Laminated busbar convenient for heat dissipation

Abstract

The utility model discloses a laminated busbar convenient for heat dissipation, a heat dissipation mechanism also comprises an installation block, one side of the installation block is fixedly provided with an extension plate, the surface of one side, far away from the installation block, of the extension plate is fixedly connected with a heat dissipation needle row, and the installation block and the extension plate are integrally formed. The heat dissipation needle row is formed by longitudinally arranging a plurality of heat dissipation needles at equal intervals, the heat dissipation needle rows are arranged at equal intervals in the length direction of the extension plate, an isolation frame is fixedly connected to the portion, close to the side wall of the extension plate, of the surface of the installation block, and the side edge of the isolation frame extends towards the outer side of the end of the heat dissipation needle row. The heat dissipation mechanisms are arranged on the two sides of the conductive layer, the multiple sets of heat dissipation pin rows are arranged in the heat dissipation mechanisms, the heat dissipation area of the conductive layer is increased through the heat dissipation pin rows, heat dissipation of the laminated busbar body during use is facilitated, the heat dissipation pin rows are prevented from being impacted by external force through the isolation frame, and the service life of the laminated busbar body is prolonged. And the heat dissipation needles are prevented from being broken.

Description

Technical Field

[0001] The utility model relates to the technical field of electrolytic capacitor connection equipment, and particularly relates to a stacked busbar convenient for heat dissipation. Background Art

[0002] A stacked busbar is a multi-layer conductive structure used in power and electronic equipment, usually composed of multiple layers of copper foil or aluminum foil and insulating materials stacked together. It can provide efficient power transmission in a compact space, reduce electromagnetic interference and the parasitic inductance of the current loop. Stacked busbars are widely used in the fields of power electronics, frequency converters, electric vehicles, and new energy, etc., which helps to improve the performance and reliability of the system.

[0003] A Chinese patent discloses a stacked busbar convenient for heat dissipation (Publication No.: CN218733043U). By setting the positive plate structure, insulating plate, and negative plate structure, the positive plate and the negative plate are respectively installed on the upper and lower side surfaces of the insulating plate and inserted along the limiting groove until the connection small holes and the negative limiting small holes are inserted into the clamping points. This installation method makes the busbar more firm and not easy to fall off. At the same time, the heat dissipation holes on the insulating plate can dissipate heat when the busbar generates heat, ensuring the service life of the busbar. However, the heat dissipation effect of this device through the heat dissipation holes provided on the insulating plate is relatively limited. Therefore, a stacked busbar convenient for heat dissipation is proposed to solve the above problems. Content of the Utility Model

[0004] The technical problems to be solved by the utility model are as follows: The heat dissipation effect through the heat dissipation holes provided on the insulating plate is relatively limited.

[0005] The purpose of the utility model can be achieved by the following technical solutions:

[0006] A stacked busbar convenient for heat dissipation, including a stacked busbar main body, and heat dissipation mechanisms are arranged on both sides of the stacked busbar main body;

[0007] It further includes:

[0008] The heat dissipation mechanism further includes a mounting block, one side of the mounting block is fixedly installed with an extension plate, and a heat dissipation pin row is fixedly connected to the surface of the extension plate away from the mounting block;

[0009] Wherein, the mounting block and the extension plate are integrally formed;

[0010] Wherein, the heat dissipation pin row is composed of a plurality of heat dissipation pins arranged longitudinally at equal intervals, and each heat dissipation pin row is arranged at equal intervals along the length direction of the extension plate.

[0011] As a further solution of the present utility model: A isolation frame is fixedly connected to the surface of the mounting block and on the side wall close to the extension plate, the side of the isolation frame extends towards the outside of the end of the heat dissipation pin row, and each heat dissipation pin row is surrounded inside the isolation frame.

[0012] As a further solution of the present utility model: A plurality of positioning blocks are fixedly connected to the surface of the isolation frame and above and below the mounting block, and the positioning blocks on both sides are arranged equidistantly along the length direction of the mounting block.

[0013] As a further solution of the present utility model: A number of heat dissipation holes are opened on the outer surface of the four sides of the isolation frame, the upper and lower ends of each heat dissipation hole are not in the same vertical plane, and the upper and lower ends of each heat dissipation hole are completely staggered.

[0014] As a further solution of the present utility model: The stacked busbar body includes a conductive layer, insulating layers are bonded to the top and bottom surfaces of the conductive layer, mounting grooves are opened on both outer walls of the conductive layer, and a number of positioning grooves are opened on both outer walls of the insulating layer.

[0015] As a further solution of the present utility model: Thermal conductive glue is coated inside the mounting groove, and the inner side of the mounting groove is also movably connected to the mounting block.

[0016] As a further solution of the present utility model: The inner walls of each positioning groove are respectively inserted with the positioning blocks.

[0017] Advantages of the present utility model:

[0018] (1) In the present utility model, heat dissipation mechanisms are arranged on both sides of the conductive layer, and multiple groups of heat dissipation pin rows are arranged inside the heat dissipation mechanisms. Each heat dissipation pin row increases the heat dissipation area of the conductive layer, thereby helping to assist in the heat dissipation of the stacked busbar body during use;

[0019] (2) Mounting grooves are opened on both sides of the conductive layer. The mounting blocks inside the heat dissipation mechanisms are inserted into the mounting grooves for convenient heat conduction. Thermal conductive glue is coated inside the mounting grooves. The thermal conductive glue can fill the tiny gaps between the mounting grooves and the mounting blocks, reducing the contact thermal resistance, thereby improving the heat dissipation effect; in addition, since the conductivity of the thermal conductive glue is usually very low, the parasitic capacitance and parasitic inductance generated on the heat dissipation pin row due to the contact between the mounting block and the conductive layer can be reduced. In this way, the influence of the heat dissipation pins on the high-frequency signal transmission can be reduced to a certain extent;

[0020] (3) A isolation frame is arranged outside the heat dissipation pin row for protection, preventing the heat dissipation pin row from contacting other conductive components to cause a short circuit. In addition, the isolation frame protects the heat dissipation pin row from external impact and prevents the heat dissipation pins from breaking. Description of the Drawings

[0021] The present utility model will be further described below in conjunction with the accompanying drawings.

[0022] Figure 1 is a schematic diagram of the overall structure of the present utility model;

[0023] Figure 2 is a schematic cross-sectional view of the heat dissipation mechanism in the present utility model;

[0024] Figure 3 is Figure 2 a schematic enlarged view of area A in;

[0025] Figure 4 is a schematic side view of the overall structure of the present utility model;

[0026] Figure 5 is a schematic side view of the main body of the stacked busbar in the present utility model.

[0027] In the figure: 1. Main body of the stacked busbar; 101. Conductive layer; 102. Insulating layer; 103. Installation groove; 104. Thermal conductive adhesive; 105. Positioning groove; 2. Heat dissipation mechanism; 201. Installation block; 202. Extension plate; 203. Heat dissipation pin row; 204. Isolation frame; 205. Positioning block; 206. Heat dissipation hole. Specific embodiments

[0028] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0029] As Figures 1-5 shown, a stacked busbar convenient for heat dissipation includes a main body 1 of the stacked busbar, and heat dissipation mechanisms 2 are arranged on both sides of the main body 1 of the stacked busbar; further included: the heat dissipation mechanism 2 further includes an installation block 201, one side of the installation block 201 is fixedly installed with an extension plate 202, and a heat dissipation pin row 203 is fixedly connected to the surface of the extension plate 202 away from the installation block 201; wherein, the installation block 201 and the extension plate 202 are integrally formed; wherein, the heat dissipation pin row 203 is composed of a plurality of heat dissipation pins arranged longitudinally at equal intervals, and each heat dissipation pin row 203 is arranged at equal intervals along the length direction of the extension plate 202. As Figure 2 , Figure 4 shown, the heat dissipation pins can effectively increase the heat dissipation area and improve the heat conduction efficiency, thereby reducing the temperature of the conductive layer 101;

[0030] A partition frame 204 is fixedly connected to the surface of the mounting block 201 and located on the side wall close to the extension plate 202. The side of the partition frame 204 extends towards the outside of the end of the heat dissipation pin row 203, and each heat dissipation pin row 203 is surrounded inside the partition frame 204. As Figure 2 shown, the partition frame 204 is made of insulating material, and the partition frame 204 prevents external impacts from contacting the heat dissipation pin row 203;

[0031] A plurality of positioning blocks 205 are fixedly connected to the surface of the partition frame 204 and above and below the mounting block 201. The positioning blocks 205 on both sides are arranged at equal intervals along the length direction of the mounting block 201. A plurality of heat dissipation holes 206 are formed on the outer surface of the four sides of the partition frame 204. The upper and lower ends of each heat dissipation hole 206 are not in the same vertical plane, and the upper and lower ends of each heat dissipation hole 206 are completely staggered. As Figures 2-3 shown, the heat dissipation holes 206 can assist the heat dissipation pin row 203 to dissipate heat to the external environment. At the same time, the obliquely arranged heat dissipation holes 206 can prevent external objects from directly contacting the heat dissipation pin row through the heat dissipation holes;

[0032] The laminated busbar body 1 includes a conductive layer 101. Insulating layers 102 are bonded to the top and bottom surfaces of the conductive layer 101. Installation grooves 103 are formed on both outer walls of the conductive layer 101. A plurality of positioning grooves 105 are formed on both outer walls of the insulating layer 102. A heat-conducting adhesive 104 is coated inside the installation groove 103. The inner side of the installation groove 103 is also movably connected to the mounting block 201. The inner walls of each positioning groove 105 are respectively inserted into the positioning blocks 205. As Figure 1 shown, the heat-conducting adhesive 104 can fill the tiny gap between the installation groove 103 and the mounting block 201, reduce the contact thermal resistance, and thus improve the heat dissipation effect; in addition, since the conductivity of the heat-conducting adhesive 104 is usually very low, it can reduce the parasitic capacitance and parasitic inductance of the heat dissipation pin row 203 caused by the contact between the mounting block 201 and the conductive layer 101. In this way, the influence of the heat dissipation pins on the high-frequency signal transmission can be reduced to a certain extent.

[0033] The working principle of the present utility model:

[0034] When installing the laminated busbar body 1 and the heat dissipation mechanism 2, first coat the heat-conducting adhesive 104 in the installation groove 103, and then insert the positioning block 205 into the positioning groove 105. During this period, the mounting block 201 is gradually inserted into the installation groove 103. The heat-conducting adhesive 104 can act as an adhesive to help fix the mounting block 201 and the installation groove 103, reduce mechanical looseness under vibration or thermal cycling conditions, which helps to maintain the structural integrity and reliability of the laminated busbar body 1, and at the same time reduces the electrical performance changes caused by mechanical vibration.

[0035] When the conductive layer 101 generates heat, the heat is transferred to the mounting block 201 and the extension plate 202 through the thermal conductive adhesive 104, so that the heat is distributed on each heat dissipation pin row 203 on the surface of the extension plate 202, thereby improving the heat dissipation efficiency.

[0036] The above has described in detail an embodiment of the present invention, but the content described is only a preferred embodiment of the present invention and cannot be considered as being used to limit the implementation scope of the present invention. All equal changes and improvements made according to the scope of the present invention application should still fall within the patent coverage scope of the present invention.

Claims

1. A laminated busbar facilitating heat dissipation, comprising a laminated busbar body (1), and heat dissipation mechanisms (2) are arranged on both sides of the laminated busbar body (1); It is characterized in that It further comprises: The heat dissipation mechanism (2) further comprises a mounting block (201), an extension plate (202) is fixedly installed on one side of the mounting block (201), and a heat dissipation pin row (203) is fixedly connected to the surface of the extension plate (202) on the side away from the mounting block (201); Wherein, the mounting block (201) and the extension plate (202) are integrally formed; Wherein, the heat dissipation pin row (203) is composed of a plurality of heat dissipation pins arranged longitudinally at equal intervals, and each of the heat dissipation pin rows (203) is arranged at equal intervals along the length direction of the extension plate (202).

2. The stacked busbar facilitating heat dissipation according to claim 1, wherein, A partition frame (204) is fixedly connected to the surface of the mounting block (201) on the side wall close to the extension plate (202), the side of the partition frame (204) extends towards the outside of the end of the heat dissipation pin row (203), and each of the heat dissipation pin rows (203) is surrounded inside the partition frame (204).

3. The stacked busbar facilitating heat dissipation according to claim 2, wherein A plurality of positioning blocks (205) are fixedly connected to the surface of the partition frame (204) above and below the mounting block (201), and the positioning blocks (205) on both sides are arranged at equal intervals along the length direction of the mounting block (201).

4. The laminated busbar facilitating heat dissipation according to claim 2, characterized in that, A plurality of heat dissipation holes (206) are formed on the outer surface of the periphery of the partition frame (204), the upper and lower ends of each of the heat dissipation holes (206) are not in the same vertical plane, and the upper and lower ends of each of the heat dissipation holes (206) are completely staggered.

5. The laminated busbar for facilitating heat dissipation according to claim 1, wherein The laminated busbar body (1) comprises a conductive layer (101), insulating layers (102) are bonded to the top surface and the bottom surface of the conductive layer (101), mounting grooves (103) are formed on both outer walls of the conductive layer (101), and a plurality of positioning grooves (105) are formed on both outer walls of the insulating layer (102).

6. The stacked busbar facilitating heat dissipation according to claim 5, wherein, A heat-conducting adhesive (104) is coated inside the mounting groove (103), and the inside of the mounting groove (103) is also movably connected to the mounting block (201).

7. The laminated busbar facilitating heat dissipation according to claim 5, wherein The inner walls of each of the positioning grooves (105) are respectively inserted into the positioning blocks (205).

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