Wafer-level reliability testing device

Abstract

The utility model relates to the technical field of wafer testing, in particular to a wafer-level reliability testing device which comprises an operation table, a wafer, a flexible insulating plate, a probe mounting seat and a circuit board, a placement groove is formed in the upper surface of the operation table, sliding grooves with openings in the top ends are formed in the two sides of the inner wall of the placement groove, and a containing groove is formed in the bottom wall of the placement groove; through the cooperative arrangement of the placement groove, the sliding groove, the laser transmitter and other structures, when the device is used, a crystal grain on a wafer is parallel to a shooting line of the laser transmitter, and the flexible insulating plate, the probe mounting seat and the circuit board are sequentially placed into the placement groove through the sliding block and the sliding groove to be positioned; and the probes under the circuit board penetrate through the holes to be in contact with the crystal grains, so that the wafer is tested, and the problem that the alignment is difficult to ensure during installation, part of the probes cannot be in contact with the crystal grains, and the test accuracy is reduced is avoided as much as possible.

Description

Technical Field

[0001] This application relates to the technical field of wafer testing, and particularly to a wafer-level reliability testing device. Background Art

[0002] When performing high-voltage reliability testing on a wafer, it is necessary to align and contact each test probe with each die on the wafer one by one, and it is also necessary to seal the test probe and the test circuit board in a cavity filled with high-pressure gas at a certain pressure to ensure no arcing during high-voltage testing (in normal atmospheric air, high voltage will break down the air and cause arcing, and high-voltage arcing can be avoided by increasing the air pressure in the environment).

[0003] The utility model patent with the publication number CN219625632U proposes a wafer-level reliability testing device, which includes a plurality of probes, and a circuit board, a probe mounting base, and a flexible insulating board arranged in layers in sequence; wherein, the probe mounting base is provided with a plurality of probe mounting holes; the side of the flexible insulating board away from the probe mounting base is attached to the wafer to be tested, and the flexible insulating board is provided with probe through holes corresponding to each of the probe mounting holes one by one; each corresponding probe mounting hole and the probe through hole are filled with high-pressure gas; each probe is installed in each corresponding probe mounting hole and the probe through hole, and one end of each probe is connected to the circuit board and the other end is connected to each die of the wafer to be tested.

[0004] For the above-mentioned wafer-level reliability testing device, by aligning the probe mounting holes on the probe mounting base with the probe through holes on the flexible insulating board, and then passing the probes through the probe mounting holes and the probe through holes to align with the dies on the wafer for testing. However, the number of dies, probe mounting holes, and probe through holes on the wafer is too large and small, and it is difficult to ensure alignment during installation, which may cause some probes to fail to contact the dies, resulting in a problem of reduced test accuracy. Summary of the Utility Model

[0005] The purpose of the present utility model is to solve or at least alleviate the problem of an existing wafer-level reliability testing device. By aligning the probe mounting holes on the probe mounting base with the probe through holes on the flexible insulating board, and then passing the probes through the probe mounting holes and the probe through holes to align with the dies on the wafer for testing. However, the number of dies, probe mounting holes, and probe through holes on the wafer is too large and small, and it is difficult to ensure alignment during installation, which may cause some probes to fail to contact the dies, resulting in a problem of reduced test accuracy.

[0006] To achieve the above purpose, the present utility model adopts the following technical solutions:

[0007] A wafer-level reliability test device includes an operating table, a wafer, a flexible insulating board, a probe mounting seat, and a circuit board. An accommodation groove is formed on the upper surface of the operating table. Slide grooves with openings at the top are formed on both sides of the inner wall of the accommodation groove. A receiving groove is formed on the bottom wall of the accommodation groove. A placement table is arranged in the receiving groove. A laser emitter is arranged in one of the slide grooves, and the emitting end of the laser emitter is arranged opposite to the other slide groove. Sliders are fixedly connected to both ends of the side walls of the circuit board, the probe mounting seat, and the flexible insulating board, and the sliders are respectively slidably arranged in the slide grooves.

[0008] By adopting the above technical solution, during use, the wafer is placed on the placement table, and the wafer is rotated by the shooting line emitted by the laser emitter so that the crystal grains on the wafer are parallel to the shooting line. Then, the flexible insulating board, the probe mounting seat, and the circuit board are sequentially placed into the accommodation groove, and the sliders are respectively slid into the slide grooves for positioning, so that the holes of the flexible insulating board and the probe mounting seat are aligned with the crystal grains of the wafer. The probes under the circuit board pass through the holes and contact the crystal grains to test the wafer, thus avoiding as much as possible the problem that the number of crystal grains, probe mounting holes, and probe vias of the wafer is too large and too small, making it difficult to ensure alignment during installation, and some probes may not be able to contact the crystal grains, resulting in a reduction in test accuracy.

[0009] Optionally, a rotating shaft is fixedly connected to the lower surface of the placement table. The end of the rotating shaft away from the placement table is located inside the operating table and is fixedly connected to a first bevel gear. A rotating rod is arranged on one side wall of the operating table. One end of the rotating rod is located inside the operating table and is fixedly connected to a second bevel gear. The first bevel gear meshes with the second bevel gear. Both the rotating shaft and the rotating rod are rotatably connected to the operating table.

[0010] By adopting the above technical solution, by rotating the rotating rod, the second bevel gear can drive the first bevel gear to rotate, so that the rotating shaft drives the placement table to rotate, and the wafer on the placement table is rotated, which is convenient for adjusting the wafer.

[0011] Optionally, an accommodation hole is formed in the slide groove at the lower surface of the laser emitter. A spring is fixedly connected in the accommodation hole. The end of the spring away from the accommodation hole is fixedly connected to the laser emitter. The laser emitter is slidably arranged in the accommodation hole.

[0012] By adopting the above technical solution, when the laser emitter is under pressure, the spring will contract, moving the laser emitter into the accommodation hole to prevent the laser emitter from blocking the flexible insulating board and causing it to be unable to abut against the wafer.

[0013] Optionally, a cover plate is provided on the upper surface of the operating table. The lower surface of the cover plate is located within the placement groove and abuts against the circuit board. A plurality of fixing bolts are provided on the upper surface of the cover plate. The fixing bolts all penetrate through the cover plate and are threadedly connected to the upper surface of the operating table.

[0014] By adopting the above technical solution, the circuit board is abutted by the cover plate, and then the cover plate is fixed to the operating table by the fixing bolts, which can prevent the spring from rebounding, causing the laser emitter to push the flexible insulating plate upward and unable to fit with the wafer.

[0015] Optionally, a telescopic rod is provided inside the spring. The two ends of the telescopic rod are respectively fixedly connected to the side wall of the receiving hole and the laser emitter.

[0016] By adopting the above technical solution, the stability of the spring can be improved through the telescopic rod.

[0017] Optionally, the distance between the upper surface of the placement table and the placement groove is not higher than the thickness of the wafer.

[0018] By adopting the above technical solution, it is prevented that the wafer is located in the receiving groove and cannot fit with the flexible insulating plate.

[0019] Optionally, an air inlet hole is provided on the upper surface of the cover plate, and an air groove is provided on the lower surface of the cover plate. The air groove is communicated with the air inlet hole. A plurality of air outlet holes communicated with the holes on the probe mounting seat are provided on the circuit board, and the air outlet holes are all located in the air groove.

[0020] By adopting the above technical solution, by adding high-pressure gas into the air inlet hole, the high-pressure gas can enter the holes on the probe mounting seat and the flexible insulating plate through the air groove and the air outlet holes, and high-pressure gas is filled into each hole.

[0021] Optionally, a protective cylinder is sleeved on one end of the rotating rod located outside the operating table, and one end of the protective cylinder is inserted into the side wall of the operating table.

[0022] By adopting the above technical solution, the protective cylinder can prevent accidental contact with the rotating rod during testing, causing the rotating rod to rotate and the wafer to rotate.

[0023] In summary, the beneficial effects of the present application are as follows:

[0024] 1. In the present application, through the cooperative arrangement of structures such as a placement groove, a sliding groove, and a laser emitter, during use, a wafer is placed on the placement table, and the wafer is rotated by the shooting line emitted by the laser emitter to keep the crystal grains on the wafer parallel to the shooting line. Then, a flexible insulating plate, a probe mounting seat, and a circuit board are sequentially placed into the placement groove, and the sliders slide into the sliding grooves respectively for positioning, so that the holes of the flexible insulating plate and the probe mounting seat are aligned with the crystal grains of the wafer. The probes under the circuit board pass through the holes to contact the crystal grains, thereby testing the wafer. This can avoid as much as possible the problem that the number of crystal grains, probe mounting holes, and probe vias of the wafer is too large and small, making it difficult to ensure alignment during installation, and there may be a situation where some probes cannot contact the crystal grains, resulting in a reduction in test accuracy.

[0025] 2. By rotating the rotating rod, the second bevel gear can drive the first bevel gear to rotate, causing the rotating shaft to drive the placement table to rotate, thereby rotating the wafer on the placement table, which is convenient for adjusting the wafer. Description of the Drawings

[0026] Figure 1 is the overall structural schematic diagram of the present utility model;

[0027] Figure 2 is the exploded structural schematic diagram of the present utility model;

[0028] Figure 3 is the Figure 2 enlarged structural schematic diagram of area A in the present utility model;

[0029] Figure 4 is the Figure 1 enlarged structural schematic diagram of area B in the present utility model.

[0030] Description of the Reference Numerals: 1, operating table; 2, wafer; 3, circuit board; 4, probe mounting seat; 5, flexible insulating plate; 6, placement groove; 7, sliding groove; 8, receiving groove; 9, placement table; 10, laser emitter; 11, slider; 12, rotating shaft; 13, first bevel gear; 14, rotating rod; 15, second bevel gear; 16, receiving hole; 17, spring; 18, cover plate; 19, fixing bolt; 20, telescopic rod; 21, air inlet hole; 22, air groove; 23, air outlet hole; 24, protection cylinder. Detailed Embodiment

[0031] The following further elaborates on the present application in conjunction with the Figures 1-4 drawings.

[0032] Please refer to Figures 1-3, A wafer-level reliability test device, comprising an operating table 1, a wafer 2, a flexible insulating plate 5, a probe mounting seat 4 and a circuit board 3. Multiple holes respectively aligned with the chips on the wafer 2 are provided on both the flexible insulating plate 5 and the probe mounting seat 4. A plurality of probes respectively passing through the holes and connected to the chips on the wafer 2 are fixedly connected to the lower surface of the circuit board 3. By connecting the circuit board 3 to an external test device, the test device provides high voltage electricity, thereby realizing high-voltage reliability tests on each chip of the wafer 2. A placement groove 6 for placing the flexible insulating plate 5, the probe mounting seat 4 and the circuit board 3 is provided on the upper surface of the operating table 1. Sliding grooves 7 with openings at the top are provided on both sides of the inner wall of the placement groove 6. A receiving groove 8 is provided on the bottom wall of the placement groove 6. A placement table 9 for placing the wafer 2 is provided in the receiving groove 8. The placement table 9 can rotate in the receiving groove 8 to adjust the position of the wafer 2. A laser emitter 10 for positioning the chips on the wafer 2 is provided in one of the sliding grooves 7 to keep the chips parallel to the rays. The emitting end of the laser emitter 10 is arranged opposite to the other sliding groove 7. Sliders 11 are fixedly connected to both ends of the side walls of the circuit board 3, the probe mounting seat 4 and the flexible insulating plate 5. The sliders 11 are respectively slidably arranged in the sliding grooves 7.

[0033] During use, the wafer 2 is placed on the placement table 9. The wafer 2 is rotated by the rays emitted by the laser emitter 10 to keep the chips on the wafer 2 parallel to the rays. Then, the flexible insulating plate 5, the probe mounting seat 4 and the circuit board 3 are successively placed into the placement groove 6, and the sliders 11 are respectively slid into the sliding grooves 7 for positioning, so that the holes of the flexible insulating plate 5 and the probe mounting seat 4 are aligned with the chips of the wafer 2. The probes under the circuit board 3 pass through the holes and contact the chips to test the wafer 2, thus avoiding as much as possible the problem that the number of chips, probe mounting holes and probe vias of the wafer is too large and small, and it is difficult to ensure alignment during installation, and some probes may not be able to contact the chips, resulting in a reduction in test accuracy.

[0034] Refer to Figure 1 , A rotating shaft 12 is fixedly connected to the lower surface of the placement table 9. One end of the rotating shaft 12 away from the placement table 9 is located inside the operating table 1 and fixedly connected to a first bevel gear 13. A rotating rod 14 is provided on one side wall of the operating table 1. One end of the rotating rod 14 is located inside the operating table 1 and fixedly connected to a second bevel gear 15. The first bevel gear 13 meshes with the second bevel gear 15. Both the rotating shaft 12 and the rotating rod 14 are rotatably connected to the operating table 1. By rotating the rotating rod 14, the second bevel gear 15 can drive the first bevel gear 13 to rotate, so that the rotating shaft 12 drives the placement table 9 to rotate, and the wafer 2 on the placement table 9 is rotated to facilitate the adjustment of the wafer 2.

[0035] Refer to Figure 3, a chute 7 is provided with a receiving hole 16 on the lower surface of the laser emitter 10. A spring 17 is fixedly connected inside the receiving hole 16. One end of the spring 17 away from the receiving hole 16 is fixedly connected to the laser emitter 10. The laser emitter 10 is slidably arranged inside the receiving hole 16. When the laser emitter 10 is under pressure, the spring 17 will contract, moving the laser emitter 10 into the receiving hole 16 to prevent the laser emitter 10 from blocking the flexible insulating plate 5, resulting in the inability to abut against the wafer 2.

[0036] Refer to Figure 1 , a cover plate 18 is provided on the upper surface of the operating table 1. The lower surface of the cover plate 18 is located in the placement groove 6 and abuts against the circuit board 3. A plurality of fixing bolts 19 are provided on the upper surface of the cover plate 18. The fixing bolts 19 all penetrate through the cover plate 18 and are threadedly connected to the upper surface of the operating table 1. By abutting the circuit board 3 with the cover plate 18 and then fixing the cover plate 18 to the operating table 1 with the fixing bolts 19, it is possible to prevent the spring 17 from rebounding, causing the laser emitter 10 to push the flexible insulating plate 5 upward and unable to fit with the wafer 2.

[0037] Refer to Figure 3 , a telescopic rod 20 is provided inside the spring 17. Both ends of the telescopic rod 20 are fixedly connected to the side wall of the receiving hole 16 and the laser emitter 10 respectively. The stability of the spring 17 can be improved through the telescopic rod 20.

[0038] Refer to Figure 1 , the distance between the upper surface of the placement table 9 and the placement groove 6 is not higher than the thickness of the wafer 2 to prevent the wafer 2 from being located in the receiving groove 8 and unable to fit with the flexible insulating plate 5.

[0039] Refer to Figure 2 and Figure 4 , an air inlet hole 21 is provided on the upper surface of the cover plate 18, and an air groove 22 is provided on the lower surface of the cover plate 18. The air groove 22 is communicated with the air inlet hole 21. A plurality of air outlet holes 23 communicated with the holes on the probe mounting seat 4 are provided on the circuit board 3. The air outlet holes 23 are all located in the air groove 22. By adding high-pressure gas into the air inlet hole 21, the high-pressure gas can enter the holes in the probe mounting seat 4 and the flexible insulating plate 5 through the air groove 22 and the air outlet holes 23 to fill high-pressure gas into each hole.

[0040] Refer to Figure 1 , a protective cylinder 24 is sleeved on one end of the rotating rod 14 located outside the operating table 1. One end of the protective cylinder 24 is inserted into the side wall of the operating table 1. Through the protective cylinder 24, it is possible to prevent accidentally touching the rotating rod 14 during testing, causing the rotating rod 14 to rotate and the wafer 2 to rotate.

[0041] The implementation principle of this application is as follows: During use, the wafer 2 is placed on the placement table 9. The rotation rod 14 is rotated by the shooting line emitted by the laser emitter 10, so that the second bevel gear 15 drives the first bevel gear 13 to rotate, and the rotating shaft 12 drives the placement table 9 to rotate, thereby rotating the wafer 2 to make the crystal grains on the wafer 2 parallel to the shooting line. Then, the flexible insulating plate 5, the probe mounting seat 4, and the circuit board 3 are sequentially placed into the placement groove 6, and the sliders 11 are respectively slid into the sliding grooves 7 for positioning, so that the holes of the flexible insulating plate 5 and the probe mounting seat 4 are aligned with the crystal grains of the wafer 2. The probes under the circuit board 3 pass through the holes and contact the crystal grains to test the wafer 2. This can avoid the problem that it is difficult to ensure alignment during installation due to the excessive number and small size of the crystal grains, probe mounting holes, and probe vias of the wafer, which may cause some probes to fail to contact the crystal grains, resulting in a reduction in test accuracy.

[0042] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A wafer-level reliability test device, comprising an operation table (1), a wafer (2), a flexible insulating board (5), a probe mounting seat (4), and a circuit board (3), characterized in that: The upper surface of the operating table (1) is provided with a placement groove (6). Both sides of the inner wall of the placement groove (6) are provided with chutes (7) with openings at the top. The bottom wall of the placement groove (6) is provided with a receiving groove (8). A placement table (9) is arranged in the receiving groove (8). A laser emitter (10) is arranged in one of the chutes (7). The emitting end of the laser emitter (10) is arranged opposite to the other chute (7). Both ends of the side walls of the circuit board (3), the probe mounting seat (4), and the flexible insulating board (5) are fixedly connected with sliders (11). The sliders (11) are respectively slidably arranged in the chutes (7).

2. A wafer-level reliability testing device according to claim 1, characterized in that: The lower surface of the placement table (9) is fixedly connected with a rotating shaft (12). One end of the rotating shaft (12) away from the placement table (9) is located inside the operating table (1) and is fixedly connected with a first bevel gear (13). One side wall of the operating table (1) is provided with a rotating rod (14). One end of the rotating rod (14) is located inside the operating table (1) and is fixedly connected with a second bevel gear (15). The first bevel gear (13) meshes with the second bevel gear (15). Both the rotating shaft (12) and the rotating rod (14) are rotatably connected with the operating table (1).

3. The wafer-level reliability testing device according to claim 1, wherein: The chute (7) is provided with a receiving hole (16) on the lower surface of the laser emitter (10). A spring (17) is fixedly connected in the receiving hole (16). One end of the spring (17) away from the receiving hole (16) is fixedly connected with the laser emitter (10). The laser emitter (10) is slidably arranged in the receiving hole (16).

4. A wafer-level reliability test device according to claim 1, characterized in that: The upper surface of the operating table (1) is provided with a cover plate (18). The lower surface of the cover plate (18) is located in the placement groove (6) and abuts against the circuit board (3). The upper surface of the cover plate (18) is provided with a plurality of fixing bolts (19). The fixing bolts (19) all penetrate through the cover plate (18) and are threadedly connected with the upper surface of the operating table (1).

5. The wafer-level reliability testing device according to claim 3, wherein: An expansion rod (20) is arranged in the spring (17). Both ends of the expansion rod (20) are respectively fixedly connected with the side wall of the receiving hole (16) and the laser emitter (10).

6. The wafer-level reliability testing device according to claim 1, characterized in that: The distance between the upper surface of the placement table (9) and the placement groove (6) is not higher than the thickness of the wafer (2).

7. The wafer-level reliability testing device according to claim 4, wherein: The upper surface of the cover plate (18) is provided with an air inlet hole (21). The lower surface of the cover plate (18) is provided with an air groove (22). The air groove (22) is communicated with the air inlet hole (21). The circuit board (3) is provided with a plurality of air outlet holes (23) communicated with the holes on the probe mounting seat (4). The air outlet holes (23) are all located in the air groove (22).

8. The wafer-level reliability testing device according to claim 2, characterized in that: One end of the rotating rod (14) located outside the operating table (1) is sleeved with a protection cylinder (24). One end of the protection cylinder (24) is inserted into the side wall of the operating table (1).

Images