Electroplating bath structure for manufacturing integrated circuit

Abstract

The utility model discloses an electroplating bath structure for manufacturing an integrated circuit, which comprises an electroplating bath, a group of electric heating tubes are fixedly embedded in the electroplating bath, a temperature monitoring sensor is fixedly embedded on the left side surface of the electroplating bath, two alarms are fixedly connected to the left side surface of the electroplating bath, and a PLC (programmable logic controller) is fixedly connected to the front surface of the electroplating bath. The upper surface of the electroplating pool is fixedly connected with a U-shaped water pipe, the outer surface of the U-shaped water pipe fixedly communicates with two sets of cleaning spray pipes, the output end of each cleaning spray pipe fixedly communicates with a cleaning nozzle, and the right side face of the electroplating pool is fixedly connected with a high-pressure cleaning pump. Through the arrangement of the electric heating pipe, the PLC, the temperature monitoring sensor and the temperature display instrument, the electric heating pipe can be controlled to work through the PLC to heat the electroplating tank, the temperature of electroplating liquid in the electroplating tank is monitored at any time, the appropriate temperature of the electroplating liquid is kept at any time, and high-quality electroplating of an integrated circuit is facilitated.

Description

Technical Field

[0001] This application relates to the technical field of integrated circuit manufacturing related equipment, and particularly relates to an electroplating tank structure for integrated circuit manufacturing. Background Art

[0002] Electroplating refers to a surface processing method in which, in a salt solution containing the metal to be plated, the substrate metal to be plated is used as the cathode, and through electrolysis, cations of the metal to be plated in the plating solution are deposited on the surface of the substrate metal to form a coating. The properties of the coating are different from those of the substrate metal and have new characteristics. According to the function of the coating, it is divided into protective coatings, decorative coatings and other functional coatings. Electroplating is an electrochemical process and also an oxidation-reduction process. After connecting to a DC power supply, the required coating is deposited on the part. In recent years, with the rapid development of integrated circuit technology, the requirements for metallization processes have become increasingly high, and electroplating technology plays a crucial role in metallization processes. Therefore, during the integrated circuit manufacturing process, electroplating processes often need to be carried out.

[0003] The utility model patent with the publication number CN208570542U discloses an electroplating tank structure for integrated circuit manufacturing. However, there are still certain deficiencies in the above patent during use. It is unable to effectively control the appropriate temperature of the electroplating solution inside the electroplating tank, thus affecting the electroplating quality of integrated circuits. Moreover, after electroplating is completed, it is not convenient to clean the electroplating tank, which is not conducive to subsequent electroplating use. Therefore, we provide an electroplating tank structure for integrated circuit manufacturing to solve the above problems. Utility Model Content

[0004] The purpose of the present utility model is to provide an electroplating tank structure for integrated circuit manufacturing to solve the problems raised in the above background art.

[0005] The embodiments of this application adopt the following technical solutions:

[0006] An electroplating tank structure for integrated circuit manufacturing includes an electroplating bath. A group of electric heating tubes are fixedly embedded inside the electroplating bath. A temperature monitoring sensor is fixedly embedded on the left side of the electroplating bath. Two alarms are fixedly connected to the left side of the electroplating bath. A PLC controller is fixedly connected to the front of the electroplating bath. A U-shaped water pipe is fixedly connected to the upper surface of the electroplating bath. Two groups of cleaning spray pipes are fixedly communicated with the outer surface of the U-shaped water pipe. The output end of each cleaning spray pipe is fixedly communicated with a cleaning nozzle. A high-pressure cleaning pump is fixedly connected to the right side of the electroplating bath. The output end of the high-pressure cleaning pump is fixedly communicated with the input end of the U-shaped water pipe. The input end of the high-pressure cleaning pump is fixedly communicated with a water supply pipe. A control water valve is fixedly communicated with the outer surface of the water supply pipe.

[0007] Preferably, a processor module is provided inside the PLC controller, and the PLC controller is electrically connected to a temperature monitoring sensor, an alarm, and a high-pressure cleaning pump through wires.

[0008] Preferably, a temperature display instrument is fixedly connected to the front of the electroplating bath, and the temperature monitoring sensor is electrically connected to the temperature display instrument through a wire.

[0009] Preferably, an operation sign plate is fixedly connected to the front of the electroplating bath, and the operation sign plate is located on the right side of the PLC controller.

[0010] Preferably, a discharge pipe is fixedly communicated with the bottom surface of the electroplating bath, and a discharge valve is fixedly communicated with the bottom surface of the discharge pipe.

[0011] Preferably, two mounting brackets are fixedly connected to the bottom surface of the electroplating bath, and two mounting holes are formed on the upper surface of each mounting bracket.

[0012] The above at least one technical solution adopted in the embodiment of the present application can achieve the following beneficial effects:

[0013] First, through the provided electric heating tube, PLC controller, temperature monitoring sensor and temperature display instrument, the PLC controller can control the electric heating tube to work to heat the electroplating bath, and continuously monitor the temperature of the electroplating solution inside the electroplating bath, so as to always maintain the appropriate temperature of the electroplating solution, which is convenient for high-quality electroplating of integrated circuits.

[0014] Second, through the provided water supply pipe, control water valve, high-pressure cleaning pump, U-shaped water pipe, cleaning spray pipe and cleaning nozzle, the high-pressure cleaning pump can be used to pump the water liquid inside the water supply pipe, flow through the U-shaped water pipe and be sprayed out through the cleaning spray pipe and cleaning nozzle, so as to realize automatic mechanical flushing and spraying of the electroplating bath, which is convenient for the subsequent use of the electroplating bath. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The drawings described herein are used to provide a further understanding of the present application, and constitute a part of the present application. The schematic embodiments of the present application and their descriptions are used to explain the present application, and do not constitute an improper limitation to the present application. In the drawings:

[0016] Figure 1 is: an overall three-dimensional structure schematic diagram of an electroplating tank structure for integrated circuit manufacturing according to the present invention;

[0017] Figure 2 is: a bottom view of the electroplating bath of the present invention;

[0018] Figure 3 is: a side view of the electroplating bath of the present invention;

[0019] Figure 4It is: the top view of the electroplating bath of the present utility model;

[0020] Figure 5 It is: the schematic diagram of the internal dissection structure of the electroplating bath of the present utility model.

[0021] In the figure: 1. Electroplating bath; 2. Installation bracket; 3. Drain pipe; 4. Water supply pipe; 5. Control water valve; 6. High-pressure cleaning pump; 7. U-shaped water pipe; 8. Cleaning spray pipe; 9. Cleaning nozzle; 10. Operation sign; 11. Temperature display instrument; 12. PLC controller; 13. Installation hole; 14. Drain valve; 15. Temperature monitoring sensor; 16. Alarm; 17. Electric heating pipe. Specific embodiments

[0022] To make the objectives, technical solutions and advantages of the present application clearer, the technical solutions of the present application will be clearly and completely described below in conjunction with specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0023] The following will, with reference to the drawings, elaborate on the technical solutions provided by each embodiment of the present application.

[0024] Please refer to Figures 1-5 , the present utility model provides a technical solution for an electroplating tank structure for integrated circuit manufacturing:

[0025] An electroplating tank structure for integrated circuit manufacturing includes an electroplating bath 1, a group of electric heating pipes 17 are fixedly embedded inside the electroplating bath 1, a temperature monitoring sensor 15 is fixedly embedded on the left side of the electroplating bath 1, two alarms 16 are fixedly connected to the left side of the electroplating bath 1, a PLC controller 12 is fixedly connected to the front of the electroplating bath 1, a U-shaped water pipe 7 is fixedly connected to the upper surface of the electroplating bath 1, two groups of cleaning spray pipes 8 are fixedly communicated with the outer surface of the U-shaped water pipe 7, the output end of each cleaning spray pipe 8 is fixedly communicated with a cleaning nozzle 9, a high-pressure cleaning pump 6 is fixedly connected to the right side of the electroplating bath 1, the output end of the high-pressure cleaning pump 6 is fixedly communicated with the input end of the U-shaped water pipe 7, the input end of the high-pressure cleaning pump 6 is fixedly communicated with a water supply pipe 4, and a control water valve 5 is fixedly communicated with the outer surface of the water supply pipe 4; specifically, the electroplating bath 1 can be heated inside by the electric heating pipes 17 to facilitate maintaining the appropriate temperature of the electroplating solution, the temperature can be alarmed through the alarms 16 to facilitate timely adjusting the temperature of the electroplating solution, and when the high-pressure cleaning pump 6 works, the water liquid inside the water supply pipe 4 can be pumped, flowing through the U-shaped water pipe 7 and sprayed out through the cleaning spray pipes 8 and the cleaning nozzles 9 to facilitate the flushing and spraying operation of the inner wall of the electroplating bath 1;

[0026] In this embodiment, a processor module is provided inside the PLC controller 12. The PLC controller 12 is electrically connected to the temperature monitoring sensor 15, the alarm 16, and the high-pressure cleaning pump 6 through wires. A temperature display instrument 11 is fixedly connected to the front of the electroplating bath 1, and the temperature monitoring sensor 15 is electrically connected to the temperature display instrument 11 through a wire. An operation sign 10 is fixedly connected to the front of the electroplating bath 1, and the operation sign 10 is located on the right side of the PLC controller 12. Specifically, through the PLC controller 12, electroplating personnel can more conveniently control this electroplating tank device, facilitating the electroplating operation of integrated circuits. Through the temperature display instrument 11, the temperature of the electroplating solution can be displayed at all times, facilitating the understanding of the specific temperature of the electroplating solution. Through the operation sign 10, the operation steps can be described, facilitating the electroplating operation of integrated circuits.

[0027] In this embodiment, a discharge pipe 3 is fixedly communicated with the bottom surface of the electroplating bath 1, and a discharge valve 14 is fixedly communicated with the bottom surface of the discharge pipe 3. Two mounting brackets 2 are fixedly connected to the bottom surface of the electroplating bath 1, and two mounting holes 13 are formed on the upper surface of each mounting bracket 2. Specifically, through the discharge pipe 3, the discharge operation of the electroplating solution can be facilitated. Through the mounting brackets 2 and the mounting holes 13, the electroplating bath 1 can be installed and fixed, facilitating the stable use of this electroplating tank structure.

[0028] Working principle: When this electroplating tank structure for integrated circuit manufacturing is in use, the user first installs and fixes the electroplating bath 1 through the mounting brackets 2 and the mounting holes 13, then powers on this electroplating tank, injects the electroplating solution into the interior of the electroplating bath 1, and clicks the PLC controller 12 to make the electric heating tube 17 work to heat the electroplating solution inside the electroplating bath 1. The temperature monitoring sensor 15 is used to detect the temperature of the electroplating solution and simultaneously transmit it to the temperature display instrument 11 for temperature display. At the same time, the temperature data is transmitted to the PLC controller 12. When the temperature exceeds the set range, the alarm 16 is controlled to work, timely notifying the electroplating personnel to adjust the temperature. After electroplating is completed, the electroplating solution is discharged, and the control water valve 5 is opened to make the high-pressure cleaning pump 6 work to extract the water liquid inside the water supply pipe 4, which flows through the U-shaped water pipe 7 and is sprayed out through the cleaning nozzle 9 and the cleaning nozzle 8, realizing the automatic mechanical flushing and spraying operation of the electroplating bath 1.

[0029] It should also be noted that the term "comprising", "including" or any other variation thereof is intended to cover a non-exclusive inclusion, such that a process, method, commodity or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, commodity or device. Without further limitation, an element defined by the phrase "comprising a..." does not exclude the existence of additional identical elements in the process, method, commodity or device comprising the element.

[0030] The above are only embodiments of the present application and are not intended to limit the present application. For those skilled in the art, various modifications and variations can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the scope of the claims of the present application.

Claims

1. An electroplating tank structure for integrated circuit manufacturing, including an electroplating bath (1), characterized in that: A group of electric heating tubes (17) are fixedly embedded inside the electroplating bath (1). A temperature monitoring sensor (15) is fixedly embedded on the left side surface of the electroplating bath (1). Two alarms (16) are fixedly connected to the left side surface of the electroplating bath (1). A PLC controller (12) is fixedly connected to the front surface of the electroplating bath (1). A U-shaped water pipe (7) is fixedly connected to the upper surface of the electroplating bath (1). Two groups of cleaning spray pipes (8) are fixedly communicated with the outer surface of the U-shaped water pipe (7). The output end of each cleaning spray pipe (8) is fixedly communicated with a cleaning nozzle (9). A high-pressure cleaning pump (6) is fixedly connected to the right side surface of the electroplating bath (1). The output end of the high-pressure cleaning pump (6) is fixedly communicated with the input end of the U-shaped water pipe (7). The input end of the high-pressure cleaning pump (6) is fixedly communicated with a water supply pipe (4). A control water valve (5) is fixedly communicated with the outer surface of the water supply pipe (4).

2. The electroplating tank structure for integrated circuit manufacturing according to claim 1, characterized in that: A processor module is provided inside the PLC controller (12). The PLC controller (12) is electrically connected to the temperature monitoring sensor (15), the alarms (16), and the high-pressure cleaning pump (6) through wires.

3. The electroplating tank structure for integrated circuit manufacturing according to claim 1, characterized in that: A temperature display instrument (11) is fixedly connected to the front surface of the electroplating bath (1). The temperature monitoring sensor (15) is electrically connected to the temperature display instrument (11) through a wire.

4. A plating tank structure for integrated circuit manufacturing according to claim 1, characterized in that: An operation signboard (10) is fixedly connected to the front surface of the electroplating bath (1). The operation signboard (10) is located on the right side of the PLC controller (12).

5. The electroplating tank structure for integrated circuit manufacturing according to claim 1, characterized in that: A discharge pipe (3) is fixedly communicated with the bottom surface of the electroplating bath (1). A discharge valve (14) is fixedly communicated with the bottom surface of the discharge pipe (3).

6. The electroplating tank structure for integrated circuit manufacturing according to claim 1, wherein: Two mounting brackets (2) are fixedly connected to the bottom surface of the electroplating bath (1). Two mounting holes (13) are formed on the upper surface of each mounting bracket (2).

Images