Heat dissipation module and electronic equipment

Abstract

The utility model relates to a heat dissipation module and electronic equipment. The heat dissipation module comprises a circuit board which is provided with a first surface and a second surface which are oppositely arranged in the thickness direction; the first type of electronic components and the second type of electronic components are arranged on the first surface at intervals; the heat dissipation piece comprises a first heat dissipation part and a second heat dissipation part, and the orthographic projection of the first type electronic assembly on the plane where the first surface is located is overlapped with the orthographic projection of the first heat dissipation part on the plane where the first surface is located; the orthographic projection of the second type electronic assembly on the plane where the first surface is located is overlapped with the orthographic projection of the second heat dissipation part on the plane where the first surface is located, and at least one of the first heat dissipation part and the second heat dissipation part is electrically connected with a stable potential on the circuit board. Therefore, according to the heat dissipation module and the electronic equipment provided by the invention, the electromagnetic compatibility can be improved.

Description

Technical Field

[0001] This application relates to the field of new energy technologies, and particularly to a heat dissipation module and an electronic device. Background Art

[0002] With the rapid development of new energy technologies, solar energy has been widely applied to daily production and life due to its advantages such as pollution-free and sustainable utilization. Generally, the solar light energy can be converted into electrical energy through photovoltaic power generation technology. The direct current generated by the photovoltaic power generation technology is then converted into alternating current through a power conversion device, and this alternating current can become available electrical energy and be input into the power grid through a connector. However, the electromagnetic compatibility (EMC) of the above-mentioned power conversion device is poor. Summary of the Utility Model

[0003] Based on this, it is necessary to provide a heat dissipation module and an electronic device that can improve the electromagnetic compatibility of the heat dissipation module and the electronic device.

[0004] In a first aspect, an embodiment of the present application provides a heat dissipation module, including:

[0005] A circuit board having a first surface and a second surface disposed opposite to each other in the thickness direction;

[0006] A first type of electronic component and a second type of electronic component, which are spaced apart and disposed on the first surface;

[0007] A conductive heat dissipation member, the heat dissipation member includes a first heat dissipation portion and a second heat dissipation portion. The orthographic projection of the first type of electronic component on the plane where the first surface is located overlaps with the orthographic projection of the first heat dissipation portion on the plane where the first surface is located, and the orthographic projection of the second type of electronic component on the plane where the first surface is located overlaps with the orthographic projection of the second heat dissipation portion on the plane where the first surface is located. At least one of the first heat dissipation portion and the second heat dissipation portion is electrically connected to a stable potential on the circuit board.

[0008] In the heat dissipation module provided by the embodiment of the present application, at least one of the first heat dissipation portion and the second heat dissipation portion is electrically connected to a stable potential on the circuit board, which can ensure that at least one of the first heat dissipation portion and the second heat dissipation portion is fixed at a stable potential, thereby significantly reducing noise radiation to improve the electromagnetic compatibility of the heat dissipation module. In addition, high-frequency noise can be restricted in a low-impedance loop to further reduce noise radiation and improve the electromagnetic compatibility of the heat dissipation module.

[0009] In one of the embodiments, the heat dissipation module includes a noise reduction element, and the noise reduction element is electrically connected to the first heat dissipation portion and the second heat dissipation portion.

[0010] In one of the embodiments, the first heat dissipation portion and the second heat dissipation portion are arranged at intervals.

[0011] In one embodiment, the first heat dissipation part and the second heat dissipation part are of an integral structure, and the orthographic projection of the circuit board on the plane where the first surface is located is located within the orthographic projection of the heat dissipation member on the plane where the first surface is located.

[0012] In one embodiment, the noise reduction element is arranged on the first surface and is spaced between the first type of electronic component and the second type of electronic component.

[0013] In one embodiment, the noise reduction element is arranged on the second surface.

[0014] In one embodiment, there are multiple noise reduction elements, and each noise reduction element is electrically connected to both the first heat dissipation part and the second heat dissipation part.

[0015] In one embodiment, the heat dissipation module includes a first conductive member and a second conductive member. One end of the first conductive member is connected to one end of the noise reduction element, the other end of the first conductive member is threadedly connected to the first heat dissipation part, one end of the second conductive member is connected to the other end of the noise reduction element, and the other end of the second conductive member is threadedly connected to the second heat dissipation part.

[0016] In one embodiment, the noise reduction element includes an inductor or a capacitor;

[0017] And / or, one of the first type of electronic component and the second type of electronic component is located on the DC side circuit, and the other is located on the AC side circuit;

[0018] And / or, the material of at least one of the first heat dissipation part and the second heat dissipation part includes a metal material;

[0019] And / or, a thermal conductive adhesive is provided between at least one of the first heat dissipation part and the second heat dissipation part and the circuit board.

[0020] In a second aspect, an embodiment of the present application provides an electronic device, including: a housing and the heat dissipation module in the first aspect above, and the heat dissipation module is located in the housing.

[0021] For the electronic device provided by the embodiment of the present application, including the heat dissipation module, at least one of the first heat dissipation part and the second heat dissipation part is electrically connected to the stable potential on the circuit board, which can ensure that at least one of the first heat dissipation part and the second heat dissipation part is fixed at a stable potential, thereby significantly reducing noise radiation to improve the electromagnetic compatibility of the heat dissipation module. In addition, high-frequency noise can be restricted in a low-impedance loop to further reduce noise radiation and improve the electromagnetic compatibility of the heat dissipation module. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic structural diagram of the heat dissipation module provided by the embodiment of the present application.

[0023] Figure 2Another structural schematic diagram of the heat dissipation module provided by the embodiment of the present application.

[0024] Figure 3 Another structural schematic diagram of the heat dissipation module provided by the embodiment of the present application.

[0025] Figure 4 A cross-sectional view of the heat dissipation module provided by the embodiment of the present application.

[0026] Figure 5 Another cross-sectional view of the heat dissipation module provided by the embodiment of the present application.

[0027] Figure 6 A top view of the heat dissipation component provided by the embodiment of the present application.

[0028] Explanation of reference numerals:

[0029] 100, heat dissipation module; 110, first type of electronic component; 120, second type of electronic component; 130, circuit board; 131, first surface; 132, second surface; 140, heat dissipation component; 141, first heat dissipation part; 142, second heat dissipation part; 150, noise reduction element; 161, first conductive part; 162, second conductive part; 170, stable potential; 180, connection hole; 181, first connection hole; 182, second connection hole; 183, third connection hole; 184, fourth connection hole. Detailed implementation manners

[0030] To make the above objects, features, and advantages of the present application more obvious and understandable, the following will describe the detailed implementation manners of the present application with reference to the accompanying drawings. Many specific details are set forth in the following description to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0031] In the description of the present application, it should be understood that if there are terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0032] In addition, if the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0033] In this application, unless otherwise clearly specified and defined, if terms such as "installed", "connected", "joined", "fixed", etc. appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0034] In this application, unless otherwise clearly specified and defined, if there is a description such as a first feature being "on" or "under" a second feature, its meaning can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature can mean that the first feature is directly above or obliquely above the second feature, or simply indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or simply indicates that the first feature has a lower horizontal height than the second feature.

[0035] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there can also be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. If so, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in this application are only for the purpose of illustration and do not represent the only implementation.

[0036] In the related art, a heat dissipation module may include a circuit board, a DC-side circuit, an AC-side circuit and a metal heat dissipation plate. The DC-side circuit and the AC-side circuit are disposed on one side in the thickness direction of the circuit board, and the metal heat dissipation plate is disposed on the other side in the thickness direction of the circuit board. The DC-side circuit and the AC-side circuit both overlap with the metal heat dissipation plate in the thickness direction of the circuit board so that the metal heat dissipation plate can dissipate heat from both the DC-side circuit and the AC-side circuit.

[0037] However, both the DC-side circuit and the AC-side circuit overlap with the metal heat sink in the thickness direction of the circuit board. An obvious parasitic capacitance will be formed between the circuit board and the metal heat sink. The dynamic potential (potential jump, dv / dt) generated by the power semiconductor devices in the DC-side circuit and the AC-side circuit during high-frequency operation will cause the potential jump of the metal heat sink through the above parasitic capacitance, and then serious noise will be generated. In addition, due to the large area of the metal heat sink, it is difficult to suppress the noise path, resulting in serious electromagnetic radiation problems in the overall heat dissipation module, and the electromagnetic compatibility of the heat dissipation module is poor.

[0038] To solve the above problems, the embodiments of the present application provide a heat dissipation module and an electronic device, which can reduce the electromagnetic radiation generated by the heat dissipation module and the electronic device to the outside world, so as to improve the electromagnetic compatibility of the heat dissipation module.

[0039] The following will be combined with Figures 1-6 to describe the electronic device provided by the embodiments of the present application.

[0040] The embodiments of the present application provide an electronic device, which can be a power converter or other electronic devices.

[0041] Exemplarily, the electronic device may include a housing and a heat dissipation module 100. At least a part of the heat dissipation module 100 can be located in the housing, and the housing can protect the heat dissipation module 100.

[0042] The following will describe the heat dissipation module 100 provided by the embodiments of the present application

[0043] Referring to Figure 1 , the heat dissipation module 100 may include a circuit board 130, a first type of electronic component 110, and a second type of electronic component 120. The circuit board 130 has a first surface 131 and a second surface 132 that are oppositely arranged in the thickness direction (i.e., Figure 1 the direction Z in ), and the first type of electronic component 110 and the second type of electronic component 120 can be arranged on the first surface 131 at intervals.

[0044] Referring to Figure 1 , the heat dissipation module 100 includes a conductive heat dissipation member 140. The heat dissipation member 140 includes a first heat dissipation portion 141 and a second heat dissipation portion 142. The orthographic projection of the first type of electronic component 110 on the plane where the first surface 131 is located overlaps with the orthographic projection of the first heat dissipation portion 141 on the plane where the first surface 131 is located. The first heat dissipation portion 141 can be used to dissipate heat from the first type of electronic component 110. The orthographic projection of the second type of electronic component 120 on the plane where the first surface 131 is located overlaps with the orthographic projection of the second heat dissipation portion 142 on the plane where the first surface 131 is located. The second heat dissipation portion 142 can be used to dissipate heat from the second type of electronic component 120.

[0045] Compared with only setting one of the first heat dissipation part 141 and the second heat dissipation part 142, in the embodiment of the present application, both the first heat dissipation part 141 and the second heat dissipation part 142 are set, which is beneficial to increasing the area of the heat dissipation part 140, and further improving the heat dissipation effect of the heat dissipation part 140.

[0046] Among them, the parasitic capacitance between the first heat dissipation part 141 and the first type of electronic component 110 is the first parasitic capacitance C1, and the parasitic capacitance between the second heat dissipation part 142 and the second type of electronic component 120 is the second parasitic capacitance C2.

[0047] See Figure 1 , at least one of the first heat dissipation part 141 and the second heat dissipation part 142 is electrically connected to the stable potential 170 on the circuit board 130. For example, when the first heat dissipation part 141 is electrically connected to the stable potential 170 on the circuit board 130, it can ensure that the first heat dissipation part 141 is fixed at a stable potential 170, thereby significantly reducing noise radiation to improve the electromagnetic compatibility of the heat dissipation module 100. In addition, the first heat dissipation part 141, the stable potential 170 on the circuit board 130, and the first parasitic capacitance C1 together form a low-impedance loop L1, so that high-frequency noise can be restricted in the loop L1, further reducing noise radiation to improve the electromagnetic compatibility of the heat dissipation module 100.

[0048] Or, when the second heat dissipation part 142 is electrically connected to the stable potential 170 on the circuit board 130, it can ensure that the second heat dissipation part 142 is fixed at a stable potential 170, thereby significantly reducing noise radiation to improve the electromagnetic compatibility of the heat dissipation module 100. In addition, the second heat dissipation part 142, the stable potential 170 on the circuit board 130, and the second parasitic capacitance C2 together form a low-impedance loop L2 as shown in Figure 2 , so that high-frequency noise can be restricted in the loop L2, further reducing noise radiation to improve the electromagnetic compatibility of the heat dissipation module 100.

[0049] Or, when both the first heat dissipation part 141 and the second heat dissipation part 142 are electrically connected to the stable potential 170 on the circuit board 130, it can ensure that the first heat dissipation part 141 and the second heat dissipation part 142 are fixed at a stable potential 170, thereby significantly reducing noise radiation to improve the electromagnetic compatibility of the heat dissipation module 100. In addition, high-frequency noise can also be restricted in the loops L3 and L4 as shown in Figure 3 , further reducing noise radiation to improve the electromagnetic compatibility of the heat dissipation module 100.

[0050] In the embodiment of the present application, the case where both the first heat dissipation part 141 and the second heat dissipation part 142 are electrically connected to the stable potential 170 on the circuit board 130 is taken as an example for illustration.

[0051] Exemplarily, the stable potential 170 can be provided by the ground point or the negative electrode of the DC-side circuit.

[0052] In some embodiments, referring to Figure 2 , the heat dissipation module 100 includes a noise reduction element 150, and the noise reduction element 150 is electrically connected to the first heat dissipation part 141 and the second heat dissipation part 142. Thus, after both the first heat dissipation part 141 and the second heat dissipation part 142 are connected to the stable potential 170 on the circuit board 130, they are then connected through the noise reduction element 150 to provide a low-impedance loop for high-frequency noise, thereby reducing noise radiation and improving the electromagnetic compatibility of the heat dissipation module 100.

[0053] Exemplarily, one of the first type of electronic components 110 and the second type of electronic components 120 is located on the DC-side circuit, and the other is located on the AC-side circuit.

[0054] Exemplarily, one of the first type of electronic components 110 and the second type of electronic components 120 can be used to form a high-voltage circuit, and the other of the first type of electronic components 110 and the second type of electronic components 120 can be used to form a low-voltage circuit. Electrical isolation between the high-voltage circuit and the low-voltage circuit can be achieved by using an isolation transformer to meet the safety specification requirements. Taking the first heat dissipation part 141 dissipating heat from the high-voltage circuit and the second heat dissipation part 142 dissipating heat from the low-voltage circuit as an example, when the first heat dissipation part 141 and the second heat dissipation part 142 are connected to the stable potential 170, there is usually a potential difference between the first heat dissipation part 141 and the second heat dissipation part 142. By setting the noise reduction element 150, a low-impedance loop can be provided for high-frequency signals, and at the same time, the potential difference between the first heat dissipation part 141 and the second heat dissipation part 142 and the safety regulation isolation requirements can be solved.

[0055] Exemplarily, the noise reduction element 150 can be a passive device. For example, the noise reduction element 150 includes an inductor or a capacitor (such as a high-voltage safety capacitor).

[0056] In some embodiments, referring to Figure 2 , the first heat dissipation part 141 and the second heat dissipation part 142 are arranged at intervals. The first heat dissipation part 141 and the second heat dissipation part 142 are two independent structures, and there is a spacing between the first heat dissipation part 141 and the second heat dissipation part 142. On the plane where the first heat dissipation part 141 and the second heat dissipation part 142 are located, the first heat dissipation part 141 and the second heat dissipation part 142 are not electrically connected. In this way, the first heat dissipation part 141 and the second heat dissipation part 142 are two independent heat dissipation parts, which is beneficial to reducing the mutual interference between the first type of electronic components 110 and the second type of electronic components 120 generated through the heat dissipation member 140.

[0057] In other embodiments, referring to Figure 3The first heat dissipation part 141 and the second heat dissipation part 142 are an integrated structure. The first heat dissipation part 141 and the second heat dissipation part 142 can be formed in an integrated molding manner. The first heat dissipation part 141 and the second heat dissipation part 142 can be completed by a single processing, and there is no need to perform more than two processing. The orthographic projection of the circuit board 130 on the plane where the first surface 131 is located is located within the orthographic projection of the heat sink 140 on the plane where the first surface 131 is located. The area of the heat sink 140 is greater than or equal to the area of the circuit board 130, so that the heat sink 140 completely covers the circuit board 130, and the heat sink 140 can dissipate heat at all places of the circuit board 130. In this way, it is beneficial to increase the setting area of the heat sink 140, and it is beneficial to improve the heat dissipation effect of the heat sink 140. In addition, it can also simplify the preparation process of the first heat dissipation part 141 and the second heat dissipation part 142.

[0058] In some embodiments, see Figure 4 , the noise reduction element 150 is disposed on the first surface 131, and the noise reduction element 150 is disposed at intervals between the first type electronic component 110 and the second type electronic component 120, and there is a gap between the first type electronic component 110 and the second type electronic component 120 and the noise reduction element 150. When the first type electronic component 110 and / or the second type electronic component 120 includes a plurality of electronic components, there may be a gap between the plurality of electronic components and the noise reduction element 150. In this way, by disposing the noise reduction element 150 on the first surface 131, it is convenient to process the noise reduction element 150 and the circuit board 130 together, which is conducive to improving the processing convenience.

[0059] In some embodiments, see Figure 5 The noise reduction element 150 is disposed on the second surface 132 , thereby preventing the noise reduction element 150 from affecting the layout of the first type electronic component 110 and the second type electronic component 120 on the first surface 131 , reducing the number of devices on the first surface 131 , and facilitating reducing the area of the circuit board 130 .

[0060] Exemplarily, the noise reduction element 150 may be at least one, for example, the noise reduction element 150 may be 1, 2, 3 or any number greater than 3. When there are multiple noise reduction elements 150, each noise reduction element 150 may be electrically connected to the first heat dissipation portion 141 and the second heat dissipation portion 142. In this way, by increasing the number of noise reduction elements 150, noise radiation can be better reduced and the electromagnetic compatibility of the heat dissipation module 100 can be better improved.

[0061] In some embodiments, see Figure 4 and Figure 5, the heat dissipation module 100 may include a first conductive member 161 and a second conductive member 162 correspondingly arranged with the noise reduction element 150. In the embodiments of the present application, the A structure and the B structure are correspondingly arranged. Taking the A structure as the noise reduction element 150 and the B structure as the first conductive member 161 as an example, the corresponding arrangement of the noise reduction element 150 and the first conductive member 161 may mean that at least one first conductive member 161 is correspondingly arranged with one noise reduction element 150, or at least one noise reduction element 150 may be correspondingly arranged with one first conductive member 161. In the embodiments of the present application, it is taken as an example that one noise reduction element 150 may be correspondingly arranged with one first conductive member 161 and one second conductive member 162. One end of the first conductive member 161 is connected to one end of the corresponding noise reduction element 150, and the other end of the first conductive member 161 is threadedly connected to the first heat dissipation part 141. The first conductive member 161 is used for electrically connecting the first heat dissipation part 141 and the noise reduction element 150, so that the connection between the first heat dissipation part 141 and the noise reduction element 150 is relatively simple, which is beneficial to cost reduction. One end of the second conductive member 162 is connected to the other end of the corresponding noise reduction element 150, and the other end of the second conductive member 162 is threadedly connected to the second heat dissipation part 142. The second conductive member 162 is used for electrically connecting the second heat dissipation part 142 and the noise reduction element 150, so that the connection between the second heat dissipation part 142 and the noise reduction element 150 is relatively simple, which is beneficial to cost reduction.

[0062] Exemplarily, referring to Figure 4 , connection holes 180 are provided on both the first heat dissipation part 141 and the second heat dissipation part 142. The inner wall of the connection hole 180 has internal threads, and the outer walls of the first conductive member 161 and the second conductive member 162 have external threads. The first conductive member 161 is inserted into the connection hole 180 of the first heat dissipation part 141, and the second conductive member 162 is inserted into the connection hole 180 of the second heat dissipation part 142.

[0063] For example, the first conductive member 161 and the second conductive member 162 may include bolts, and the noise reduction element 150 can be fixed on the first heat dissipation part 141 and the second heat dissipation part 142 by screwing the bolts.

[0064] For example, the connection hole 180 may be a blind hole or a through hole.

[0065] Taking the number of noise reduction elements 150 as two as an example, referring to Figure 6 , two connection holes 180 (i.e., the first connection hole 181 and the second connection hole 182) are provided on the first heat dissipation part 141, and two connection holes 180 (i.e., the third connection hole 183 and the fourth connection hole 184) are provided on the second heat dissipation part 142. One noise reduction element 150 is connected between the first connection hole 181 and the third connection hole 183, and another noise reduction element 150 is connected between the second connection hole 182 and the fourth connection hole 184.

[0066] Exemplarily, the material of at least one of the first heat dissipation part 141 and the second heat dissipation part 142 is a metal material, and the metal material has a good heat dissipation effect and can form a good protection for the circuit board 130.

[0067] Exemplarily, a thermal conductive adhesive is provided between at least one of the first heat dissipation part 141 and the second heat dissipation part 142 and the circuit board 130, and at least one of the first heat dissipation part 141 and the second heat dissipation part 142 is closely attached to the circuit board 130 through the thermal conductive adhesive, which is beneficial to improving the heat conduction efficiency between at least one of the first heat dissipation part 141 and the second heat dissipation part 142 and the circuit board 130 and improving the heat dissipation effect.

[0068] The technical features of the above embodiments can be combined arbitrarily. For the sake of concise description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0069] The above embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation to the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.

Claims

1. A heat dissipation module, characterized in that, Comprising: A circuit board having a first surface and a second surface oppositely disposed in the thickness direction; A first type of electronic component and a second type of electronic component, which are spaced apart and disposed on the first surface; A conductive heat sink, the heat sink including a first heat dissipation portion and a second heat dissipation portion, a positive projection of the first type of electronic component on the plane where the first surface is located overlaps with a positive projection of the first heat dissipation portion on the plane where the first surface is located, a positive projection of the second type of electronic component on the plane where the first surface is located overlaps with a positive projection of the second heat dissipation portion on the plane where the first surface is located, and at least one of the first heat dissipation portion and the second heat dissipation portion is electrically connected to a stable potential on the circuit board.

2. The heat dissipation module according to claim 1, wherein The heat dissipation module includes a noise reduction element, and the noise reduction element is electrically connected to the first heat dissipation portion and the second heat dissipation portion.

3. The heat dissipation module according to claim 2, characterized in that, The first heat dissipation portion and the second heat dissipation portion are arranged at intervals.

4. The heat dissipation module according to claim 2, wherein The first heat dissipation portion and the second heat dissipation portion are of an integral structure, and a positive projection of the circuit board on the plane where the first surface is located is located within a positive projection of the heat sink on the plane where the first surface is located.

5. The heat dissipation module according to any one of claims 2-4, characterized in that, The noise reduction element is disposed on the first surface and is spaced apart from the first type of electronic component and the second type of electronic component.

6. The heat dissipation module according to any one of claims 2-4, characterized in that, The noise reduction element is disposed on the second surface.

7. The heat dissipation module according to any one of claims 2-4, characterized in that The noise reduction elements are multiple, and each noise reduction element is electrically connected to the first heat dissipation portion and the second heat dissipation portion.

8. The heat dissipation module according to any one of claims 2-4, characterized in that, The heat dissipation module includes a first conductive member and a second conductive member. One end of the first conductive member is connected to one end of the noise reduction element, the other end of the first conductive member is threadedly connected to the first heat dissipation portion, one end of the second conductive member is connected to the other end of the noise reduction element, and the other end of the second conductive member is threadedly connected to the second heat dissipation portion.

9. The heat dissipation module according to any one of claims 2-4, characterized in that The noise reduction element includes an inductor or a capacitor; And / or, one of the first type of electronic component and the second type of electronic component is located in a DC side circuit, and the other is located in an AC side circuit; And / or, at least one of the first heat dissipation portion and the second heat dissipation portion is made of a metal material; And / or, a thermal conductive adhesive is provided between at least one of the first heat dissipation portion and the second heat dissipation portion and the circuit board.

10. An electronic device, characterized in that, Comprising: a housing and the heat dissipation module according to any one of claims 1-9, and the heat dissipation module is located in the housing.

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