Probe card electric leakage detection device and wafer acceptance test equipment
By setting up a test adapter board and detection module on the probe card, the leakage of the probe card is detected in real time, which solves the problem of difficulty in real-time monitoring of leakage in the existing technology, and improves the reliability of the probe card and the efficiency of the wafer acceptance test.
Patent Information
- Application Number
- CN202422266146.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-14
- Publication Date
- 2025-07-18
- Estimated Expiration
- 2034-09-14
AI Technical Summary
In the prior art, it is difficult to monitor the leakage of the probe card in real time during wafer testing, resulting in invalid capacity occupancy, affecting the reliability of the probe card usage and WAT test efficiency.
The test adapter board and a detection module are set on the probe card, and the first probe and the second probe of the probe card are connected through the test resistor structure, and the detection module is used to detect electrical changes in real time to realize real-time detection of the leakage situation of the probe card.
It realizes real-time identification of probe card leakage during wafer acceptance testing, avoids ineffective capacity occupation, and improves the reliability of probe card usage and wafer acceptance testing efficiency.
Smart Images
Figure CN223123208U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor testing technologies, and particularly to a probe card leakage detection device and a wafer acceptance test equipment. Background Art
[0002] Wafer Acceptance Test (WAT) is an electrical parameter measurement performed after wafer manufacturing is completed and before quality inspection. During the WAT test process, the probe card, as a key test component, directly affects the accuracy of test results.
[0003] However, it is difficult to accurately monitor the leakage of the probe card during continuous testing. And when problems occur with the probe card, it is usually necessary to wait until the entire batch of tests is completed to determine the problem point through the output data, and it is impossible to identify and solve problems in real time during the test process, resulting in ineffective occupation of production capacity. These problems limit the reliability of the probe card and the test efficiency of WAT.
[0004] It should be noted that the information disclosed in the above background art section is only used to enhance the understanding of the background of this application, and thus may include information that does not constitute the prior art known to those of ordinary skill in the art. Summary of the Utility Model
[0005] Based on this, the embodiments of this application provide a probe card leakage detection device and a wafer acceptance test equipment, which can perform real-time detection of the leakage of the probe card and do not additionally occupy production capacity, effectively improving the reliability of the probe card and the wafer acceptance test efficiency.
[0006] According to some embodiments, this application provides a probe card leakage detection device on the one hand, which is applied to the probe card and includes:
[0007] A test adapter board, on which a test resistance structure is provided; one end of the test resistance structure is electrically connected to the first probe in the probe card, and the other end of the test resistance structure is electrically connected to the second probe in the probe card;
[0008] A detection module, connected to the test adapter board, for detecting the electrical changes occurring at both ends of the test resistance structure when performing leakage detection on the probe card.
[0009] In some embodiments, the test adapter board includes a printed circuit board.
[0010] In some embodiments, the test resistance structure includes a metal wiring structure provided on the printed circuit board.
[0011] In some embodiments, the test resistance structure includes the metal wiring structure disposed in a serpentine shape on the printed circuit board.
[0012] In some embodiments, the metal wiring structure is arranged as a single-layer structure in the printed circuit board.
[0013] In some embodiments, the test resistance structure is electrically connected to corresponding probes through test pads, and the size of the test pads is less than or equal to 70 μm.
[0014] In some embodiments, pin headers are provided on the test adapter board; the test adapter board is fixed to the probe card through the pin headers.
[0015] According to some embodiments, on the other hand, the present application further provides a wafer acceptance test device, including a probe card, and
[0016] The probe card leakage detection device provided in any of the above embodiments, and the probe card leakage detection device is connected between any two probes of the probe card.
[0017] In some embodiments, the test resistance structure in the probe card leakage detection device is electrically connected to corresponding probes through test pads;
[0018] The wafer acceptance test device includes a plurality of the probe cards arranged in sequence and spaced apart; in the direction in which the plurality of probe cards are arranged in sequence, adjacent probe cards share the same test pad.
[0019] In some embodiments, the wafer acceptance test device includes a plurality of probe card leakage detection devices, and a plurality of test adapter boards in the plurality of probe card leakage detection devices share the same printed circuit board.
[0020] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present application.
[0021] The embodiments of the present application may / at least have the following advantages:
[0022] In the embodiments of the present application, a test resistance structure is provided on the test adapter board, the first probe and the second probe of the probe card are connected through the test resistance structure, and the detection module is connected to the test adapter board. Therefore, when detecting the leakage of the probe card, the electrical changes occurring at both ends of the test resistance structure can be detected in real time through the detection module, and further the leakage situation between the first probe and the second probe can be characterized.
[0023] In the embodiment of the present application, the detection module performs real-time detection on the electrical changes occurring at both ends of the test resistor structure. Instead of waiting for the entire batch of wafers to complete the test before judging the leakage of the probe card, the leakage of the probe card is fed back in real time. Even during the wafer testing process, the leakage problem of the probe card can be identified in real time, thereby avoiding the ineffective occupation of production capacity and helping to improve the reliability of the probe card and the efficiency of wafer testing.
[0024] Other advantages, objectives, and features of the present application will be described to some extent in the subsequent specification, and to some extent, will be obvious to those skilled in the art based on the study of the following text, or can be taught from the practice of the present application. The objectives and other advantages of the present application can be achieved and obtained through the following specification. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] By reading the detailed description of the non-limiting embodiments with reference to the following drawings, other features, objectives, and advantages of the present application will become more obvious.
[0026] Figure 1 Schematic structural diagram when the probe card leakage detection device provided by some embodiments of the present application is applied to a probe card;
[0027] Figure 2 Schematic structural diagram of the test resistor structure in the probe card leakage detection device provided by some embodiments of the present application;
[0028] Figure 3 Schematic structural diagram of the test adapter board in the probe card leakage detection device provided by some embodiments of the present application.
[0029] DESCRIPTION OF REFERENCE NUMERALS:
[0030] 1. Ring-shaped printed circuit board; 10. Test resistor structure; 10a. First test pad; 10b. Second test pad; 11A. First probe card; 11B. Second probe card; 111. First probe; 112. Second probe; 12. Pin header. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0031] To make the technical objectives, technical solutions, and technical effects of the present application clearer, the technical solutions in the present application will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are some embodiments of the present application, rather than all embodiments. The components of the embodiments of the present application usually described and illustrated in the drawings here can be arranged and designed in various different configurations.
[0032] Accordingly, the following detailed description of the embodiments of the present application is not intended to limit the scope of the claimed present application, but merely represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts fall within the scope of protection of the present application.
[0033] In the description of the present application, it should be noted that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present application. The terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection or a detachable connection. Additionally, the description with reference to terms such as "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0034] The Wafer Acceptance Test (WAT) is an electrical parameter measurement performed after wafer manufacturing is completed and before quality inspection. During the WAT test process, the probe card, as a key test component, directly affects the accuracy of the test results.
[0035] However, it is difficult to accurately monitor the leakage current of the probe card during continuous testing. And when a problem occurs with the probe card, it is usually necessary to wait for the entire batch of tests to be completed before judging the problem point through the output data, and it is impossible to identify and solve the problem in real time during the test process, resulting in ineffective occupation of production capacity. These problems limit the use reliability of the probe card and the test efficiency of WAT.
[0036] In view of the deficiencies in the above-related technologies, the present application provides a probe card leakage detection device and a wafer acceptance test device, which can perform real-time detection of the leakage current of the probe card and does not additionally occupy production capacity, effectively improving the use reliability of the probe card and the wafer acceptance test efficiency. The detailed content will be elaborated in the subsequent embodiments.
[0037] According to some embodiments, on the one hand, the present application provides a leakage detection device for a probe card. The leakage detection device for the probe card can be applied to the probe card. Exemplarily, a tester is connected to a wafer under test through the probe card, thereby forming a test loop, and the test loop is used for performing leakage tests in WAT.
[0038] The following takes the first probe card 11A shown as Figure 1 an example for illustration.
[0039] Specifically, the leakage detection device for the probe card includes a test adapter board and a detection module. Among them, a test resistance structure 10 can be arranged on the test adapter board. One end of the test resistance structure 10 is used for electrical connection with a first probe 111 in the probe card (such as the first probe card 11A), and the other end of the test resistance structure 10 is used for electrical connection with a second probe 112 in the probe card (such as the first probe card 11A); the detection module is connected to the test adapter board and is used for detecting the electrical changes occurring at both ends of the test resistance structure when performing leakage detection on the probe card (such as the first probe card 11A).
[0040] It should be noted that the first probe 111 and the second probe 112 in the above probe card (such as the first probe card 11A) can be adjacent probes, or they can also not be adjacent probes, and the present application has no specific limitation on this.
[0041] It can be understood that in the embodiments of the present application, the probe card can be connected to the wafer under test through probes (such as the first probe 111 and the second probe 112) to form a test channel, and the test channel can be used for performing wafer acceptance tests.
[0042] In the above leakage detection device for the probe card, the test resistance structure 10 is arranged on the test adapter board, the first probe 111 and the second probe 112 of the probe card are connected through the test resistance structure 10, and the detection module is connected to the test adapter board. Thus, when performing leakage detection on the probe card, the electrical changes occurring at both ends of the test resistance structure 10 can be detected in real time through the detection module, and further the leakage situation between the first probe 111 and the second probe 112 can be characterized.
[0043] For the above leakage detection device for the probe card, by detecting the electrical changes occurring at both ends of the test resistance structure 10 in real time through the detection module, it is not necessary to wait for the completion of the wafer acceptance tests for the entire batch to judge the leakage situation of the probe card, but the leakage situation of the probe card is fed back in real time. Even during the wafer acceptance tests, the leakage problem of the probe card can be recognized in real time, thereby avoiding the ineffective occupation of production capacity and helping to improve the use reliability of the probe card and the efficiency of wafer acceptance tests.
[0044] Moreover, in the above probe card leakage detection device, by using the test adapter board, the length of the leads during testing can also be reduced, thereby reducing resistance and other transmission losses. This makes the leakage test more accurate and helps to reduce the attenuation and interference of electrical signals during transmission. By setting up the test adapter board, the lead spacing between adjacent test channels can also be widened, thereby reducing the electrical interference and impedance effect between adjacent test channels, avoiding leakage errors caused by the leads being too close, and thus improving the accuracy of the leakage test.
[0045] Exemplarily, by adopting the above probe card leakage detection device, the test signal applied by the tester can also be directly transmitted to the first probe 111 and the second probe 112 through the test adapter board, thereby avoiding relying on the spring pins (POGOPIN) on the probe table. Since the spring pins are prone to damage due to frequent use, adopting the above probe card leakage detection device also helps to improve the connection reliability between the tester and the probe card, thereby reducing test deviation and making the test results more accurate.
[0046] In the embodiments of the present application, the detection module detects the electrical changes occurring at both ends of the test resistance structure. Such electrical changes can be, for example, the voltage change at both ends of the test resistance structure, the current change flowing through the test resistance structure, and the electrical changes generated in the test resistance structure when there is leakage between other test channels. It can be understood that the detection module can be implemented by a variety of existing devices and components as long as it can detect the electrical changes occurring at both ends of the test resistance structure. The detection module can be, for example, an operational amplifier, a precision current detection resistor, an analog-to-digital converter, a current sensing amplifier, and a microcontroller, etc., but is not limited thereto. Its specific structure can be understood with reference to the related art and is not the focus of the present application, so the present application will not elaborate on this.
[0047] In some embodiments, a preset test voltage value can be applied to both ends of the test resistance structure 10 by the tester, and the corresponding leakage value can be detected. Exemplarily, the detection module can output the logarithm -Log(A) of the leakage value of the probe card for more intuitively reflecting the magnitude of the leakage.
[0048] Exemplarily, the detection module can also locate the corresponding test channel according to the electrical changes occurring at both ends of the test resistance structure.
[0049] The above probe card leakage detection device can obtain the leakage situation between the first probe 111 and the second probe 112 through the detection module. Exemplarily, the detection module can output the electrical changes occurring at both ends of the detected test resistance structure. Such electrical changes can be used to characterize the leakage value between the first probe 111 and the second probe 112.
[0050] In some embodiments, it is possible to determine whether the above-mentioned leakage value is within the normal leakage range; if the leakage value exceeds the normal leakage range, a leakage anomaly signal is issued. The operator and / or the testing machine can respond to this leakage anomaly signal and stop the ongoing leakage detection, so as to facilitate the timely replacement of the probe card with leakage anomaly problems. In this way, the retest rate can be effectively reduced, thereby improving the utilization rate of the production line.
[0051] In some embodiments, as Figure 2 shown, the test adapter board may include a printed circuit board (PCB), but is not limited thereto. That is to say, the test adapter board can be obtained based on a printed circuit board.
[0052] The embodiments of the present application do not specifically limit the manifestation form of the test resistor structure 10. In some embodiments, the test resistor structure 10 may specifically include a metal wiring structure disposed on the printed circuit board.
[0053] The embodiments of the present application also do not specifically limit the design method of the above-mentioned metal wiring structure. In some embodiments, as Figure 2 shown, the metal wiring structure can be serpentinely arranged on the printed circuit board.
[0054] In some embodiments, the above-mentioned metal wiring structure can be arranged as a single-layer structure in the printed circuit board; that is, the test resistor structure can be obtained by placing a layer of metal wiring structure on the printed circuit board.
[0055] Exemplarily, the test resistor structure 10 can be electrically connected to the corresponding probe in the probe card through a test pad (Pad).
[0056] The embodiments of the present application do not specifically limit the size of the test pad. As an example, the size of the test pad can be within the range of less than or equal to 70μm; that is, both the length and width of the test pad are within the range of less than or equal to 70μm. For example, the size of the test pad can be 70μm, 65μm, 60μm, 55μm, 50μm, etc.
[0057] In some embodiments, pin headers can be provided on the test adapter board. In this way, the test adapter board can be fixed to the probe card through the pin headers.
[0058] Exemplarily, the pin headers on the test adapter board can be inserted into the through holes of the corresponding test channels of the probe card and welded at the bottom. For example, welding can be performed at the bottom through the aforementioned test pads.
[0059] In some embodiments, the test adapter board may include as Figure 3The annular printed circuit board 1 shown. For example Figure 3 As shown, the pin headers 12 on the annular printed circuit board 1 can be evenly spaced along the circumference of the annular printed circuit board, so as to facilitate insertion into the through holes of the corresponding test channels of the probe card.
[0060] The embodiments of the present application do not specifically limit the number of pin headers 12 provided on the test adapter board. For example Figure 3 As shown, 48 pin headers can be provided on the test adapter board, and each pin header can correspond to two of the aforementioned test pads.
[0061] Based on the same concept, on the other hand, the present application also provides a wafer receiving test device, including a probe card (such as Figure 1 the first probe card 11A shown in), and the probe card leakage detection device provided in any of the above embodiments. Specifically, the above probe card leakage detection device can be connected between any two probes of the probe card.
[0062] As described above, the test resistance structure 10 can be electrically connected to the corresponding probes in the probe card (such as the first probe card 11A) through the test pads. The test pads are, for example Figure 1 the first test pad 10a and the second test pad 10b shown in.
[0063] In some embodiments, the wafer receiving test device may include a plurality of probe cards arranged in sequence and spaced apart, such as Figure 1 the first probe card 11A and the second probe card 11B shown in.
[0064] Exemplarily, in the direction in which the plurality of probe cards are arranged in sequence (such as Figure 1 the X direction shown in), adjacent probe cards can share the same test pad. Here, it can be combined with Figure 1 Understand that, as Figure 1 shown, the first probe card 11A and the second probe card 11B are closest in the Figure 1 X direction shown in, so the first probe card 11A and the second probe card 11B are adjacent in the direction in which the plurality of probe cards are arranged in sequence. The adjacent first probe card 11A and second probe card 11B share the second test pad 10b.
[0065] As described above, the test adapter board in the probe card leakage detection device can be obtained based on a printed circuit board.
[0066] In some embodiments, the wafer receiving test device may include a plurality of probe card leakage detection devices, and the plurality of test adapter boards in the plurality of probe card leakage detection devices can share the same printed circuit board.
[0067] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features of the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.
[0068] The above-described embodiments merely represent several implementation manners of the present application. The description thereof is relatively specific and detailed, but it should not be construed as a limitation to the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.
Claims
1. A probe card leakage detection device, characterized in that, Applied to a probe card, including: A test adapter board, on which a test resistance structure is provided; one end of the test resistance structure is electrically connected to a first probe in the probe card, and the other end of the test resistance structure is electrically connected to a second probe in the probe card; A detection module, connected to the test adapter board, for detecting the electrical change occurring at both ends of the test resistance structure when performing leakage detection on the probe card.
2. The probe card leakage detection device according to claim 1, wherein The test adapter board includes a printed circuit board.
3. The probe card leakage detection device according to claim 2, wherein, The test resistance structure includes a metal wiring structure provided on the printed circuit board.
4. The probe card leakage detection device according to claim 3, wherein, The test resistance structure includes the metal wiring structure spirally arranged in a serpentine shape on the printed circuit board.
5. The probe card leakage detection device according to claim 4, wherein, The metal wiring structure is arranged as a single-layer structure in the printed circuit board.
6. The probe card leakage detection device according to claim 1, characterized in that, The test resistance structure is electrically connected to the corresponding probe through a test pad, and the size of the test pad is less than or equal to 70μm.
7. The probe card leakage detection device according to claim 1, wherein Pin headers are provided on the test adapter board; the test adapter board is fixed to the probe card through the pin headers.
8. A wafer acceptance test device, characterized in that, Including a probe card, and A probe card leakage detection device according to any one of claims 1 to 7, the probe card leakage detection device being connected between any two probes of the probe card.
9. The wafer acceptance test device according to claim 8, wherein, The test resistance structure in the probe card leakage detection device is electrically connected to the corresponding probe through a test pad; The wafer receiving test equipment includes a plurality of the probe cards arranged in sequence and spaced apart; in the direction in which the plurality of probe cards are arranged in sequence, adjacent probe cards share the same test pad.
10. The wafer acceptance test device according to claim 8, characterized in that, The wafer receiving test equipment includes a plurality of probe card leakage detection devices, and a plurality of the test adapter boards in the plurality of probe card leakage detection devices share the same printed circuit board.