Oscillator with refrigeration platform

By using semiconductor refrigeration sheets and reasonable heat dissipation design in the oscillator, the problem of sample inactivation and large space occupancy of the oscillator under low temperature conditions is solved, and the application of temperature control and compact space is realized.

CN223127955UActive Publication Date: 2025-07-22MONAD SUZHOU BIOTECH CO LTD
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Patent Information

Application Number
CN202422962437.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-03
Publication Date
2025-07-22
Estimated Expiration
2034-12-03

AI Technical Summary

Technical Problem

The existing oscillators cannot provide low temperature conditions, resulting in the inactivation of temperature-sensitive samples during mixing and oscillation. The oscillators with refrigeration function are complex in structure and take up a large space, which is not suitable for the compact layout of automated pipetting workstations.

Method used

The semiconductor refrigeration plate is used as a refrigeration device, combined with the cooling fan and reasonable inlet and outlet path design, to achieve accurate control of the refrigeration temperature and efficient heat dissipation, ensuring that the overall oscillator occupies a small space.

Benefits of technology

It realizes the maintenance of sample activity during the mixing of temperature-sensitive samples, while reducing the overall space occupation of the oscillator, and is suitable for automated detection platforms.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides an oscillator with a refrigeration platform, which comprises a refrigeration platform unit and a base unit, and the refrigeration platform unit comprises a placing platform, a semiconductor refrigeration sheet and a radiating seat; air outlets are formed in the lower portions of the left side wall and the right side wall of an air inlet lower shell of the base unit, and cooling fans are installed on the left half portion and the right half portion of an inner cavity of the air inlet lower shell respectively. The semiconductor chilling plate is used as a refrigerating device, the size is small, the weight is light, and accurate control over the refrigerating temperature is facilitated; the base unit fully utilizes the space on the left side and the right side below the refrigeration platform unit, a cooling fan and an air inlet and outlet path are reasonable and compact in design, efficient heat dissipation is carried out, it is ensured that the oscillator is small in overall occupied space, the oscillator can be conveniently integrated and applied to other automatic detection platforms such as an automatic pipetting work station, and the applicability of the oscillator is improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of oscillators, in particular to an oscillator with a refrigeration platform. Background Art

[0002] An oscillator is a commonly used device in laboratories and is widely used in fields such as biology, chemistry, and medicine for rapid mixing and oscillation of samples. The working principle of an oscillator is mainly based on rotational or oscillatory movements. Through electric drive, strong eddy current movements or reciprocating movements are generated in the container with the sample, thereby achieving rapid mixing and oscillation of the sample. A vortex mixer oscillator utilizes the principle of eccentric rotation. Through a drive device, strong eddy current movements are generated in the liquid in the container, thereby achieving rapid mixing of the sample and being suitable for mixing small-volume samples.

[0003] Existing general oscillators cannot provide low-temperature conditions. During the mixing and oscillation of samples, temperature rise will occur, which will cause inactivation of some samples for samples that are sensitive to temperature adaptation conditions, affecting the accuracy of subsequent experimental test results, and corresponding adaptation temperatures cannot be provided for corresponding low-temperature scenarios. A small number of oscillators with refrigeration functions also have the disadvantages of complex structure and large occupied space, which is not conducive to the compact structure layout of an automated pipetting workstation. Summary of the Utility Model

[0004] In order to overcome the above deficiencies of the prior art, the purpose of the utility model is to provide an oscillator with a refrigeration platform.

[0005] To achieve the above purpose, the technical solution adopted by the utility model to solve its technical problems is: an oscillator with a refrigeration platform, comprising:

[0006] A refrigeration platform unit, which includes a placement platform, a semiconductor refrigeration chip, and a heat dissipation base arranged in sequence from top to bottom. An insulation pad is also provided in a circle outside the semiconductor refrigeration chip between the placement platform and the heat dissipation base. The bottom surface of the heat dissipation base is provided with multiple magnetic attraction columns and multiple ceramic wear-resistant pieces. A drive connection head is provided in the middle of the bottom surface of the heat dissipation base, and heat dissipation fins are provided at the left and right ends of the bottom surface of the heat dissipation base;

[0007] Base unit, which includes an air inlet lower housing. Multiple concave polarization track holes and multiple ball receiving holes are provided at the top of the air inlet lower housing. Magnets are provided at the bottoms of the polarization track holes. The magnetic attraction columns are located within the polarization track holes. Ball bearings are provided within the ball receiving holes, and the ball bearings are in contact with the ceramic wear-resistant sheets. Air inlets are provided at the upper portions of the left and right side walls of the air inlet lower housing, and air outlets are provided at the lower portions. Cooling fans are respectively installed in the left and right halves of the inner cavity of the air inlet lower housing. A polarization driving mechanism is provided in the middle of the inner cavity of the air inlet lower housing. The polarization driving mechanism includes a motor, a polarization shaft, and a balance weight. The lower end of the polarization shaft is connected to the output shaft of the motor, the balance weight is connected to the polarization shaft, the top end of the polarization shaft is connected to the driving connection head on the bottom surface of the heat dissipation base, and the top and bottom ends of the polarization shaft are eccentrically arranged.

[0008] In the present utility model, the upper surface of the thermoelectric cooler can cool the placement platform according to a set temperature. The heat on the lower surface of the thermoelectric cooler is transferred to the heat dissipation base. Cooling fans are respectively arranged on the left and right sides of the base unit, which can timely dissipate the heat of the heat dissipation base and improve the working efficiency of the thermoelectric cooler. In the present utility model, the thermoelectric cooler is used as a refrigeration device, which is small in volume and light in weight, and is convenient for accurately controlling the refrigeration temperature. The base unit makes full use of the space on the left and right sides below the refrigeration platform unit. The cooling fans and the air inlet and outlet paths are designed reasonably and compactly. While achieving efficient heat dissipation, it ensures that the overall space occupied by the oscillator is small, which is convenient for integration and application in other automated detection platforms such as automated pipetting workstations, thus improving the applicability of the oscillator.

[0009] Further, a carbon film is provided between the upper surface of the thermoelectric cooler and the bottom surface of the placement platform.

[0010] Adopting the above preferred solution, the carbon film can improve the heat conduction efficiency between the thermoelectric cooler and the placement platform and enhance the refrigeration effect.

[0011] Further, a groove is provided on the upper surface of the heat dissipation base, and multiple copper heat conduction bars are embedded in the groove.

[0012] Further, the copper heat conduction bars are distributed parallel to the length direction of the heat dissipation base.

[0013] Adopting the above preferred solution, the high temperature in the non-heat dissipation fin area on the heat dissipation base can be timely transferred to the heat dissipation fins for dissipation, improving the heat dissipation efficiency of the lower surface of the thermoelectric cooler.

[0014] Further, a heat insulation outer frame is provided around the refrigeration platform unit, and one orifice plate corner seat is provided at each of the four corners of the heat insulation outer frame.

[0015] Further, X-direction elastic pieces and Y-direction elastic pieces are provided on the orifice plate corner seat.

[0016] With the above - mentioned preferred solution, the position stability of the porous plate on the placement platform is improved.

[0017] Furthermore, the heat - dissipating fins extend vertically downward from the bottom surface of the heat - dissipating base, and the heat - dissipating fins are parallel to the length direction of the heat - dissipating base.

[0018] Furthermore, a wind - blocking plate is provided on the side of the heat - dissipating fin close to the drive connector.

[0019] With the above - mentioned preferred solution, the incoming air is smoothly blown towards the heat - dissipating fins, reducing wind resistance and improving the heat - dissipation efficiency. Brief Description of the Drawings

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following - described drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0021] Figure 1 It is a schematic structural diagram of an embodiment of the present invention.

[0022] Figure 2 It is a schematic structural diagram of the refrigeration platform unit of the present invention.

[0023] Figure 3 It is a cross - sectional view of the refrigeration platform unit of the present invention.

[0024] Figure 4 It is a schematic rear view of the refrigeration platform unit of the present invention.

[0025] Figure 5 It is a schematic structural diagram of the heat - dissipating base of the present invention.

[0026] Figure 6 It is one of the schematic structural diagrams of the base unit of the present invention.

[0027] Figure 7 It is the other schematic structural diagram of the base unit of the present invention.

[0028] The names of the corresponding components represented by the numbers and letters in the figures:

[0029] 10 - Refrigeration platform unit; 11 - Placement platform; 12 - Thermoelectric cooler; 13 - Heat dissipation base; 131 - Heat dissipation fins; 132 - Windshield; 133 - Copper heat conduction bar; 134 - Magnetic attraction column; 135 - Ceramic wear-resistant piece; 14 - Heat insulation pad; 15 - Drive connector; 16 - Carbon film; 17 - Heat insulation outer frame; 18 - Orifice plate corner seat; 181 - X-direction elastic piece; 182 - Y-direction elastic piece; 20 - Base unit; 21 - Air inlet lower shell; 211 - Air inlet; 212 - Air outlet; 213 - Polarization track slot hole; 214 - Ball receiving hole; 22 - Heat dissipation fan; 23 - Polarization drive mechanism; 231 - Motor; 232 - Polarization axis; 233 - Balance weight; 24 - Ball. Detailed implementation manner

[0030] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0031] As Figure 1-7 shown, an oscillator with a refrigeration platform includes:

[0032] The refrigeration platform unit 10, which includes a placement platform 11, a thermoelectric cooler 12, and a heat dissipation base 13 arranged in sequence from top to bottom. A heat insulation pad 14 is also provided in a circle outside the thermoelectric cooler 12 between the placement platform 11 and the heat dissipation base 13. A plurality of magnetic attraction columns 134 and a plurality of ceramic wear-resistant pieces 135 are provided on the bottom surface of the heat dissipation base 13. A drive connector 15 is provided in the middle of the bottom surface of the heat dissipation base 13, and heat dissipation fins 131 are provided at the left and right ends of the bottom surface of the heat dissipation base 13;

[0033] Base unit 20, which includes an air intake lower housing 21. Multiple concave polarization track holes 213 and multiple ball receiving holes 214 are provided at the top of the air intake lower housing 21. Magnets are provided at the bottom of the polarization track holes 213. The magnetic attraction column 134 is located within the polarization track holes 213. Ball bearings 24 are provided within the ball receiving holes 214, and the ball bearings 24 are in contact with the ceramic wear-resistant sheet 135. Air inlets 211 are provided at the upper parts of the left and right side walls of the air intake lower housing 21, and air outlets 212 are provided at the lower parts. Cooling fans 22 are respectively installed in the left and right halves of the inner cavity of the air intake lower housing 21. A polarization driving mechanism 23 is provided in the middle of the inner cavity of the air intake lower housing 21. The polarization driving mechanism 23 includes a motor 231, a polarization shaft 232, and a balance weight 233. The lower end of the polarization shaft 232 is connected to the output shaft of the motor 231, the balance weight 233 is connected to the polarization shaft 232, the top end of the polarization shaft 232 is connected to the driving connection head 15 on the bottom surface of the heat dissipation base 13, and the axis of the top end and the axis of the lower end of the polarization shaft 232 are eccentrically arranged.

[0034] The beneficial effects of adopting the above technical solution are as follows: The upper surface of the semiconductor refrigeration sheet can refrigerate the placement platform according to the set temperature. The heat on the lower surface of the semiconductor refrigeration sheet is transferred to the heat dissipation base. Cooling fans are respectively arranged on the left and right sides of the base unit, which can timely dissipate the heat of the heat dissipation base and improve the working efficiency of the semiconductor refrigeration sheet. In the present utility model, the semiconductor refrigeration sheet is used as the refrigeration device, which is small in volume and light in weight, and is convenient for accurately controlling the refrigeration temperature. The base unit makes full use of the space on the left and right sides below the refrigeration platform unit. The cooling fans and the air inlet and outlet paths are designed reasonably and compactly. While dissipating heat efficiently, it ensures that the overall space occupied by the oscillator is small, which is convenient for integration and application in other automated detection platforms such as automated liquid transfer workstations, and improves the applicability of the oscillator.

[0035] As Figure 3 shown, in some other embodiments of the present utility model, a carbon film 16 is provided between the upper surface of the semiconductor refrigeration sheet 12 and the bottom surface of the placement platform 11. The beneficial effect of adopting the above technical solution is that the carbon film can improve the heat conduction efficiency between the semiconductor refrigeration sheet and the placement platform and improve the refrigeration effect.

[0036] As Figure 5 shown, in some other embodiments of the present utility model, a groove is provided on the upper surface of the heat dissipation base 13, and multiple copper heat conduction bars 133 are embedded in the groove. The copper heat conduction bars 133 are distributed parallel to the length direction of the heat dissipation base 13. The beneficial effect of adopting the above technical solution is that it can timely transfer the high temperature in the non-heat dissipation fin area on the heat dissipation base to the heat dissipation fins for dissipation, and improve the heat dissipation efficiency of the lower surface of the semiconductor refrigeration sheet.

[0037] As Figure 2As shown, in some other embodiments of the present utility model, a heat insulation outer frame 17 is provided around the refrigeration platform unit 10, and one orifice plate corner seat 18 is provided at each of the four corners of the heat insulation outer frame 17. An X-direction leaf spring 181 and a Y-direction leaf spring 182 are provided on the orifice plate corner seat 18. The beneficial effect of adopting the above technical solution is: to improve the position stability of the multi-orifice plate on the placement platform.

[0038] As Figure 4 shown, in some other embodiments of the present utility model, the heat dissipation fins 131 extend vertically downward from the bottom surface of the heat dissipation seat 13, and the heat dissipation fins 131 are parallel to the length direction of the heat dissipation seat 13. A wind deflector 132 is provided on the side of the heat dissipation fin 131 close to the drive connector. The beneficial effect of adopting the above technical solution is: to smoothly blow the incoming air towards the heat dissipation fins, reduce wind resistance, and improve the heat dissipation efficiency.

[0039] The above embodiments are only for illustrating the technical concept and features of the present utility model, and the purpose is to enable those of ordinary skill in the art to understand the content of the present utility model and implement it. It should not be used to limit the protection scope of the present utility model. Any equivalent changes or modifications made according to the spirit and essence of the present utility model should be covered within the protection scope of the present utility model.

Claims

1. An oscillator with a refrigeration platform, characterized in that, Comprising: A refrigeration platform unit, which includes a placement platform, a semiconductor refrigeration sheet, and a heat dissipation base arranged in sequence from top to bottom. There is also a heat insulation pad located around the semiconductor refrigeration sheet between the placement platform and the heat dissipation base. The bottom surface of the heat dissipation base is provided with multiple magnetic adsorption columns and multiple ceramic wear-resistant sheets. A drive connection head is provided in the middle of the bottom surface of the heat dissipation base, and heat dissipation fins are provided at the left and right ends of the bottom surface of the heat dissipation base; A base unit, which includes an air inlet lower case. The top of the air inlet lower case is provided with multiple concave polarization track holes and multiple ball receiving holes. Magnets are provided at the bottoms of the polarization track holes. The magnetic adsorption columns are located in the polarization track holes. Ball bearings are provided in the ball receiving holes, and the ball bearings are in contact with the ceramic wear-resistant sheets; Air inlets are provided on the upper parts of the left and right side walls of the air inlet lower case, and air outlets are provided on the lower parts of the left and right side walls. Heat dissipation fans are respectively installed in the left half and the right half of the inner cavity of the air inlet lower case; A polarization drive mechanism is provided in the middle of the inner cavity of the air inlet lower case. The polarization drive mechanism includes a motor, a polarization shaft, and a balance block. The lower end of the polarization shaft is connected to the output shaft of the motor, the balance block is connected to the polarization shaft, the top end of the polarization shaft is connected to the drive connection head on the bottom surface of the heat dissipation base, and the top end and the lower end of the polarization shaft are eccentrically arranged.

2. The oscillator with a refrigeration platform according to claim 1, characterized in that, A carbon film is provided between the upper surface of the semiconductor refrigeration sheet and the bottom surface of the placement platform.

3. The oscillator with a refrigeration platform according to claim 1, characterized in that, The upper surface of the heat dissipation base is provided with grooves, and multiple copper heat conduction strips are embedded in the grooves.

4. The oscillator with a refrigeration platform according to claim 3, characterized in that, The copper heat conduction strips are distributed parallel to the length direction of the heat dissipation base.

5. The oscillator with a refrigeration platform according to claim 1, characterized in that, A heat insulation outer frame is provided around the refrigeration platform unit, and one orifice plate corner seat is provided at each of the four corners of the heat insulation outer frame.

6. The oscillator with a refrigeration platform according to claim 5, characterized in that, X-direction elastic pieces and Y-direction elastic pieces are provided on the orifice plate corner seat.

7. The oscillator with a refrigeration platform according to claim 1, characterized in that, The heat dissipation fins extend vertically downward from the bottom surface of the heat dissipation base, and the heat dissipation fins are parallel to the length direction of the heat dissipation base.

8. The oscillator with a refrigeration platform according to claim 7, characterized in that, A wind shield is provided on the side surface of the heat dissipation fin close to the drive connection head.