Light emitting diode assembly
By introducing cooling boxes, water tanks, micro water pumps and buffer components into the LED assembly, efficient heat dissipation and shock absorption are achieved, solving the problems caused by heat accumulation and vibration of traditional LEDs, extending service life and preventing short circuits.
Patent Information
- Application Number
- CN202421999906.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-19
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2034-08-19
AI Technical Summary
Traditional light-emitting diodes lack independent heat dissipation structures, which lead to heat accumulation and temperature rise, shorten service life, and are prone to short circuits due to vibration.
The cooling box, water tank, micro water pump, semiconductor refrigeration sheet and mixing components are used to dissipate heat by circulating cooling water, and the buffer components are used to absorb shock to prevent vibration.
It improves the service life of the light emitting diode assembly, prevents short circuits caused by vibration, and enhances the heat dissipation effect.
Smart Images
Figure CN223137825U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of light - emitting diodes, and particularly to a light - emitting diode component. Background Technique
[0002] A light - emitting diode is also called an LED lamp. Due to its long service life and the fact that the initial light - emitting diode was a monochromatic light source, it was used as an equipment indicator light. Later, because of its good controllability, it was used in digital tubes and display technologies. Now, with the expansion of light - emitting technologies, light - emitting diodes have been widely used in various industries. When a large number of light - emitting diodes work simultaneously, a large amount of heat is generated. Since there is no independent heat - dissipation structure in traditional light - emitting diodes, when the accumulated heat is difficult to discharge, its temperature will rise, which will cause the light - emitting diodes to age after long - term use and reduce their service life. Therefore, we propose a light - emitting diode component to solve the above problems. Content of the Utility Model
[0003] (1) Technical Problems to be Solved
[0004] In view of the deficiencies of the prior art, the utility model provides a light - emitting diode component, which solves the problems raised in the above - mentioned background technique.
[0005] (2) Technical Solutions
[0006] The utility model specifically adopts the following technical solutions to achieve the above purposes:
[0007] A light - emitting diode component includes a cooling box. A telescopic cover is fixed at the opening on the top of the cooling box. A metal box is fixed at the top of the telescopic cover. A diode component body is fixed inside the metal box. Two buffer components for damping the diode component body are arranged on the top of the cooling box. A water tank is fixed at the bottom of the cooling box. The drain pipe of the cooling box is fixedly connected to the water tank. A micro - water pump is fixed on one side wall of the water tank. The inlet - end pipe of the micro - water pump penetrates through the water tank and extends into its interior. The outlet - end pipe of the micro - water pump is fixedly connected to the bottom of the cooling box. Semiconductor refrigeration sheets are fixed on both sides of the water tank. A mixing component is arranged inside the water tank.
[0008] Furthermore, the buffer component includes a U - shaped seat fixed on the top of the cooling box. Miniature damping buffers I are fixed on both inner walls of the U - shaped seat. A connecting plate is fixed on the top of the metal box. The bottom of the connecting plate is rotatably connected to two buffer rods through pin shafts. The bottom ends of the two buffer rods are respectively rotatably connected to the corresponding miniature damping buffers I through pin shafts.
[0009] Furthermore, the mixing component includes a rotating shaft rotatably connected inside the water tank through a bearing. Blades are equidistantly fixed on the surface of the rotating shaft.
[0010] Further, inclined plates for decelerating the water flow are fixedly arranged at equal intervals inside the cooling box.
[0011] Further, a water inlet pipe is fixedly connected and communicated with one side wall of the cooling box, and a pipe cap is threadedly connected to the top end of the water inlet pipe.
[0012] Further, mounting plates are fixedly arranged on both side walls of the water tank, and two mounting holes are respectively formed in the tops of the mounting plates.
[0013] (III) Beneficial effects
[0014] Compared with the prior art, the present utility model provides a light-emitting diode component, which has the following beneficial effects:
[0015] In the present utility model, by arranging a cooling box, a telescopic cover, a metal box, a water tank, a micro water pump, a semiconductor refrigeration sheet and a mixing assembly, during the use of this light-emitting diode component, with the cooperation of the cooling box and the water tank, the circulating cooling water can be used to cool and dissipate heat from the diode component body. Compared with the previous method of using heat dissipation fins, this method has a better heat dissipation effect, thereby improving the service life of the diode component body. At the same time, with the cooperation of the buffer assembly, the diode component body can be prevented from being affected by vibration during use, thereby preventing a short circuit from occurring between it and the base. Description of the drawings
[0016] Figure 1 is a schematic diagram of the overall structure of the present utility model;
[0017] Figure 2 is a cross-sectional view of the overall structure of the present utility model;
[0018] Figure 3 is a schematic diagram of the structure of the metal box of the present utility model.
[0019] In the figure: 1, cooling box; 2, telescopic cover; 3, metal box; 4, diode component body; 5, buffer assembly; 501, U-shaped seat; 502, first micro damping buffer; 503, connecting plate; 504, buffer rod; 6, water tank; 7, micro water pump; 8, semiconductor refrigeration sheet; 9, mixing assembly; 901, rotating shaft; 902, blade; 10, inclined plate; 11, water inlet pipe; 12, mounting plate; 13, U-shaped plate; 14, second micro damping buffer; 15, moving block; 16, pressing plate; 17, bent plate; 18, limiting plate. Detailed implementation manners
[0020] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0021] Embodiment
[0022] As Figure 1 and Figure 2 shown, a light-emitting diode component proposed in an embodiment of the present utility model includes a cooling box 1. A water inlet pipe 11 is fixedly connected and communicated with one side wall of the cooling box 1. A pipe cap is threadedly connected to the top end of the water inlet pipe 11, which can facilitate the addition of cooling water inside the water tank 6. A telescopic cover 2 is fixed at the through opening provided at the top of the cooling box 1. A metal box 3 is fixed at the top of the telescopic cover 2. A diode component body 4 is fixed inside the metal box 3. Two sets of buffer components 5 for damping the diode component body 4 are provided at the top of the cooling box 1. A water tank 6 is fixed at the bottom of the cooling box 1. Mounting plates 12 are fixed on both side walls of the water tank 6. Two mounting holes are provided at the top of each mounting plate 12, which will make it more convenient to operate when installing the entire light-emitting diode component. The drain pipe of the cooling box 1 is fixedly connected and communicated with the water tank 6. A micro water pump 7 is fixed on one side wall of the water tank 6. The inlet end pipe of the micro water pump 7 penetrates through the water tank 6 and extends into its interior. The outlet end pipe of the micro water pump 7 is fixedly connected and communicated with the bottom of the cooling box 1. Semiconductor refrigeration chips 8 are fixed on both sides of the water tank 6. A mixing component 9 is arranged inside the water tank 6. When using this light-emitting diode component, the semiconductor refrigeration chip 8 provided can cool the water inside the water tank 6, and starting the mixing component 9 can stir the cooling water to make the water inside the water tank 6 cooler more evenly. During use, the heat generated by the diode component body 4 will be conducted to the metal box 3. When heat dissipation is required, start the micro water pump 7 to pump the cooling water inside the water tank 6 into the interior of the cooling box 1, and after the cooling water enters the interior of the cooling box 1, it will flow back into the water tank 6 again. Thus, when the cooling water circulates, the heat on the surface of the metal box 3 can be taken away, so as to realize the cooling and heat dissipation of the diode component body 4.
[0023] As Figure 3As shown in the figure, there is another way for the two buffer components 5 used to shock-absorb the diode component body 4 in the present utility model. It mainly includes a U-shaped plate 13 fixed to the top of the cooling box 1. Miniature damping buffers II 14 are fixed to both inner walls of the U-shaped plate 13. Moving blocks 15 are fixed to one ends of the miniature damping buffers II 14. A pressing plate 16 is slidably connected inside the guiding grooves formed in the two moving blocks 15. A bent plate 17 is fixed to the top of the metal box 3. The bent plate 17 is fixedly connected to the pressing plate 16. A limiting plate 18 for limiting the bent plate 17 is fixed to the top of the U-shaped plate 13. When in use, when the water tank 6 is vibrated, with the cooperation of the two miniature damping buffers II 14, the vibration can be buffered, preventing the metal box 3 and the diode component body 4 inside it from being affected by the vibration.
[0024] As Figure 1 shown, in some embodiments, the buffer component 5 includes a U-shaped seat 501 fixed to the top of the cooling box 1. Miniature damping buffers I 502 are fixed to both inner walls of the U-shaped seat 501. A connecting plate 503 is fixed to the top of the metal box 3. Two buffer rods 504 are rotatably connected to the bottom of the connecting plate 503 through pins. The bottom ends of the two buffer rods 504 are respectively rotatably connected to the corresponding miniature damping buffers I 502 through pins. When in use, when the water tank 6 is vibrated, buffering and shock absorption can be carried out with the cooperation of the two miniature damping buffers I 502, thereby protecting the metal box 3 and the diode component body 4 from being affected by the vibration.
[0025] As Figure 2 shown, in some embodiments, the mixing component 9 includes a rotating shaft 901 rotatably connected to the inside of the water tank 6 through a bearing. Blades 902 are equidistantly fixed to the surface of the rotating shaft 901. When in use, start the miniature motor to drive the rotating shaft 901 to rotate, and after the rotating shaft 901 rotates, it will drive the blades 902 to rotate. At this time, the cooling water inside the water tank 6 can be stirred to make the cooling water cooler more evenly.
[0026] As Figure 2 shown, in some embodiments, inclined plates 10 for decelerating the water flow are equidistantly fixed inside the cooling box 1, which can delay the flow rate of the cooling water inside the cooling box 1 to improve the cooling effect on the metal box 3.
[0027] Finally, it should be noted that the above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.
Claims
1. A light-emitting diode component, comprising a cooling box (1), characterized in that: A telescopic cover (2) is fixed at the opening on the top of the cooling box (1). A metal box (3) is fixed at the top of the telescopic cover (2). A diode component body (4) is fixed inside the metal box (3). Two buffer components (5) for damping the diode component body (4) are arranged on the top of the cooling box (1). A water tank (6) is fixed at the bottom of the cooling box (1). The drain pipe of the cooling box (1) is fixedly connected and communicated with the water tank (6). A micro water pump (7) is fixed on one side wall of the water tank (6). The inlet end pipe of the micro water pump (7) penetrates through the water tank (6) and extends to its interior. The outlet end pipe of the micro water pump (7) is fixedly connected and communicated with the bottom of the cooling box (1). Semiconductor refrigeration sheets (8) are fixed on both sides of the water tank (6). A mixing component (9) is arranged inside the water tank (6).
2. The light emitting diode component according to claim 1, wherein: The buffer component (5) includes a U-shaped seat (501) fixed on the top of the cooling box (1). Micro damping buffers one (502) are fixed on both inner walls of the U-shaped seat (501). A connecting plate (503) is fixed on the top of the metal box (3). Two buffer rods (504) are rotatably connected to the bottom of the connecting plate (503) through pins. The bottom ends of the two buffer rods (504) are respectively rotatably connected to the corresponding micro damping buffers one (502) through pins.
3. The light emitting diode component according to claim 1, characterized in that: The mixing component (9) includes a rotating shaft (901) rotatably connected to the inside of the water tank (6) through a bearing. Blades (902) are equidistantly fixed on the surface of the rotating shaft (901).
4. A light emitting diode component according to claim 1, characterized in that: Oblique plates (10) for slowing down the water flow are equidistantly fixed inside the cooling box (1).
5. A light-emitting diode component according to claim 1, characterized in that: A water inlet pipe (11) is fixedly connected and communicated with one side wall of the cooling box (1). A pipe cap is threadedly connected to the top end of the water inlet pipe (11).
6. The light-emitting diode component according to claim 1, wherein: Mounting plates (12) are fixed on both side walls of the water tank (6). Two mounting holes are formed in the top of each mounting plate (12).