Inverter and energy storage system

Abstract

The utility model provides an inverter and an energy storage system. The inverter comprises a housing; the circuit board is arranged in the shell; the power module is arranged on the circuit board and is electrically connected with the circuit board; the heat conduction layer is arranged on the side, away from the power module, of the circuit board and used for conducting heat exchange with the circuit board, and at least one part of the heat conduction layer comprises a graphene film layer. When heat generated by the power module and the circuit board is transferred to the graphene film layer, the heat is quickly transferred in the direction perpendicular to the thickness direction of the graphene film layer and is dispersed to the periphery of the graphene film layer, so that the situation that the heat is concentrated in the area where the power module is located and cannot be effectively dissipated, and consequently the power module is too high in temperature rise and fails is avoided; the overall temperature of the graphene film layer is roughly the same, the purpose of rapidly balancing heat generated by the power module is achieved, the heat dissipation requirement of a high-power and high-heat-consumption inverter is met, the service life of the inverter is prolonged, and the reliability of the inverter is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of household energy storage appliances, and in particular to an inverter and an energy storage system. Background Art

[0002] At present, the inverter in the related art generally uses a ceramic gasket to transfer the heat generated by an IGBT (Insulated Gate Bipolar Transistor) to a heat sink for heat dissipation.

[0003] Since the IGBT itself is relatively small, that is, a small area of heat source on a single side is in contact with the heat sink for heat dissipation, the heat dissipation effect is poor. If the heat dissipation demand is to be met, the size of the heat sink must be increased to increase the heat exchange area. However, increasing the size of the heat sink will increase the weight of the inverter and reduce the reliability of the inverter. Utility Model Content

[0004] The embodiments of the utility model are intended to solve at least one of the technical problems existing in the prior art.

[0005] To this end, a first aspect of an embodiment of the present utility model provides an inverter.

[0006] A second aspect of the embodiments of the present utility model provides an energy storage system.

[0007] In view of this, according to the first aspect of an embodiment of the utility model, an inverter is provided, the inverter comprising: a shell; a circuit board, arranged in the shell; a power module, arranged on the circuit board and electrically connected to the circuit board; a thermal conductive layer, arranged on a side of the circuit board away from the power module, for heat exchange with the circuit board, at least a portion of the thermal conductive layer comprising a graphene film layer.

[0008] The inverter provided by the embodiment of the utility model includes a housing, a circuit board, a power module and a heat-conducting layer. Specifically, the power module is arranged on the circuit board, and the power module is electrically connected to the circuit board. Optionally, the power module includes a transistor. Since the power module is directly fixed on the circuit board, compared with the related art of welding the power module on the circuit board using a fixing fixture, it is beneficial to reduce the number of parts, thereby being able to reduce production costs while improving installation efficiency.

[0009] It is understandable that during the operation of the inverter, the power module and the circuit board will generate heat. Under certain working conditions, the power and heat consumption of the power module will be very high, causing the heat in a single area of the power module to increase rapidly and the temperature of the power module to rise rapidly. If the heat dissipation is not timely or the heat dissipation effect is poor, it may easily lead to power module failure or circuit board failure.

[0010] The heat-conducting layer is disposed on the side of the circuit board facing away from the power module, that is, the heat-conducting layer is disposed on the back side of the circuit board, and at least a part of the heat-conducting layer includes a graphene film layer. It can be understood that the graphene film layer has characteristics such as high thermal conductivity, low temperature rise, good flexibility, high adhesion, and not easy to break. Among them, the lateral thermal conductivity of the graphene film layer can reach 1900 W / (m·k), that is, the graphene film layer has a relatively high thermal conductivity in the direction perpendicular to the thickness direction of the graphene film layer.

[0011] When the heat generated by the power module and the circuit board is transferred to the graphene film layer, the heat is quickly transferred in the direction perpendicular to the thickness direction of the graphene film layer and dispersed to the surrounding of the graphene film layer, avoiding the heat being concentrated in the area where the power module is located and unable to be effectively dissipated, which may lead to the situation that the temperature rise of the power module is too high and fails. This makes the overall temperature of the graphene film layer roughly the same, achieving the purpose of quickly balancing the heat generated by the power module, meeting the heat dissipation requirements of high-power and high-heat-consumption inverters, being beneficial to extending the service life of the inverter, and improving the reliability of the inverter.

[0012] In addition, it can be understood that during the use of the inverter, it is generally installed and fixed by hanging on the wall or stacking. By using the heat-conducting layer with at least a part being a graphene film layer to dissipate heat from the power module, compared with increasing the size of the radiator to meet the heat dissipation requirements in the related art, it is beneficial to reduce the overall weight of the inverter, make the product lightweight while meeting the heat dissipation requirements, and further improve the reliability of the inverter.

[0013] Optionally, the entire heat-conducting layer is a graphene film layer. Or, the heat-conducting layer includes a heat-conducting film layer and a graphene film layer, the heat-conducting film layer is located between the circuit board and the graphene film layer, or the graphene film layer is located between the heat-conducting film layer and the circuit board. It can be specifically set according to actual needs.

[0014] Optionally, the density of the graphene film layer is 0.7 g / cm 3 ~2.1 g / cm 3 。

[0015] Optionally, the density of the graphene film layer is 1.7 g / cm 3 ~2.0 g / cm 3 。

[0016] Optionally, the lateral thermal conductivity of the graphene film layer is less than or equal to 1900 W / (m·k). Optionally, the lateral thermal conductivity of the graphene film layer is between 1100 W / (m·k) and 1600 W / (m·k), the longitudinal thermal conductivity is 10 W / (m·k), and it can withstand high temperatures up to 400 °C, the flame retardant grade is V0, it has relatively high flexibility, and the number of bending times is greater than 10000 times and does not break.

[0017] In addition, the inverter provided by the above technical solution of the present utility model further has the following additional technical features:

[0018] In some technical solutions, optionally, the side surface of the circuit board facing away from the power module is attached to the heat conduction layer.

[0019] In this technical solution, it is defined that the side surface of the circuit board facing away from the power module is attached to the heat conduction layer, so that the heat generated by the power module and the circuit board can be transferred to the graphene film layer as much as possible, significantly improving the heat exchange efficiency.

[0020] Since when the heat generated by the power module and the circuit board is transferred to the graphene film layer, the heat is quickly transferred in the thickness direction perpendicular to the graphene film layer and dispersed to the periphery of the graphene film layer, avoiding the heat being concentrated in the area where the power module is located and unable to be effectively dissipated, which may lead to the situation that the temperature rise of the power module is too high and it fails. This makes the temperature of the entire graphene film layer roughly the same, achieving the purpose of quickly balancing the heat generated by the power module and meeting the heat dissipation requirements of high-power and high-heat-consumption inverters.

[0021] In some technical solutions, optionally, the inverter further includes a heat dissipation component, which is arranged on the outer side of the housing and at least partially opposite to the heat conduction layer.

[0022] In this technical solution, it is defined that the inverter further includes a heat dissipation component. Specifically, the heat dissipation component is arranged on the outer side of the housing, and at least a part of the heat dissipation component is opposite to the heat conduction layer.

[0023] Specifically, when the heat generated by the power module and the circuit board is transferred to the graphene film layer, the heat is quickly transferred in the thickness direction perpendicular to the graphene film layer and dispersed to the periphery of the graphene film layer, and then transferred from the graphene film layer to the heat dissipation component. The heat dissipation component exchanges heat with the external environment due to the heat rise it receives to achieve heat dissipation. While avoiding the heat being concentrated in the area where the power module is located and unable to be effectively dissipated, which may lead to the situation that the temperature rise of the power module is too high and it fails, the heat dissipation efficiency is improved, and further the purpose of quickly balancing the heat generated by the power module is achieved, meeting the heat dissipation requirements of high-power and high-heat-consumption inverters, and improving the stability and reliability of the inverter.

[0024] In some technical solutions, optionally, the housing is provided with an avoidance opening, and at least a part of the heat conduction layer and at least a part of the heat dissipation component are respectively located on both sides of the avoidance opening.

[0025] In this technical solution, it is defined that the housing is further provided with an avoidance opening. Specifically, at least a part of the heat conduction layer and at least a part of the heat dissipation component are respectively located on both sides of the avoidance opening. That is to say, when the heat generated by the power module and the circuit board is transferred to the heat conduction layer, the heat is directly transferred to the heat dissipation component through the avoidance opening, which is beneficial to further improving the heat transfer efficiency and the heat dissipation effect.

[0026] In some technical solutions, optionally, at least part of the heat conduction layer is attached to the heat dissipation component through an avoidance opening.

[0027] In this technical solution, it is defined that at least part of the heat conduction layer is attached to the heat dissipation component through an avoidance opening, so that the heat transferred to the heat conduction layer can be transferred to the heat dissipation component as much as possible. Through the heat exchange between the heat dissipation component and the external environment, rapid heat dissipation is achieved, which is beneficial to further improving the heat exchange efficiency, thereby enhancing the heat dissipation effect, meeting the heat dissipation requirements of high-power and high-heat-consumption inverters, and enhancing the product competitiveness.

[0028] In some technical solutions, optionally, the heat dissipation component further includes a substrate and a plurality of fins. The substrate is arranged on the outer side of the housing. The first end of each fin is connected to the side of the substrate facing away from the housing, and the second end of each fin extends in a direction away from the substrate; wherein, the extension length L of at least one fin satisfies 40mm ≤ L ≤ 50mm.

[0029] In this technical solution, it is defined that the heat dissipation component further includes a substrate and a plurality of fins. Specifically, the substrate is connected to the outer wall of the housing, and the plurality of fins are arranged at intervals on the side of the substrate facing away from the housing, and the second end of each fin extends in a direction away from the substrate, so as to increase the heat exchange area between the heat dissipation component and the external environment, which is beneficial to further improving the heat exchange effect, quickly balancing the heat generated by the power module, meeting the heat dissipation requirements of high-power and high-heat-consumption inverters, and enhancing the stability and reliability of the inverter.

[0030] For the inverter in the related technology to meet the heat dissipation requirements, the fin height of the radiator is generally about 70mm. Using a heat conduction layer with at least part being a graphene film layer for heat transfer between the power module and the heat dissipation component, while meeting the heat dissipation requirements of high-power and high-heat-consumption inverters, the extension length of the fins can be correspondingly reduced, that is, the extension length of at least one fin is between 40mm and 50mm, which is beneficial to reducing the production cost of the inverter. At the same time, it can also reduce the overall weight of the inverter, make the product lightweight, and further enhance the reliability and product competitiveness of the inverter.

[0031] Optionally, the thickness of the substrate is about 10mm.

[0032] In some technical solutions, optionally, the substrate includes an aluminum substrate; and / or at least one fin includes an aluminum fin.

[0033] In this technical solution, the substrate includes an aluminum substrate, that is to say, the substrate is made of metal aluminum, so as to ensure the heat dissipation effect while being beneficial to further reducing the weight of the whole machine and enhancing the stability and reliability of the inverter.

[0034] At least one fin includes an aluminum fin, that is to say, at least one fin is made of metallic aluminum, so as to ensure the heat dissipation effect while being conducive to further reducing the weight of the whole machine and improving the stability and reliability of the inverter.

[0035] In some technical solutions, optionally, the cross-sectional area of the heat conducting layer in the direction perpendicular to its thickness is greater than or equal to the area of the side of the circuit board facing away from the power module.

[0036] In this technical solution, it is defined that the cross-sectional area of the heat conducting layer in the direction perpendicular to its thickness is greater than or equal to the area of the side of the circuit board facing away from the power module, that is, the cross-sectional area of the heat conducting layer is increased, so as to increase the contact area between the heat conducting layer and the circuit board, enabling the heat generated by the power module and the circuit board to be transferred to the heat conducting layer as much as possible, and improving the heat exchange efficiency.

[0037] Moreover, the heat quickly spreads in the direction perpendicular to the thickness of the graphene film layer and is dispersed to the periphery of the graphene film layer, preventing the heat from concentrating in the area where the power module is located and being unable to dissipate effectively, which may otherwise cause the temperature of the power module to rise too high and lead to failure, meeting the heat dissipation requirements of high-power and high-heat-consumption inverters.

[0038] In some technical solutions, optionally, the thickness d of the graphene film layer satisfies 12μm ≤ d ≤ 100μm.

[0039] In this technical solution, the value range of the thickness of the graphene film layer is defined. Specifically, the thickness of the graphene film layer is between 12μm and 100μm, ensuring the heat dissipation effect and meeting the heat dissipation requirements of high-power and high-heat-consumption inverters.

[0040] Moreover, by using the heat conducting layer at least partially composed of the graphene film layer to dissipate heat from the power module, compared with the related art that meets the heat dissipation requirements by increasing the size of the radiator, it is beneficial to reduce the overall weight of the inverter, make the product lightweight while meeting the heat dissipation requirements, and further improve the reliability of the inverter.

[0041] According to the second aspect of the present invention, there is provided an energy storage system including the inverter provided in any of the above technical solutions, thus having all the beneficial technical effects of this inverter, which will not be elaborated herein.

[0042] The additional aspects and advantages of the present invention will be given in the following description section, some of which will become obvious from the following description, or can be understood through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The above and / or additional aspects and advantages of the present invention will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, wherein:

[0044] Figure 1 FIG. 2 shows a partial structural schematic diagram of an inverter according to an embodiment of the present invention;

[0045] Figure 2 FIG. 3 shows a partial exploded view of an inverter according to an embodiment of the present invention.

[0046] Wherein, Figure 1 and Figure 2 the corresponding relationship between the reference numerals and the component names in the figures is as follows:

[0047] 100 inverter, 110 housing, 111 avoidance opening, 120 circuit board, 130 power module, 140 heat conduction layer, 141 graphene film layer, 150 heat dissipation component, 151 substrate, 152 fin. Detailed implementation manners

[0048] In order to more clearly understand the above objects, features and advantages of the present invention, the present invention will be further described in detail below with reference to the drawings and specific implementation manners. It should be noted that, without conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

[0049] Many specific details are set forth in the following description in order to fully understand the present invention. However, the present invention may be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited by the specific embodiments disclosed below.

[0050] Next, refer to Figure 1 and Figure 2 to describe an inverter 100 and an energy storage system provided according to some embodiments of the present invention.

[0051] In an embodiment according to the present application, as Figure 1 and Figure 2 shown, an inverter 100 is proposed. The inverter 100 includes: a housing 110; a circuit board 120 disposed within the housing 110; a power module 130 disposed on the circuit board 120 and electrically connected to the circuit board 120; a heat conduction layer 140 disposed on a side of the circuit board 120 facing away from the power module 130 for performing heat exchange with the circuit board 120, and at least a part of the heat conduction layer 140 includes a graphene film layer 141.

[0052] The inverter 100 provided by an embodiment of the present utility model includes a housing 110, a circuit board 120, a power module 130, and a heat-conducting layer 140. Specifically, the power module 130 is disposed on the circuit board 120, and the power module 130 is electrically connected to the circuit board 120. Optionally, the power module 130 includes transistors. Since the power module 130 is directly fixed on the circuit board 120, compared with the related art in which the power module is soldered to the circuit board by using a fixing tooling, it is beneficial to reduce the number of components, thereby being able to reduce production costs while improving the installation efficiency.

[0053] It can be understood that during the operation of the inverter 100, the power module 130 and the circuit board 120 will generate heat. Under individual working conditions, the power and heat dissipation of the power module 130 will be very high, causing the heat in a single area of the power module 130 to increase rapidly, and the temperature of the power module 130 to rise rapidly. If the heat dissipation is not timely or the heat dissipation effect is poor, it is easy to cause the power module 130 to fail or the circuit board 120 to malfunction.

[0054] The heat-conducting layer 140 is disposed on the side of the circuit board 120 facing away from the power module 130, that is, the heat-conducting layer 140 is disposed on the back side of the circuit board 120, and at least part of the heat-conducting layer 140 includes a graphene film layer 141. It can be understood that the graphene film layer 141 has characteristics such as high thermal conductivity, low temperature rise, good flexibility, high adhesion, and not easy to break. Among them, the lateral thermal conductivity of the graphene film layer 141 can reach 1900 W / (m·k), that is, the graphene film layer 141 has a high thermal conductivity in the direction perpendicular to the thickness of the graphene film layer 141.

[0055] When the heat generated by the power module 130 and the circuit board 120 is transferred to the graphene film layer 141, the heat is rapidly transferred in the direction perpendicular to the thickness of the graphene film layer 141 and dispersed to the surrounding of the graphene film layer 141, avoiding the heat being concentrated in the area where the power module 130 is located and unable to be effectively dissipated, thereby causing the temperature rise of the power module 130 to be too high and resulting in a failure. The temperature of the entire graphene film layer 141 is approximately the same, achieving the purpose of quickly balancing the heat generated by the power module 130, meeting the heat dissipation requirements of the high-power and high-heat dissipation inverter 100, being beneficial to extending the service life of the inverter 100, and improving the reliability of the inverter 100.

[0056] In addition, it can be understood that during the use of the inverter 100, it is generally installed and fixed by hanging on the wall or stacking. By using the heat-conducting layer 140 with at least part being the graphene film layer 141 to dissipate heat from the power module 130, compared with the related art in which the size of the radiator is increased to meet the heat dissipation requirements, it is beneficial to reduce the overall weight of the inverter 100, make the product lightweight while meeting the heat dissipation requirements, and further improve the reliability of the inverter 100.

[0057] Optionally, the entire heat-conducting layer 140 is a graphene film layer 141. Alternatively, the heat-conducting layer 140 includes a heat-conducting film layer and a graphene film layer 141, where the heat-conducting film layer is located between the circuit board 120 and the graphene film layer 141, or the graphene film layer 141 is located between the heat-conducting film layer and the circuit board 120. Specifically, it can be set according to actual needs.

[0058] Optionally, the density of the graphene film layer 141 is 0.7 g / cm 3 ~2.1 g / cm 3 .

[0059] Optionally, the density of the graphene film layer 141 is 1.7 g / cm 3 ~2.0 g / cm 3 .

[0060] Optionally, the lateral thermal conductivity of the graphene film layer 141 is less than or equal to 1900 W / (m·k). Optionally, the lateral thermal conductivity of the graphene film layer 141 is between 1100 W / (m·k) and 1600 W / (m·k), the longitudinal thermal conductivity is 10 W / (m·k), and it can withstand high temperatures up to 400 °C, the flame retardant grade is V0, it has high flexibility, the number of bending times is greater than 10000 times and it does not break, as shown in the following table:

[0061]

[0062]

[0063] In some embodiments, optionally, the side of the circuit board 120 facing away from the power module 130 is attached to the heat-conducting layer 140.

[0064] In this embodiment, it is defined that the side of the circuit board 120 facing away from the power module 130 is attached to the heat-conducting layer 140, so that the heat generated by the power module 130 and the circuit board 120 can be transferred to the graphene film layer 141 as much as possible, significantly improving the heat exchange efficiency.

[0065] Since when the heat generated by the power module 130 and the circuit board 120 is transferred to the graphene film layer 141, the heat is quickly transferred in the thickness direction perpendicular to the graphene film layer 141 and dispersed to the surroundings of the graphene film layer 141, avoiding the heat being concentrated in the area where the power module 130 is located and unable to be effectively dissipated, which may lead to the situation that the temperature rise of the power module 130 is too high and it fails, making the temperature of the entire graphene film layer 141 roughly the same, achieving the purpose of quickly balancing the heat generated by the power module 130 and meeting the heat dissipation requirements of the high-power and high-heat-consumption inverter 100.

[0066] Such as Figure 1 and Figure 2As shown, in some embodiments, optionally, the inverter 100 further includes a heat dissipation component 150, which is disposed outside the housing 110 and at least partially opposite to the heat conduction layer 140.

[0067] In this embodiment, it is defined that the inverter 100 further includes a heat dissipation component 150. Specifically, the heat dissipation component 150 is disposed outside the housing 110, and at least a part of the heat dissipation component 150 is opposite to the heat conduction layer 140.

[0068] Specifically, when the heat generated by the power module 130 and the circuit board 120 is transferred to the graphene film layer 141, the heat is rapidly transferred in the thickness direction perpendicular to the graphene film layer 141 and dispersed to the periphery of the graphene film layer 141, and then transferred from the graphene film layer 141 to the heat dissipation component 150. The heat dissipation component 150 exchanges heat with the external environment to achieve heat dissipation, avoiding heat concentration in the area where the power module 130 is located and unable to be effectively dissipated, thereby preventing the power module 130 from overheating and failing. At the same time, the heat dissipation efficiency is improved, and the purpose of quickly balancing the heat generated by the power module 130 is achieved, meeting the heat dissipation requirements of high-power and high-heat-consumption inverters 100, and improving the stability and reliability of the inverter 100.

[0069] As Figure 2 shown, in some embodiments, optionally, the housing 110 is provided with an avoidance opening 111, and at least a part of the heat conduction layer 140 and at least a part of the heat dissipation component 150 are respectively located on both sides of the avoidance opening 111.

[0070] In this embodiment, it is defined that the housing 110 is further provided with an avoidance opening 111. Specifically, at least a part of the heat conduction layer 140 and at least a part of the heat dissipation component 150 are respectively located on both sides of the avoidance opening 111. That is to say, when the heat generated by the power module 130 and the circuit board 120 is transferred to the heat conduction layer 140, the heat is directly transferred to the heat dissipation component 150 through the avoidance opening 111, which is beneficial to further improving the heat transfer efficiency and the heat dissipation effect.

[0071] In some embodiments, optionally, at least a part of the heat conduction layer 140 is attached to the heat dissipation component 150 through the avoidance opening 111.

[0072] In this embodiment, it is defined that at least a part of the heat conduction layer 140 is attached to the heat dissipation component 150 through the avoidance opening 111, so that as much heat as possible transferred to the heat conduction layer 140 can be transferred to the heat dissipation component 150. The heat dissipation component 150 exchanges heat with the external environment to achieve rapid heat dissipation, which is beneficial to further improving the heat exchange efficiency, and then improving the heat dissipation effect, meeting the heat dissipation requirements of high-power and high-heat-consumption inverters 100, and enhancing the product competitiveness.

[0073] AsFigure 1 As shown, in some embodiments, optionally, the heat dissipation component 150 further includes a substrate 151 and a plurality of fins 152. The substrate 151 is disposed on the outer side of the housing 110. The first end of each fin 152 is connected to the side of the substrate 151 facing away from the housing 110, and the second end of each fin 152 extends in a direction away from the substrate 151; wherein, the extension length L of at least one fin 152 satisfies 40 mm ≤ L ≤ 50 mm.

[0074] In this embodiment, it is defined that the heat dissipation component 150 further includes a substrate 151 and a plurality of fins 152. Specifically, the substrate 151 is connected to the outer wall of the housing 110, and the plurality of fins 152 are arranged at intervals on the side of the substrate 151 facing away from the housing 110, and the second end of each fin 152 extends in a direction away from the substrate 151, so as to increase the heat exchange area between the heat dissipation component 150 and the external environment, which is beneficial to further improving the heat exchange effect, quickly balancing the heat generated by the power module 130, meeting the heat dissipation requirements of the high-power and high-heat-consumption inverter 100, and improving the stability and reliability of the inverter 100.

[0075] For the inverter in the related art to meet the heat dissipation requirements, the fin height of the radiator is generally about 70 mm. The heat conduction layer 140 with at least part being the graphene film layer 141 is used for heat transfer between the power module 130 and the heat dissipation component 150. While meeting the heat dissipation requirements of the high-power and high-heat-consumption inverter 100, the extension length of the fins 152 can be correspondingly reduced, that is, the extension length of at least one fin 152 is between 40 mm and 50 mm, which is beneficial to reducing the production cost of the inverter 100. At the same time, it can also reduce the overall weight of the inverter 100, make the product lightweight, and further improve the reliability and product competitiveness of the inverter 100.

[0076] Optionally, the thickness of the substrate 151 is 10 mm.

[0077] In some embodiments, optionally, the substrate 151 includes an aluminum substrate; and / or at least one fin 152 includes an aluminum fin.

[0078] In this embodiment, the substrate 151 includes an aluminum substrate, that is to say, the substrate 151 is made of metallic aluminum, so as to ensure the heat dissipation effect while being beneficial to further reducing the weight of the whole machine and improving the stability and reliability of the inverter 100.

[0079] At least one fin 152 includes an aluminum fin, that is to say, at least one fin 152 is made of metallic aluminum, so as to ensure the heat dissipation effect while being beneficial to further reducing the weight of the whole machine and improving the stability and reliability of the inverter 100.

[0080] In some embodiments, optionally, the cross-sectional area of the heat-conducting layer 140 in a direction perpendicular to its thickness is greater than or equal to the area of the side of the circuit board 120 facing away from the power module 130.

[0081] In this embodiment, it is defined that the cross-sectional area of the heat-conducting layer 140 in a direction perpendicular to its thickness is greater than or equal to the area of the side of the circuit board 120 facing away from the power module 130, that is, the cross-sectional area of the heat-conducting layer 140 is increased, so as to increase the contact area between the heat-conducting layer 140 and the circuit board 120, enabling the heat generated by the power module 130 and the circuit board 120 to be transferred to the heat-conducting layer 140 as much as possible, and improving the heat exchange efficiency.

[0082] Moreover, the heat rapidly spreads in a direction perpendicular to the thickness of the graphene film layer 141 and disperses to the periphery of the graphene film layer 141, preventing the heat from concentrating in the area where the power module 130 is located and being unable to dissipate effectively, which may otherwise lead to the situation that the temperature of the power module 130 rises too high and fails, meeting the heat dissipation requirements of the high-power and high-heat-consumption inverter 100.

[0083] As Figure 1 shown, in some embodiments, optionally, the thickness d of the graphene film layer 141 satisfies 12μm ≤ d ≤ 100μm.

[0084] In this embodiment, the value range of the thickness of the graphene film layer 141 is defined. Specifically, the thickness of the graphene film layer 141 is between 12μm and 100μm, ensuring the heat dissipation effect and meeting the heat dissipation requirements of the high-power and high-heat-consumption inverter 100.

[0085] Moreover, by using the heat-conducting layer 140 at least partially composed of the graphene film layer 141 to dissipate the heat of the power module 130, compared with the related art of meeting the heat dissipation requirements by increasing the size of the radiator, it is beneficial to reduce the overall weight of the inverter 100, make the product lightweight while meeting the heat dissipation requirements, and further improve the reliability of the inverter 100.

[0086] According to the second aspect of the present invention, an energy storage system is provided, including the inverter 100 provided in any of the above embodiments, thus having all the beneficial technical effects of the inverter 100, which will not be elaborated here.

[0087] In the description of this specification, terms such as "connection", "installation", and "fixation" should all be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0088] In the description of this specification, the descriptions of terms such as "one embodiment", "some embodiments", "specific embodiments", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0089] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. For those skilled in the art, the present utility model may have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. An inverter, characterized in that, Comprising: A housing; A circuit board disposed within the housing; A power module disposed on the circuit board and electrically connected to the circuit board; A heat-conducting layer disposed on a side of the circuit board facing away from the power module for heat exchange with the circuit board, at least a part of the heat-conducting layer comprising a graphene film layer.

2. The inverter according to claim 1, characterized in that, A side surface of the circuit board facing away from the power module is in contact with the heat-conducting layer.

3. The inverter according to claim 1, wherein Further comprising: A heat dissipation assembly disposed outside the housing and at least partially opposite to the heat-conducting layer.

4. The inverter according to claim 3, characterized in that, The housing is provided with an avoidance opening, at least a part of the heat-conducting layer and at least a part of the heat dissipation assembly are respectively located on two sides of the avoidance opening.

5. The inverter according to claim 4, wherein At least a part of the heat-conducting layer is in contact with the heat dissipation assembly through the avoidance opening.

6. The inverter according to claim 3, characterized in that, The heat dissipation assembly further comprises: A substrate disposed outside the housing; A plurality of fins, a first end of each fin is connected to a side of the substrate facing away from the housing, and a second end of each fin extends in a direction away from the substrate; Wherein, the extension length L of at least one of the fins satisfies 40mm ≤ L ≤ 50mm.

7. The inverter according to claim 6, wherein The substrate comprises an aluminum substrate; and / or At least one of the fins comprises an aluminum fin.

8. The inverter according to any one of claims 1 to 7, characterized in that The cross-sectional area of the heat-conducting layer in a direction perpendicular to the thickness direction is greater than or equal to the area of the side surface of the circuit board facing away from the power module.

9. The inverter according to any one of claims 1 to 7, characterized in that, The thickness d of the graphene film layer satisfies 12μm ≤ d ≤ 100μm.

10. A energy storage system, characterized in that, Comprising the inverter according to any one of claims 1 to 9.

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