Full-automatic vacuum thermoplastic molding and plastic uptake molding integrated device
Through the design of temperature control components, low-temperature gas cooling products are used to solve the problem of low cooling efficiency in existing devices and achieve a more efficient production process.
Patent Information
- Application Number
- CN202422973378.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-03
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2034-12-03
AI Technical Summary
The existing vacuum thermoplastic blister molding devices are inefficient during the cooling process of products, resulting in insufficient production efficiency.
Design temperature control components, including fixed shells, temperature control pipes, heat dissipation blocks and guide fans, after heating the parison through the heating plate, the products are cooled with low temperature gas to shorten the cooling time.
It improves the cooling effect of the product, shortens production time, and enhances the overall practicality of the device.
Smart Images
Figure CN223131349U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of vacuum thermoplastic thermoforming, in particular to an integrated device for full-automatic vacuum thermoplastic thermoforming. Background Technique
[0002] Vacuum forming is to fix a thermoplastic plastic sheet or sheet on a mold, heat it with a radiation heater to reach the softening temperature, then use a vacuum pump to evacuate the air between the mold and the sheet (blank), so that the sheet (blank) preform is formed according to the mold contour. As the vacuum degree increases, the forming pressure below the preform is only 0.06 - 0.085 MPa, while the air pressure above the preform remains at about 0.1 MPa. After cooling and shaping, compressed air is used to blow the product out of the mold for demolding.
[0003] After retrieval, the publication number CN214239511U discloses an integrated device for full-automatic vacuum thermoplastic thermoforming, including a mold. A vacuum groove is opened on the mold, and a plurality of suction holes are opened at the bottom of the vacuum groove. The bottom of the plurality of suction holes is provided with the same vacuum cavity. The bottom of the vacuum cavity is fixedly connected with a vacuum tube. The bottom end of the vacuum tube extends below the mold and is fixedly connected with a vacuum pump. Sliding grooves are opened at the top of both ends of the mold, and sealing covers are slidably connected in the sliding grooves. The utility model can push the sealing cover to slide in the sliding groove through the cooperation of a screw sleeve and a screw rod. Through the cooperation of the two sealing covers, the sheet can be squeezed and sealed and fixed, which is convenient and effective. Its defect is that when cooling the product, the device cools the product through natural cooling, which makes the production efficiency lower during processing. Therefore, for the improvement of the existing integrated device, it is particularly important to design a new type of integrated device for full-automatic vacuum thermoplastic thermoforming to solve the above technical defects and improve the practicability of the overall integrated device. Summary of the Utility Model
[0004] The purpose of the utility model is to provide an integrated device for full-automatic vacuum thermoplastic thermoforming. Through the design of a temperature control component, when the heating plate heats the preform, hot air can be introduced into the connecting frame, and cooperate with the heating plate to heat the preform, so that the heating time is shorter. When the preform is shaped, low-temperature gas is introduced into the connecting frame to effectively cool the product, reduce the cooling time of the product, increase the cooling effect, and thus reduce the production duration, so as to solve the problems raised in the above background technique.
[0005] To achieve the above purpose, the utility model provides the following technical solutions:
[0006] An integrated device for fully automatic vacuum thermoplastic thermoforming, including a mold body, a connection frame is provided at the top of the mold body, a heating plate is provided inside the connection frame, and a temperature control component is provided outside the heating plate and inside the connection frame;
[0007] The temperature control component is used for temperature control of the temperature at the top of the mold body; and the temperature control component is composed of a fixed shell, a temperature control pipe, heat dissipation blocks and guiding fans. The fixed shell is located outside the connection frame, the temperature control pipe is located outside the fixed shell and extends into the connection frame, multiple groups of the heat dissipation blocks are all located outside the temperature control pipe, and multiple groups of the guiding fans are all located inside the connection frame and close to one end of the temperature control pipe.
[0008] As a preferred solution of the present utility model, a temperature rising chamber is opened inside the fixed shell, a temperature lowering chamber is opened outside the temperature rising chamber and inside the fixed shell, and a delivery pipe and a return pipe are respectively provided at both ends of the fixed shell.
[0009] As a preferred solution of the present utility model, both the delivery pipe and the return pipe are respectively connected to the temperature rising chamber and the temperature lowering chamber through two groups of through grooves. A moving block is slidably connected inside the two groups of through grooves and inside the fixed shell, and a delivery groove is opened inside the moving block.
[0010] As a preferred solution of the present utility model, a compression spring is provided outside the moving block and inside the fixed shell, a moving rod is provided inside the fixed shell and outside the two groups of moving blocks, and a driving block is provided outside the moving rod.
[0011] As a preferred solution of the present utility model, a limiting groove is opened inside the driving block, and the driving block is connected to the moving block through the limiting groove. A telescopic cylinder is provided outside the moving rod, and the driving end of the telescopic cylinder is fixedly connected to the moving rod.
[0012] As a preferred solution of the present utility model, a semiconductor refrigeration sheet is provided inside the fixed shell and between the temperature lowering chamber and the temperature rising chamber. The semiconductor refrigeration sheet is respectively connected to the temperature lowering chamber and the temperature rising chamber through two groups of conduction plates. A circulation pump is provided outside the fixed shell and close to one end of the delivery pipe, and the delivery pipe is connected to the delivery pipe through the circulation pump.
[0013] As a preferred solution of the present utility model, multiple groups of the heat dissipation blocks are equidistantly distributed outside the temperature control pipe, and one end of the temperature control pipe far from the circulation pump is connected to the return pipe.
[0014] Compared with the prior art, the beneficial effects of the present utility model are:
[0015] In the present utility model, through the design of the temperature control component, when the heating plate heats the preform, hot air can be introduced into the connection frame, cooperating with the heating plate to heat the preform, so that the heating time is shorter. When the preform is shaped, low-temperature gas is introduced into the connection frame to effectively cool the product, reducing the cooling time of the product, increasing the cooling effect, and thus reducing the production duration. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 is a schematic diagram of the overall structure of the present utility model;
[0017] Figure 2 is a schematic diagram of the structure of the temperature control component of the present utility model;
[0018] Figure 3 is a schematic diagram of the internal structure of the fixed shell of the present utility model.
[0019] In the figure: 1, die body; 2, connection frame; 3, temperature control component; 4, fixed shell; 5, temperature control pipe; 6, heat dissipation block; 7, guiding fan; 8, heating chamber; 9, cooling chamber; 10, conveying pipe; 11, return pipe; 12, through groove; 13, moving block; 14, conveying groove; 15, compression spring; 16, moving rod; 17, driving block; 18, limiting groove; 19, semiconductor refrigeration sheet. SPECIFIC EMBODIMENTS
[0020] The technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0021] Embodiment:
[0022] Please refer to Figures 1 - 3 , the present utility model provides a technical solution:
[0023] An integrated device for fully automatic vacuum thermoplastic thermoforming, including a die body 1, a connection frame 2 is provided at the top of the die body 1, a heating plate is provided inside the connection frame 2, and a temperature control component 3 is provided outside the heating plate and inside the connection frame 2;
[0024] The temperature control component 3 is used to control the temperature at the top of the mold body 1; and the temperature control component 3 is composed of a fixed shell 4, a temperature control pipe 5, heat dissipation blocks 6 and a guiding fan 7. The fixed shell 4 is located outside the connecting frame 2, the temperature control pipe 5 is located outside the fixed shell 4 and extends into the inside of the connecting frame 2, multiple groups of heat dissipation blocks 6 are all located outside the temperature control pipe 5, and multiple groups of guiding fans 7 are all located inside the connecting frame 2 and close to one end of the temperature control pipe 5.
[0025] Furthermore, a heating chamber 8 is opened inside the fixed shell 4, a cooling chamber 9 is opened outside the heating chamber 8 and inside the fixed shell 4. Two ends of the fixed shell 4 are respectively provided with a delivery pipe 10 and a return pipe 11. The delivery pipe 10 and the return pipe 11 are respectively connected to the heating chamber 8 and the cooling chamber 9 through two sets of through slots 12. Inside the two sets of through slots 12 and inside the fixed shell 4, there is a moving block 13 slidably connected. A delivery groove 14 is opened inside the moving block 13. By connecting the delivery pipe 10 and the return pipe 11 to the through slots 12 respectively, the delivery pipe 10 and the return pipe 11 can be respectively connected to the heating chamber 8 and the cooling chamber 9.
[0026] Secondly, a compression spring 15 is provided inside the fixed shell 4 and outside the moving block 13. Inside the fixed shell 4 and outside the two moving blocks 13, there is a moving rod 16. A driving block 17 is provided outside the moving rod 16. By connecting the compression spring 15 to the moving block 13, when the moving block 13 does not contact the driving block 17, the moving block 13 can be driven to displace by the compression spring 15.
[0027] Moreover, a limiting groove 18 is opened inside the driving block 17, and the driving block 17 is connected to the moving block 13 through the limiting groove 18. A telescopic cylinder is provided outside the moving rod 16, and the driving end of the telescopic cylinder is fixedly connected to the moving rod 16. When the telescopic cylinder is started, it drives the moving rod 16 to displace, so that the driving block 17 displaces to drive the moving block 13 to displace. The moving block 13 can be limited through the limiting groove 18. When the moving block 13 displaces, it can drive the delivery groove 14 to displace, and connect the delivery groove 14 to one of the two through slots 12, so that the delivery pipe 10 and the return pipe 11 can be connected to the heating chamber 8 or the cooling chamber 9, enabling the liquid inside the heating chamber 8 or the cooling chamber 9 to be introduced into the inside of the temperature control pipe 5.
[0028] Furthermore, a semiconductor refrigeration sheet 19 is provided inside the fixed shell 4 and between the cooling chamber 9 and the heating chamber 8. The semiconductor refrigeration sheet 19 is connected to the cooling chamber 9 and the heating chamber 8 through two groups of conduction plates respectively. A circulation pump is provided outside the fixed shell 4 and near one end of the conveying pipe 10. The conveying pipe 10 is connected to the conveying pipe 10 through the circulation pump. Multiple groups of heat dissipation blocks 6 are evenly distributed on the outer side of the temperature control pipe 5. One end of the temperature control pipe 5 away from the circulation pump is connected to the return pipe 11. When the semiconductor refrigeration sheet 19 is started, the liquid inside the cooling chamber 9 and the heating chamber 8 can be cooled and heated respectively through the conduction plates at the refrigerating end and the heating end of the semiconductor refrigeration sheet 19. When the circulation pump is started, the liquid inside the cooling chamber 9 or the heating chamber 8 can be introduced into the interior of the temperature control pipe 5 through the conveying pipe 10.
[0029] In this embodiment, the implementation scenario is specifically as follows: When the heating plate heats the preform, the semiconductor refrigeration sheet 19 is started. The liquid inside the cooling chamber 9 and the heating chamber 8 can be cooled and heated respectively through the conduction plates at the refrigerating end and the heating end of the semiconductor refrigeration sheet 19. At this time, the conveying grooves 14 inside the two moving blocks 13 are both connected to the heating chamber 8, so that the conveying pipe 10 and the return pipe 11 can be connected to the heating chamber 8. The circulation pump is started to introduce the heated liquid into the interior of the temperature control pipe 5. The guiding fan 7 is started to cooperate with the heat dissipation blocks 6 to conduct the heat into the interior of the connecting frame 2, and cooperate with the heating plate to heat the preform, so as to improve the forming efficiency of the preform. When the preform is formed and needs to be cooled, the telescopic cylinder is started to drive the moving rod 16 to displace, so that the driving block 17 displaces to drive the moving block 13 to displace. The moving block 13 can be limited through the limiting groove 18. When the moving block 13 displaces, it can drive the conveying groove 14 to displace and connect the conveying groove 14 to the cooling chamber 9, so that the low-temperature liquid inside the cooling chamber 9 is introduced into the interior of the temperature control pipe 5. The preform is cooled and shaped through the cooperation of the heat dissipation blocks 6 and the guiding fan 7. Through the overall design, the preform can be effectively cooled, and the cooling effect can be effectively increased. Through the return pipe 11, the liquid can be refluxed and introduced into the interior of the cooling chamber 9 or the heating chamber 8 for repeated use. Compared with the existing integrated device, the overall practicability of the integrated device can be improved through the design of the present utility model.
[0030] Although the embodiments of the present utility model have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.
Claims
1. An integrated device for fully automatic vacuum thermoplastic thermoforming, comprising a mold body (1), characterized in that: A connecting frame (2) is provided at the top of the mold body (1). A heating plate is provided inside the connecting frame (2), and a temperature control component (3) is provided outside the heating plate and inside the connecting frame (2). The temperature control component (3) is used to control the temperature at the top of the mold body (1). The temperature control component (3) is composed of a fixed shell (4), a temperature control pipe (5), a heat dissipation block (6), and a guiding fan (7). The fixed shell (4) is located outside the connecting frame (2), the temperature control pipe (5) is located outside the fixed shell (4) and extends into the connecting frame (2), multiple groups of the heat dissipation blocks (6) are all located outside the temperature control pipe (5), and multiple groups of the guiding fans (7) are all located inside the connecting frame (2) and close to one end of the temperature control pipe (5).
2. An integrated device for fully automatic vacuum thermoplastic thermoforming, characterized in that: A heating chamber (8) is opened inside the fixed shell (4), a cooling chamber (9) is opened outside the heating chamber (8) and inside the fixed shell (4), and a delivery pipe (10) and a return pipe (11) are respectively provided at both ends of the fixed shell (4).
3. An integrated device for fully automatic vacuum thermoplastic thermoforming, according to claim 2, characterized in that: Both the delivery pipe (10) and the return pipe (11) are connected to the heating chamber (8) and the cooling chamber (9) respectively through two groups of through slots (12). A moving block (13) is slidably connected inside the two groups of through slots (12) and inside the fixed shell (4), and a delivery groove (14) is opened inside the moving block (13).
4. An integrated device for fully automatic vacuum thermoplastic thermoforming, according to claim 3, characterized in that: A compression spring (15) is provided outside the moving block (13) and inside the fixed shell (4). A moving rod (16) is provided inside the fixed shell (4) and outside the two groups of moving blocks (13), and a driving block (17) is provided on the outside of the moving rod (16).
5. An integrated device for fully automatic vacuum thermoplastic thermoforming, characterized in that: A limiting groove (18) is opened inside the driving block (17), and the driving block (17) is connected to the moving block (13) through the limiting groove (18). A telescopic cylinder is provided on the outside of the moving rod (16), and the driving end of the telescopic cylinder is fixedly connected to the moving rod (16).
6. An integrated device for fully automatic vacuum thermoplastic thermoforming, characterized in that: A semiconductor refrigeration sheet (19) is provided inside the fixed shell (4) and between the cooling chamber (9) and the heating chamber (8). The semiconductor refrigeration sheet (19) is connected to the cooling chamber (9) and the heating chamber (8) respectively through two groups of conduction plates. A circulation pump is provided outside the fixed shell (4) and close to one end of the delivery pipe (10), and the delivery pipe (10) is connected to the delivery pipe (10) through the circulation pump.
7. An integrated device for fully automatic vacuum thermoplastic thermoforming, according to claim 6, characterized in that: Multiple groups of the heat dissipation blocks (6) are evenly distributed outside the temperature control pipe (5), and one end of the temperature control pipe (5) far from the circulation pump is connected to the return pipe (11).