Ceramic substrate breaking equipment

Abstract

The utility model provides ceramic substrate breaking equipment which comprises a feeding mechanism, an edge breaking mechanism, a first taking and placing mechanism, a first breaking mechanism, a second breaking mechanism, a second taking and placing mechanism, a third taking and placing mechanism and a visual inspection mechanism, and the first taking and placing mechanism is used for taking and placing a ceramic substrate from the feeding mechanism to the edge breaking mechanism; the second taking and placing mechanism is used for taking and placing the ceramic substrate from the edge breaking mechanism to the first sheet breaking mechanism, and the third taking and placing mechanism is used for taking and placing the ceramic substrate from the first sheet breaking mechanism to the second sheet breaking mechanism; the visual detection mechanism comprises a first visual assembly, a second visual assembly and a third visual assembly, the first visual assembly is arranged at the front end of the edge breaking mechanism, the second visual assembly is arranged at the front end of the first piece breaking mechanism, and the third visual assembly is arranged at the front end of the second piece breaking mechanism. According to the utility model, through the highly automatic and precise design, the full-automatic operation from a ceramic mother board to a single ceramic mother board is realized, the production efficiency and the product quality are greatly improved, and the cost is greatly reduced.

Description

Technical Field

[0001] The utility model relates to the field of automation equipment, in particular to a ceramic substrate breaking device. Background Art

[0002] Ceramic substrates have become the basic materials for high-power power electronic circuit structure technology and interconnection technology due to their advantages such as high thermal conductivity and high insulation. At present, ceramic substrates mainly adopt laser cutting technology, and then are manually broken along the slits. This method has a high labor intensity, is prone to produce defective products, and will generate slag and debris during the breaking process, causing pollution to the surrounding environment. In addition, after long-term operation, the existing automatic breaking device for ceramic copper-clad substrates may have problems such as unstable pressing or inability to break open at one time, resulting in damage to the cut seams of the ceramic copper-clad substrates. In addition, the existing ceramic substrate cutting device will generate a lot of slag and debris during cutting, resulting in pollution to the surrounding environment during use.

[0003] Therefore, it is necessary to design a ceramic substrate breaking device to solve the above problems. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a ceramic substrate breaking device, which improves production efficiency and product quality and reduces labor intensity through automated processes such as feeding, edge breaking, and sheet breaking.

[0005] To achieve the above purpose, the utility model adopts the following technical scheme: a ceramic substrate breaking device, which includes a feeding mechanism, an edge breaking mechanism, a first picking and placing mechanism, a first sheet breaking mechanism, a second sheet breaking mechanism, a second picking and placing mechanism, a third picking and placing mechanism, and a vision detection mechanism. The first picking and placing mechanism is used to pick and place the ceramic substrate from the feeding mechanism to the edge breaking mechanism; the second picking and placing mechanism is used to pick and place the ceramic substrate from the edge breaking mechanism to the first sheet breaking mechanism, and the third picking and placing mechanism is used to pick and place the ceramic substrate from the first sheet breaking mechanism to the second sheet breaking mechanism; the vision detection mechanism includes a first vision component, a second vision component, and a third vision component. The first vision component is arranged at the front end of the edge breaking mechanism, the second vision component is arranged at the front end of the first sheet breaking mechanism, and the third vision component is arranged at the front end of the second sheet breaking mechanism.

[0006] As a further improved technical scheme of the utility model, the edge breaking mechanism includes an edge breaking moving fixture, a clamping component for clamping and fixing the substrate on the edge breaking moving fixture, and a liftable pressing strip. The liftable pressing strip is arranged along the edge of the substrate and presses and breaks the edge of the substrate after the clamping component clamps the substrate.

[0007] As a further improved technical solution of the present utility model, the first sheet-breaking mechanism includes a first moving fixture and a liftable pressing strip, and the liftable pressing strip presses and breaks the ceramic substrate on the first moving fixture during the descending process.

[0008] As a further improved technical solution of the present utility model, the second sheet-breaking mechanism includes a second moving fixture and a liftable pressing strip, and the liftable pressing strip presses and breaks the ceramic substrate on the second moving fixture during the descending process.

[0009] As a further improved technical solution of the present utility model, the edge-breaking mechanism, the first sheet-breaking mechanism and the second sheet-breaking mechanism are arranged side by side in sequence, and the first picking and placing mechanism includes a linear module and a plurality of suction cup groups driven by the linear module.

[0010] As a further improved technical solution of the present utility model, the number of the edge-breaking mechanisms is at least two groups, the number of the first sheet-breaking mechanisms is at least two groups, and the number of the second sheet-breaking mechanisms is at least three groups.

[0011] As a further improved technical solution of the present utility model, a turning-over mechanism is further included. The turning-over mechanism is arranged between the edge-breaking mechanism and the second picking and placing mechanism. The turning-over module includes a substrate temporary storage position and a turning-over module. The ceramic substrate after edge-breaking is picked and placed to the turning-over module by the second picking and placing mechanism. The turning-over module turns over the ceramic substrate and places it at the substrate temporary storage position, and the second picking and placing mechanism picks and places the ceramic substrate on the substrate temporary storage position to the first sheet-breaking mechanism.

[0012] As a further improved technical solution of the present utility model, the feeding mechanism includes a material frame belt line, a transfer belt, a material frame turning-over component and a substrate belt line. The transfer belt is docked with the material frame belt line and the material frame turning-over component to transfer the material frame from the material frame belt line to the material frame turning-over component. The material frame turning-over component is docked with the substrate belt line to transfer the ceramic substrates to the substrate belt line one by one.

[0013] As a further improved technical solution of the present utility model, a defective substrate collecting mechanism is further included. The defective substrate collecting mechanism is located on one side of the first vision component, and the first picking and placing mechanism is further used to pick and place the defective ceramic substrates from the feeding mechanism to the defective substrate collecting mechanism.

[0014] As a further improved technical solution of the present utility model, a discharging mechanism is further included. The discharging mechanism is arranged on one side of the second sheet-breaking mechanism to take down the ceramic substrates on the second sheet-breaking mechanism.

[0015] As can be seen from the above technical solutions, the ceramic substrate breaking equipment of the present utility model uses the feeding mechanism, the edge-breaking mechanism, the first picking and placing mechanism, the first breaking mechanism, the second breaking mechanism, the second picking and placing mechanism and the vision detection mechanism in cooperation. Among them, the feeding mechanism is used to transfer ceramic substrates to subsequent processes one by one; the edge-breaking mechanism is used to trim the edges of ceramic substrates; the first picking and placing mechanism is used to pick and place ceramic substrates from the feeding mechanism to the edge-breaking mechanism; the second picking and placing mechanism is used to pick and place ceramic substrates from the edge-breaking mechanism to the first breaking mechanism, and to pick and place ceramic substrates from the first breaking mechanism to the second breaking mechanism; the vision detection mechanism is used to detect and position ceramic substrates in each process to ensure product quality. Through the cooperation of these mechanisms, not only the production efficiency is greatly improved, but also the production efficiency and product quality are greatly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 FIG. is a perspective view of the ceramic substrate breaking equipment according to an embodiment of the present utility model.

[0017] Figure 2 is Figure 1 a perspective view of the first picking and placing mechanism in

[0018] Figure 3 is Figure 1 a perspective view of the edge-breaking mechanism in

[0019] Figure 4 is Figure 1 a perspective view of the first breaking mechanism in

[0020] Figure 5 is Figure 1 a perspective view of the third picking and placing mechanism in

[0021] Figure 6 is Figure 1 a perspective view of the second breaking mechanism in DETAILED DESCRIPTION OF THE EMBODIMENTS

[0022] In order to make the objectives, technical solutions and advantages of the present utility model clearer, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0023] Please refer Figure 1 as shown, the present utility model provides a ceramic substrate breaking equipment, which includes a feeding mechanism 10, a first picking and placing mechanism 20, an edge-breaking mechanism 30, a defective substrate collecting mechanism 40, a first breaking mechanism 50, a second picking and placing mechanism 70, a second breaking mechanism 60, a third picking and placing mechanism 80, a vision detection mechanism and a blanking mechanism 90.

[0024] The feeding mechanism 10 is used to feed the batch of ceramic substrates in the material frame one by one. The feeding mechanism 10 includes a material frame conveyor belt 11, a transfer conveyor belt 12, a material frame flipping assembly 13, and a substrate conveyor belt 14 arranged in sequence. The transfer conveyor belt 12 is docked with the material frame conveyor belt 11 and the material frame flipping assembly 13 to transfer the material frame full of substrates from the material frame conveyor belt 11 to the material frame flipping assembly 13. The material frame flipping assembly 13 is docked with the substrate conveyor belt 14 to transfer the ceramic substrates in the material frame to the substrate conveyor belt 14 one by one.

[0025] Please refer Figure 3 As shown, the edge-breaking mechanism 30 includes an edge-breaking moving fixture 31, a bracket horizontally arranged on the edge-breaking moving fixture 31, a clamping assembly arranged on the bracket for clamping and fixing the substrate on the edge-breaking moving fixture 31, and a liftable pressing strip 36. The liftable pressing strip 36 is arranged along the edge of the substrate and presses and breaks the edge of the substrate after the clamping assembly clamps the substrate. The clamping assembly includes a lifting motor 32 fixed on the bracket, an upper clamping plate 33, and a lower clamping plate 34. The upper clamping plate 33 moves up and down under the drive of the lifting motor 32 to approach or move away from the lower clamping plate 34. In this embodiment, the number of the edge-breaking mechanisms 30 is two and they are arranged side by side, that is, the substrate moving directions of the two edge-breaking mechanisms 30 are parallel to each other. The two edge-breaking mechanisms 30 are respectively used to break the edges of the substrates in different directions.

[0026] The first picking and placing mechanism 20 is used to pick and place the ceramic substrate from the feeding mechanism 10 to the edge-breaking mechanism 30. Please refer Figure 2 As shown, the first picking and placing mechanism 20 includes a linear module 21 and a plurality of suction cup groups 23 driven by it. Specifically, a bracket 24, a lifting motor (not shown), and a cross beam 22 are further arranged on the linear module 21. The bracket 24 moves horizontally under the drive of the linear module 21. A plurality of suction cup groups 23 are arranged in a row below the cross beam 22, and the lifting motor drives the cross beam 22 and the plurality of suction cup groups 23 to lift. The distance between the suction cup groups 23 is equal to the distance between the two edge-breaking mechanisms 30, that is, two adjacent suction cup groups 23 can pick and place the substrates on the two edge-breaking mechanisms simultaneously.

[0027] Please refer Figure 4 As shown, the first wafer-breaking mechanism 50 includes a first moving fixture 51 and a liftable pressing strip 54. Specifically, a bracket 52 and a lifting motor 53 arranged on the bracket 52 are further provided. The pressing strip 54 is arranged below the lifting motor and is lifted and lowered under the drive of the lifting motor 53. The pressing strip 54 presses and breaks the ceramic substrate on the first moving fixture 51 during the descending process. In this embodiment, the number of the first wafer-breaking mechanisms 50 is two and they are arranged side by side. Preferably, the first wafer-breaking mechanism 50 further includes a substrate cleaning assembly arranged within the moving range of the first moving fixture 51. The substrate moving cleaning is used to clean the substrate that moves below it after wafer breaking.

[0028] The second pick-and-place mechanism 70 is used to pick and place the ceramic substrate from the edge-breaking mechanism 30 to the first wafer-breaking mechanism 50. Please refer to Figure 5 As shown, the second pick-and-place mechanism 70 includes a linear module 71, a lifting motor 72 disposed on the linear module 71, and a suction cup group driven by the lifting motor 72 to lift.

[0029] Preferably, the ceramic substrate wafer-breaking device further includes a turning-over mechanism, which is disposed between the edge-breaking mechanism 30 and the second pick-and-place mechanism 70. The turning-over mechanism includes a substrate temporary storage position and a turning-over module. The edge-broken ceramic substrate is picked and placed to the turning-over module by the second pick-and-place mechanism. The turning-over module turns over the ceramic substrate and places it at the substrate temporary storage position. The second pick-and-place mechanism 70 picks and places the ceramic substrate on the substrate temporary storage position to the first wafer-breaking mechanism 50.

[0030] Please refer to Figure 6 As shown, the second wafer-breaking mechanism 60 includes a second moving fixture 61 and a liftable pressing strip 65. Specifically, it further includes a linear module 62 disposed on one side of the second moving fixture 61, a bracket 63 disposed on the linear module 62, a lifting motor 64 disposed on the bracket 63, and the pressing strip 65 is disposed on the lifting motor 64. The pressing strip 65 presses and breaks the ceramic substrate on the second moving fixture 61 during the descending process. In this embodiment, the number of the second wafer-breaking mechanisms 60 is three groups and they are arranged side by side.

[0031] The third pick-and-place mechanism 80 is used to pick and place the ceramic substrate from the first wafer-breaking mechanism 50 to the second wafer-breaking mechanism 60. Its structure is similar to that of the first pick-and-place mechanism 20 and will not be elaborated here.

[0032] The vision inspection mechanism (not labeled) includes a first vision component, a second vision component, and a third vision component. The first vision component is disposed at the front end of the edge-breaking mechanism 30, the second vision component is disposed at the front end of the first wafer-breaking mechanism 50, and the third vision component is disposed at the front end of the second wafer-breaking mechanism 60. The defective substrate collection mechanism 40 is located on one side of the first vision component. The first pick-and-place mechanism 20 is used to pick and place the defective ceramic substrate from the feeding mechanism 10 to the defective substrate collection mechanism 40. The vision inspection mechanism can not only detect the defects of the substrate to be edge-broken to prevent defective products from being mixed into the finished products, but also can position the substrates entering the edge-breaking mechanism 30, the first wafer-breaking mechanism 50, and the second wafer-breaking mechanism 60 to make the subsequent edge-breaking and wafer-breaking accurately positioned.

[0033] The blanking mechanism 90 is disposed on one side of the second wafer-breaking mechanism 60 to remove the ceramic substrate on the second wafer-breaking mechanism 60. The blanking mechanism 90 is preferably a multi-axis manipulator.

[0034] Spatial relative position terms such as "upper", "lower", "front", "rear", etc. used in this text are for the purpose of facilitating description of the relationship of one feature relative to another as shown in the accompanying drawings. It can be understood that depending on the placement position of the product, the spatial relative position terms may be intended to include different orientations other than those shown in the figures, and should not be construed as a limitation on the claims.

[0035] In addition, the above embodiments are only used to illustrate the present utility model and do not limit the technical solutions described in the present utility model. The understanding of this specification should be based on those skilled in the art of the relevant technical field. Although this specification has described the present utility model in detail with reference to the above embodiments, those of ordinary skill in the art should understand that those skilled in the relevant technical field can still modify the present utility model or make equivalent replacements, and all technical solutions and their improvements that do not depart from the spirit and scope of the present utility model should be covered within the scope of the claims of the present utility model.

Claims

1. A ceramic substrate breaking device, characterized in that, It includes a loading mechanism, a side-breaking mechanism, a first picking and placing mechanism, a first chip-breaking mechanism, a second chip-breaking mechanism, a second picking and placing mechanism, a third picking and placing mechanism and a vision inspection mechanism. The first picking and placing mechanism is used to pick and place the ceramic substrate from the loading mechanism to the side-breaking mechanism; the second picking and placing mechanism is used to pick and place the ceramic substrate from the side-breaking mechanism to the first chip-breaking mechanism, and the third picking and placing mechanism is used to pick and place the ceramic substrate from the first chip-breaking mechanism to the second chip-breaking mechanism; the vision inspection mechanism includes a first vision component, a second vision component and a third vision component. The first vision component is arranged at the front end of the side-breaking mechanism, the second vision component is arranged at the front end of the first chip-breaking mechanism, and the third vision component is arranged at the front end of the second chip-breaking mechanism.

2. The ceramic substrate breaking device according to claim 1, characterized in that: The side-breaking mechanism includes a side-breaking moving jig, a clamping component for clamping and fixing the substrate on the side-breaking moving jig, and a liftable pressing strip. The liftable pressing strip is arranged along the edge of the substrate and presses and breaks the edge of the substrate after the clamping component clamps the substrate.

3. The ceramic substrate breaking device according to claim 1, characterized in that: The first chip-breaking mechanism includes a first moving jig and a liftable pressing strip. The liftable pressing strip presses and breaks the ceramic substrate on the first moving jig during the descending process.

4. The ceramic substrate breaking device according to claim 1, wherein: The second chip-breaking mechanism includes a second moving jig and a liftable pressing strip. The liftable pressing strip presses and breaks the ceramic substrate on the second moving jig during the descending process.

5. The ceramic substrate breaking device according to claim 1, wherein: The side-breaking mechanism, the first chip-breaking mechanism and the second chip-breaking mechanism are arranged side by side in sequence. The first picking and placing mechanism includes a linear module and a plurality of suction cup groups driven by it.

6. The ceramic substrate breaking device according to claim 5, wherein: The number of the side-breaking mechanisms is at least two groups, the number of the first chip-breaking mechanisms is at least two groups, and the number of the second chip-breaking mechanisms is at least three groups.

7. The ceramic substrate breaking device according to claim 1, characterized in that: It further includes a turning-over mechanism. The turning-over mechanism is arranged between the side-breaking mechanism and the second picking and placing mechanism. The turning-over mechanism includes a substrate temporary storage position and a turning-over module. The ceramic substrate after side-breaking is picked and placed to the turning-over module by the second picking and placing mechanism. The turning-over module turns over the ceramic substrate and places it at the substrate temporary storage position. The second picking and placing mechanism picks and places the ceramic substrate on the substrate temporary storage position to the first chip-breaking mechanism.

8. The ceramic substrate breaking device according to claim 1, wherein: The loading mechanism includes a frame belt line, a transfer belt, a frame turning-over component and a substrate belt line. The transfer belt is docked with the frame belt line and the frame turning-over component to transfer the frame from the frame belt line to the frame turning-over component. The frame turning-over component is docked with the substrate belt line to transfer the ceramic substrates one by one to the substrate belt line.

9. The ceramic substrate breaking device according to claim 1, wherein: It further includes a defective substrate collection mechanism. The defective substrate collection mechanism is located on one side of the first vision component. The first picking and placing mechanism is also used to pick and place the defective ceramic substrate from the loading mechanism to the defective substrate collection mechanism.

10. The ceramic substrate breaking device according to claim 1, wherein: It further includes a discharging mechanism. The discharging mechanism is arranged on one side of the second chip-breaking mechanism to take down the ceramic substrate on the second chip-breaking mechanism.

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