Wafer coating equipment
By introducing automated clamping components and rotary connection structures into the wafer coating equipment, the problem of low coating efficiency caused by different wafer specifications is solved, and efficient automatic clamping and flip operations of wafer coating are achieved.
Patent Information
- Application Number
- CN202422401324.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-30
- Publication Date
- 2025-07-18
- Estimated Expiration
- 2034-09-30
AI Technical Summary
Due to the different wafer specifications of existing wafer coating equipment, it requires manual adjustment of the clamping structure, resulting in low coating efficiency.
Design a wafer coating equipment, adopting automated clamping components and rotating connection structures, including fixed slide rails, mobile sliders, vertical slide rails, rotating motors and rotating shafts, to realize automatic adjustment and flip clamping of wafers of different specifications, and coating them in combination with electroplating structures.
It improves coating efficiency, reduces the need for manual adjustment, and improves the degree of automation and coating speed of the equipment.
Smart Images
Figure CN223118537U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of coating equipment, in particular to a wafer coating equipment. Background Art
[0002] A wafer refers to a silicon wafer used for manufacturing silicon semiconductor integrated circuits. Since its shape is circular, it is called a wafer. The original material of the wafer is silicon, and there is an inexhaustible supply of silicon dioxide on the earth's crust surface.
[0003] When the existing wafer coating equipment coats wafers, due to the different specifications of the wafers, the staff needs to actively adjust the clamping structure to clamp and coat the wafers. However, the manual adjustment efficiency is low, resulting in a decrease in the coating efficiency.
[0004] Therefore, in view of the different specifications of the existing wafers above, the staff needs to actively adjust the clamping structure, resulting in inconvenient use. A wafer coating equipment can be designed to solve the above problems. Summary of the Utility Model
[0005] In order to overcome the disadvantages that due to the different specifications of the wafers, when the existing wafer coating equipment coats wafers, the staff needs to actively adjust the clamping structure to clamp and coat the wafers, and the manual adjustment efficiency is low, resulting in a decrease in the coating efficiency.
[0006] The technical solution of the utility model is: a wafer coating equipment, including a square plate and a clamping assembly; the clamping assembly is a place for fixed clamping. A clamping assembly for fixed clamping is arranged on the square plate; the clamping assembly includes a fixed slide rail; a moving slider is slidably connected to the fixed slide rail; a vertical slide rail is arranged at the upper end of the moving slider; a vertical slider is slidably connected to the vertical slide rail; the two fixed slide rails, the two moving sliders, the two vertical slide rails and the two vertical sliders are set as a whole, and there are two groups in the whole. A rotating motor is arranged on the inner vertical slider; a rotating shaft is arranged on the outer vertical slider.
[0007] Preferably, by setting a main support rotating connecting piece to perform a rotating operation; setting a clamping assembly to perform a moving clamping operation; setting an electroplating structure to perform a coating operation.
[0008] Preferably, two bidirectional sliding rails are arranged between two opposite rotating shafts; a moving block is slidably connected to the bidirectional sliding rails; a groove clamping frame is arranged on the moving block. The moving slider slides on the fixed sliding rail, and can adjust the clamping of wafers with different widths. The vertical slider slides on the vertical sliding rail, and can adjust the height. The moving block slides on the bidirectional sliding rail, driving the groove clamping frame to displace, so as to clamp the wafer. After coating on one side is completed, the rotating motor is started to drive the rotating shaft to rotate and perform coating on the other side.
[0009] Preferably, two fixed sliding rails, two moving sliders, two vertical sliding rails, two vertical sliders, one rotating motor, two rotating shafts, two bidirectional sliding rails, four moving blocks and four groove clamping frames are set as a main body, and there are four groups in total, which are respectively arranged around the device. The four groups of structures are convenient for improving the coating efficiency.
[0010] Preferably, a rotating rod is arranged at the lower end of the square plate; a large gear is arranged on the rotating rod. The square plate supports the main body, and the rotating rod is fixedly connected to the large gear.
[0011] Preferably, small gears are meshed and rotated around the large gear; a rotating shaft is arranged at the lower end of the small gear; a rotating motor is arranged at the lower end of the rotating shaft; a disc is arranged at the lower end of the rotating motor. When the rotating motor is started, it drives the rotating shaft and the small gears to rotate, so that the large gear meshed with them rotates to perform overall rotation. The disc fixes the main body.
[0012] Preferably, the rotating motor, the rotating shaft and the small gears are set as a group, and there are four groups in total, which are arranged around the large gear. The four groups of structures are convenient for meshing and rotating.
[0013] Preferably, an L-shaped fixing frame is arranged at the rear end of the disc; a push rod is arranged on the L-shaped fixing frame; an electroplating instrument is arranged at the lower end of the push rod. The L-shaped fixing frame fixedly supports the push rod, the push rod adjusts the height, and the electroplating instrument performs electroplating coating work.
[0014] The beneficial effects of the present utility model:
[0015] 1. By setting a bottom fixing part for fixed support, and at the same time setting a rotating connection structure at its upper end, it is convenient to carry out the main support and rotating connection work, and can rotate independently, which is convenient for use. An automatic clamping component is set at the upper end of the rotating structure, which is convenient for automatic adjustment and moving clamping work. It can fix wafers of different specifications and can also rotate to achieve turning over. Finally, an electroplating structure is set at its upper end for coating work with height adjustment. It overcomes the drawback that due to different specifications of wafers, when the existing wafer coating equipment coats wafers, workers need to actively adjust the clamping structure to clamp the wafers for coating, and the manual adjustment efficiency is low, resulting in a decrease in coating efficiency.
[0016] 2. By setting a main body mechanism for support and rotation work, when the rotation motor starts, it drives the rotating shaft and the small gear to rotate, so that the meshing large gear rotates, and the whole rotates. The disc is used for main body fixation. The four groups of structures are convenient for meshing rotation. The rotating rod is fixedly connected to the large gear, and the square plate supports the main body. Then, the clamping work is carried out through the set clamping structure. The moving slider slides on the fixed slide rail, and can adjust and clamp wafers of different widths. The vertical slider slides on the vertical slide rail to adjust the height. The moving block slides on the bidirectional slide rail, driving the groove clamping frame to displace, so as to clamp the wafer. After coating one side is completed, the rotation motor starts, driving the rotating shaft to rotate, and coating the other side. The four groups of structures are convenient for improving the coating efficiency. Finally, the coating work is carried out through the set electroplating structure. The L-shaped fixing frame fixedly supports the push rod, the push rod adjusts the height, and the electroplating instrument carries out electroplating coating work to complete the coating work of the wafer. Brief Description of the Drawings
[0017] Figure 1 Shows a three-dimensional structural schematic diagram of the wafer coating equipment of the present invention;
[0018] Figure 2 Shows a schematic diagram of the rotation motor of the wafer coating equipment of the present invention;
[0019] Figure 3 Shows a schematic diagram of the groove clamping frame of the wafer coating equipment of the present invention;
[0020] Figure 4 Shows a schematic diagram of the electroplating instrument of the wafer coating equipment of the present invention;
[0021] Description of reference numerals: 1, disc; 2, rotating motor; 3, rotating shaft; 4, small gear; 5, large gear; 6, rotating rod; 7, square plate; 9, L-shaped fixing bracket; 10, push rod; 11, electroplating instrument; 801, fixed sliding rail; 802, moving slider; 803, vertical sliding rail; 804, vertical slider; 805, rotating motor; 806, rotating shaft; 807, bidirectional sliding rail; 808, moving block; 809, groove clamping bracket. Detailed implementation manners
[0022] The present utility model will be further described below in conjunction with the accompanying drawings and embodiments.
[0023] Please refer to Figures 1 - 4 , the present utility model provides an embodiment: a rotating rod 6 is provided at the lower end of the square plate 7; a large gear 5 is provided on the rotating rod 6. A small gear 4 meshes and rotates around the large gear 5; a rotating shaft 3 is provided at the lower end of the small gear 4; a rotating motor 2 is provided at the lower end of the rotating shaft 3; a disc 1 is provided at the lower end of the rotating motor 2. The rotating motor 2, the rotating shaft 3 and the small gear 4 are set as a group, and a total of four groups are provided, surrounding the large gear 5. An L-shaped fixing bracket 9 is provided at the rear end of the disc 1; a push rod 10 is provided on the L-shaped fixing bracket 9; an electroplating instrument 11 is provided at the lower end of the push rod 10. The rotating motor 2 is started, driving the rotating shaft 3 and the small gear 4 to rotate, so that the meshing large gear 5 rotates, performing overall rotation. The disc 1 is fixedly supported. The four groups of structures are convenient for meshing rotation. The rotating rod 6 is fixedly connected to the large gear 5, and the square plate 7 supports the main body. The L-shaped fixing bracket 9 fixedly supports the push rod 10, the push rod 10 adjusts the height, and the electroplating instrument 11 performs electroplating coating work.
[0024] Please refer to Figure 1 and Figure 3, the present utility model provides an embodiment: a wafer coating device, including a square plate 7; characterized in that: it further includes a clamping assembly; a clamping assembly for fixed clamping is provided on the square plate 7; the clamping assembly includes a fixed slide rail 801; a moving slider 802 is slidably connected to the fixed slide rail 801; a vertical slide rail 803 is provided at the upper end of the moving slider 802; a vertical slider 804 is slidably connected to the vertical slide rail 803; two fixed slide rails 801, two moving sliders 802, two vertical slide rails 803 and two vertical sliders 804 are set as a whole, there are two groups in the whole, a rotating motor 805 is provided on the inner vertical slider 804; a rotating shaft 806 is provided on the outer vertical slider 804. Two bidirectional slide rails 807 are provided between two opposite rotating shafts 806; a moving block 808 is slidably connected to the bidirectional slide rail 807; a groove clamping frame 809 is provided on the moving block 808. Two fixed slide rails 801, two moving sliders 802, two vertical slide rails 803, two vertical sliders 804, one rotating motor 805, two rotating shafts 806, two bidirectional slide rails 807, four moving blocks 808 and four groove clamping frames 809 are set as a main body, and there are four groups in total, which are respectively placed around the device. The moving slider 802 slides on the fixed slide rail 801 to adjust and clamp wafers of different widths. The vertical slider 804 slides on the vertical slide rail 803 to adjust the height. The moving block 808 slides on the bidirectional slide rail 807 to drive the groove clamping frame 809 to displace, so as to clamp the wafer. After one side is coated, the rotating motor 805 is started to drive the rotating shaft 806 to rotate and coat the other side. The four groups of structures are convenient for improving the coating efficiency.
[0025] When working, the rotating motor 2 is started to drive the rotating shaft 3 and the small gear 4 to rotate, so that the meshing large gear 5 rotates to perform overall rotation. The disc 1 is fixed to the main body. The four groups of structures are convenient for meshing rotation. The rotating rod 6 is fixedly connected to the large gear 5, and the square plate 7 supports the main body. The moving slider 802 slides on the fixed slide rail 801 to adjust and clamp wafers of different widths. The vertical slider 804 slides on the vertical slide rail 803 to adjust the height. The moving block 808 slides on the bidirectional slide rail 807 to drive the groove clamping frame 809 to displace, so as to clamp the wafer. After one side is coated, the rotating motor 805 is started to drive the rotating shaft 806 to rotate and coat the other side. The four groups of structures are convenient for improving the coating efficiency. The L-shaped fixing frame 9 fixedly supports the push rod 10, the push rod 10 adjusts the height, and the electroplating instrument 11 performs electroplating coating work to complete all work.
[0026] Through the above steps, by setting the bottom fixing member for fixed support, and at the same time setting a rotational connection structure at its upper end, it is convenient to carry out the main support and rotational connection work, enabling autonomous rotation, facilitating use. The rotation motor 2 is started to drive the rotation shaft 3 and the small gear 4 to rotate, so that the meshing large gear 5 rotates, achieving overall rotation. The disc 1 is fixedly supported. The four groups of structures are convenient for meshing rotation. The rotating rod 6 is fixedly connected to the large gear 5, and the square plate 7 supports the main body. An automated clamping assembly is provided at the upper end of the rotating structure, facilitating automatic adjustment and moving clamping work. It can fix wafers of different specifications and can also rotate to achieve turning over. The moving slider 802 slides on the fixed slide rail 801 to adjust and clamp wafers of different widths. The vertical slider 804 slides on the vertical slide rail 803 to adjust the height. The moving block 808 slides on the bidirectional slide rail 807 to drive the groove clamping frame 809 to displace, thereby clamping the wafer. After coating one side is completed, the rotation motor 805 is started to drive the rotation shaft 806 to rotate for coating the other side. The four groups of structures are convenient for improving the coating efficiency. Finally, an electroplating structure is provided at its upper end for coating work with height adjustment. The L-shaped fixing frame 9 fixedly supports the push rod 10, the push rod 10 adjusts the height, and the electroplating instrument 11 performs electroplating coating work. It overcomes the drawback that due to the different specifications of wafers, when the existing wafer coating equipment coats wafers, the staff needs to actively adjust the clamping structure to clamp and coat the wafers, and the manual adjustment efficiency is low, resulting in a decrease in the coating efficiency.
[0027] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the purpose of the present invention.
Claims
1. A wafer coating device, comprising a square plate (7); characterized in that: It further includes a clamping assembly; a clamping assembly for fixing and clamping is provided on the square plate (7); the clamping assembly includes a fixed slide rail (801); a moving slider (802) is slidably connected to the fixed slide rail (801); a vertical slide rail (803) is provided at the upper end of the moving slider (802); a vertical slider (804) is slidably connected to the vertical slide rail (803); two fixed slide rails (801), two moving sliders (802), two vertical slide rails (803) and two vertical sliders (804) are set as a whole, and there are two groups in the whole, a rotating motor (805) is provided on the inner vertical slider (804); a rotating shaft (806) is provided on the outer vertical slider (804).
2. The wafer coating equipment according to claim 1, characterized in that: Two bidirectional slide rails (807) are provided between two opposite rotating shafts (806); a moving block (808) is slidably connected to the bidirectional slide rail (807); a groove clamping frame (809) is provided on the moving block (808).
3. A wafer coating device according to claim 1, characterized in that: Two fixed slide rails (801), two moving sliders (802), two vertical slide rails (803), two vertical sliders (804), one rotating motor (805), two rotating shafts (806), two bidirectional slide rails (807), four moving blocks (808) and four groove clamping frames (809) are set as a main body, and there are four groups in total, which are respectively arranged around the device.
4. A wafer coating device according to claim 1, characterized in that: A rotating rod (6) is provided at the lower end of the square plate (7); a large gear (5) is provided on the rotating rod (6).
5. A wafer coating device according to claim 4, characterized in that: Small gears (4) are meshed and rotated around the large gear (5); a rotating shaft (3) is provided at the lower end of the small gear (4); a rotating motor (2) is provided at the lower end of the rotating shaft (3); a disc (1) is provided at the lower end of the rotating motor (2).
6. A wafer coating device according to claim 5, characterized in that: The rotating motor (2), the rotating shaft (3) and the small gear (4) are set as a group, and there are four groups in total, surrounding the large gear (5).
7. A wafer coating device according to claim 5, characterized in that: An L-shaped fixing frame (9) is provided at the rear end of the disc (1); a push rod (10) is provided on the L-shaped fixing frame (9); a plating instrument (11) is provided at the lower end of the push rod (10).