Bottom pressing die structure

Abstract

The utility model relates to the technical field of main pressing equipment, and discloses a main pressing bottom die structure and a bottom die, the bottom die comprises a bottom die body and a supporting plate, the supporting plate is arranged at the bottom of the bottom die body, a containing through groove is formed in the supporting plate, a rib plate is contained in the containing through groove, and the rib plate is fixedly connected with the bottom die body; the bottom die is arranged on the driving mechanism, and the driving mechanism is used for driving the bottom die to move. According to the bottom die pressing structure, the supporting plate is arranged on the bottom die body, the supporting strength of the supporting plate can be improved, the containing through groove is formed in the supporting plate, the rib plate is arranged in the containing through groove, the structural strength of the bottom die body can be enhanced, and the surface of the bottom die body can maintain better flatness; therefore, the size of the bottom die body can be made large, the requirement for large-size PCB machining is met, and the problem that a pressing device can only machine small-size PCBs is solved.

Description

Technical Field

[0001] This application relates to the technical field of pressing equipment, and specifically to a bottom die structure for pressing. Background Art

[0002] In the production process of liquid crystal display modules, it is necessary to use pressing equipment to press and fix the FPC and the PCB. Usually, the PCB board with the conductive adhesive film attached is placed on the bottom die of the pressing equipment, and then the FPC is moved above the PCB so that the center of the area where the circuit interfaces of the FPC need to be bonded coincides with the center of the area of the PCB lead position. Then, the pressing head descends for pressing, so that the FPC and the PCB are bonded and a circuit path is formed.

[0003] In the related prior art, in order to enable the FPC and the PCB to be stably bonded and form a circuit path, it is necessary to ensure the flatness of the surface of the bottom die of the pressing equipment. Affected by this, the size of the bottom die of the pressing equipment is usually made smaller to meet the requirement of the flatness of the surface plane, resulting in that the pressing equipment can only process PCBs with smaller sizes. Summary of the Invention

[0004] Aiming at the deficiencies of the prior art, this application provides a bottom die structure for pressing, which solves the problem that the pressing equipment can only process PCBs with smaller sizes.

[0005] To achieve the above object, this application provides the following technical solution: A bottom die structure for pressing, comprising:

[0006] A bottom die, the bottom die includes a bottom die body and a support plate, the support plate is arranged at the bottom of the bottom die body, a receiving through groove is opened on the support plate, a rib plate is received in the receiving through groove, and the rib plate is fixedly connected to the bottom die body;

[0007] A driving mechanism, the bottom die is arranged on the driving mechanism, and the driving mechanism is used to drive the bottom die to move.

[0008] Preferably, the bottom die further includes an adsorption assembly, the adsorption assembly includes a slide rail, a slide seat and a vacuum chuck, the slide rail is arranged on one side of the bottom die body, the slide seat is slidably connected to the slide rail, and the vacuum chuck is arranged on the slide seat.

[0009] Preferably, the bottom die further includes a limiting strip, and the limiting strip is arranged on the side of the bottom die body away from the support plate.

[0010] Preferably, the bottom die further includes a heating rod, an installation groove is opened on the bottom die, and the heating rod is fixedly connected to the groove wall of the installation groove.

[0011] Preferably, the driving mechanism includes:

[0012] The first linear module, the slide of the first linear module slides along the first direction;

[0013] The second linear module, the base of the second linear module is arranged on the slide of the first linear module, and the slide of the second linear module slides along the second direction;

[0014] The third linear module, the base of the third linear module is arranged on the slide of the second linear module, the slide of the third linear module slides along the third direction, and the bottom die body is arranged on the third linear module.

[0015] Preferably, the driving mechanism further includes a rotating module, the rotating module is arranged on the slide of the second linear module, and the base of the third linear module is arranged on the turntable of the rotating module.

[0016] Preferably, a plurality of setscrew holes are formed on one side of the bottom die body away from the support plate, and the plurality of setscrew holes are spaced apart on the bottom die body.

[0017] Preferably, a hardening layer is arranged on one side of the bottom die body away from the support plate.

[0018] The present application provides a bottom die structure for pressing, which has the following beneficial effects:

[0019] For this bottom die structure for pressing, by arranging a support plate on the bottom die body, it is beneficial to improve the support strength of the support plate, and a receiving through groove is formed on the support plate, and a rib plate is arranged in the receiving through groove, which can strengthen the structural strength of the bottom die body, so that the surface of the bottom die body can maintain better flatness, thereby enabling the volume of the bottom die body to be enlarged to meet the conditions for processing large-size PCBs, and solving the problem that the pressing equipment can only process smaller-size PCBs. Description of the Drawings

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0021] Figure 1 It is a schematic diagram of the overall structure of the embodiment of the present application.

[0022] Figure 2 It is a schematic diagram of the structure of the bottom die in the embodiment of the present application.

[0023] In the figure: 1. Bottom mold; 11. Bottom mold body; 12. Support plate; 13. Heating rod; 14. Limit strip; 15. Accommodating through groove; 16. Set screw hole; 2. Adsorption assembly; 21. Slide rail; 22. Slide seat; 23. Vacuum suction cup; 3. Driving mechanism; 31. First linear module; 32. Second linear module; 33. Third linear module; 34. Rotating module. Specific embodiments

[0024] In order to make the application purpose, features, and advantages of the present application more obvious and understandable, the following will combine the accompanying drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described below are only a part of the embodiments of the present application, rather than all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0025] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0026] The following will further illustrate the technical solutions of the present application in conjunction with the accompanying drawings and through specific embodiments.

[0027] Please refer to Figure 1 and Figure 2 , the present application provides a technical solution: The bottom pressing mold structure includes a bottom mold 1, an adsorption assembly 2, and a driving mechanism 3. The bottom mold 1 is used to carry the PCB. The bottom mold 1 includes a bottom mold body 11, a support plate 12, a heating rod 13, and a limit strip 14. The bottom mold body 11 is arranged in a long strip shape. A plurality of set screw holes 16 are opened on the bottom mold body 11, and the plurality of set screw holes 16 are spaced along the length direction of the bottom mold body 11, which is not only beneficial to the fixation of the support plate 12, but also beneficial to correcting the upper surface of the bottom mold body 11 through the openings, thereby improving the flatness of the upper surface of the bottom mold body 11. A hardening layer is provided on the upper surface of the bottom mold body 11. In this embodiment, the hardening layer is formed by quenching steel to reduce the decrease in flatness of the bottom mold body 11 due to wear during use.

[0028] Please refer to Figure 1 and Figure 2, the support plate 12 is fixedly connected to the bottom of the bottom mold body 11. A plurality of accommodation through grooves 15 are formed in the support plate 12. The plurality of accommodation through grooves 15 are spaced apart along the length direction of the support plate 12. A plurality of rib plates are accommodated in each accommodation through groove 15. The plurality of rib plates are arranged at equal intervals along the length direction of the accommodation through groove 15. All the rib plates are fixedly connected to the bottom mold body 11 to improve the overall strength of the bottom mold body 11. The limiting strip 14 is fixedly connected to the top of the bottom mold body 11. The limiting strip 14 is arranged along the length direction of the bottom mold body 11. The limiting strip 14 is used to limit the PCB. An installation groove is formed on one side of the bottom mold body 11 in the width direction. The heating rod 13 is accommodated in the installation groove and fixedly connected to the groove wall of the installation groove. Heating the bottom mold body 11 by the heating rod 13 is beneficial to the pressing and bonding of the PCB and the FPC.

[0029] Please refer to Figure 1 , the adsorption assembly 2 is used to adsorb the PCB. The adsorption assembly 2 includes a slide rail 21, a plurality of slide seats 22 and a plurality of vacuum suction cups 23. The slide rail 21 is arranged in a long strip shape. The slide rail 21 is fixedly arranged on one side of the bottom mold body 11. The slide rail 21 is arranged along the length direction of the bottom mold body 11. The plurality of slide seats 22 are all slidably connected to the slide rail 21. The vacuum suction cups 23 are arranged in one-to-one correspondence with the slide seats 22. Each vacuum suction cup 23 is fixedly connected to the corresponding slide seat 22. The vacuum suction cups 23 are communicated with an external vacuum source.

[0030] Please refer to Figure 1 , the driving mechanism 3 is used to drive the bottom mold body 11 to move. The driving mechanism 3 includes a first linear module 31, a second linear module 32, a third linear module 33 and a rotation module. The base of the first linear module 31 is arranged on the ground or the frame of an external device. The slide table of the first linear module 31 is slidably connected along a first direction. The base of the second linear module 32 is arranged on the slide table of the first linear module 31. The slide table of the second linear module 32 slides along a second direction. The base of the rotation module is arranged on the slide table of the second linear module 32. The turntable of the rotation module can rotate in a plane. The base of the third linear module 33 is arranged on the turntable of the rotation module. The slide table of the third linear module 33 can slide along a third direction. In this embodiment, both the first direction and the second direction are horizontal directions. The first direction is perpendicular to the second direction. The third direction is a vertical direction.

[0031] In summary, for this bottom pressing mold structure, by arranging the support plate 12 on the bottom mold body 11, it is beneficial to improve the support strength of the support plate 12. And by opening the accommodation through grooves 15 on the support plate 12 and arranging rib plates in the accommodation through grooves 15, the structural strength of the bottom mold body 11 can be enhanced, enabling the surface of the bottom mold body 11 to maintain better flatness. Thus, the volume of the bottom mold body 11 can be made larger to meet the conditions for processing large-size PCBs, solving the problem that this pressing equipment can only process smaller-size PCBs.

[0032] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device.

[0033] Although embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

[0034] As mentioned above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent substitutions for some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A bottom pressing die structure, characterized in that, Comprising: A bottom mold (1), the bottom mold (1) includes a bottom mold body (11) and a support plate (12), the support plate (12) is arranged at the bottom of the bottom mold body (11), a receiving through groove (15) is opened on the support plate (12), a rib plate is received in the receiving through groove (15), and the rib plate is fixedly connected to the bottom mold body (11); A driving mechanism (3), the bottom mold (1) is arranged on the driving mechanism (3), and the driving mechanism (3) is used to drive the bottom mold (1) to move.

2. The bottom pressing die structure according to claim 1, wherein The bottom mold (1) further includes an adsorption assembly (2), the adsorption assembly (2) includes a slide rail (21), a slide seat (22) and a vacuum chuck (23), the slide rail (21) is arranged on one side of the bottom mold body (11), the slide seat (22) is slidably connected to the slide rail (21), and the vacuum chuck (23) is arranged on the slide seat (22).

3. A bottom pressing die structure according to claim 1, characterized in that, The bottom mold (1) further includes a limiting strip (14), and the limiting strip (14) is arranged on the side of the bottom mold body (11) away from the support plate (12).

4. A bottom pressing die structure according to claim 1, characterized in that, The bottom mold (1) further includes a heating rod (13), an installation groove is opened on the bottom mold body (11), and the heating rod (13) is fixedly connected to the groove wall of the installation groove.

5. A bottom pressing die structure according to claim 1, characterized in that, The driving mechanism (3) includes: A first linear module (31), the slide table of the first linear module (31) slides along a first direction; A second linear module (32), the base of the second linear module (32) is arranged on the slide table of the first linear module (31), and the slide table of the second linear module (32) slides along a second direction; A third linear module (33), the base of the third linear module (33) is arranged on the slide table of the second linear module (32), the slide table of the third linear module (33) slides along a third direction, and the bottom mold body (11) is arranged on the third linear module (33).

6. A bottom pressing die structure according to claim 5, characterized in that, The driving mechanism (3) further includes a rotation module, the rotation module is arranged on the slide table of the second linear module (32), and the base of the third linear module (33) is arranged on the turntable of the rotation module.

7. A bottom pressing die structure according to claim 1, characterized in that, A plurality of setscrew holes (16) are opened on the side of the bottom mold body (11) away from the support plate (12), and the plurality of setscrew holes (16) are spaced apart on the bottom mold body (11).

8. A bottom pressing die structure according to claim 1, characterized in that, A hardening layer is arranged on the side of the bottom mold body (11) away from the support plate (12).

Images