Liquid cooling heat dissipation device and LED lamp

Abstract

The utility model provides a liquid cooling heat dissipation device and an LED lamp. The liquid cooling heat dissipation device comprises a first heat dissipation assembly and a second heat dissipation assembly, the second heat dissipation assembly comprises a second heat dissipation plate used for dissipating heat of the circuit board, and the second heat dissipation plate is provided with a second heat dissipation cavity communicated with the first heat dissipation cavity; the third heat dissipation assembly comprises a third heat dissipation plate used for dissipating heat of the transistor, the third heat dissipation plate is arranged on the second heat dissipation plate, and the third heat dissipation plate is provided with a third heat dissipation cavity communicated with the first heat dissipation cavity and the second heat dissipation cavity; the fourth heat dissipation assembly comprises a fourth heat dissipation plate used for dissipating heat of the LED light source, and the fourth heat dissipation plate is provided with a fourth heat dissipation cavity communicated with the first heat dissipation cavity; and the driving assembly is used for driving the cooling liquid to circularly flow in the first heat dissipation cavity, the second heat dissipation cavity, the third heat dissipation cavity and the fourth heat dissipation cavity. By the adoption of the technical scheme, the size of the liquid cooling heat dissipation device is reduced, and the LED lamp can be thinned.

Description

Technical Field

[0001] The utility model relates to the technical field of LED lamps, and more specifically, to a liquid cooling heat dissipation device and an LED lamp. Background Art

[0002] With the booming development of the current electronics industry, the power consumption of various electronics industries is getting larger and larger. In the current LED industry, due to the increase in power consumption, the heat generation of LED light sources, circuit boards, and MOS transistors is becoming more and more serious. The application of MOS transistors (Metal-Oxide-Semiconductor Field-Effect Transistors) in LED lamps is mainly reflected in adjusting the brightness and current of LEDs, achieving efficient control of LEDs, and improving the stability and safety of LED non-isolated power supplies. However, LED lamps are usually cooled by liquid cooling heat dissipation devices. The existing liquid cooling heat dissipation devices occupy a large space and cannot be thinned with LED light sources and MOS transistors, increasing the volume of LED lamps. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a liquid cooling heat dissipation device and an LED lamp to solve the technical problem in the prior art that the volume of the LED lamp is large due to the large space occupied by the internal heat dissipation components and the thinness cannot be achieved.

[0004] To achieve the above purpose, the technical solution adopted by the utility model is:

[0005] In the first aspect, a liquid cooling heat dissipation device is provided, including:

[0006] A first heat dissipation component, including a first heat dissipation plate and an air cooling component. A first heat dissipation cavity for circulating coolant is provided inside the first heat dissipation plate, and the air cooling component is used to cool the first heat dissipation plate;

[0007] A second heat dissipation component, including a second heat dissipation plate for dissipating heat from a circuit board. The second heat dissipation plate is provided with a second heat dissipation cavity communicated with the first heat dissipation cavity;

[0008] A third heat dissipation component, including a third heat dissipation plate for dissipating heat from a transistor. The third heat dissipation plate is arranged on the second heat dissipation plate, and the third heat dissipation plate is provided with a third heat dissipation cavity communicated with the first heat dissipation cavity and the second heat dissipation cavity;

[0009] A fourth heat dissipation component, including a fourth heat dissipation plate for dissipating heat from an LED light source. The fourth heat dissipation plate is provided with a fourth heat dissipation cavity communicated with the first heat dissipation cavity;

[0010] A driving component for driving the coolant to circulate in the first heat dissipation cavity, the second heat dissipation cavity, the third heat dissipation cavity and the fourth heat dissipation cavity.

[0011] By adopting the above technical solution, the liquid cooling heat dissipation device of this embodiment can simultaneously dissipate heat from the LED light source, the circuit board and the transistor in the LED lamp, improving the integration degree of the liquid cooling heat dissipation device; at the same time, the third heat dissipation plate for dissipating heat from the transistor is arranged on the second heat dissipation plate, enabling the second heat dissipation plate and the third heat dissipation plate to simultaneously dissipate heat from the transistor, improving the heat dissipation efficiency of the transistor and also enhancing the integration degree of the second heat dissipation plate and the third heat dissipation plate, further reducing the volume of the liquid cooling heat dissipation device and enabling the LED lamp equipped with the liquid cooling heat dissipation device of this embodiment to be thin.

[0012] In one embodiment, the second heat dissipation plate is provided with a second heat dissipation surface for abutting against the circuit board, and the third heat dissipation plate is provided with a third heat dissipation surface for abutting against the transistor on the circuit board, and the third heat dissipation surface is arranged perpendicular to the second heat dissipation surface.

[0013] By adopting the above technical solution, at least two surfaces of the transistor can be in contact with the third heat dissipation surface and the second heat dissipation surface respectively, improving the heat dissipation efficiency of the transistor.

[0014] In one embodiment, the third heat dissipation plate is provided with two opposite third heat dissipation surfaces for abutting against the transistors located on both sides of the third heat dissipation plate.

[0015] By adopting the above technical solution, one third heat dissipation plate can simultaneously dissipate heat from two rows of transistors, saving the number of third heat dissipation plates arranged, reducing the cost and shrinking the volume of the entire liquid cooling heat dissipation device.

[0016] In one embodiment, the first heat dissipation component further includes a first through pipe connecting the first heat dissipation plate and the second heat dissipation plate, and the first through pipe is provided with a first heat dissipation channel, and the first heat dissipation channel communicates the first heat dissipation cavity and the second heat dissipation cavity;

[0017] The second heat dissipation component further includes a second through pipe connecting the second heat dissipation plate and the third heat dissipation plate, and the second through pipe is provided with a second heat dissipation channel, and the second heat dissipation channel communicates the second heat dissipation cavity and the third heat dissipation cavity;

[0018] The third heat dissipation component further includes a third through pipe connecting the third heat dissipation plate and the first heat dissipation plate, and the third through pipe is provided with a third heat dissipation channel, and the third heat dissipation channel communicates the third heat dissipation cavity and the first heat dissipation cavity;

[0019] The fourth heat dissipation component further includes a fourth through pipe and a fifth through pipe connecting the fourth heat dissipation plate and the first heat dissipation plate, and the fourth through pipe and the fifth through pipe communicate the fourth heat dissipation cavity and the first heat dissipation cavity.

[0020] Here, it can be understood that the shape of the second heat dissipation cavity is "U"-shaped, which has a head end and a tail end. In this way, when the coolant flows between the head end and the tail end, it can flow from a part of the second heat dissipation plate to another part. This design takes into account the fluidity of the coolant, increases the contact area between the coolant and the inner wall of the second heat dissipation plate, and improves the cooling efficiency.

[0021] By adopting the above technical solution, the first through pipe, the second through pipe, the third through pipe, the fourth through pipe and the fifth through pipe realize the communication between the first heat dissipation cavity, the second heat dissipation cavity, the third heat dissipation cavity and the fourth heat dissipation cavity.

[0022] In one embodiment, at least one of the first through pipe, the second through pipe, the third through pipe and the fourth through pipe is a flexible through pipe.

[0023] By adopting the above technical solution, the adjustment flexibility of the positions of the second heat dissipation component, the third heat dissipation component and the fourth heat dissipation component relative to the first heat dissipation component is improved.

[0024] In one embodiment, the second heat dissipation component is arranged on one side of the first heat dissipation component, and the third heat dissipation component and the fourth heat dissipation component are arranged on the other side of the first heat dissipation component.

[0025] By adopting the above technical solution, the thickness of the liquid cooling heat dissipation device is reduced, making it thinner.

[0026] In one embodiment, the first heat dissipation component includes a plurality of first heat dissipation plates, and two adjacent first heat dissipation plates are arranged at intervals and form a heat dissipation gap, and the air cooling member is arranged opposite to the plurality of heat dissipation gaps.

[0027] By adopting the above technical solution, the heat dissipation efficiency of the first heat dissipation component is improved.

[0028] In one embodiment, the first heat dissipation component includes a plurality of the first heat dissipation plates arranged in sequence along the width direction of the first heat dissipation component; and / or, the first heat dissipation component includes a plurality of the first heat dissipation plates arranged in sequence along the thickness direction of the first heat dissipation component.

[0029] By adopting the above technical solution, the plurality of first heat dissipation plates are arranged in an array, improving the regularity of the first heat dissipation component package and facilitating the arrangement of the first heat dissipation component.

[0030] In one embodiment, a plurality of heat dissipation fins arranged along the length direction of the first heat dissipation assembly are provided between two adjacent first heat dissipation plates, and the heat dissipation fins are in contact with the adjacent first heat dissipation plates and divide the heat dissipation gap into a plurality of heat dissipation segments.

[0031] By adopting the above technical solution, the heat dissipation efficiency of the first heat dissipation assembly is further improved.

[0032] In a second aspect, an LED lamp is provided, which includes an LED light source, a circuit board, a transistor, and the above liquid cooling heat dissipation device, and the LED light source, the circuit board, and the transistor are arranged on the liquid cooling heat dissipation device.

[0033] By adopting the above technical solution, on the basis of having the advantages of the liquid cooling heat dissipation device in the above embodiment, the LED lamp in this embodiment also has the advantage of being thin. Description of the Drawings

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be used in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0035] Figure 1 is a three-dimensional structure diagram of the liquid cooling heat dissipation device provided by the embodiment of the present invention from the first perspective.

[0036] Figure 2 is an exploded view of the liquid cooling heat dissipation device provided by the embodiment of the present invention from the first perspective.

[0037] Figure 3 is an exploded view of the liquid cooling heat dissipation device provided by the embodiment of the present invention from the second perspective.

[0038] Figure 4 is a three-dimensional structure diagram of the liquid cooling heat dissipation device provided by the embodiment of the present invention from the third perspective.

[0039] Figure 5 is Figure 4 an enlarged view of the "A" part in

[0040] The reference numerals in the drawings are as follows:

[0041] 1, first heat dissipation assembly; 2, second heat dissipation assembly; 3, third heat dissipation assembly; 4, fourth heat dissipation assembly; 5, drive assembly;

[0042] 11. First heat dissipation plate; 12. Air cooling component; 13. First heat dissipation cavity; 14. First through pipe; 21. Circuit board; 22. Second heat dissipation plate; 23. Second heat dissipation cavity; 24. Second through pipe; 31. Transistor; 32. Third heat dissipation plate; 33. Third heat dissipation cavity; 34. Third through pipe; 41. LED light source; 42. Fourth heat dissipation plate; 43. Fourth heat dissipation cavity; 44. Fourth through pipe; 45. Fifth through pipe;

[0043] 221. Second heat dissipation surface; 321. Third heat dissipation surface; 111. Heat dissipation gap; X. Width direction; Y. Thickness direction; 112. Heat dissipation fin;

[0044] 1111. Heat dissipation section. Detailed implementation mode

[0045] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present utility model clearer, the present utility model will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0046] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected or indirectly connected to the other element.

[0047] It should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model, rather than indicating that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present utility model.

[0048] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating relative importance or indicating the number of technical features. In the description of the present utility model, the meaning of "a plurality of" is two or more, unless otherwise specifically defined. The following describes the specific implementation of the present utility model in more detail with reference to specific embodiments:

[0049] As Figures 1 to 3As shown in the figure, an embodiment of the present utility model provides a liquid cooling heat dissipation device, which is used to be installed in an LED lamp so that the LED lamp can dissipate heat quickly; in this embodiment, the LED lamp includes, but is not limited to, a supplementary light lamp for photography. In a photography scene, the power of the supplementary light lamp is large, and a liquid cooling heat dissipation device with good heat dissipation effect is required; the liquid cooling heat dissipation device of this embodiment has the advantages of high heat dissipation efficiency and small volume; the following is illustrated through specific embodiments:

[0050] The liquid cooling heat dissipation device of this embodiment includes:

[0051] The first heat dissipation component 1, including a first heat dissipation plate 11 and an air cooling component 12. A first heat dissipation cavity 13 for circulating coolant is provided inside the first heat dissipation plate 11, and the air cooling component 12 is used to cool the first heat dissipation plate 11;

[0052] The second heat dissipation component 2, including a second heat dissipation plate 22 for dissipating heat from the circuit board 21. The second heat dissipation plate 22 is provided with a second heat dissipation cavity 23 communicating with the first heat dissipation cavity 13;

[0053] The third heat dissipation component 3, including a third heat dissipation plate 32 for dissipating heat from the transistor 31. The third heat dissipation plate 32 is arranged on the second heat dissipation plate 22, and the third heat dissipation plate 32 is provided with a third heat dissipation cavity 33 communicating with the first heat dissipation cavity 13 and the second heat dissipation cavity 23;

[0054] The fourth heat dissipation component 4, including a fourth heat dissipation plate 42 for dissipating heat from the LED light source 41. The fourth heat dissipation plate 42 is provided with a fourth heat dissipation cavity 43 communicating with the first heat dissipation cavity 13;

[0055] The driving component 5 is used to drive the coolant to circulate in the first heat dissipation cavity 13, the second heat dissipation cavity 23, the third heat dissipation cavity 33 and the fourth heat dissipation cavity 43.

[0056] Among them, the first heat dissipation component 1 refers to a component for heat exchange with air; the first heat dissipation component 1 includes a first heat dissipation plate 11 and an air cooling component 12. The first heat dissipation plate 11 refers to a plate-like structure. A first heat dissipation cavity 13 is provided inside the first heat dissipation plate 11, and the first heat dissipation cavity 13 is for the coolant to flow; the air cooling component 12 refers to a structure that drives air flow to take away heat. In this embodiment, the air cooling component 12 is a fan, and the air cooling component 12 drives air to flow on the surface of the first heat dissipation plate 11, so that heat exchange occurs between the air and the first heat dissipation plate 11 to cool the temperature of the coolant in the first heat dissipation cavity 13;

[0057] The second heat dissipation component 2 refers to a component used for heat exchange with the circuit board 21; the second heat dissipation component 2 includes a second heat dissipation plate 22, the second heat dissipation plate 22 refers to a plate-like structure, and a second heat dissipation cavity 23 is provided inside the second heat dissipation plate 22 for the coolant to flow; the second heat dissipation cavity 23 is communicated with the first heat dissipation cavity 13, that is, the coolant can flow from the first heat dissipation cavity 13 to the second heat dissipation cavity 23, and the coolant exchanges heat with the circuit board 21 arranged on the second heat dissipation plate 22 in the second heat dissipation cavity 23 to cool the circuit board 21, and the coolant after heat exchange flows back to the first heat dissipation cavity 13 from the second heat dissipation cavity 23 again for cooling;

[0058] The third heat dissipation component 3 refers to a component used for heat exchange with the transistor 31 (MOS transistor, metal-oxide-semiconductor field-effect transistor); the third heat dissipation component 3 includes a third heat dissipation plate 32, the third heat dissipation plate 32 refers to a plate-like structure, and a third heat dissipation cavity 33 is provided inside the third heat dissipation plate 32 for the coolant to flow; the third heat dissipation plate 32 is arranged on the second heat dissipation plate 22, and the third heat dissipation cavity 33 is communicated with the first heat dissipation cavity 13 and the second heat dissipation cavity 23, that is, the coolant can flow from the first heat dissipation cavity 13 to the third heat dissipation cavity 33, or from the second heat dissipation cavity 23 to the third heat dissipation cavity 33, that is, whether the coolant enters the second heat dissipation cavity 23 or the third heat dissipation cavity 33 first depends on the flow direction of the coolant. If the coolant flows into the second heat dissipation cavity 23 first, the circuit board 21 is cooled first, and if the coolant flows into the third heat dissipation cavity 33 first, the transistor 31 is cooled first; the coolant exchanges heat with the transistor 31 arranged on the third heat dissipation plate 32 in the third heat dissipation cavity 33 to cool the transistor 31, and the coolant after heat exchange flows back to the first heat dissipation cavity 13 from the third heat dissipation cavity 33 again for cooling; it should be further explained that since the transistor 31 generates a large amount of heat during operation, the third heat dissipation plate 32 is arranged on the second heat dissipation plate 22 to jointly dissipate heat from the transistor 31 and improve the heat dissipation efficiency of the transistor 31;

[0059] The fourth heat dissipation component 4 refers to a component used for heat exchange with the LED light source 41; the fourth heat dissipation component 4 includes a fourth heat dissipation plate 42, the fourth heat dissipation plate 42 refers to a plate-like structure, and a fourth heat dissipation cavity 43 is provided inside the fourth heat dissipation plate 42 for the coolant to flow; the fourth heat dissipation cavity 43 is communicated with the first heat dissipation cavity 13, that is, the coolant can flow from the first heat dissipation cavity 13 to the fourth heat dissipation cavity 43, and the coolant exchanges heat with the LED light source 41 arranged on the fourth heat dissipation plate 42 in the fourth heat dissipation cavity 43 to cool the LED light source 41, and the coolant after heat exchange flows back to the first heat dissipation cavity 13 from the fourth heat dissipation cavity 43 again for cooling;

[0060] The driving component 5 refers to the component used to drive the coolant to flow; the driving component 5 includes but is not limited to a liquid pump; the driving component 5 is used to drive the coolant to circulate in the first heat dissipation cavity 13, the second heat dissipation cavity 23, the third heat dissipation cavity 33 and the fourth heat dissipation cavity 43; here, it needs to be further explained that the coolant can flow from the first heat dissipation cavity 13 to the second heat dissipation cavity 23 and the third heat dissipation cavity 33, then flow back to the first heat dissipation cavity 13, and then flow from the first heat dissipation cavity 13 to the fourth heat dissipation cavity 43; or, the coolant can flow from the first heat dissipation cavity 13 to the fourth heat dissipation cavity 43, then flow back from the fourth heat dissipation cavity 43 to the first heat dissipation cavity 13, then flow from the first heat dissipation cavity 13 to the third heat dissipation cavity 33, then flow from the third heat dissipation cavity 33 to the second heat dissipation cavity 23, and finally flow back from the second heat dissipation cavity 23 to the first heat dissipation cavity 13.

[0061] By adopting the above technical solution, the liquid cooling heat dissipation device of this embodiment can simultaneously dissipate heat from the LED light source 41, the circuit board 21 and the transistor 31 in the LED lamp, improving the integration degree of the liquid cooling heat dissipation device; at the same time, the third heat dissipation plate 32 for dissipating heat from the transistor 31 is arranged on the second heat dissipation plate 22, so that the second heat dissipation plate 22 and the third heat dissipation plate 32 can simultaneously dissipate heat from the transistor 31, improving the heat dissipation efficiency of the transistor 31 and also improving the integration degree of the second heat dissipation plate 22 and the third heat dissipation plate 32, further reducing the volume of the liquid cooling heat dissipation device, and enabling the LED lamp equipped with the liquid cooling heat dissipation device of this embodiment to be thin.

[0062] In one embodiment, the second heat dissipation plate 22 is provided with a second heat dissipation surface 221 for abutting against the circuit board 21, and the third heat dissipation plate 32 is provided with a third heat dissipation surface 321 for abutting against the transistor 31 on the circuit board 21, and the third heat dissipation surface 321 is arranged perpendicular to the second heat dissipation surface 221.

[0063] Here, it can be understood that the second heat dissipation surface 221 refers to the surface of the second heat dissipation plate 22 for contacting the circuit board 21, and the heat of the circuit board 21 can be transferred to the coolant in the second heat dissipation cavity 23 through the second heat dissipation surface 221 to achieve heat dissipation; the third heat dissipation surface 321 refers to the surface of the third heat dissipation plate 32 for contacting the transistor 31, and the heat of the transistor 31 can be transferred to the coolant in the third heat dissipation cavity 33 through the third heat dissipation surface 321 to achieve heat dissipation; the third heat dissipation surface 321 is arranged perpendicular to the second heat dissipation surface 221, so that the third heat dissipation surface 321 and the second heat dissipation surface 221 can jointly dissipate heat from the transistor 31.

[0064] By adopting the above technical solution, at least two surfaces of the transistor 31 can be in contact with the third heat dissipation surface 321 and the second heat dissipation surface 221 respectively, improving the heat dissipation efficiency of the transistor 31.

[0065] In one embodiment, the third heat dissipation plate 32 is provided with two opposite third heat dissipation surfaces 321, and the third heat dissipation surfaces 321 are used for abutting against the transistors 31 located on both sides of the third heat dissipation plate 32.

[0066] Here, it can be understood that there are at least two rows of transistors 31 provided on the circuit board 21, and the third heat dissipation plate 32 is disposed between the two rows of transistors 31. The third heat dissipation plate 32 is provided with two third heat dissipation surfaces 321, and the two third heat dissipation surfaces 321 are in contact with the two rows of transistors 31 respectively.

[0067] By adopting the above technical solution, one third heat dissipation plate 32 can dissipate heat from two rows of transistors 31 at the same time, saving the number of third heat dissipation plates 32 provided, reducing the cost and reducing the volume of the entire liquid cooling heat dissipation device.

[0068] In one embodiment, the third heat dissipation plate 32 includes a heat dissipation main portion 3210 and a plurality of heat dissipation branch portions 3220 provided on the heat dissipation main body 321. The heat dissipation main portion 3210 extends along the width direction X, and the heat dissipation branch portions 3220 extend from the heat dissipation main portion 3210 along the thickness direction Y. The heat dissipation main portion 3210 is in contact with a part of the transistors 31, and the heat dissipation branch portions 3220 are in contact with another part of the transistors 31. Such a design increases the heat dissipation area of the third heat dissipation plate 32, enabling the third heat dissipation plate 32 to dissipate heat from more transistors 31 at the same time.

[0069] In one embodiment, the first heat dissipation component 1 further includes a first through pipe 14 connecting the first heat dissipation plate 11 and the second heat dissipation plate 22. The first through pipe 14 is provided with a first heat dissipation channel, and the first heat dissipation channel communicates with the first heat dissipation cavity 13 and the second heat dissipation cavity 23;

[0070] The second heat dissipation component 2 further includes a second through pipe 24 connecting the second heat dissipation plate 22 and the third heat dissipation plate 32. The second through pipe 24 is provided with a second heat dissipation channel, and the second heat dissipation channel communicates with the second heat dissipation cavity 23 and the third heat dissipation cavity 33;

[0071] The third heat dissipation component 3 further includes a third through pipe 34 connecting the third heat dissipation plate 32 and the first heat dissipation plate 11. The third through pipe 34 is provided with a third heat dissipation channel, and the third heat dissipation channel communicates with the third heat dissipation cavity 33 and the first heat dissipation cavity 13;

[0072] The fourth heat dissipation component 4 further includes a fourth through pipe 44 and a fifth through pipe 45 connecting the fourth heat dissipation plate 42 and the first heat dissipation plate 11. The fourth through pipe 44 and the fifth through pipe 45 communicate the fourth heat dissipation cavity 43 and the first heat dissipation cavity 13.

[0073] By adopting the above technical solution, the first through pipe 14 , the second through pipe 24 , the third through pipe 34 , the fourth through pipe 44 and the fifth through pipe 45 realize the communication between the first heat dissipation cavity 13 , the second heat dissipation cavity 23 , the third heat dissipation cavity 33 and the fourth heat dissipation cavity 43 .

[0074] In one embodiment, at least one of the first through-tube 14 , the second through-tube 24 , the third through-tube 34 , the fourth through-tube 44 , and the fifth through-tube 45 is a flexible through-tube.

[0075] Here, it can be understood that the flexible through pipe refers to a through pipe that can be deformed, so that the second heat dissipation component 2, the third heat dissipation component 3 and the fourth heat dissipation component 4 have high flexibility in adjusting the positions relative to the first heat dissipation component 1, which is beneficial to the arrangement of internal components of the liquid-cooled heat dissipation device.

[0076] By adopting the above technical solution, the flexibility of adjusting the positions of the second heat dissipation component 2 , the third heat dissipation component 3 and the fourth heat dissipation component 4 relative to the first heat dissipation component 1 is improved.

[0077] In one embodiment, the second heat dissipation component 2 is disposed on one side of the first heat dissipation component 1 , and the third heat dissipation component 3 and the fourth heat dissipation component 4 are disposed on the other side of the first heat dissipation component 1 .

[0078] Here, it can be understood that the first heat dissipation component 1, the second heat dissipation component 2, the third heat dissipation component 3 and the fourth heat dissipation component 4 are basically in the same plane, which is conducive to the thinning of the liquid cooling device.

[0079] By adopting the above technical solution, the thickness of the liquid cooling heat dissipation device is reduced, making it thinner.

[0080] Please also read Figure 3 , Figure 4 and Figure 5 In one embodiment, the first heat dissipation assembly 1 includes a plurality of first heat dissipation plates 11 , two adjacent first heat dissipation plates 11 are spaced apart and form a heat dissipation gap 111 , and the air cooling member 12 is disposed relative to the plurality of heat dissipation gaps 111 .

[0081] Here, it can be understood that multiple first heat dissipation plates 11 can improve the heat dissipation efficiency of the first heat dissipation assembly 1, and a heat dissipation gap 111 is formed between two adjacent first heat dissipation plates 11. The air cooling component 12 is arranged relative to the heat dissipation gap 111. The air cooling component 12 drives air to flow through the heat dissipation gap 111 and take away the heat of the first heat dissipation plate 11.

[0082] By adopting the above technical solution, the heat dissipation efficiency of the first heat dissipation component 1 is improved.

[0083] In one embodiment, the first heat dissipation assembly 1 includes a plurality of first heat dissipation plates 11 sequentially arranged along the width direction X of the first heat dissipation assembly 1; or, the first heat dissipation assembly 1 includes a plurality of first heat dissipation plates 11 sequentially arranged along the thickness direction Y of the first heat dissipation assembly 1. In other embodiments, the first heat dissipation assembly 1 includes a plurality of first heat dissipation plates 11 sequentially arranged along the width direction X of the first heat dissipation assembly 1; and, the first heat dissipation assembly 1 includes a plurality of first heat dissipation plates 11 sequentially arranged along the thickness direction Y of the first heat dissipation assembly 1.

[0084] By adopting the above technical solution, a plurality of first heat dissipation plates 11 are arranged in a display, thereby improving the regularity of the first heat dissipation component 1 and facilitating the arrangement of the first heat dissipation component 1 .

[0085] In one embodiment, a plurality of heat sinks 112 arranged along the length direction of the first heat sink assembly 1 are provided between two adjacent first heat sinks 11 . The heat sinks 112 abut against the adjacent first heat sinks 11 and divide the heat sink gap 111 into a plurality of heat sink segments 1111 .

[0086] Here, it can be understood that multiple heat sinks 112 can improve the heat dissipation efficiency of the first heat dissipation component 1, and a heat dissipation section 1111 is formed between two adjacent heat sinks 112. The air cooling component 12 is arranged relative to the heat dissipation section 1111. The air cooling component 12 drives air to flow through the heat dissipation section 1111 and take away the heat of the heat sink 112. Since the heat sink 112 is in contact with the first heat sink 11, the air cooling component 12 simultaneously takes away the heat of the first heat sink 11.

[0087] By adopting the above technical solution, the heat dissipation efficiency of the first heat dissipation component 1 is further improved.

[0088] In a second aspect, an LED lamp is provided, comprising an LED light source 41, a circuit board 21, a transistor 31 and the above-mentioned liquid cooling heat dissipation device, wherein the LED light source 41, the circuit board 21 and the transistor 31 are arranged on the liquid cooling heat dissipation device.

[0089] By adopting the above technical solution, on the basis of having the advantages of the liquid cooling heat dissipation device of the above embodiment, the LED lamp of this embodiment also has the advantage of being thin.

[0090] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A liquid cooling and heat dissipation device, characterized in that, Comprising: A first heat dissipation component (1), including a first heat dissipation plate (11) and an air cooling member (12). A first heat dissipation cavity (13) for circulating a coolant is provided inside the first heat dissipation plate (11), and the air cooling member (12) is used to cool the first heat dissipation plate (11); A second heat dissipation component (2), including a second heat dissipation plate (22) for dissipating heat from a circuit board (21). The second heat dissipation plate (22) is provided with a second heat dissipation cavity (23) communicating with the first heat dissipation cavity (13); A third heat dissipation component (3), including a third heat dissipation plate (32) for dissipating heat from a transistor (31). The third heat dissipation plate (32) is disposed on the second heat dissipation plate (22), and the third heat dissipation plate (32) is provided with a third heat dissipation cavity (33) communicating with the first heat dissipation cavity (13) and the second heat dissipation cavity (23); A fourth heat dissipation component (4), including a fourth heat dissipation plate (42) for dissipating heat from an LED light source (41). The fourth heat dissipation plate (42) is provided with a fourth heat dissipation cavity (43) communicating with the first heat dissipation cavity (13); A driving component (5) for driving the coolant to circulate in the first heat dissipation cavity (13), the second heat dissipation cavity (23), the third heat dissipation cavity (33), and the fourth heat dissipation cavity (43).

2. The liquid cooling and heat dissipation device according to claim 1, characterized in that The second heat dissipation plate (22) is provided with a second heat dissipation surface (221) for abutting against the circuit board (21), and the third heat dissipation plate (32) is provided with a third heat dissipation surface (321) for abutting against the transistor (31) on the circuit board (21). The third heat dissipation surface (321) is disposed perpendicular to the second heat dissipation surface (221).

3. The liquid cooling heat dissipation device according to claim 2, characterized in that, The third heat dissipation plate (32) is provided with two opposite third heat dissipation surfaces (321), and the third heat dissipation surfaces (321) are used to abut against the transistors (31) located on both sides of the third heat dissipation plate (32).

4. The liquid cooling and heat dissipation device according to claim 1, wherein The first heat dissipation component (1) further includes a first through pipe (14) connecting the first heat dissipation plate (11) and the second heat dissipation plate (22). The first through pipe (14) is provided with a first heat dissipation channel, and the first heat dissipation channel communicates the first heat dissipation cavity (13) and the second heat dissipation cavity (23); The second heat dissipation component (2) further includes a second through pipe (24) connecting the second heat dissipation plate (22) and the third heat dissipation plate (32). The second through pipe (24) is provided with a second heat dissipation channel, and the second heat dissipation channel communicates the second heat dissipation cavity (23) and the third heat dissipation cavity (33); The third heat dissipation component (3) further includes a third through pipe (34) connecting the third heat dissipation plate (32) and the first heat dissipation plate (11). The third through pipe (34) is provided with a third heat dissipation channel, and the third heat dissipation channel communicates the third heat dissipation cavity (33) and the first heat dissipation cavity (13); The fourth heat dissipation component (4) further includes a fourth through pipe (44) and a fifth through pipe (45) connecting the fourth heat dissipation plate (42) and the first heat dissipation plate (11), and the fourth through pipe (44) and the fifth through pipe (45) communicate the fourth heat dissipation cavity (43) and the first heat dissipation cavity (13).

5. The liquid cooling and heat dissipation device according to claim 4, wherein, At least one of the first through pipe (14), the second through pipe (24), the third through pipe (34), the fourth through pipe (44), and the fifth through pipe (45) is a flexible through pipe.

6. The liquid cooling and heat dissipation device according to any one of claims 1 to 4, characterized in that The second heat dissipation component (2) is disposed on one side of the first heat dissipation component (1), and the third heat dissipation component (3) and the fourth heat dissipation component (4) are disposed on the other side of the first heat dissipation component (1).

7. The liquid cooling and heat dissipation device according to claim 1, wherein The first heat dissipation component (1) includes a plurality of first heat dissipation plates (11), and two adjacent first heat dissipation plates (11) are spaced apart and form a heat dissipation gap (111), and the air cooling member (12) is disposed opposite to the plurality of heat dissipation gaps (111).

8. The liquid cooling and heat dissipation device according to claim 2, characterized in that, The first heat dissipation component (1) includes a plurality of first heat dissipation plates (11) arranged in sequence along the width direction X of the first heat dissipation component (1); and / or, the first heat dissipation component (1) includes a plurality of first heat dissipation plates (11) arranged in sequence along the thickness direction Y of the first heat dissipation component (1).

9. The liquid cooling and heat dissipation device according to claim 7, wherein A plurality of heat dissipation fins (112) are provided between two adjacent first heat dissipation plates (11) along the length direction of the first heat dissipation component (1), and the heat dissipation fins (112) are in contact with the adjacent first heat dissipation plates (11) and divide the heat dissipation gap (111) into a plurality of heat dissipation segments (1111).

10. An LED lamp, characterized in that, Including an LED light source (41), a circuit board (21), a transistor (31), and the liquid cooling heat dissipation device according to any one of claims 1 to 9, and the LED light source (41), the circuit board (21), and the transistor (31) are disposed on the liquid cooling heat dissipation device.

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