Semiconductor heating furnace tube

Abstract

The utility model discloses a semiconductor heating furnace tube which comprises a heating furnace body, the heating furnace body comprises a plurality of ceramic fiber layers, the plurality of ceramic fiber layers are sequentially assembled together to form the heating furnace body, and a plurality of heating wires are installed in the heating furnace body. The multiple heating wires are installed in the multiple ceramic fiber layers correspondingly and used for heating the interior of the heating furnace body, an integral ceramic fiber layer is installed on the outer side wall of the heating furnace body, and a cooling assembly is installed on the outer side wall of the integral ceramic fiber layer. According to the utility model, the heating furnace is divided into a plurality of heating areas to heat the heating furnace together, so that the temperature in the heating furnace is uniformly distributed; due to the multi-zone design, the heating furnace can meet wider technological requirements including deposition of different materials and preparation of a multi-layer structure; the multi-zone heating furnace can process a plurality of base materials at the same time or perform deposition in a plurality of zones, so that the production efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductors, and particularly relates to a semiconductor heating furnace tube. Background Art

[0002] A heating furnace is a device that heats materials or workpieces to a certain temperature. Heating furnaces are applied in many industries such as petroleum, chemical industry, metallurgy, machinery, heat treatment, surface treatment, building materials, electronics, materials, light industry, daily chemicals, and pharmaceuticals. Heating furnaces can be divided into vertical heating furnaces and horizontal heating furnaces. With the development of semiconductors, semiconductor heating furnaces have emerged.

[0003] Most of the existing domestic heating furnaces are single-zone heating, so the temperature distribution inside the furnace is not uniform enough. At the same time, the single-zone furnace tube limits its flexibility in processing different materials and deposition requirements.

[0004] The information disclosed in this background art section is only intended to enhance the overall understanding of the utility model and should not be regarded as an admission or any form of suggestion that this information constitutes prior art already known to those of ordinary skill in the art. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a semiconductor heating furnace tube, which can solve the problem of uneven temperature distribution caused by single-zone heating of the heating furnace.

[0006] In order to achieve the above purpose, the technical solution provided by a specific embodiment of the utility model is as follows:

[0007] A semiconductor heating furnace tube includes a heating furnace body. The heating furnace body includes a plurality of ceramic fiber layers. The plurality of ceramic fiber layers are assembled together in sequence to form the heating furnace body, so that the heating furnace body is composed of a combination of a plurality of ceramic fiber layers. A plurality of heating wires are installed inside the heating furnace body. The plurality of heating wires are respectively installed in the plurality of ceramic fiber layers. The plurality of heating wires are used to heat the inside of the heating furnace body, so that the inside of the heating furnace body is heated by the plurality of heating wires. Since the heating wires are installed in the plurality of ceramic fiber layers in sequence, the plurality of heating wires can be evenly distributed inside the heating furnace body, so as to heat the inside of the heating furnace body through the plurality of heating wires to make the temperature distribution of the heating furnace body uniform. An integral ceramic fiber layer is installed on the outer side wall of the heating furnace body, so that the integral ceramic fiber layer can protect the plurality of ceramic fiber layers, so as to ensure the stable structure of the heating furnace body composed of the plurality of ceramic fiber layers. A cooling component is installed on the outer side wall of the integral ceramic fiber layer. The cooling component is used to cool the heating furnace body, so that the inside of the heating furnace body can be quickly cooled through the cooling component.

[0008] In one or more embodiments of the present utility model, ceramic protrusions are integrally formed on the inner sidewall of the ceramic fiber layer, and the heating wire is installed on the ceramic protrusions so as to support the heating wire through the ceramic protrusions, making the heating wire stable after installation.

[0009] In one or more embodiments of the present utility model, the heating wire is made of iron-chromium-aluminum material, and the iron-chromium-aluminum is flat strip iron-chromium-aluminum.

[0010] In one or more embodiments of the present utility model, the inner diameter of the integral ceramic fiber layer matches the outer diameter of the ceramic fiber layer, making the support of the integral ceramic fiber layer for the ceramic fiber layer stable.

[0011] In one or more embodiments of the present utility model, the cooling assembly includes a cooling water pipe, and the cooling water pipe is composed of a plurality of U-shaped pipes combined together so as to increase the contact area between the cooling water pipe and the integral ceramic fiber layer, making the cooling effect of the cooling water pipe on the integral ceramic fiber layer better, thereby improving the cooling effect on the heating furnace body.

[0012] In one or more embodiments of the present utility model, a water inlet pipe is installed at the water inlet of the cooling water pipe, and a return pipe is installed at the water outlet of the cooling water pipe, so as to supply cooling water to the cooling water pipe through the water inlet pipe, and the cooling water in the cooling water pipe cools the integral ceramic fiber layer in a flowing manner, and the cooling water flows back through the return pipe for recycling.

[0013] In one or more embodiments of the present utility model, a heat insulation layer is provided on the outer side of the cooling water pipe, and a protective shell is provided on the outer side of the heat insulation layer. The integral ceramic fiber layer is insulated through the heat insulation layer so as to insulate the heating furnace body.

[0014] In one or more embodiments of the present utility model, the water inlet pipe and the return pipe sequentially penetrate through the heat insulation layer and the protective shell and are located outside the protective shell, making it convenient for the water inlet pipe and the return pipe to be connected to the cooling water.

[0015] In one or more embodiments of the present utility model, a power supply assembly is provided on the outer sidewall of the integral ceramic fiber layer, and the power supply assembly is used to supply power to the heating wire. The power supply assembly includes a mounting member, and the mounting member is mounted on the sidewall of the integral ceramic fiber layer.

[0016] In one or more embodiments of the present utility model, a plurality of electrodes are mounted on the mounting member and are connected to a power supply through the electrodes. A connecting wire is mounted on the electrodes, and the connecting wire is connected to the heating wire. The power of the electrodes is transmitted to the heating wire through the connecting wire, making the heating wire heat the inside of the heating furnace body.

[0017] Compared with the prior art, the utility model divides the heating furnace into multiple heating zones to jointly heat the heating furnace, making the temperature distribution in the heating furnace uniform; the multi-zone design enables the heating furnace to be applicable to a wider range of process requirements, including the deposition of different materials and the preparation of multi-layer structures; the multi-zone heating furnace can process multiple substrates simultaneously or perform depositions in multiple zones, thereby improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings described below are only some embodiments recorded in the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0019] Figure 1 A perspective view of a semiconductor heating furnace tube in an embodiment of the present utility model;

[0020] Figure 2 A schematic diagram of a cooling water pipe in an embodiment of the present utility model;

[0021] Figure 3 A sectional view of a semiconductor heating furnace tube in an embodiment of the present utility model;

[0022] Figure 4 In an embodiment of the present utility model Figure 3 An enlarged view of part A.

[0023] MAIN REFERENCE NUMERALS DESCRIPTION:

[0024] 1 - Heating furnace body, 11 - Ceramic fiber layer, 12 - Ceramic protrusion, 2 - Heating wire, 3 - Integral ceramic fiber layer, 4 - Heat insulation layer, 5 - Power supply assembly, 51 - Electrode, 52 - Connecting wire, 53 - Mounting part, 6 - Cooling assembly, 61 - Cooling water pipe, 62 - Water inlet pipe, 63 - Water return pipe, 7 - Protective shell. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0025] In order to enable those skilled in the art to better understand the technical solutions in the present utility model, the following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0026] As Figures 1 to 3As shown in the figure, a semiconductor heating furnace tube in an embodiment of the present utility model is used to solve the problem of uneven temperature distribution caused by single-zone heating of the heating furnace.

[0027] As Figures 1 to 3 shown, the semiconductor heating furnace tube includes a heating furnace body 1. The heating furnace body 1 includes a plurality of ceramic fiber layers 11. The plurality of ceramic fiber layers 11 are assembled together in sequence to form the heating furnace body 1, so that the heating furnace body 1 is composed of a combination of a plurality of ceramic fiber layers 11. A plurality of heating wires 2 are installed in the heating furnace body 1. The plurality of heating wires 2 are respectively installed in the plurality of ceramic fiber layers 11. The plurality of heating wires 2 are used to heat the inside of the heating furnace body 1, so that the inside of the heating furnace body 1 is heated by the plurality of heating wires 2. Since the heating wires 2 are sequentially installed in the plurality of ceramic fiber layers 11, the plurality of heating wires 2 can be evenly distributed in the heating furnace body 1, so as to heat the inside of the heating furnace body 1 through the plurality of heating wires 2 to make the temperature distribution of the heating furnace body 1 uniform. An integral ceramic fiber layer 3 is installed on the outer side wall of the heating furnace body 1, so that the integral ceramic fiber layer 3 can protect the plurality of ceramic fiber layers 11, so as to ensure the structural stability of the heating furnace body 1 composed of the plurality of ceramic fiber layers 11. A cooling assembly 6 is installed on the outer side wall of the integral ceramic fiber layer 3. The cooling assembly 6 is used to cool the heating furnace body 1, so that the inside of the heating furnace body 1 can be quickly cooled through the cooling assembly 6.

[0028] As Figure 4 shown, a ceramic protrusion 12 is integrally formed on the inner side wall of the ceramic fiber layer 11. The heating wire 2 is installed on the ceramic protrusion 12, so as to support the heating wire 2 through the ceramic protrusion 12 to make the heating wire 2 stable after installation.

[0029] Preferably, the heating wire 2 is made of an iron-chromium-aluminum material, and the iron-chromium-aluminum is flat strip iron-chromium-aluminum.

[0030] As Figure 3 shown, the inner diameter of the integral ceramic fiber layer 3 matches the outer diameter of the ceramic fiber layer 11, so that the integral ceramic fiber layer 3 stably supports the ceramic fiber layer 11.

[0031] As Figure 2 shown, the cooling assembly 6 includes a cooling water pipe 61. The cooling water pipe 61 is composed of a plurality of U-shaped pipes, so as to increase the contact area between the cooling water pipe 61 and the integral ceramic fiber layer 3, make the cooling effect of the cooling water pipe 61 on the integral ceramic fiber layer 3 better, and thus improve the cooling effect on the heating furnace body 1.

[0032] As Figure 2As shown, a water inlet pipe 62 is installed at the water inlet of the cooling water pipe 61, and a return water pipe 63 is installed at the water outlet of the cooling water pipe 61. Thus, cooling water is provided to the cooling water pipe 61 through the water inlet pipe 62, and the cooling water in the cooling water pipe 61 cools the integral ceramic fiber layer 3 by flowing, and the cooling water flows back through the return water pipe 63 for recycling.

[0033] As Figure 1 and Figure 3 shown, a heat insulation layer 4 is provided on the outer side of the cooling water pipe 61, and a protective shell 7 is provided on the outer side of the heat insulation layer 4. The integral ceramic fiber layer 3 is thermally insulated through the heat insulation layer 4 to thermally insulate the heating furnace body 1.

[0034] As Figure 1 shown, the water inlet pipe 62 and the return water pipe 63 sequentially penetrate through the heat insulation layer 4 and the protective shell 7 and are placed outside the protective shell 7, so that the water inlet pipe 62 and the return water pipe 63 are convenient for connection with the cooling water.

[0035] As Figure 1 and Figure 2 shown, a power supply assembly 5 is provided on the outer side wall of the integral ceramic fiber layer 3, and the power supply assembly 5 is used to supply power to the heating wire 2. The power supply assembly 5 includes a mounting member 53, and the mounting member 53 is mounted on the side wall of the integral ceramic fiber layer 3.

[0036] As Figure 1 and Figure 2 shown, a plurality of electrodes 51 are mounted on the mounting member 53. The electrodes 51 are connected to the power supply, and connection wires 52 are mounted on the electrodes 51. The connection wires 52 are connected to the heating wire 2. The power of the electrodes 51 is transmitted to the heating wire 2 through the connection wires 52, so that the heating wire 2 heats the inside of the heating furnace body 1.

[0037] Preferably, the heating furnace body 1 is divided into multiple heating zones, and the heating furnace body 1 is equipped with an advanced control system, which can accurately control parameters such as temperature and air flow in each zone, and can monitor and adjust the deposition process in real time, and can more accurately control the temperature of each zone, so as to realize uniform distribution of the temperature in the furnace.

[0038] Working principle: By dividing the heating furnace body 1 into multiple heating zones, the temperature of each zone can be controlled more precisely, thus achieving a uniform temperature distribution within the heating furnace body 1; the multi-zone design enables the heating furnace body 1 to be applicable to a wider range of process requirements, including the deposition of different materials, the preparation of multi-layer structures, etc.; the multiple heating zones within the heating furnace body 1 are equipped with advanced control systems that can precisely control parameters such as the temperature and air flow of each zone, and monitor and adjust the deposition process in real time; the multiple heating zones within the heating furnace body 1 can process multiple substrates simultaneously or perform depositions in multiple zones, thereby improving production efficiency; the modular design of the heating furnace body 1 makes its maintenance more convenient and component replacement easier.

[0039] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above-described exemplary embodiments, and without departing from the spirit or basic characteristics of the present utility model, the present utility model can be implemented in other specific forms. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be encompassed within the present utility model. Any reference signs in the claims should not be construed as limiting the claimed rights.

[0040] In addition, it should be understood that although this specification is described in terms of embodiments, not every embodiment contains only one independent technical solution. This narrative manner of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A semiconductor heating furnace tube, comprising a heating furnace body, characterized in that, The heating furnace body includes a plurality of ceramic fiber layers, and the plurality of ceramic fiber layers are assembled together in sequence to form the heating furnace body. A plurality of heating wires are installed in the heating furnace body, and the plurality of heating wires are respectively installed in the plurality of ceramic fiber layers. The plurality of heating wires are used to heat the inside of the heating furnace body. An integral ceramic fiber layer is installed on the outer side wall of the heating furnace body, and a cooling component is installed on the outer side wall of the integral ceramic fiber layer. The cooling component is used to cool down the heating furnace body.

2. A semiconductor heating furnace tube according to claim 1, characterized in that, Ceramic protrusions are integrally formed on the inner side wall of the ceramic fiber layer, and the heating wire is installed on the ceramic protrusions.

3. A semiconductor heating furnace tube according to claim 1, characterized in that, The heating wire is made of iron-chromium-aluminum material, and the iron-chromium-aluminum is flat strip iron-chromium-aluminum.

4. A semiconductor heating furnace tube according to claim 1, characterized in that, The inner diameter of the integral ceramic fiber layer matches the outer diameter of the ceramic fiber layer.

5. A semiconductor heating furnace tube according to claim 1, wherein, The cooling component includes a cooling water pipe, and the cooling water pipe is composed of a plurality of U-shaped pipes combined.

6. A semiconductor heating furnace tube according to claim 5, characterized in that, A water inlet pipe is installed at the water inlet of the cooling water pipe, and a water return pipe is installed at the water outlet of the cooling water pipe.

7. A semiconductor heating furnace tube according to claim 6, characterized in that, A heat insulation layer is arranged on the outer side of the cooling water pipe, and a protective shell is arranged on the outer side of the heat insulation layer.

8. A semiconductor heating furnace tube according to claim 7, wherein, The water inlet pipe and the water return pipe sequentially penetrate through the heat insulation layer and the protective shell and are located outside the protective shell.

9. A semiconductor heating furnace tube according to claim 1, wherein, A power supply component is arranged on the outer side wall of the integral ceramic fiber layer. The power supply component includes a mounting member, and the mounting member is installed on the side wall of the integral ceramic fiber layer.

10. A semiconductor heating furnace tube according to claim 9, characterized in that, A plurality of electrodes are installed on the mounting member, and connecting wires are installed on the electrodes. The connecting wires are connected to the heating wires.

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