Ultra-thin high-brightness side-emitting blue-white double-color light emitting diode

Abstract

The utility model relates to the technical field of light-emitting diodes (LEDs), solves the technical problems that a single lamp bead in the prior art cannot meet the technological process of blue light and white light when emitting white light and cannot meet the requirement for brightness due to low brightness, and particularly relates to a light-emitting diode capable of emitting blue and white light on an ultrathin high-brightness side, which comprises a base plate, the top surface of the base plate is provided with a limiting assembly used for limiting the chip and increasing the capillary action of the bottom filling glue, the limiting assembly comprises a flow guide inclined surface enabling the bottom filling glue to sufficiently flow downwards along the inclined surface opening, and the bottom surface of the flow guide inclined surface is provided with a plurality of limiting ball grooves for limiting the chip by utilizing the circular arc recess; according to the utility model, brand new manufacture procedures and materials are adopted, one lamp bead can be utilized to simultaneously realize one SMD (Surface Mount Device) LED material, and the requirement of lightening blue light and white light at the same time is met, so that more use scenes are met, flip chips with the same size are used for lighting, and the brightness is higher than that of a traditional normal chip.

Description

Technical Field

[0001] The utility model relates to the technical field of LEDs, and particularly relates to a light-emitting diode that realizes ultra-thin, high-brightness, side-emitting blue and white dual colors. Background Art

[0002] Conventional SMD patch LEDs generally use a single lamp bead to emit white light. The light emission can only meet the demand for white light, and cannot simultaneously meet the process requirements of blue light plus white light. The brightness is low and cannot meet the brightness requirements. If a flip-chip with high brightness is used, there will be a problem that the solder balls at the bottom of the flip-chip are unstable and easy to slide, so that an additional clamping device is required for positioning during welding, increasing the process cost and manufacturing difficulty. Summary of the Utility Model

[0003] Aiming at the deficiencies of the prior art, the utility model provides a light-emitting diode that realizes ultra-thin, high-brightness, side-emitting blue and white dual colors, solves the technical problems that conventional SMD patch LEDs cannot simultaneously meet the process requirements of blue light plus white light and have low brightness, and achieves the purpose of using a single lamp bead to simultaneously meet the requirements of lighting blue light plus white light for an SMD patch LED material and having higher brightness.

[0004] To solve the above technical problems, the utility model provides the following technical solutions: A light-emitting diode that realizes ultra-thin, high-brightness, side-emitting blue and white dual colors, including a base plate, characterized in that a limiting component for limiting the chip is provided on the top surface of the base plate, and a light-emitting component is arranged on the top of the limiting component.

[0005] Preferably, the limiting component includes a diversion inclined plane that enables the bottom filling glue to flow downward fully along the inclined plane opening, and a plurality of limiting ball grooves for limiting the chip by arc depressions are arranged on the bottom surface of the diversion inclined plane.

[0006] Preferably, the light-emitting component includes solder balls welded to the plurality of limiting ball grooves, a conductive seat is fixedly connected to the top end of each solder ball, the top ends of the conductive seats are fixedly connected to the bottom ends of two conductive sheets, and a light-emitting chip is fixedly connected to the top ends of the two conductive sheets.

[0007] Preferably, a transparent epoxy cover for protecting the light-emitting component is fixedly connected to the outside of the light-emitting component.

[0008] Preferably, a heat dissipation plate is fixedly connected to the middle position of the transparent epoxy cover.

[0009] Preferably, the bottom end of the transparent epoxy cover is fixedly connected to the top surface of the base plate and wraps and seals the light-emitting component inside.

[0010] Preferably, the heat dissipation plate is fixed between the two conductive sheets and the two light-emitting chips.

[0011] Preferably, there is a gap between the conductive sheet and the diversion inclined surface so that the bottom filling glue can be sprayed inward.

[0012] By means of the above technical solution, the present utility model provides a light-emitting diode that realizes ultra-thin, high-brightness, side-emitting blue and white dual colors, and at least has the following beneficial effects:

[0013] 1. The present utility model uses the diversion inclined surface to divert the bottom filling glue to the bottom surface of the base plate, and fully utilizes its own gravity to evenly fill the bottom. At the same time, by means of the limiting ball groove, the solder balls can be limited, preventing the displacement of the top light-emitting component during testing or welding, and reducing the gap between the light-emitting component and the base plate, increasing the speed and uniformity of the diffusion of the bottom filling glue by capillary action, making the welding and bottom filling faster and more efficient.

[0014] 2. The present utility model adopts a new process and materials, and can use a single lamp bead to simultaneously realize the requirements of a single SMD patch LED material, while lighting blue light and white light, meeting more usage scenarios. Using flip chips of the same size for light emission can be brighter than traditional front-mounted wafers. Description of the Drawings

[0015] The drawings described herein are used to provide a further understanding of the present application, and constitute a part of the present application. The schematic embodiments of the present application and their descriptions are used to explain the present application, and do not constitute an improper limitation of the present application. In the drawings:

[0016] Figure 1 is the front-side three-dimensional structure diagram of the present utility model;

[0017] Figure 2 is the three-dimensional structure diagram of the light-emitting component of the present utility model;

[0018] Figure 3 is the internal three-dimensional structure diagram of the light-emitting component of the present utility model;

[0019] Figure 4 is the internal three-dimensional structure diagram of the limiting component of the present utility model;

[0020] Figure 5 is the bottom-side three-dimensional structure diagram of the light-emitting component of the present utility model.

[0021] In the figure: 1. Base plate; 2. Transparent epoxy cover; 3. Light-emitting component; 301. Light-emitting chip; 302. Conductive sheet; 303. Conductive seat; 304. Solder ball; 4. Limiting component; 401. Diversion inclined surface; 402. Limiting ball groove; 5. Heat dissipation plate. Detailed Embodiments

[0022] To make the above objects, features, and advantages of the present utility model more apparent and understandable, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. Thus, the implementation process of how this application uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0023] Since conventional SMD surface-mounted LEDs cannot simultaneously meet the process requirements of blue light plus white light and have a low brightness, please refer to Figures 1-5 , this embodiment provides a light-emitting diode that realizes ultra-thin and high-brightness side-emitting blue and white dual colors, which can use a single lamp bead to simultaneously meet the requirements of lighting blue light plus white light with a single SMD surface-mounted LED material and has a higher brightness. The light-emitting diode includes a base plate 1, characterized in that a limiting component 4 for limiting the chip is provided on the top surface of the base plate 1, a light-emitting component 3 is provided on the top of the limiting component 4, the limiting component 4 includes a diversion inclined surface 401 for allowing the bottom filling glue to flow downward fully along the inclined surface opening, a plurality of limiting ball grooves 402 for limiting the chip by using arc depressions are provided on the bottom surface of the diversion inclined surface 401, the light-emitting component 3 includes solder balls 304 welded to the plurality of limiting ball grooves 402, a conductive seat 303 is fixedly connected to the top end of each solder ball 304, the top end of the conductive seat 303 is fixedly connected to the bottom ends of two conductive sheets 302, a light-emitting chip 301 is fixedly connected to the top ends of the two conductive sheets 302, and a gap is left between the conductive sheet 302 and the diversion inclined surface 401 to allow the bottom filling glue to be sprayed inward.

[0024] It should be noted that capillary action refers to the capillary phenomenon, and its principle is a phenomenon in which a wetting liquid surface attracts a solid surface to cause the liquid to gradually spread or rise. In the production of flip-chip, the bottom voids of the solder balls 304 are filled with a bottom fill adhesive. At this time, by using the characteristic that the bottom fill adhesive is a wetting liquid, it evenly diffuses in the small voids by means of capillary action to complete the filling. Among them, the diversion inclined surface 401 can automatically fill and guide the bottom filling glue on the inclined surface to the bottom surface of the diversion inclined surface 401 by gravity. The limiting ball groove 402, by virtue of its hemispherical shape, can temporarily fix the solder ball 304 by the limiting and friction of the arc surface, which is convenient for welding and testing.

[0025] The light-emitting component 3 uses the flip-chip technology of the chip to weld the light-emitting chip 301 to the top surface of the base plate 1. This technology welds the conductive side of the light-emitting chip 301 downward. Different from the case where the leads are exposed on the outside during normal mounting, since the light-emitting chip 301 faces upward on both sides in this technology, more brightness can be obtained. At the same time, welding is performed using the solder balls 304, making the LED lamp bead have better conductivity and stability.

[0026] The conductive sheet 302 is a commonly used composite material, which facilitates the conduction of electricity and heat dissipation of the light-emitting chip 301. The composite material is formed by combining materials such as rigid printed circuit boards, aluminum substrates with high thermal conductivity coefficients, insulating adhesives, conductive silver adhesives, and epoxy resins. Generally, a small spray gun is used to spray the underfill glue into the inside. Due to the capillary action, it only needs to be sprayed on both sides of the four sides of the light-emitting chip 301. Due to the function of the limit ball groove 402, it reduces the gap between the light-emitting component 3 and the base plate 1, increases the speed and uniformity of the underfill glue diffusing by capillary action, and makes the soldering and underfilling faster and more efficient.

[0027] In an alternative embodiment, as Figure 2 and Figure 3 shown, a transparent epoxy cover 2 for protecting the light-emitting component 3 and improving the light extraction efficiency is fixedly connected to the outside of the light-emitting component 3. A heat dissipation plate 5 is fixedly connected to the middle position of the transparent epoxy cover 2. The bottom end of the transparent epoxy cover 2 is fixedly connected to the top surface of the base plate 1 and wraps and seals the light-emitting component 3 inside. The heat dissipation plate 5 is fixed between the two conductive sheets 302 and the light-emitting chip 301.

[0028] It should be noted that the heat dissipation plate 5 can be set according to the actual situation. If the power of the light-emitting chip 301 is relatively high and the heat dissipation effect of the base plate 1 is insufficient, then the heat dissipation plate 5 needs to be installed. If the power of the light-emitting chip 301 is not large, it can be chosen not to install it.

[0029] Each embodiment in this specification is described in a progressive manner. The key point of each embodiment is to illustrate the differences from other embodiments. The same or similar parts among the embodiments can be referred to each other. For the above embodiments, since they are basically similar to the method embodiments, the description is relatively simple. For the relevant parts, refer to the partial description of the method embodiments.

[0030] The above embodiments have introduced the present invention in detail. Specific examples are used in this article to elaborate on the principle and implementation manner of the present invention. The description of the above embodiments is only used to help understand the method and its core idea of the present invention; at the same time, for those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present invention.

Claims

1. A light-emitting diode that realizes ultra-thin and high-brightness side-emitting blue and white dual colors, including a base plate (1), characterized in that, The top surface of the base plate (1) is provided with a limiting component (4) for limiting the chip, and a light-emitting component (3) is arranged on the top of the limiting component (4); The limiting component (4) includes a diversion inclined plane (401) for enabling the bottom filling glue to fully flow downward along the inclined plane opening, and a plurality of limiting ball grooves (402) for limiting the chip by using arc depressions are arranged on the bottom surface of the diversion inclined plane (401); The light-emitting component (3) includes solder balls (304) welded to the plurality of limiting ball grooves (402), a conductive base (303) is fixedly connected to the top end of each solder ball (304), the top end of the conductive base (303) is fixedly connected to the bottom ends of two conductive sheets (302), and a light-emitting chip (301) is fixedly connected to the top ends of the two conductive sheets (302).

2. The light-emitting diode for realizing ultra-thin, high-brightness, side-emitting blue and white dual colors according to claim 1, wherein A transparent epoxy cover (2) for protecting the light-emitting component (3) is fixedly connected to the outside of the light-emitting component (3).

3. The light-emitting diode for realizing ultra-thin, high-brightness, side-emitting blue and white dual colors according to claim 2, wherein A heat dissipation plate (5) is fixedly connected to the middle position of the transparent epoxy cover (2).

4. The light-emitting diode according to claim 2 for realizing ultra-thin, high-brightness, side-emitting blue and white dual colors, characterized in that, The bottom end of the transparent epoxy cover (2) is fixedly connected to the top surface of the base plate (1) and wraps and seals the light-emitting component (3) inside.

5. The light-emitting diode for realizing ultra-thin, highly bright side-emitting blue and white dual colors according to claim 3, wherein The heat dissipation plate (5) is fixed between the two conductive sheets (302) and the two light-emitting chips (301).

6. The light-emitting diode for realizing ultra-thin, highly bright side-emitting blue and white dual colors according to claim 1, wherein A gap is left between the conductive sheet (302) and the diversion inclined plane (401) to enable the bottom filling glue to be sprayed inward.

Images