Silicon wafer turnover mechanism

Abstract

The utility model discloses a silicon wafer overturning mechanism, which is used for overturning silicon wafers on a silicon wafer feeding line and placing the silicon wafers in a plurality of reaction tanks for nickel plating, and comprises a plurality of vacuum suction discs, the plurality of vacuum suction discs are symmetrically arranged on the two sides of the reaction tank and correspond to reaction tanks on the reaction tank in position, each vacuum suction disc is detachably connected with a turnover assembly, the turnover assembly comprises a driving part, and when a driving end of the driving part rotates, the driving end of the driving part drives the vacuum suction discs to rotate. And the vacuum suction disc can be overturned towards the direction close to or far away from the reaction tank. The nickel plating device can quickly turn over the silicon wafer and place the silicon wafer in the reaction tank for nickel plating, improves the processing efficiency of the silicon wafer, and is simple in structure and convenient to maintain.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer production equipment, in particular to a silicon wafer turning mechanism. Background Art

[0002] Photovoltaic is short for solar photovoltaic power generation system. It is a new type of power generation system that uses the photovoltaic effect of solar cell semiconductor materials to directly convert solar radiation energy into electrical energy, and has two operation modes: independent operation and grid-connected operation. The photovoltaic power generation industry chain from upstream to downstream mainly includes polysilicon, silicon wafers, solar cells and solar modules.

[0003] During the production process of silicon wafers, electroless nickel plating needs to be carried out on the surface of the silicon wafers. Electroless nickel plating utilizes the redox reaction between divalent nickel ions and reducing agents to deposit nickel on the surface of the silicon wafers to form a nickel layer. The existing nickel plating production efficiency of silicon wafers is low. Therefore, a silicon wafer turning mechanism is needed to solve the above problems. Summary of the Utility Model

[0004] In order to overcome the above disadvantages, the purpose of the utility model is to provide a silicon wafer turning mechanism, which can quickly turn the silicon wafers and place them in the reaction pool for nickel plating, improve the processing efficiency of the silicon wafers, and has a simple structure and is convenient for maintenance.

[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is: a silicon wafer turning mechanism for turning the silicon wafers on the silicon wafer feeding line and placing them in a plurality of reaction pools for nickel plating, including a plurality of vacuum suction discs; the plurality of vacuum suction discs are symmetrically arranged on both sides of the reaction pool and correspond to the reaction grooves on the reaction pool, and each vacuum suction disc is detachably connected to a turning assembly, and the turning assembly includes a driving member, and when the driving end of the driving member rotates, it can make the vacuum suction disc turn towards or away from the reaction pool.

[0006] Furthermore, the vacuum suction cup is fixedly connected to the connecting shaft on the suction cup flip bracket through the suction cup connector, and a belt transmission assembly is vertically arranged on the suction cup flip bracket, and the belt transmission assembly includes a belt driving wheel, a belt driven wheel and a transmission belt, and the end of the connecting shaft away from the suction cup connector is connected to the belt driven wheel bearing, and a transverse shaft for connecting the belt driving wheel bearing is arranged at the bottom of the suction cup flip bracket. The suction cup flip bracket supports the flipping of the vacuum suction cup, and the suction cup connector is rotatably connected to the suction cup flip bracket, so that when the suction cup connector rotates with the connecting shaft as the fulcrum, the vacuum suction cup also rotates a corresponding angle, thereby realizing the automatic flipping of the vacuum suction cup; the belt transmission assembly provides power for the rotation of the connecting shaft, and there is no need for the staff to manually rotate the connecting shaft. When the belt driving wheel rotates, under the transmission action of the transmission belt, the belt driven wheel with the bearing connected to the connecting shaft can drive the connecting shaft to rotate, thereby realizing the flipping of the vacuum suction cup relative to the connecting shaft.

[0007] Further, the flip assembly also includes a rotating shaft extending along the length direction of the reaction pool and a driving gear. One end of the rotating shaft is connected to the driving end of the driving member. When the driving end of the driving member rotates, it can directly provide power for the rotating shaft to rotate. In some embodiments, the driving member is a driving motor. It should be noted that it is not limited to a driving motor, and it can also be a known mechanical structure such as a dividing plate that can drive the rotating shaft to rotate.

[0008] The bearing on the rotating shaft is connected to a number of driving main gears that are the same in number and position as the reaction tanks, and the driving slave gear is coaxially connected to the belt driving wheel and meshes with the driving main gear. The driving member drives the rotating shaft to rotate, so that the driving main gear on it drives the driving slave gear meshed with it to rotate, thereby providing power for the belt transmission assembly to realize the flipping of the vacuum suction plate.

[0009] Furthermore, it also includes a suction tray placement rack, the vacuum suction tray is located on the suction tray placement rack, and the suction tray placement rack is connected to the suction tray on a side away from the vacuum suction tray. The suction tray placement rack is provided to provide support for the vacuum suction tray, so as to facilitate its connection with the suction tray connector.

[0010] Furthermore, the suction plate connector includes a fixing portion and a connecting portion, the connecting portion is arranged obliquely along the center line of the second direction away from the reaction pool, and the suction plate placement frame is provided with a clearance groove for the suction plate connector to be placed obliquely on both sides of the side close to the silicon wafer loading direction. The second direction of the reaction pool is parallel to the direction of silicon wafer feeding, and the setting of the clearance groove provides guidance for the flipping of the vacuum suction plate, ensuring that after the vacuum suction plate is flipped, the side of the silicon wafer adsorbed thereon away from the vacuum suction plate can be immersed in the reaction pool for nickel plating.

[0011] Further, the fixing part is arranged in a cross shape, and threaded holes for the locking bolts to pass through and connect it with the suction cup placement rack are provided at the four corners of the cross shape. The cross-shaped structure makes the connection between the suction cup connecting piece and the suction cup placement rack closer, and the bolt locking at the four mutually perpendicular points can better ensure the stability during frequent flipping processes.

[0012] Further, a plurality of the reaction tanks and the suction cup flipping brackets are arranged alternately at intervals, and the suction cup flipping bracket is arranged on one side of the reaction tank along the first direction. The first direction of the reaction tank is perpendicular to the direction of silicon wafer feeding. The spaced arrangement of the reaction tanks avoids interference between them when the vacuum suction cup adsorbs and flips the silicon wafers. The suction cup flipping bracket is arranged on one side of the reaction tank along the first direction, making the entire silicon wafer flipping mechanism structurally compact, effectively reducing the overall floor area, and reserving sufficient space for the setting of the silicon wafer feeding line parallel to the nickel plating line of the reaction tank.

[0013] Advantages of the present utility model:

[0014] In the present utility model, the vacuum suction cup, the suction cup flipping bracket, the suction cup connecting piece and the flipping assembly cooperate with each other. Driven by the driving part of the flipping assembly, the vacuum suction cup can quickly flip the silicon wafer and place it in the reaction tank for nickel plating, improving the processing efficiency of the silicon wafer. The structure is simple and convenient for maintenance. Description of the Drawings

[0015] Figure 1 It is an axonometric view of the overall structure of an embodiment of the present utility model;

[0016] Figure 2 is Figure 1 an enlarged structural schematic diagram of A in

[0017] Figure 3 is a top view of the overall structure during the feeding process on the silicon wafer feeding line;

[0018] In the figure: 1. Vacuum suction cup; 2. Suction cup flipping bracket; 3. Suction cup connecting piece; 4. Locking bolt; 5. Connecting shaft; 6. Flipping assembly; 61. Driving part; 62. Rotating shaft; 63. Support plate; 64. Driving main gear; 65. Driving slave gear; 66. Belt transmission assembly; 661. Transmission belt; 662. Belt driving wheel; 663. Belt driven wheel; 7. Reaction tank; 8. Suction cup placement rack. Detailed Embodiments

[0019] The following elaborates on the preferred embodiments of the present utility model in conjunction with the drawings, so that the advantages and features of the present utility model can be more easily understood by those skilled in the art, thereby making the protection scope of the present utility model more clearly defined.

[0020] See the appendix Figures 1 to 3 As shown, a silicon wafer flipping mechanism in this embodiment is used to flip the silicon wafers on the silicon wafer feeding line and place them in several reaction chambers 7 for nickel plating. It includes several vacuum suction pads 1, which directly adsorb the silicon wafers through the vacuum suction pads 1. In some embodiments, the vacuum suction pads 1 are square in shape that matches the shape of the silicon wafers, and can ensure that all parts of the silicon wafers are adsorbed during vacuum adsorption, thus avoiding the phenomenon of warping of the silicon wafers due to insufficient suction force;

[0021] Several of the vacuum suction pads 1 are symmetrically arranged on both sides of the reaction chamber 7 and correspond to the positions of the reaction grooves on the reaction chamber 7. By symmetrically arranging the vacuum suction pads 1, the silicon wafers can be alternately placed in the corresponding reaction chambers 7 for nickel plating, realizing uninterrupted nickel plating operation of the silicon wafers, and thus effectively improving the working efficiency of silicon wafer nickel plating processing;

[0022] Each of the vacuum suction pads 1 is detachably connected to a flipping assembly 6. The flipping assembly 6 includes a driving member 61. When the driving end of the driving member 61 rotates, it can make the vacuum suction pad 1 flip in the direction of approaching or departing from the reaction chamber 7. The detachable connection of the vacuum suction pad 1 facilitates its maintenance and replacement at any time, which is convenient for the operation of the staff. The driving member 61 makes the vacuum suction pad 1 flip, and then realizes that the silicon wafers are automatically adsorbed by the vacuum suction pad 1 and flipped into the reaction chamber 7 for nickel plating without manual operation, which can improve the efficiency of silicon wafer nickel plating and reduce the labor intensity of the staff at the same time.

[0023] The vacuum suction pad 1 is fixedly connected to a connecting shaft 5 on a suction pad flipping bracket 2 through a suction pad connecting member 3. The suction pad flipping bracket 2 plays a supporting role in the flipping of the vacuum suction pad 1. The suction pad connecting member 3 is rotatably connected to the suction pad flipping bracket 2, so that when the suction pad connecting member 3 rotates with the connecting shaft 5 as the fulcrum, the vacuum suction pad 1 also rotates by a corresponding angle, thus realizing the automatic flipping of the vacuum suction pad 1;

[0024] A belt transmission assembly 66 is vertically arranged on the suction pad flipping bracket 2. The belt transmission assembly 66 includes a belt driving wheel 662, a belt driven wheel 663 and a transmission belt 661. One end of the connecting shaft 5 away from the suction pad connecting member 3 is connected to the belt driven wheel 663 by a bearing, and a transverse shaft for bearing connection of the belt driving wheel 662 is arranged at the bottom of the suction pad flipping bracket 2. The belt transmission assembly 66 provides power for the rotation of the connecting shaft 5 without manual operation of the staff to rotate the connecting shaft 5. When the belt driving wheel 662 rotates, under the driving action of the transmission belt 661, the belt driven wheel 663 bearing-connected to the connecting shaft 5 can drive the connecting shaft 5 to rotate, and then realize the flipping of the vacuum suction pad 1 relative to the connecting shaft 5.

[0025] The flipping assembly 6 further includes a rotating shaft 62 extending along the length direction of the reaction tank 7 and a driving driven gear 65. One end of the rotating shaft 62 is connected to the driving end of the driving member 61. When the driving end of the driving member 61 rotates, it can directly provide the power for the rotating shaft 62 to rotate. In some embodiments, the driving member 61 is a driving motor. It should be noted that it is not limited to only a driving motor, and it can also be a known mechanical structure such as a dividing plate that can drive the rotating shaft 62 to rotate;

[0026] A number of driving main gears 64 corresponding in number and position to the reaction grooves are connected to the rotating shaft 62 by bearings. The driving driven gear 65 is coaxially connected to the belt driving wheel 662 and meshes with the driving main gear 64. The driving member 61 drives the rotating shaft 62 to rotate, so that the driving main gear 64 thereon drives the meshing driving driven gear 65 to rotate, thereby providing power for the belt transmission assembly 66 and realizing the flipping of the vacuum suction tray 1.

[0027] In some embodiments, the silicon wafer flipping mechanism is arranged on the bottom plate. A plurality of support plates 63 through which the rotating shaft 62 passes and is connected by bearings are arranged on the bottom plate. The arrangement of the support plates 63 can support the rotating shaft 62, thereby ensuring the stability of the rotation of the rotating shaft 62 driven by the driving member 61, and further ensuring the stability of the flipping of the vacuum suction tray 1.

[0028] It further includes a suction tray placement rack 8. The vacuum suction tray 1 is located on the suction tray placement rack 8. One side of the suction tray placement rack 8 away from the vacuum suction tray 1 is connected to the suction tray. The arrangement of the suction tray placement rack 8 provides support for the vacuum suction tray 1 and facilitates its connection with the suction tray connecting member 3.

[0029] The suction tray connecting member 3 includes a fixing portion and a connecting portion. The connecting portion is inclined along the center line in the second direction away from the reaction tank 7. A relief groove for the inclined placement of the suction tray connecting member 3 is provided at both corners on one side of the suction tray placement rack 8 close to the silicon wafer loading direction. The second direction of the reaction tank 7 is parallel to the direction of silicon wafer feeding. The arrangement of the relief groove provides guidance for the flipping of the vacuum suction tray 1, ensuring that the side of the silicon wafer adsorbed on the vacuum suction tray 1 away from the vacuum suction tray 1 can be immersed in the reaction tank 7 for nickel plating after the vacuum suction tray 1 is flipped.

[0030] The fixing portion is arranged in a cross shape, and threaded holes for the locking bolts 4 to pass through and connect it to the suction tray placement rack 8 are provided at the four corners of the cross shape. The cross-shaped structure makes the connection between the suction tray connecting member 3 and the suction tray placement rack 8 closer, and the bolt locking at the four mutually perpendicular points can also better ensure the stability during frequent flipping.

[0031] A plurality of the reaction tanks 7 and the sucker turning brackets 2 are arranged alternately at intervals, and the sucker turning brackets 2 are arranged on one side of the reaction tanks 7 along the first direction. The first direction of the reaction tanks 7 is perpendicular to the direction of silicon wafer feeding. The reaction tanks 7 are arranged at intervals to avoid interference between each other when the vacuum suction trays 1 adsorb and turn the silicon wafers. The sucker turning brackets 2 are arranged on one side of the reaction tanks 7 along the first direction, making the entire silicon wafer turning mechanism structure compact, effectively reducing the overall floor area, and reserving sufficient space for the setting of the silicon wafer feeding line parallel to the nickel plating line of the reaction tanks 7.

[0032] The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose is to enable those who are familiar with this technology to understand the content of the present invention and implement it. It should not be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims

1. A silicon wafer flipping mechanism is used to flip the silicon wafers on the silicon wafer feeding line and place them in a number of reaction chambers for nickel plating, and is characterized in that: It comprises a plurality of vacuum suction discs, which are symmetrically arranged on both sides of the reaction pool and correspond to the positions of the reaction slots on the reaction pool. Each of the vacuum suction discs is detachably connected to a flipping assembly. The flipping assembly comprises a driving member. When the driving end of the driving member rotates, the vacuum suction disc can be flipped towards a direction close to or away from the reaction pool.

2. The silicon wafer turnover mechanism according to claim 1, characterized in that: The vacuum suction cup is fixedly connected to the connecting shaft on the suction cup flip bracket through a suction cup connecting piece. A belt transmission assembly is vertically arranged on the suction cup flip bracket. The belt transmission assembly includes a belt driving wheel, a belt driven wheel and a transmission belt. One end of the connecting shaft away from the suction cup connecting piece is connected to the belt driven wheel bearing. A transverse shaft for connecting the belt driving wheel bearing is arranged at the bottom of the suction cup flip bracket.

3. The silicon wafer turnover mechanism according to claim 2, characterized in that: The flip assembly also includes a rotating shaft extending along the length direction of the reaction tank and a drive slave gear. One end of the rotating shaft is connected to the driving end of the driving member. The bearing on the rotating shaft is connected to a plurality of drive main gears whose number is consistent with the reaction tank and whose positions correspond. The drive slave gear is coaxially connected to the belt driving wheel and meshes with the drive main gear.

4. A silicon wafer flipping mechanism according to claim 2, characterized in that: It also includes a suction plate placement rack, the vacuum suction plate is located on the suction plate placement rack, and the suction plate placement rack is connected to the suction plate at a side away from the vacuum suction plate.

5. A silicon wafer flipping mechanism according to claim 4, characterized in that: The suction plate connecting piece includes a fixing part and a connecting part, and the connecting part is arranged obliquely along the center line of the second direction away from the reaction pool. Both corners of the suction plate placement rack on one side close to the silicon wafer loading direction are provided with a makeshift groove for the suction plate connecting piece to be placed obliquely.

6. The wafer turning mechanism according to claim 5, wherein: The fixing part is arranged in a cross shape, and threaded holes are provided at the four corners of the cross for locking bolts to pass through and connect the locking bolts with the suction pan placement frame.

7. A silicon wafer flipping mechanism according to claim 1, characterized in that: A plurality of the reaction pools and the suction cup flip brackets are arranged alternately and at intervals, and the suction cup flip bracket is arranged on one side of the reaction pool along the first direction.

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