Ultrahigh-temperature evaporation source device suitable for molecular beam epitaxy system

Abstract

The utility model discloses an ultra-high temperature evaporation source device suitable for a molecular beam epitaxy system, and particularly relates to the technical field of thin film deposition, which comprises an integrated water cooling device, a baffle connecting rod, a baffle, a PBN crucible, a heating body assembly, isolation ceramics, an electrode connecting rod, a rotary magnetic coupling and a thermocouple electrode, the PBN crucible is inserted into the heating body assembly, and the heating body assembly is wrapped with a heat insulation screen; the isolation ceramic is arranged in the heating body assembly; the rotary magnetic coupling and the thermocouple electrode are mounted at the bottom of the integrated water cooling device; the baffle is installed on the top of the baffle connecting rod which is in coupling connection with the rotating magnet. According to the integrated water cooling device, the fixed circulating pipeline is arranged in the integrated water cooling device, connection is more convenient, no residual space exists in the circulating pipeline, cooling is more uniform, cyclic utilization of the water cooling space is achieved, the uniformity of the cooling effect is greatly improved, and the service life of an internal heating body assembly is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of thin film deposition, and more specifically, to an ultra-high temperature evaporation source device applicable to a molecular beam epitaxy system. Background Art

[0002] It is known that an evaporation source system is used in molecular beam epitaxy technology to evaporate metal materials and deposit them on the surface of a substrate to form a thin film. It can achieve high-quality, high-precision, and high-purity thin film growth by precisely controlling the flow rate and energy of the molecular beam in an ultra-high vacuum environment.

[0003] Among them, Chinese Patent Application No. 201520365112.7 discloses an ultra-high vacuum molecular beam epitaxy evaporation device; its main water-cooling device has multiple water-containing cavities, and adjacent water-containing cavities are connected through connection holes. When water flows in the water-containing cavities, the water flow between each layer of water-containing cavities can stay in the corresponding cavity for a certain period of time, thus avoiding the phenomenon of uneven cooling due to no water at the top of the annular cooling cavity. The water inlet pipe of the water-cooling device is connected to the water-containing cavity at the top layer of the water-cooling device, and the water outlet pipe of the water-cooling device is connected to the water-containing cavity at the bottom layer of the water-cooling device, ensuring that the water flow moves from high to low in the water-cooling device. Thus, this method belongs to the method of inlet water at the upper end and outlet water at the lower end.

[0004] Among them, Chinese Patent Application No. 202210392212.3 discloses a beam source furnace water cooler and a beam source device; by installing the beam source furnace inside the water-cooling housing, when the beam source furnace is installed at a certain angle with the horizontal plane, the water-passing rotor rotates relative to the rotor mounting seat under the action of gravity until its water-passing area is at the highest point of the water-passing rotor, and cooling water is injected into the water-cooling housing to absorb the heat of the beam source furnace. The water inlet hole is located at the highest point of the water-passing rotor, and cooling water is injected into the water-cooling housing from the water inlet pipe to absorb the heat of the beam source furnace. The liquid level of the cooling water in the water-cooling housing rises and enters the communication cavity formed by the water-passing rotor and the rotor mounting seat from the water-passing area, and finally discharges from the water outlet pipe out of the water-cooling housing, so as to achieve the purpose of cooling the beam source furnace; this method belongs to the method of inlet water at the upper end and outlet water at the lower end.

[0005] It can be seen that the existing integrated water-cooling structure of the evaporation source mostly adopts the method of inlet water at the upper end of a closed cylindrical chamber and outlet water at its lower end; and this conventional method does not have a stable cooling water circulation route, and there will be a residual space at the uppermost part of the closed chamber, resulting in the problem of uneven water-cooling effect, thus affecting the service life of the internal heating element; therefore, an ultra-high temperature evaporation source device applicable to a molecular beam epitaxy system is proposed as a further improvement. Summary of the Utility Model

[0006] To overcome the above defects of the prior art, an embodiment of the present utility model provides an ultra-high temperature evaporation source device applicable to a molecular beam epitaxy system to solve the problems raised in the above background art.

[0007] To achieve the above object, the present utility model provides the following technical solution: An ultra-high temperature evaporation source device applicable to a molecular beam epitaxy system, the evaporation source device comprising: an integrated water cooling device, a baffle connecting rod, a baffle, a PBN crucible, a heating element assembly, an isolation ceramic, an electrode connecting rod, a rotational magnetic coupling, and a thermocouple electrode;

[0008] The heating element assembly is detachably connected to the integrated water cooling device through the electrode connecting rod, and the integrated water cooling device is sleeved on the outer surface of the heating element assembly. The heating element assembly is detachably connected to the top of the electrode connecting rod. The PBN crucible is inserted into the interior of the heating element assembly, and the outer surface of the heating element assembly is wrapped with a tantalum heat shield providing support for the PBN crucible;

[0009] The isolation ceramic is disposed within the heating element assembly; the rotational magnetic coupling and the thermocouple electrode are detachably mounted at the bottom of the integrated water cooling device; the baffle is fixedly mounted at the top of the baffle connecting rod, the baffle connecting rod passes through the integrated water cooling device, and the bottom end of the baffle connecting rod passing through the integrated water cooling device is detachably connected to the top of the rotational magnetic coupling.

[0010] Further, the heating element assembly includes: tantalum heating wires, and a plurality of the isolation ceramics are evenly distributed on the tantalum heating wires, and the tantalum heating wires pass through the isolation ceramics, and the tantalum heat shield is wrapped on the outer surfaces of the tantalum heating wires and the PBN crucible.

[0011] Further, the integrated water cooling device includes: an upper welded cover, an inner wall of the water cooling device, an outer wall of the water cooling device, a lower welded cover, a circulation pipeline, and a first CF flange;

[0012] The upper welded cover is fixedly mounted at the top of the outer wall of the water cooling device and the inner wall of the water cooling device, and the lower welded cover is fixedly mounted at the bottom of the outer wall of the water cooling device and the inner wall of the water cooling device;

[0013] The circulation pipeline includes: a water cooling straight pipe and a water cooling elbow;

[0014] The water cooling elbow is fixedly connected to the lower welded cover and the inner wall of the water cooling device. The two ends of the water cooling straight pipe are respectively fixedly connected to the lower welded cover and the first CF flange, and the two ends of the water cooling straight pipe respectively pass through the lower welded cover and the first CF flange. The two ends of the water cooling straight pipe passing through the lower welded cover and the first CF flange are respectively fixedly connected to the water cooling elbow and an external water pipe.

[0015] Further, a first connecting pipe and a second connecting pipe are fixedly installed at one end of the first CF flange away from the straight water-cooled pipe. Second CF flanges are fixedly installed at one ends of the first connecting pipe and the second connecting pipe away from the first CF flange. The rotating magnetic coupling and the thermocouple electrode are respectively fixedly installed on the two second CF flanges.

[0016] Further, a baffle isolation straight pipe is fixedly installed inside the integrated water-cooling device, and the baffle connecting rod penetrates into the inside of the baffle isolation straight pipe.

[0017] Further, the length of the heating element assembly is not greater than the length of the water-cooled elbow pipe.

[0018] Technical effects and advantages of the present utility model:

[0019] Compared with the prior art, by arranging a fixed circulation pipeline in the integrated water-cooling device, due to this circulation pipeline, the water inlet and outlet are not distinguished, making the connection more convenient. At the same time, there is no residual space in this circulation pipeline, making the cooling more uniform, thereby realizing the recycling of the water-cooling space, and further greatly improving the uniformity of the cooling effect and increasing the service life of the internal heating element assembly. Description of the drawings

[0020] Figure 1 It is a schematic cross-sectional view of the overall structure of the present utility model.

[0021] Figure 2 It is a schematic cross-sectional view of the integrated water-cooling device of the present utility model.

[0022] Figure 3 It is an exploded schematic view of the overall structure of the present utility model.

[0023] Figure 4 It is Figure 3 a partial schematic view of

[0024] Figure 5 It is Figure 3 a partial schematic view of

[0025] Figure 6 It is Figure 4 an exploded schematic view of

[0026] Reference numerals are:

[0027] 1. Integrated water-cooling device;

[0028] 11. Upper welding cover; 12. Inner wall of water-cooling device; 13. Outer wall of water-cooling device;

[0029] 14. Lower welding cover;

[0030] 15. Circulation pipeline; 151. Straight water-cooled pipe; 152. Water-cooled elbow pipe;

[0031] 16. First CF flange; 17. First connecting pipe; 18. Second connecting pipe; 19. Second CF flange;

[0032] 20. Baffle isolation straight pipe;

[0033] 2. Baffle connecting rod; 3. Baffle; 4. PBN crucible;

[0034] 5. Heating element assembly; 51. Tantalum heating wire;

[0035] 6. Isolation ceramic; 7. Electrode connecting rod; 8. Rotating magnetic coupling; 9. Thermocouple electrode;

[0036] 10. Tantalum heat shield. Detailed implementation manners

[0037] In order to make the objectives, technical solutions and advantages of the present utility model clearer and more understandable, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0038] As shown in the attached Figures 1-6 A ultra-high temperature evaporation source device applicable to a molecular beam epitaxy system, the evaporation source device includes: an integrated water-cooling device 1, a baffle connecting rod 2, a baffle 3, a PBN crucible 4, a heating element assembly 5, an isolation ceramic 6, an electrode connecting rod 7, a rotating magnetic coupling 8 and a thermocouple electrode 9;

[0039] The heating element assembly 5 is detachably connected to the integrated water-cooling device 1 through the electrode connecting rod 7, and the integrated water-cooling device 1 is sleeved on the outer surface of the heating element assembly 5. The heating element assembly 5 is detachably connected to the top of the electrode connecting rod 7. The PBN crucible 4 is inserted into the interior of the heating element assembly 5. The outside of the heating element assembly 5 is wrapped with a tantalum heat shield 10 that provides support for the PBN crucible 4;

[0040] The isolation ceramic 6 is arranged inside the heating element assembly 5; the rotating magnetic coupling 8 and the thermocouple electrode 9 are detachably installed at the bottom of the integrated water-cooling device 1;

[0041] The baffle 3 is fixedly installed at the top of the baffle connecting rod 2. The baffle connecting rod 2 passes through the integrated water-cooling device 1, and the bottom end of the baffle connecting rod 2 passing through the integrated water-cooling device 1 is detachably connected to the top of the rotating magnetic coupling 8.

[0042] Wherein, the baffle 3 is installed at the top of the baffle connecting rod 2, and the baffle connecting rod 2 and the rotating magnetic coupling 8 are fastened by threads;

[0043] Wherein, the heating element assembly 5 inside the evaporation source device is fixed to the integrated water-cooling device 1 through the electrode connecting rod 7;

[0044] In a preferred embodiment, as shown in the appendix Figures 1-6 As shown, the heating element assembly 5 includes: a tantalum heating wire 51, a plurality of insulating ceramics 6 evenly distributed on the tantalum heating wire 51, and the tantalum heating wire 51 passes through the insulating ceramics 6, and a tantalum heat shield 10 wraps around the outer surfaces of the tantalum heating wire 51 and the PBN crucible 4.

[0045] Among them, in the heating element assembly 5 inside the evaporation source device, the tantalum heating wire 51 passes through the insulating ceramics 6 and is wrapped in the tantalum heat shield 10; while the PBN crucible 4 is inserted from the upper part of the heating element assembly 5 and is supported by the tantalum heat shield 10;

[0046] In a preferred embodiment, as shown in the appendix Figures 1-6 As shown, the integrated water-cooling device 1 includes: an upper welding cover 11, an inner wall 12 of the water-cooling device, an outer wall 13 of the water-cooling device, a lower welding cover 14, a circulation pipeline 15 and a first CF flange 16;

[0047] The upper welding cover 11 is fixedly installed at the top of the outer wall 13 and the inner wall 12 of the water-cooling device, and the lower welding cover 14 is fixedly installed at the bottom of the outer wall 13 and the inner wall 12 of the water-cooling device;

[0048] The circulation pipeline 15 includes: a straight water-cooling pipe 151 and a bent water-cooling pipe 152;

[0049] The bent water-cooling pipe 152 is fixedly connected to the lower welding cover 14 and the inner wall 12 of the water-cooling device,

[0050] Among them, the bent water-cooling pipe 152 is welded to the lower welding cover 14 and the inner wall 12 of the water-cooling device;

[0051] Both ends of the straight water-cooling pipe 151 are fixedly connected to the lower welding cover 14 and the first CF flange 16 respectively, and both ends of the straight water-cooling pipe 151 pass through the lower welding cover 14 and the first CF flange 16 respectively. Among them, the straight water-cooling pipe 151 is welded and sealed to the first CF flange 16 and the lower welding cover 14;

[0052] Both ends of the straight water-cooling pipe 151 passing through the lower welding cover 14 and the first CF flange 16 are respectively fixedly connected to the bent water-cooling pipe 152 and an external water pipe.

[0053] Among them, the first CF flange 16 is a CF35 flange;

[0054] Among them, the rotating magnetic coupling 8 and the thermocouple electrode 9 are connected to the integrated water-cooling device 1 through the first CF flange 16;

[0055] Among them, the integrated water cooling device 1 is constructed by an upper welding cover 11, an inner wall 12 of the water cooling device, an outer wall 13 of the water cooling device, and a lower welding cover 14. There is a cavity inside, which is convenient for placing the water cooling elbow 152 in the coiled circulation pipeline 15, forming a fixed and stable water cooling circuit, improving the uniformity of water cooling. And the water cooling elbow 152 is welded to the inner wall 12 of the water cooling device to improve the water cooling effect;

[0056] Among them, for the circulation pipeline 15 adopting this method, the water inlet and outlet are not distinguished, making the connection more convenient. At the same time, there is no residual space in this circulation pipeline 15, making the cooling more uniform.

[0057] In a preferred embodiment, as shown in the appendix Figures 1-6 As shown, at one end of the first CF flange 16 away from the water cooling straight pipe 151, a first connecting pipe 17 and a second connecting pipe 18 are fixedly installed. At one end of the first connecting pipe 17 and the second connecting pipe 18 away from the first CF flange 16, second CF flanges 19 are fixedly installed. The rotating magnetic coupling 8 and the thermocouple electrode 9 are respectively fixedly installed on the two second CF flanges 19.

[0058] In a preferred embodiment, as shown in the appendix Figures 1-6 As shown, a baffle isolation straight pipe 20 is fixedly installed inside the integrated water cooling device 1, and the baffle connecting rod 2 penetrates into the inside of the baffle isolation straight pipe 20.

[0059] In a preferred embodiment, as shown in the appendix Figures 1-6 As shown, the length of the heating element assembly 5 is not greater than the length of the water cooling elbow 152; so as to ensure the cooling effect.

[0060] Working principle of the present utility model: When the evaporation source device is in use, evaporation materials accounting for 1 / 3 of the capacity of the PBN crucible 4 are added to the PBN crucible 4. The thermocouple electrode 9 is connected to the power temperature control meter, and the controller is enabled to heat the materials. During the process of heating and melting the materials, it is ensured that there is uninterrupted circulating water in the integrated water cooling device 1 to cool the overflowing heat. Since the integrated water cooling device 1 does not distinguish between the water inlet and outlet interfaces, the circulating water enters from the water cooling straight pipe 151 and then flows along the water cooling elbow 152 to cool the heating element assembly 5. The rotating magnetic coupling 8 controls to keep the baffle 3 in the blocking state. When the melting temperature is stable, the baffle 3 is opened and evaporation coating starts.

[0061] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device.

[0062] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A ultra-high temperature evaporation source device applicable to a molecular beam epitaxy system, characterized in that: The evaporation source device includes: an integrated water-cooling device (1), a baffle connecting rod (2), a baffle (3), a PBN crucible (4), a heating element assembly (5), an isolation ceramic (6), an electrode connecting rod (7), a rotating magnetic coupling (8), and a thermocouple electrode (9); The heating element assembly (5) is detachably connected to the integrated water-cooling device (1) through the electrode connecting rod (7), and the integrated water-cooling device (1) is sleeved on the outer surface of the heating element assembly (5). The heating element assembly (5) is detachably connected to the top of the electrode connecting rod (7). The PBN crucible (4) is inserted into the interior of the heating element assembly (5). A tantalum heat shield (10) for supporting the PBN crucible (4) is wrapped around the outside of the heating element assembly (5); The isolation ceramic (6) is arranged inside the heating element assembly (5); the rotating magnetic coupling (8) and the thermocouple electrode (9) are detachably installed at the bottom of the integrated water-cooling device (1); the baffle (3) is fixedly installed at the top of the baffle connecting rod (2), and the baffle connecting rod (2) passes through the integrated water-cooling device (1). The baffle connecting rod (2) passes through the bottom end of the integrated water-cooling device (1) and is detachably connected to the top of the rotating magnetic coupling (8).

2. The ultra-high temperature evaporation source device applicable to a molecular beam epitaxy system according to claim 1, wherein: The heating element assembly (5) includes: a tantalum heating wire (51). A plurality of the isolation ceramics (6) are evenly distributed on the tantalum heating wire (51), and the tantalum heating wire (51) passes through the isolation ceramic (6). The tantalum heat shield (10) is wrapped around the outer surfaces of the tantalum heating wire (51) and the PBN crucible (4).

3. The ultra-high temperature evaporation source device applicable to a molecular beam epitaxy system according to claim 1, characterized in that: The integrated water-cooling device (1) includes: an upper welded cover (11), a water-cooling device inner wall (12), a water-cooling device outer wall (13), a lower welded cover (14), a circulation pipeline (15), and a first CF flange (16); The upper welded cover (11) is fixedly installed at the top of the water-cooling device outer wall (13) and the water-cooling device inner wall (12), and the lower welded cover (14) is fixedly installed at the bottom of the water-cooling device outer wall (13) and the water-cooling device inner wall (12); The circulation pipeline (15) includes: a water-cooling straight pipe (151) and a water-cooling elbow (152); The water-cooling elbow (152) is fixedly connected to the lower welded cover (14) and the water-cooling device inner wall (12). The two ends of the water-cooling straight pipe (151) are respectively fixedly connected to the lower welded cover (14) and the first CF flange (16), and the two ends of the water-cooling straight pipe (151) respectively pass through the lower welded cover (14) and the first CF flange (16). The two ends of the water-cooling straight pipe (151) passing through the lower welded cover (14) and the first CF flange (16) are respectively fixedly connected to the water-cooling elbow (152) and an external water pipe.

4. The ultra-high temperature evaporation source device applicable to a molecular beam epitaxy system according to claim 3, wherein: One end of the first CF flange (16) away from the water-cooled straight pipe (151) is fixedly installed with a first connecting pipe (17) and a second connecting pipe (18). One ends of the first connecting pipe (17) and the second connecting pipe (18) away from the first CF flange (16) are both fixedly installed with second CF flanges (19). The rotating magnetic coupling (8) and the thermocouple electrode (9) are respectively fixedly installed on the two second CF flanges (19).

5. The ultra-high temperature evaporation source device applicable to a molecular beam epitaxy system according to claim 1, wherein: A baffle isolation straight pipe (20) is fixedly installed inside the integrated water-cooling device (1), and the baffle connecting rod (2) penetrates into the inside of the baffle isolation straight pipe (20).

6. The ultra-high temperature evaporation source device applicable to a molecular beam epitaxy system according to claim 3, wherein: The length of the heating element assembly (5) is not greater than the length of the water-cooled elbow (152).

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