Solid-state relay

Abstract

The utility model relates to a solid-state relay, which comprises a base, a bottom plate and a silicon controlled rectifier, the bottom plate is arranged at the bottom of the base, the silicon controlled rectifier is arranged on the bottom plate, a plurality of rivets are arranged below the base, riveting holes corresponding to the rivets are arranged on the bottom plate, and the rivets of the base penetrate through the riveting holes to realize riveting with the base plate. The riveting device is riveted on the base through the rivets, positioning is accurate and reliable, machining is convenient, and product consistency is high.

Description

Technical Field

[0001] The utility model relates to a relay, in particular to a solid state relay. Background Art

[0002] A solid state relay (SSR for short) is a contactless switch composed of a microelectronic circuit, discrete electronic devices, and power electronic power devices. This relay realizes the contactless and sparkless connection and disconnection of the circuit through the switching characteristics of electronic components (such as semiconductor devices like switching triodes and bidirectional thyristors), so it is also called a "contactless switch".

[0003] The solid state relay is internally provided with semiconductor devices such as thyristors, and the thyristors generate a large amount of heat. Therefore, the thyristors need to be installed on a metal base plate. The existing solid state relays generally use a filling process to encapsulate the thyristors, and the metal base plate is fixed under the base by glue, but the gluing process is not convenient for automated processing, the processing efficiency is not high, and the product consistency is poor. Summary of the Invention

[0004] In view of the above deficiencies, the utility model provides a solid state relay that is convenient for processing.

[0005] To achieve the above purpose, the utility model adopts a solid state relay, including a base, a base plate, and a thyristor. The base plate is arranged at the bottom of the base, and the thyristor is arranged on the base plate. A plurality of rivets are arranged below the base, and riveting holes corresponding to the rivets are arranged on the base plate. The rivets of the base pass through the riveting holes to realize riveting with the base plate.

[0006] The utility model is further arranged such that the solid state relay further includes a thyristor support. A thyristor positioning groove adapted to the thyristor is formed in the middle of the thyristor support. The thyristor support extends outward to form two or more interlocking plates, and interlocking card slots are formed on the base. The outer ends of the interlocking plates are connected in the interlocking card slots of the base.

[0007] The utility model is further arranged such that the rivets are arranged at both ends of the base, and two rivets are arranged at each end.

[0008] The utility model is further arranged such that side walls are formed on both sides of the bottom of the base, and the side walls surround both sides of the base plate.

[0009] The utility model is further arranged such that a riveting part with a larger inner diameter is arranged in the lower half of the riveting hole.

[0010] The utility model is further arranged such that a U-shaped elastic part is formed on the interlocking plate.

[0011] The utility model is further arranged such that a ceramic substrate is arranged between the thyristor and the base plate.

[0012] The beneficial effects of the present utility model are as follows: The bottom plate is riveted to the base by rivets, with accurate and reliable positioning, convenient processing, and high product consistency. Since no glue injection is required, the side walls surrounding the bottom plate can be used to position the bottom plate, further improving the fixing accuracy of the bottom plate. At the same time, a thyristor bracket is used to fix the thyristor. Through the cooperation of the interlocking plate on the thyristor and the interlocking card slot on the base, the thyristor is closely attached to the bottom plate, ensuring a stable and tight connection between the thyristor and the bottom plate. The U-shaped elastic part provided on the interlocking plate can increase the downward pressure on the thyristor, further improving the tightness of the connection. The ceramic substrate provided between the thyristor and the bottom plate improves the heat conduction efficiency between the thyristor and the bottom plate, thereby improving the heat dissipation efficiency of the thyristor. Description of the Drawings

[0013] Figure 1 is the bottom view of a specific embodiment of the present utility model.

[0014] Figure 2 is the exploded view of a specific embodiment of the present utility model. Detailed Embodiment

[0015] As Figure 1 、 Figure 2 shown, a specific embodiment of the present utility model is a solid-state relay, which includes a base 1, a middle cover 2, an upper cover 3, a bottom plate 4, a thyristor 5, and a thyristor bracket 6. The bottom plate 4 is arranged at the bottom of the base 1. Two rivets 12 are arranged at both ends below the base 1. The bottom plate 4 is provided with riveting holes 41 corresponding to the rivets 12. The lower half of the riveting holes 41 is provided with a riveting part 42 with a larger inner diameter. The rivets 12 of the base 1 pass through the riveting holes 41 to realize riveting with the bottom plate 4. The nail heads formed by the thickening of the nail rods of the rivets 12 are arranged in the riveting part 42. Side walls 13 are formed on both sides of the bottom of the base 1, and the side walls 13 surround both sides of the bottom plate 4.

[0016] The middle cover 2 is arranged on the base 1. A wiring groove 21 is formed on the middle cover 2. The upper cover 3 is covered above the middle cover 2. The thyristor 5 is arranged on the bottom plate 4. A ceramic substrate 7 is arranged between the thyristor 5 and the bottom plate 4. The middle part of the thyristor bracket 6 forms a thyristor positioning groove 61 adapted to the thyristor 5. Both sides of the thyristor bracket 6 extend outward to form an interlocking plate 62. An interlocking card slot 11 is formed on the base 1. The outer end of the interlocking plate 62 is connected in the interlocking card slot 11 of the base 1. A U-shaped elastic part 63 is formed on the interlocking plate 62.

[0017] The directions such as above and below in the present utility model refer to the relative positions determined with the position of the upper cover as the upper and the position of the base as the lower. Other substantially identical transformations are also within the scope of the claims of the present utility model.

Claims

1. A solid-state relay, comprising a base, a bottom plate, and a thyristor. The bottom plate is disposed at the bottom of the base, and the thyristor is disposed on the bottom plate, characterized in that: A number of rivets are provided below the base, and riveting holes corresponding to the rivets are provided on the bottom plate. The rivets of the base are inserted into the riveting holes to achieve riveting with the bottom plate.

2. The solid-state relay according to claim 1, characterized in that: The solid-state relay further includes a thyristor bracket. A thyristor positioning groove adapted to the thyristor is formed in the middle of the thyristor bracket. The thyristor bracket extends outward to form two or more interlocking plates. An interlocking card slot is formed on the base, and the outer ends of the interlocking plates are connected in the interlocking card slot of the base.

3. The solid state relay according to claim 1 or 2, characterized in that: The rivets are provided at both ends of the base, and two rivets are provided at each end.

4. The solid state relay according to claim 3, characterized in that: Side walls are formed on both sides of the bottom of the base, and the side walls surround both sides of the bottom plate.

5. The solid-state relay according to claim 1 or 2, characterized in that: A riveting portion with a larger inner diameter is provided in the lower half of the riveting hole.

6. The solid state relay according to claim 2, characterized in that: A U-shaped elastic portion is formed on the interlocking plate.

7. The solid-state relay according to claim 1 or 2, characterized in that: A ceramic substrate is provided between the thyristor and the bottom plate.

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