Inverter with cooling device

Abstract

The utility model discloses an inverter with a cooling device. The inverter comprises a heating device and an outer shell, and the heating device conducts heat in the heating device to the outer shell through a cooling device serving as a medium so as to reduce the temperature of the heating device in the inverter. The heating device is effectively connected with the cooling device through welding, crimping and other processes, heat generated by the heating device is conducted to low-temperature areas such as the outer shell of the inverter, temperature balance of the heating device is achieved, the effective operation environment of the heating device can be met, meanwhile, the failure risk of the inverter is effectively reduced, and the service life of the inverter is prolonged.

Description

Technical Field

[0001] The present application relates to the technical field of inverters, and in particular to an inverter with a cooling device. Background Art

[0002] An inverter is a converter that converts DC power (batteries, storage bottles) into constant frequency and voltage or frequency and voltage alternating current. With the advancement of inverter technology, its power usage or power density has also increased, and the heat generated by power devices has also increased. When the heat reaches the tolerance limit of the device itself, its performance will be significantly reduced. In severe cases, it will cause damage to key functional devices, causing functional failures of the inverter and even causing safety hazards.

[0003] Currently, the working devices in the inverter have high requirements for temperature conditions. It is usually necessary to design heat dissipation devices with larger cross-sectional areas to improve the problem of excessive temperature of the working devices, or to select higher-performance electrical components to improve redundant design, which leads to larger inverter size, higher costs, and other problems.

[0004] It should be noted that the statements herein merely provide background information related to the present application and do not necessarily constitute prior art. Utility Model Content

[0005] In view of the above problems, the present application proposes an inverter that overcomes the above problems or at least partially solves the above problems.

[0006] The present application embodiment adopts the following technical solutions:

[0007] In a first aspect, an embodiment of the present application provides an inverter with a cooling device, comprising a heat generating device and an outer shell. The heat generating device uses the cooling device as a medium to conduct heat in the heat generating device to the outer shell to reduce the temperature of the heat generating device in the inverter.

[0008] Preferably, the cooling device comprises a heat conducting component, and the heat conducting component connects the heat generating component and the outer shell.

[0009] Preferably, the inverter further comprises a heat-conducting insulating member, wherein the heat-conducting insulating member is arranged between the heat-conducting component and the outer shell, and / or between the heat-conducting component and the heat-generating component.

[0010] Preferably, the heating device includes a copper busbar and a power device; when the heating device includes a copper busbar, the thermally conductive insulating member is disposed between the thermally conductive device and the inverter housing; when the heating device includes a power device, the thermally conductive insulating member is disposed between the thermally conductive device and the power device, and / or between the thermally conductive device and the inverter housing.

[0011] Preferably, when the heating device is arranged parallel to the outer housing, the shape of the heat conduction device includes a first bending structure to form a heat conduction path in the vertical direction through the first bending structure. When the heating device is arranged perpendicular to the outer housing, the shape of the heat conduction device includes a second bending structure to form a heat conduction path in the parallel direction through the second bending structure. When connecting multiple heating devices simultaneously, the shape of the heat conduction device includes a third bending structure to form a heat conduction path in multiple branch directions through the third bending structure.

[0012] Preferably, the power device includes at least one of a circuit board, a chip, a resistor, and a diode; when the heating device includes a copper busbar, it is connected to the heat conduction device by welding; when the power device includes at least one of a circuit board, a chip, a resistor, and a diode, it is connected to the heat conduction device by crimping.

[0013] Preferably, the heat conduction device is connected to the outer housing by one of the following methods: welding, crimping, and fixing parts. The heat conduction device includes a heat pipe.

[0014] The above at least one technical solution adopted in the embodiments of the present application can achieve the following beneficial effects:

[0015] The inverter in the technical solution of the present application can effectively solve the risk of inverter failure caused by excessive temperature rise of internal working devices, can effectively reduce the temperature of power devices or copper busbars, improve the service performance of working devices, such as power components. Under the same conditions, the inverter of the present application can significantly improve its service performance and power density, and reduce the development and maintenance costs.

[0016] The above description of the technical solution of the present application is only an overview of the technical solution of the present application. In order to be able to understand the technical means of the present application more clearly, it can be implemented according to the content of the specification. And in order to make the above and other purposes, features, and advantages of the present application more obvious and understandable, the following specific embodiments of the present application are specifically described. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] By reading the following detailed description of the preferred embodiments, various other advantages and benefits will become clear to those of ordinary skill in the art. The drawings are only for the purpose of showing the preferred embodiments and are not considered to be a limitation of the present application. And throughout the drawings, the same reference numerals are used to represent the same components. In the drawings:

[0018] Figure 1 is the first connection schematic diagram of the inverter in the embodiment of the present application;

[0019] Figure 2 is the second connection schematic diagram of the inverter in the embodiment of the present application;

[0020] Figure 3 This is the third connection schematic diagram of the inverter in the embodiment of the present application;

[0021] Figure 4 This is the fourth connection schematic diagram of the inverter in the embodiment of the present application.

[0022] In the figure, 1 - heating device, 2 - heat conducting device, 3 - heat conducting and insulating part, 4 - outer housing, 5 - circuit board. Detailed implementation manners

[0023] To make the objectives, technical solutions and advantages of the present application clearer, the technical solutions of the present application will be clearly and completely described below in conjunction with the specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0024] The concept of the present application lies in that, aiming at the current situation of heat accumulation and difficult effective discharge during the operation of power devices in the inverter in the prior art, an inverter with a cooling device is designed. The heat conducting device is effectively connected to the heating device, and the heat is conducted to low-temperature positions such as the outer housing of the inverter. The cooling device in this inverter can adjust the heat dissipation path through various processes such as bending and rotation, and perform heat exchange with the low-temperature area of the housing, so as to achieve the purpose of effectively cooling the heat source, improve the service performance and life of the inverter. The inverter of the present application can design a higher-power inverter under the same space conditions, or reduce the design size under the same power conditions, providing more design solutions for the inverter and achieving the purpose of cost reduction and efficiency improvement.

[0025] The following will detail the technical solutions provided by each embodiment of the present application in conjunction with the drawings.

[0026] The embodiment of the present application provides an inverter with a cooling device. In the present application, the inverter includes a heating device 1 and a housing 4. The heat in the heating device 1 is conducted to the housing 4 through the cooling device as a medium to reduce the temperature of the heating device 1 in the inverter. The cooling device includes a heat conducting device 2. The heat conducting device 2 includes, but is not limited to, a heat pipe, and a heat sink can also be used instead. The heat pipe is connected between the heating device 1 inside the inverter and the housing 4. The inverter in the present application further includes a heat conducting and insulating member 3, and the heat conducting and insulating member 3 is arranged at one end or both ends of the heat conducting device 2. In the present application, since certain requirements are imposed on the strength of the housing of the inverter, it is not suitable to provide a heat dissipation device on the surface of the housing. Generally, the housing of the inverter is made of metal and has a good heat dissipation effect. Based on this, the heating device 1 and the housing 4 can be connected through the heat conducting device 2 with good heat conductivity, so as to timely discharge the heat generated by the heating device in the inverter and enable the working devices in the inverter to be at an appropriate working temperature.

[0027] As Figures 1-4 shown, a schematic diagram of the connection of the inverter in the embodiment of the present application is provided. In the figure, the heating device 1 mainly includes devices with high heat generation and whose performance is easily affected by temperature during the operation of the inverter. When the inverter is continuously operating, the temperature of such devices gradually increases, and their performance will decrease as the temperature rises, or it will affect the performance of non-temperature-resistant devices around them, affecting the overall performance of the machine. Therefore, it is necessary to add a cooling device to such devices. The heating device 1 includes a copper busbar, a circuit board (PCBA substrate), and power devices. Among them, the power devices mainly include chips, diodes, resistors, etc.

[0028] The heat of the heating device 1 uses a heat conducting device with high heat conduction efficiency such as a heat pipe as a medium to efficiently conduct the heat to a low-temperature area such as the housing of the inverter, and this low-temperature area can effectively conduct heat to the outside, so that the power device is maintained within a reasonable operating temperature range, improving its service performance and service life.

[0029] Due to the different positional relationships between the heating device 1 and the housing 4 in the inverter, the heat conducting device 2 needs to present different bent shapes according to the structure of the internal space of the inverter.

[0030] During specific implementation, when the heating device 1 is arranged parallel to the housing 4, the shape of the heat conducting device 2 includes a first bent structure. As Figure 2 shown, the first bent structure of the heat conducting device is in a three-fold shape to form a heat conduction path in the vertical direction. The first fold is connected to the heating device 1 to absorb the heat of the heating device 1, the second fold is perpendicular to the housing 4 to save the amount of the heat conducting device 2 (heat pipe), and the third fold is connected to the housing 4 to better transfer the heat to the housing 4. Figure 2In the illustrated embodiment, the length of the first fold may vary according to the different lengths of the heating device 1.

[0031] When the heating device 1 is vertically arranged with respect to the outer housing 4, the shape of the heat conducting device 2 includes a second bending structure. As Figure 3 , 4 shown, the second bending structure includes a two-fold structure to form a heat conducting path in a parallel direction. Among them, the first fold is not only connected to the heating device 1 but also extends to the outer housing 4 so as to absorb the heat of the heating device and transfer it. The second fold is connected to the outer housing 4 so as to better transfer the heat to the outer housing.

[0032] When a plurality of the heating devices 1 are connected simultaneously, the shape of the heat conducting device 2 includes a third bending structure. As Figure 1 shown, the third bending structure is a five-fold structure to form a heat conducting path in a multi-branch direction. Among them, the first fold and the fifth fold are respectively connected to different heating devices 1 and are fully connected thereto, and the absorbed heat is respectively transferred to the second fold and the fourth fold heat conducting devices, and finally transferred to the outer housing 4 through the third fold.

[0033] It can be understood that in order to export the heat to the outer housing after connecting a plurality of heating devices, the bending structure of the heat conducting device in the present application can be adjusted accordingly to adapt to the spatial layout inside the inverter.

[0034] After the heat conducting device 2 is connected to the (high-voltage) power device, in order to avoid the short circuit between the heat conducting device 2 and the outer housing, a high-performance heat conducting insulating member 3 is added in the middle between the heat conducting device 2 and the outer housing 4 for blocking, which not only meets the heat conduction requirements but also avoids the occurrence of short circuit.

[0035] Specifically, when the heating device 1 includes a copper busbar, it is connected to the heat conducting device 2 by welding; since the copper busbar does not transmit electrical signals, the connection can be made more stable by welding. At the same time, if the other end of the heat conducting device 2 after welding is directly connected to the metal outer housing 4, it will cause a short circuit problem. Therefore, when the heat conducting device 2 is connected to the outer housing 4, a heat conducting insulating member 2 needs to be added and then fixedly connected to the outer housing 4. It can be understood that a heat conducting insulating member can also be added at each connection of the heat conducting device 2.

[0036] When the power device includes at least one of a circuit board, a chip, a resistor, and a diode, it is connected to the heat conducting device by crimping. Since the power device transmits electrical signals, direct welding will cause signal interference problems. Therefore, when the power device is connected to the heat conducting device 2, it needs to be isolated by a heat conducting insulating member. At the same time, a heat conducting insulating member can also be added when the heat conducting device 2 is connected to the outer housing 4, which can achieve a better insulating effect, prevent the interference of electrical signals, and at the same time can perform better heat transfer.

[0037] It can be understood that the cooling device in the present application can conduct the heat of the power devices inside the inverter to the surface of the housing, and through heat exchange between the housing and the external environment, conduct the heat of the power devices out, so that all components of the inverter maintain a stable operating temperature, while ensuring the strength and integrity of the inverter housing.

[0038] In some examples of the present application, the heat-conducting device is connected to the housing body in one of the following ways: welding, crimping, and fixing parts. Since the housing body has a good fixing effect, there can be various connection methods between it and the heat-conducting device. The heat-conducting device 2, such as a heat pipe, can be well fixed to the housing body 4 by welding; when a heat-conducting insulating part is arranged between the heat pipe and the housing body, crimping or fixing parts can also be used, such as fixing screws and fixing buckles, which are convenient for installation and disassembly. Of course, for more convenient operation, bonding can also be adopted.

[0039] In the present application, as Figure 4 described, it is difficult to directly connect the heat-conducting device to some power devices. Therefore, the heat-conducting device 2 can be connected to the circuit board 5 to indirectly conduct heat and cool the power devices. In addition, a large amount of heat is also generated during the operation of some circuit boards, resulting in temperature rise, so heat conduction and cooling are also required. The specific connection methods include but are not limited to welding, crimping, pressure welding, and connection through fixing parts.

[0040] It can be understood that this solution is to install a cooling device (including but not limited to heat pipes, heat sinks, etc.) on the power devices in the inverter through processes such as welding and crimping, reduce the temperature of the power devices in the inverter, effectively improve the performance of key components, and improve the power density and service life of the inverter.

[0041] In the present application, for other parts of the inverter, reference can be made to the prior art, and the present application will not elaborate.

[0042] The inverter of the present application can effectively solve the risk of inverter failure caused by excessive temperature rise of heat-generating devices such as power devices and copper bars in the inverter, can effectively reduce the temperature of power components or electrical connection devices such as copper bars, improve the performance of the inverter. At the same time, under the same conditions, the inverter using the cooling device can significantly improve its performance and power density, thereby reducing the development and maintenance costs.

[0043] It should be noted that in the description of the present application, terms such as "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, in the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more.

[0044] In this application, unless otherwise clearly specified or limited, terms such as "installed", "connected", "linked", "fixed", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection, an electrical connection, or communicable with each other; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0045] In this application, unless otherwise clearly specified or limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely means that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely means that the horizontal height of the first feature is less than that of the second feature.

[0046] Any process or method description shown in the flowchart or described in other ways herein can be understood as representing a module, segment, or part of the code including one or more executable instructions for implementing a specific logical function or process. And the scope of the preferred embodiments of this application includes additional implementations, where the functions may be executed in a substantially simultaneous manner or in a reverse order according to the involved functions, rather than in the order shown or discussed, which should be understood by those skilled in the technical field to which the embodiments of this application belong.

[0047] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0048] Although the embodiments of this application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting this application. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of this application.

Claims

1. An inverter with a cooling device, characterized in that, Comprising: A heating device and a housing. The heating device uses a cooling device as a medium to conduct the heat in the heating device to the housing, so as to reduce the temperature of the heating device in the inverter.

2. The inverter according to claim 1, wherein The cooling device includes a heat-conducting device, and the heat-conducting device connects the heating device and the housing.

3. The inverter according to claim 2, characterized in that, It further includes a heat-conducting insulating member, and the heat-conducting insulating member is disposed between the heat-conducting device and the housing, and / or between the heat-conducting device and the heating device.

4. The inverter according to claim 3, wherein, The heating device includes a busbar and a power device; When the heating device includes a busbar, the heat-conducting insulating member is disposed between the heat-conducting device and the inverter housing. When the heating device includes a power device, the heat-conducting insulating member is disposed between the heat-conducting device and the power device, and / or between the heat-conducting device and the inverter housing.

5. The inverter according to claim 3, characterized in that, When the heating device is disposed parallel to the housing, the shape of the heat-conducting device includes a first bending structure to form a heat-conducting path in the vertical direction through the first bending structure.

6. The inverter according to claim 3, wherein When the heating device is disposed perpendicular to the housing, the shape of the heat-conducting device includes a second bending structure to form a heat-conducting path in the parallel direction through the second bending structure.

7. The inverter according to claim 3, characterized in that, When connecting multiple heating devices simultaneously, the shape of the heat-conducting device includes a third bending structure to form a heat-conducting path in multiple branch directions through the third bending structure.

8. The inverter according to claim 4, wherein The power device includes at least one of a circuit board, a chip, a resistor, and a diode; When the heating device includes a busbar, it is connected to the heat-conducting device by welding. When the power device includes at least one of a circuit board, a chip, a resistor, and a diode, it is connected to the heat-conducting device by crimping.

9. The inverter according to claim 1, wherein The heat-conducting device is connected to the housing by one of the following methods: welding, crimping, and a fixing member.

10. The inverter according to claim 1, wherein The heat-conducting device includes a heat pipe.

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