Semiconductor device plane grinding device
By setting an adjustment rod in the plane grinding device of the semiconductor device to adjust the angle of the auxiliary plate, the problem of the inability to perform plane grinding in the prior art is solved, the grinding efficiency and flatness are improved, and the cost is reduced.
Patent Information
- Application Number
- CN202422165205.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-03
- Publication Date
- 2025-07-18
- Estimated Expiration
- 2034-09-03
AI Technical Summary
The existing mechanical structure of the precision angle grinding table can only perform cross-sectional grinding on the sides of semiconductor devices, and cannot perform flat grinding, resulting in a comprehensive understanding of product quality and internal structure. Manual operation requires long-term training, resulting in high cost and low efficiency.
A semiconductor device plane grinding device is designed, by providing multiple adjustment rods between the main board and the auxiliary board, allowing different angles between the auxiliary board and the main board to facilitate grinding of the sample at an adjusted parallel angle.
It realizes high efficiency and flatness of the plane grinding of semiconductor devices, reduces cost requirements and reduces dependence on professional training of operators.
Smart Images
Figure CN223114776U_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the present application relate to the technical field of semiconductor processing, and particularly to a planar grinding device for semiconductor devices. Background Art
[0002] In the process of semiconductor processing, it is often necessary to grind certain semiconductor devices. By observing the ground surfaces at different levels according to the grinding depth, the product quality or internal structure of the semiconductor devices can be understood. Due to the limitations of the mechanical structure of the existing precision angle measuring grinding table, only the side surfaces of semiconductor devices can be sectionally ground, and the front surfaces of semiconductor devices cannot be planarly ground, making it difficult to comprehensively understand the product quality and internal structure of semiconductor devices.
[0003] When planar grinding of semiconductor devices is required, it is often necessary for workers to hold the processed semiconductor samples on the grinding table for grinding operations. Workers need to receive long-term training to reach a professional level, which leads to high labor costs and low grinding efficiency. Summary of the Utility Model
[0004] The purpose of the embodiments of the present application is to provide a planar grinding device for semiconductor devices, which can save costs and improve the planar grinding efficiency of semiconductor devices.
[0005] To solve the above technical problems, the embodiments of the present application provide a planar grinding device for semiconductor devices. The planar grinding device for semiconductor devices includes a main board, a plurality of adjusting rods, and an auxiliary board. The main board is a hand-held carrier board; the plurality of adjusting rods all penetrate the main board from the front of the main board. One end of the adjusting rod is an adjusting end, and the other end is a connecting end. The adjusting rods are distributed at different positions on the main board; the connecting ends are all arranged on one side of the auxiliary board. By adjusting the adjusting rods, the auxiliary board has different angles relative to the main board, which is convenient for the samples fixed on the auxiliary board to be ground at the adjusted angles when the main board is held.
[0006] The planar grinding device for semiconductor devices provided by the embodiments of the present application is provided with a plurality of adjusting rods between the auxiliary board and the main board that can adjust the angle of the auxiliary board, so that different angles can be formed between the auxiliary board and the main board. When the main board is held, it is convenient for the semiconductor device samples fixed on the auxiliary board to be ground at an angle parallel to the main board after adjustment. In this way, costs can be saved, the planar grinding efficiency of semiconductor devices can be improved, and the flatness of grinding can be ensured.
[0007] In some embodiments, a fine adjuster is provided at the adjusting end. By rotating the fine adjuster, the adjusting rod expands and contracts longitudinally to adjust the angle of the auxiliary board relative to the main board.
[0008] In some embodiments, the number of adjusting rods is four.
[0009] In some embodiments, the projection of the auxiliary board in the direction perpendicular to the main board is located at the middle position of the main board.
[0010] In some embodiments, finger grooves are provided on both opposite sides of the main board.
[0011] In some embodiments, the number of finger grooves is four.
[0012] In some embodiments, a groove is provided on the side of the auxiliary board facing away from the connection end.
[0013] In some embodiments, a linkage structure is further provided between the main board and the auxiliary board.
[0014] In some embodiments, the linkage structure includes a clamping platform provided on the side of the main board facing away from the adjustment end. A clamping groove is provided in the clamping platform, and a clamping ball is rotatably connected in the clamping groove. The clamping ball is connected to a fixing rod, and the fixing rod passes through the clamping platform and is connected to the auxiliary board.
[0015] In some embodiments, the linkage structure further includes a nut provided outside the clamping platform to limit the clamping ball. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] One or more embodiments are exemplarily illustrated by the pictures in the corresponding drawings. These exemplary illustrations do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements, unless otherwise stated, and the drawings in the figures do not constitute a scale limitation.
[0017] Figure 1 is a schematic structural diagram of an embodiment of a semiconductor device planar grinding apparatus provided by some embodiments of the present application;
[0018] Figure 2 is a top view of the semiconductor device planar grinding apparatus provided by some embodiments of the present application Figure 1 ;
[0019] Figure 3 is a schematic structural diagram of another embodiment of the semiconductor device planar grinding apparatus provided by some embodiments of the present application;
[0020] Figure 4 is a schematic structural diagram of the semiconductor device planar grinding apparatus provided by some embodiments of the present application Figure 3 after angle adjustment;
[0021] Figure 5 is a schematic structural diagram of sample processing in the semiconductor device planar grinding apparatus provided by some embodiments of the present application.
[0022] Description of reference numerals: 11 - main board; 111 - finger groove; 12 - adjusting rod; 121 - adjusting end; 122 - connecting end; 123 - fine adjuster; 13 - auxiliary board; 131 - groove; 14 - linkage structure; 141 - clamping platform; 142 - clamping groove; 143 - clamping ball; 144 - fixing rod; 145 - nut; 15 - sample; 16 - permanent magnet. Detailed implementation manners
[0023] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the following will elaborate on the various implementation manners of the present application with reference to the accompanying drawings. However, those of ordinary skill in the art can understand that in the various implementation manners of the present application, many technical details are provided to help readers better understand the present application. However, even without these technical details and various changes and modifications based on the following implementation manners, the technical solutions claimed in the present application can still be achieved. The division of the following embodiments is for convenience of description and should not constitute any limitation to the specific implementation manner of the present application. The various embodiments can be combined and cross-referenced with each other on the premise of no contradiction.
[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above accompanying drawing descriptions are intended to cover non-exclusive inclusion.
[0025] In the description of the embodiments of this application, technical terms such as "first" and "second" are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity, specific order or primary-secondary relationship of the indicated technical features. In the description of the embodiments of this application, "a plurality of" means two or more unless otherwise specifically defined.
[0026] In the description of the embodiments of this application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected" and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can also be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of this application can be understood according to specific circumstances.
[0027] In the process of semiconductor processing, it is often necessary to grind certain semiconductor devices. By observing the grinding surfaces at different levels according to the grinding depth, the product quality or internal structure of the semiconductor devices can be understood. Currently, the process research on the back side of the wafer is a hot topic, and this hot topic process research requires planar grinding of the back side of the wafer. Due to the limitations of the mechanical structure of the existing precision angle measuring grinding table, only cross-sectional grinding can be performed on the side of the semiconductor device, and planar grinding cannot be performed on the front side of the semiconductor device, making it difficult to comprehensively understand the product quality and internal structure of the semiconductor device.
[0028] When planar grinding of semiconductor devices is required, it is often necessary for workers to hold the processed semiconductor samples on the grinding table for grinding operations. Workers need to receive long-term training to reach a professional level, which results in high labor costs and low grinding efficiency.
[0029] To solve the above technical problems, some embodiments of the present application provide a planar grinding device for semiconductor devices. By setting a plurality of adjusting rods that can adjust the angle of the auxiliary plate between the auxiliary plate and the main board, different angles can be formed between the auxiliary plate and the main board, facilitating the grinding of the semiconductor device samples fixed on the auxiliary plate at an angle parallel to the main board after adjustment when holding the main board. In this way, costs can be saved, the planar grinding efficiency of semiconductor devices can be improved, and the flatness of grinding can be ensured.
[0030] The following combines Figures 1 to 5 to illustrate the planar grinding device for semiconductor devices provided by some embodiments of the present application.
[0031] As Figure 1 and Figure 3 shown, the planar grinding device for semiconductor devices provided by some embodiments of the present application includes a main board 11, a plurality of adjusting rods 12, and an auxiliary board 13. The main board 11 is a hand-held carrier board; the plurality of adjusting rods 12 all penetrate the main board 11 from the front of the main board 11. One end of the adjusting rod 12 is an adjusting end 121, and the other end is a connecting end 122. The adjusting rods 12 are distributed at different positions on the main board 11; the connecting ends 122 are all arranged on one side of the auxiliary board 13. By adjusting the adjusting rods 12, the auxiliary board 13 has different angles relative to the main board 11, facilitating the grinding of the sample 15 fixed on the auxiliary board 13 at an adjusted angle when holding the main board 11.
[0032] It should be noted that the main board 11, the adjusting rod 12 and the auxiliary board 13 can be made of metals such as stainless steel and iron, or organic materials such as high-strength plastics. The main board 11 and the auxiliary board 13 can be in the shapes of rectangles, squares, triangles, etc., or can be circular. There can be two, three or four adjusting rods 12, and the specific number of adjusting rods 12 is determined according to the shape of the main board 11 and the accuracy requirements of adjustment. Components convenient for holding, such as a handle or a groove 131, can be provided on the main board 11, and a spirit level can also be provided at an appropriate position on the main board 11 to ensure the level of the main board 11 when holding the grinding device. The multiple adjusting rods 12 pass through the main board 11 and are connected to the auxiliary board 13. The position where they are connected to the auxiliary board 13 is the connection end 122, and the free end remaining at the upper end of the main board 11 is the adjusting end 121. When adjusting different angles between the auxiliary board 13 and the main board 11, there will be slight angular changes between the connection end 122 and the auxiliary board 13, which requires that the connection end 122 and the auxiliary board 13 cannot be fixed rigidly and can rotate or swing. As Figure 3 shown, the adjusting rod 12 can be an integral rod-shaped structure. The adjusting rod 12 is connected to the main board 11 by a thread. By manually rotating the adjusting end 121, the auxiliary board 13 can move up and down relative to the main board 11. By adjusting the multiple adjusting rods 12 at different positions, the angle between the auxiliary board 13 and the main board 11 can be adjusted. As Figure 2 shown, the adjusting rod 12 can be divided into two sections, having a structure similar to a micrometer. By rotating the adjusting end 121, the distance between the adjusting end 121 and the connecting section is changed, so that the auxiliary board 13 moves up and down relative to the main board 11. By adjusting the multiple adjusting rods 12 at different positions, the angle between the auxiliary board 13 and the main board 11 can be adjusted.
[0033] Figure 3 Figure 8 is a schematic diagram of the grinding device when the main board 11 and the auxiliary board 13 are parallel. If the surface of the sample 15 attached to the lower side of the auxiliary board 13 has a certain inclination, when grinding on a grinding platform at this time, the most prominent point will be ground off first and the grinding will be uneven. Therefore, the angle of the sample 15 needs to be adjusted. Figure 4 Figure 10 is a schematic diagram after the angle of the sample 15 is adjusted. By adjusting the multiple adjusting rods 12, the main board 11 and the auxiliary board 13 have a certain angle, and the surface of the sample 15 is basically parallel to the main board 11. At this time, when holding the grinding device, as long as it is ensured that the main board 11 is parallel to the grinding table by observation, the sample 15 can be ground flat.
[0034] In actual use, first, the grinding table surface needs to be adjusted to ensure its levelness. A spirit level is provided on the main board 11, which helps the worker to ensure the parallelism of the main board 11 during operation. Thus, the surface of the sample 15 that is adjusted to be parallel to the main board 11 is also parallel to the grinding table surface. In this way, the grinding flatness of the sample 15 can be ensured. If there is no such grinding device with adjustment, it is necessary for the worker to press the sample 15 by hand to grind. To ensure the grinding flatness, a large amount of time and a large number of operations and trainings are required for the worker, and quite a lot of experience is needed. With the grinding device provided by the embodiments of the present application, as long as a novice can maintain a certain balance and observe the parallelism of the main board 11, he can also hold the device to grind and ensure the grinding flatness.
[0035] For the semiconductor device planar grinding device provided by some embodiments of the present application, by arranging a plurality of adjusting rods 12 that can adjust the angle of the auxiliary board 13 between the auxiliary board 13 and the main board 11, different angles can be formed between the auxiliary board 13 and the main board 11, which is convenient for the semiconductor device sample 15 fixed on the auxiliary board 13 to be ground at an angle adjusted to be parallel to the main board 11 when the main board 11 is held by hand. In this way, the cost can be saved, the efficiency of semiconductor device planar grinding can be improved, and the grinding flatness can be ensured.
[0036] In some embodiments of the present application, a fine adjuster 123 is provided at the adjusting end 121. By rotating the fine adjuster 123, the adjusting rod 12 can be telescoped longitudinally to adjust the angle of the auxiliary board 13 relative to the main board 12.
[0037] It should be noted that at this time, the adjusting rod 12 is divided into upper and lower sections, which has a similar structure to a micrometer and can achieve fine adjustment of the angle of the sample 15, so that the grinding device has a precision at the micron level. As shown by the dotted line in, the upper and lower sections are connected by a nested structure in the main board 11. The outer shell of the upper end is fixed to the main board 11, and the outer shell of the lower end is separated from the main board 11. Thus, by rotating the adjusting end 121, the distance between the adjusting end 121 and the connecting end 122 can be changed, so that the auxiliary board 13 moves up and down relative to the main board 11. By adjusting the adjusting rods 12 at multiple different positions, the angle between the auxiliary board 13 and the main board 11 can be adjusted. Figure 1 As shown by the dotted line in, the upper and lower sections are connected by a nested structure in the main board 11. The outer shell of the upper end is fixed to the main board 11, and the outer shell of the lower end is separated from the main board 11. Thus, by rotating the adjusting end 121, the distance between the adjusting end 121 and the connecting end 122 can be changed, so that the auxiliary board 13 moves up and down relative to the main board 11. By adjusting the adjusting rods 12 at multiple different positions, the angle between the auxiliary board 13 and the main board 11 can be adjusted.
[0038] In some embodiments of the present application, the number of the adjusting rods 12 is four.
[0039] It should be noted that the semiconductor device sample 15 is generally quadrilateral, and the optimal option for the shapes of the auxiliary board 13 and the main board 11 is also quadrilateral. The four adjusting rods 12 can adjust the four directions of the sample 15, so as to finely adjust the angle of the sample 15. As shown in, there are a total of four dotted lines representing the adjusting rods 12 in the figure. Figure 2 As shown in, there are a total of four dotted lines representing the adjusting rods 12 in the figure.
[0040] In some embodiments of the present application, the projection of the auxiliary plate 13 in the direction perpendicular to the main board 11 is located at the middle position of the main board 11.
[0041] It should be noted that the auxiliary plate 13 is located at the middle position of the main board 11. On the one hand, it is convenient for the fabrication, installation and positioning of the device. On the other hand, it is convenient for the adjusting rod 12 to adjust the angle of the auxiliary plate 13 and for observation, and it is easier to maintain the balance of the main board 11 during use.
[0042] In some embodiments of the present application, finger grooves 111 are provided on both opposite sides of the main board 11.
[0043] It should be noted that the finger grooves 111 are provided on the side of the main board 11 and are small grooves 131 with a certain arc suitable for finger placement, and there can be one pair or two pairs. When holding the grinding device, the fingers are placed in the finger grooves 111, which is convenient for the worker to hold the device stably.
[0044] In some embodiments of the present application, the number of finger grooves 111 is four.
[0045] It should be noted that when the main board 11 is quadrilateral, four finger grooves 111 are the optimal option. At this time, the grinding device can be held from two directions, and the direction can be switched during grinding, which is more conducive to grinding flat. Figure 2 Four dotted lines representing the finger grooves 111 are distributed on the four sides of the main board 11.
[0046] In some embodiments of the present application, a groove 131 is provided on the side of the auxiliary plate 13 facing away from the connection end 122.
[0047] It should be noted that the side of the auxiliary plate 13 facing away from the connection end 122 is the position for installing semiconductor devices. The groove 131 provided at this position is for the convenience of installing and fixing the semiconductor device sample 15. As Figure 5 shown, semiconductor devices are generally pasted on the permanent magnet 16 with glue, and the sample 15 fixed on the permanent magnet 16 is magnetically pasted in the groove 131, and the groove 131 fixes and limits the position of the sample 15. At this time, the groove 131 is slightly larger than the permanent magnet 16, and the auxiliary plate 13 must be made of magnetic materials such as iron, cobalt, nickel, etc.
[0048] In some embodiments of the present application, a linkage structure 14 is further provided between the main board 11 and the auxiliary plate 13.
[0049] It should be noted that the linkage structure 14 is located at the middle position between the main board 11 and the auxiliary plate 13, and is generally also located at the middle position where multiple adjusting rods 12 are distributed. On the one hand, it plays an auxiliary connection role between the main board 11 and the auxiliary plate 13. On the other hand, as the angle between the main board 11 and the auxiliary plate 13 is adjusted, the internal structure of the linkage structure 14 changes accordingly.
[0050] In some embodiments of the present application, the linkage structure 14 includes a clamping platform 141 disposed on one side of the main board 11 away from the adjusting end 121. A clamping groove 142 is provided in the clamping platform 141. A clamping ball 143 is rotatably connected in the clamping groove 142. The clamping ball 143 is connected to a fixing rod 144. The fixing rod 144 passes through the clamping platform 141 and is connected to the auxiliary board 13.
[0051] As Figure 1 shown, the clamping platform 141 is fixed below the main board 11. The inside of the clamping platform 141 is hollowed out to form the clamping groove 142. The size of the clamping ball 143 is smaller than that of the clamping groove 142. On the one hand, the clamping ball 143 can rotate at different angles; on the other hand, the clamping ball 143 can move up and down within a sufficient range in the clamping groove 142 to ensure that when adjusting the angle between the auxiliary board 13 and the main board 11, the distance between the main board 11 and the auxiliary board 13 can change sufficiently. One end of the fixing rod 144 is connected to the clamping ball 143, and the other end is connected to the auxiliary board 13. By transmitting the force through the fixing rod 144, the clamping ball 143 rotates or moves.
[0052] In some embodiments of the present application, the linkage structure 14 further includes a nut 145. The nut 145 is disposed outside the clamping platform 141 and limits the clamping ball 143.
[0053] It should be noted that the nut 145 is a non-standard product customized for processing. The structure of the nut 145 needs to be designed according to the structures of the clamping platform 141 and the fixing rod 144. The nut 145 ensures the firm installation of the linkage structure 14 and at the same time limits that the clamping ball 143 can only move inside the clamping groove 142.
[0054] Those of ordinary skill in the art can understand that the above embodiments are specific embodiments for implementing the present application. In actual applications, various changes can be made in form and details without departing from the spirit and scope of the present application.
Claims
1. A planar grinding device for semiconductor devices, characterized in that, include: The main board is a hand-held carrier board; A plurality of adjustment rods, all of which penetrate the main board from the front side of the main board, one end of the adjustment rod is an adjustment end, and the other end is a connection end, and the adjustment rods are distributed at different positions of the main board; The auxiliary plate, the connecting ends are all arranged on one side of the auxiliary plate, and the auxiliary plate can have different angles relative to the main board through the adjustment of the adjustment rod, so that the sample fixed on the auxiliary plate can be ground at the adjusted angle when the main board is held.
2. The planar grinding device for semiconductor devices according to claim 1, wherein The adjusting end is provided with a fine adjuster, and the rotation of the fine adjuster causes the adjusting rod to extend and retract along the longitudinal direction to adjust the angle of the auxiliary plate relative to the main plate.
3. The semiconductor device planar grinding apparatus according to claim 1, wherein, The number of the adjusting rods is four.
4. The semiconductor device planar grinding apparatus according to claim 1, wherein The projection of the auxiliary board perpendicular to the direction of the main board is located in the middle of the main board.
5. The semiconductor device planar grinding apparatus according to claim 1, wherein, Finger grooves are arranged on two opposite sides of the main board.
6. The planar grinding device for semiconductor devices according to claim 5, wherein, The number of the finger grooves is four.
7. The semiconductor device planar grinding apparatus according to claim 1, characterized in that, A groove is arranged on a side of the auxiliary plate away from the connecting end.
8. The semiconductor device planar grinding apparatus according to claim 1, wherein, A linkage structure is also provided between the main board and the auxiliary board.
9. The semiconductor device planar grinding apparatus according to claim 8, wherein The linkage structure includes a card platform arranged on the main board away from the adjustment end, a card slot is arranged in the card platform, a card ball is rotatably connected in the card slot, the card ball is connected to a fixing rod, and the fixing rod passes through the card platform and is connected to the auxiliary plate.
10. The semiconductor device planar grinding apparatus according to claim 9, wherein, The linkage structure also includes a nut, which is arranged on the outside of the clamping platform and limits the clamping ball.