the through grooves on the sides of the support seat. The telescopic rod component can move along with the cross plate. The fixing component can change its height through the telescoping of the telescopic component. Therefore, the horizontal and vertical positions of the fixing component can be adjusted. Therefore, this base can be installed for thyristors of different sizes, and the installation flexibility is higher. Description of the Drawings

[0015] In order to more clearly illustrate the technical solutions of the present utility model, the drawings required for use in the following description of the specific embodiments will be briefly introduced. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0016] Figure 1 : The overall three - dimensional view of the present utility model;

[0017] Figure 2: Overall sectional view of the present utility model;

[0018] Figure 3 : The present utility model's Figure 2 Enlarged view at position A in

[0019] The reference numerals are as follows:

[0020] 1. Support base; 101. Groove; 2. Refrigeration component; 21. Thermoelectric cooler; 22. Heat dissipation fins; 3. Thermal conductive silicone pad; 4. Through groove; 5. Horizontal plate; 6. Telescopic component; 61. Square tube; 62. Through hole; 63. Movable rod; 64. Locking bolt; 65. Slide plate; 7. Fixing component; 71. Top plate; 72. Extrusion screw; 73. Rubber head; 8. Anti - detachment plate; 9. Side plate; 10. Mounting hole. Specific implementation mode

[0021] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

[0022] As Figures 1 - 3 shown, it relates to a new type of heat dissipation base for thyristors, including a support base 1. A groove 101 is opened at the bottom of the support base 1. The inner top wall of the groove 101 is fixedly installed with a refrigeration component 2. Two symmetrical through grooves 4 are opened on both sides of the support base 1 and on both sides of the groove 101. A horizontal plate 5 is penetrated and slidably connected inside the through groove 4. One end of the horizontal plate 5 located outside the groove 101 is fixedly provided with a telescopic component 6, and the top of the telescopic component 6 is installed with a fixing component 7 for fixing the thyristor.

[0023] Both sides of the bottom end of the support base 1 are fixedly connected with side plates 9, and mounting holes 10 are opened on the side plates 9.

[0024] The side plates 9 can be installed and fixed through the mounting holes 10, so as to realize the fixed installation of the support base 1.

[0025] The refrigeration component 2 includes a thermoelectric cooler 21 fixed to the inner top wall of the groove 101, and the refrigeration side of the thermoelectric cooler 21 is attached to the top wall of the groove 101. A plurality of heat dissipation fins 22 are fixed to the bottom heat dissipation side of the thermoelectric cooler 21. The upper surface of the support base 1 is fixedly connected with a thermal conductive silicone pad 3.

[0026] The low temperature generated by the semiconductor refrigeration chip 21 will be transferred to the support base 1, and then transferred to the thyristor through the thermal conductive silica gel pad 3 on the surface of the support base 1, so as to realize the cooling of the thyristor and achieve the heat dissipation effect. An air flow channel is formed between the heat dissipation fins 22 below the semiconductor refrigeration chip 21. When the air flows, it will take away the temperature on the surface of the heat dissipation fins 22, thereby improving the heat dissipation effect on the heat dissipation side of the semiconductor refrigeration chip 21, and further improving the refrigeration effect on the refrigeration side of the semiconductor refrigeration chip 21.

[0027] The telescopic assembly 6 includes a square tube 61 fixed to the upper surface of the cross plate 5. A through hole 62 is opened at the top end of the square tube 61. A movable rod 63 is inserted through and slidably connected inside the through hole 62. A locking bolt 64 is inserted through and threadedly connected to the side wall of the top end of the square tube 61. The fixing assembly 7 includes a top plate 71 fixed to the top end of the movable rod 63. One end of the top plate 71 away from the movable rod 63 is located above the support base 1. A pressing screw 72 is inserted through and threadedly connected to the end of the top plate 71 located above the support base 1. Rubber heads 73 and knobs are respectively fixed to the bottom end and the top end of the pressing screw 72.

[0028] The cross plate 5 can move horizontally along the through groove 4, so as to change the horizontal position of the telescopic assembly 6 and the fixing assembly 7. By moving the movable rod 63 up and down along the through hole 62, the height of the fixing assembly 7 can be changed. Therefore, the position of the fixing assembly 7 can be flexibly adjusted according to the size of the thyristor. After the height of the fixing assembly 7 is adjusted, the locking bolt 64 can be tightened to fix the movable rod 63.

[0029] A sliding plate 65 is fixedly connected to the bottom end of the movable rod 63, and the sliding plate 65 is slidably connected to the inner wall of the square tube 61. The size of the sliding plate 65 is larger than that of the through hole 62.

[0030] The sliding plate 65 can increase the stability of the movable rod 63 when moving up and down, and the sliding plate 65 can prevent the movable rod 63 from detaching from the square tube 61 when moving upward.

[0031] One end of the cross plate 5 located in the groove 101 is fixedly connected with an anti-detachment plate 8, and the size of the anti-detachment plate 8 is larger than that of the through groove 4. When the cross plate 5 slides along the through groove 4, the anti-detachment plate 8 can prevent the cross plate 5 from detaching from the through groove 4.

[0032] Working principle: First, fix and install the side plate 9 and the support base 1 through the mounting holes 10 on the side plate 9. Then, place the thyristor on the surface of the thermal conductive silicone pad 3. Next, horizontally move the cross plate 5 and vertically adjust the height of the fixing component 7 so that the extrusion screw 72 is located above the side of the thyristor. Then, tighten the locking bolt 64 to fix the height of the fixing component 7. Then, rotate the extrusion screw 72 so that the bottom end of the extrusion screw 72 abuts against the upper surface of the thyristor, and the thyristor is fixed by the extrusion screws 72 of the two fixing components 7. When the thyristor works, the semiconductor refrigeration sheet 21 cools down the support base 1, and then transfers the low temperature to the thyristor through the thermal conductive silicone pad 3 to achieve the cooling and heat dissipation of the thyristor.

[0033] The preferred embodiments of the present utility model disclosed above are only used to help explain the present utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the present utility model to the specific implementation manners described. Obviously, according to the content of this specification, many modifications and changes can be made. These embodiments are selected and specifically described in this specification to better explain the principle and practical application of the present utility model, so that those skilled in the relevant technical field can well understand and utilize the present utility model. The present utility model is only limited by the claims and their full scope and equivalents.

Claims

1. A heat dissipation base for a new type of thyristor, characterized in that: It includes a support base (1). A groove (101) is formed at the bottom of the support base (1). A refrigeration component (2) is fixedly installed on the inner top wall of the groove (101). Two symmetrical through grooves (4) are formed on both sides of the support base (1) and on both sides of the groove (101). A cross plate (5) is inserted through and slidably connected inside the through groove (4). An expansion component (6) is fixed on the surface of one end of the cross plate (5) outside the groove (101). A fixing component (7) for fixing a thyristor is installed at the top of the expansion component (6).

2. The heat dissipation base for a novel thyristor according to claim 1, wherein: Both sides at the bottom end of the support base (1) are fixedly connected with side plates (9), and mounting holes (10) are formed on the side plates (9).

3. A heat dissipation base for a novel thyristor according to claim 1, characterized in that: The refrigeration component (2) includes a thermoelectric cooler (21) fixed on the inner top wall of the groove (101). The refrigerating side of the thermoelectric cooler (21) is in contact with the top wall of the groove (101). A plurality of heat dissipation fins (22) are fixed to the bottom heat dissipation side of the thermoelectric cooler (21).

4. A heat dissipation base for a novel thyristor according to claim 1, characterized in that: A heat-conducting silicone pad (3) is fixedly connected to the upper surface of the support base (1).

5. A heat dissipation base for a novel thyristor according to claim 1, characterized in that: The expansion component (6) includes a square tube (61) fixed on the upper surface of the cross plate (5). A through hole (62) is formed at the top end of the square tube (61). A movable rod (63) is inserted through and slidably connected inside the through hole (62). A locking bolt (64) is inserted through and threadedly connected to the side wall at the top end of the square tube (61). The fixing component (7) includes a top plate (71) fixed to the top end of the movable rod (63). One end of the top plate (71) away from the movable rod (63) is located above the support base (1). An extrusion screw (72) is inserted through and threadedly connected to one end of the top plate (71) located above the support base (1). Rubber heads (73) and knobs are respectively fixed to the bottom end and the top end of the extrusion screw (72).

6. A heat dissipation base for a novel thyristor according to claim 5, characterized in that: The bottom end of the movable rod (63) is fixedly connected with a sliding plate (65), and the sliding plate (65) is slidably connected with the inner wall of the square tube (61). The size of the sliding plate (65) is larger than that of the through hole (62).

7. A heat dissipation base for a novel thyristor according to claim 1, characterized in that: One end of the cross plate (5) located inside the groove (101) is fixedly connected with an anti - detachment plate (8), and the size of the anti - detachment plate (8) is larger than that of the through groove (4).

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