Integrated double-sided water-cooling heat dissipation device

Abstract

The utility model discloses an integrated double-face water-cooling heat dissipation device which comprises a water-cooling bin, an upper water-cooling head and a lower water-cooling head. A channel for heat dissipation media to flow is formed in the water cooling bin, mounting grooves communicated with the channel are formed in the upper face and the lower face of the water cooling bin respectively, a water inlet pipe and a water outlet pipe communicated with the channel are arranged on the two transverse sides of the water cooling bin respectively, the water inlet pipe and the water outlet pipe are connected to the water cooling row, and the heat dissipation media circulate between the water cooling bin and the water cooling row. The lower surface of the upper water-cooling head is hermetically fixed with the upper mounting groove of the water-cooling bin; and the upper surface of the lower water-cooling head is hermetically fixed with the lower mounting groove of the water-cooling bin. The upper water cooling head and the lower water cooling head are arranged, the upper water cooling head is connected with the GPU graphics card, the lower water cooling head is connected with the CPU on the mainboard, a large amount of heat generated when the CPU and the GPU work is transmitted to the heat dissipation medium in the water cooling bin through the water cooling heads, the heat dissipation medium is subjected to heat dissipation through the water cooling row to form a circulation, and therefore heat dissipation is provided for the CPU and the GPU at the same time.

Description

Technical Field

[0001] The utility model relates to a computer heat dissipation accessory, in particular to an integrated double-sided water cooling device. Background Art

[0002] There are many decisive factors for computer performance. People usually choose motherboards, CPUs, graphics cards, memory modules, and solid-state drives with excellent performance to improve computer performance. However, the impact of temperature on computer performance is often overlooked. The temperature of the graphics card and CPU has a crucial impact on computer performance. In the case of high temperature, if effective heat dissipation cannot be achieved, the temperature of the chip will continue to rise. This high-temperature state will cause the heat generation of electronic components to further increase, thereby reducing the working efficiency of the chip. When the working temperature exceeds the normal range, its processing speed will slow down and the response time will increase, thus seriously affecting the performance of the overall computer.

[0003] At present, the common heat dissipation of computer CPUs and GPUs is mainly air cooling and passive cooling, and water cooling is rarely involved. The reason is that the volume of water cooling is too large to dissipate heat from the CPU and GPU simultaneously. Summary of the Invention

[0004] In view of the above existing technical problems, the utility model provides an integrated double-sided water cooling device, which can dissipate heat from the CPU and GPU simultaneously.

[0005] To solve the above technical problems, the utility model adopts the following technical solutions: an integrated double-sided water cooling device, including a water cooling chamber, an upper water cooling head, and a lower water cooling head; a channel for the flow of a heat dissipation medium is formed inside the water cooling chamber. Installation grooves communicated with the channel are respectively arranged on the upper and lower surfaces of the water cooling chamber, and a water inlet pipe and a water outlet pipe communicated with the channel are respectively arranged on the two lateral sides of the water cooling chamber horizontally. The water inlet pipe and the water outlet pipe are connected to a water cooling radiator, and the heat dissipation medium forms a cycle between the water cooling chamber and the water cooling radiator; the upper water cooling head is a heat sink, and heat dissipation fins are arranged on the lower surface of the upper water cooling head. The lower surface of the upper water cooling head is hermetically fixed to the upper installation groove of the water cooling chamber, and the heat dissipation fins are located in the installation groove; the lower water cooling head is a heat sink, and heat dissipation fins are arranged on the upper surface of the lower water cooling head. The upper surface of the lower water cooling head is hermetically fixed to the lower installation groove of the water cooling chamber, and the heat dissipation fins are located in the installation groove.

[0006] Further, a water pump and a cooling fan are arranged on the water cooling radiator, and the water inlet pipe and the water outlet pipe are respectively connected to the water cooling radiator through a water cooling pipe.

[0007] Further, the upper surface of the upper water cooling head is attached to the CPU chip and fixed together by screws; the lower surface of the lower water cooling head is attached to the GPU chip and fixed together by screws.

[0008] Furthermore, thermal paste is applied between the upper water-cooling head and the CPU chip, and thermal paste is also applied between the lower water-cooling head and the GPU chip.

[0009] Furthermore, the side of the water-cooling chamber is provided with fixing elastic pieces, and the water-cooling chamber is installed on the mainframe housing through the fixing elastic pieces.

[0010] Furthermore, the heat dissipation medium is water-cooling liquid.

[0011] The beneficial effects of adopting the above technical solutions are as follows: The present utility model integrally has upper and lower water-cooling heads. Among them, the upper water-cooling head is connected to the GPU graphics card, and the lower water-cooling head is connected to the CPU on the motherboard. When the CPU and GPU are working, a large amount of heat is directly contacted through the water-cooling heads and transferred to the heat dissipation medium in the water-cooling chamber. The heat dissipation medium then forms a cycle after being dissipated by the water-cooling radiator, so as to realize cooling for both the CPU and the GPU at the same time. Both the upper cold head and the lower cold head are provided with channels, and the heat dissipation medium can flow in the channels of the water-cooling chamber. The water path length is short, reducing energy loss caused by factors such as water path impact and friction. At the same time, the present utility model has a very small volume, and the length of the water-cooling pipe can be increased or decreased to place the entire fan water-cooling radiator in a suitable position. In this way, important electronic components such as the motherboard, CPU, and GPU can take small-volume waterproof and moisture-proof measures, and the water-cooling radiator can be separately externalized, which can also improve safety and reduce design costs in actual use. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is a schematic diagram of the split structure of the present utility model;

[0013] Figure 2 is a schematic diagram of the assembly of the present utility model with the GPU and CPU;

[0014] Figure 3 is a schematic diagram of the transmission of the heat dissipation medium inside the water-cooling chamber of the present utility model;

[0015] Figure 4 is a schematic diagram of the heat dissipation cycle structure of the heat dissipation medium of the present utility model;

[0016] In the figure: 1. Water-cooling chamber, 101. Channel, 102. Installation groove, 2. Water inlet pipe, 3. Water outlet pipe, 4. Upper water-cooling head, 5. Lower water-cooling head, 6. Screw, 7. Fixing elastic piece, 8. GPU chip, 9. CPU chip, 10. Water-cooling pipe, 11. Water-cooling radiator, 12. Heat dissipation fan. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0017] The following further describes the present utility model in detail with reference to the accompanying drawings.

[0018] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0019] An embodiment of the present utility model is as follows: As Figure 1 and Figure 3 shown, an integrated double-sided water-cooled heat dissipation device includes a water-cooling chamber 1, an upper water-cooling head 4, and a lower water-cooling head 5. A channel 101 for the heat dissipation medium to flow is formed inside the water-cooling chamber 1. Installation grooves 102 communicating with the channel 101 are respectively arranged on the upper and lower surfaces of the water-cooling chamber 1. Water inlet pipes 2 and water outlet pipes 3 communicating with the channel 101 are respectively arranged on the two lateral sides of the water-cooling chamber 1 in the horizontal direction. The water inlet pipes 2 and the water outlet pipes 3 are connected to a water-cooling radiator 11, and the heat dissipation medium forms a cycle between the water-cooling chamber 1 and the water-cooling radiator 11. The upper water-cooling head 4 is a heat sink. Heat dissipation fins are arranged on the lower surface of the upper water-cooling head 4. The lower surface of the upper water-cooling head 4 is hermetically fixed to the upper installation groove 102 of the water-cooling chamber 1, and the heat dissipation fins are located in the installation groove 102. The lower water-cooling head 5 is a heat sink. Heat dissipation fins are arranged on the upper surface of the lower water-cooling head 5. The upper surface of the lower water-cooling head 5 is hermetically fixed to the lower installation groove 102 of the water-cooling chamber 1, and the heat dissipation fins are located in the installation groove 102. The upper water-cooling head 4 and the lower water-cooling head 5 are made of copper. The heat dissipation medium can be a common water-cooling liquid or other cooling liquids on the market. The heat dissipation medium can flow between the water-cooling chambers 9 to form a return flow. The front surface of the upper water-cooling head 4 is in contact with the CPU chip 9, and heat is conducted to the heat dissipation fins on the back through copper. The front surface of the lower water-cooling head 5 is in contact with the GPU chip 8, and heat is conducted to the back heat dissipation fins through copper. The upper and lower heat dissipation fins are in contact with the heat dissipation medium in the water-cooling chamber 9, and the heat is discharged to the water-cooling radiator 11 together with the heat dissipation medium through the water-cooling pipe 10. After being cooled by the water-cooling radiator 11, it flows back into the water-cooling chamber 1 again, thus forming a cycle.

[0020] In some other specific embodiments of the present utility model, the rest is the same as the above embodiments, except that, as Figure 4As shown in the figure, a water pump and a cooling fan 12 are arranged on the water-cooled radiator 11. The water inlet pipe 2 and the water outlet pipe 3 are respectively connected to the water-cooled radiator 11 through a water-cooled pipe 10. After the water-cooled radiator 11 absorbs the heat of the GPU and CPU chips, it can form a pressure cycle for the heat in the water-cooled chamber 1. The heat circulates in the water-cooled radiator 11 and is dissipated passively through the fins on the water-cooled radiator 11, and then these heats are blown out by the cooling fan 12. Thus, the temperature of the heat dissipation medium is reduced, and the power formed by the water pump on the water-cooled radiator 11 recirculates to the water-cooled head 4 and the lower water-cooled head 5. The length of the water-cooled pipe 10 can be increased or decreased to place the entire water-cooled radiator 11 in a suitable position. In this way, important electronic components such as the motherboard, CPU, and GPU can be protected against water and moisture in a small volume, and the water-cooled radiator can be externally placed separately, which can also improve safety and reduce design costs in actual use.

[0021] In some other specific embodiments of the present invention, the rest is the same as the above embodiments, except that, as Figure 2 shown, the upper surface of the upper water-cooled head 4 is attached to the CPU chip 9 and fixed together by screws 6; the lower surface of the lower water-cooled head 5 is attached to the GPU chip 8 and fixed together by screws 6. The screw fixing is convenient for operation and the connection is firm.

[0022] In some other specific embodiments of the present invention, the rest is the same as the above embodiments, except that, as Figure 2 shown, since the air has poor thermal conductivity, thermal paste is applied between the upper water-cooled head 4 and the CPU chip 9, and thermal paste is applied between the lower water-cooled head 5 and the GPU chip 8. The thermal paste can remove the air or gaps between the water-cooled head and the chip to maximize the heat conduction amount.

[0023] In some other specific embodiments of the present invention, the rest is the same as the above embodiments, except that, as Figure 1 shown, fixing elastic pieces 7 are arranged on the side of the water-cooled chamber 1, and the water-cooled chamber 1 is installed on the main body housing through the fixing elastic pieces 7. There are strip holes on the fixing elastic pieces 7, which is convenient for adjusting the installation position and can facilitate the installation and fixing of the device.

[0024] Of course, the above embodiments are only used to illustrate the technical concept and features of the present invention, and the purpose is to enable those who are familiar with this technology to understand the content of the present invention and implement it accordingly, and cannot be used to limit the protection scope of the present invention. All equivalent transformations or modifications made according to the spirit of the main technical solution of the present invention should be covered within the protection scope of the present invention.

Claims

1. An integrated double-sided water-cooled heat dissipation device, characterized in that, It includes a water-cooling chamber, an upper water-cooling head, and a lower water-cooling head; A channel for the flow of a heat dissipation medium is formed inside the water-cooling chamber. Installation grooves communicating with the channel are respectively provided on the upper and lower surfaces of the water-cooling chamber. A water inlet pipe and a water outlet pipe communicating with the channel are respectively provided on the two lateral sides of the water-cooling chamber in the horizontal direction. The water inlet pipe and the water outlet pipe are connected to a water-cooling radiator, and the heat dissipation medium forms a cycle between the water-cooling chamber and the water-cooling radiator; The upper water-cooling head is a heat sink. Heat dissipation fins are provided on the lower surface of the upper water-cooling head. The lower surface of the upper water-cooling head is fixedly sealed with the upper installation groove of the water-cooling chamber, and the heat dissipation fins are located in the installation groove; The lower water-cooling head is a heat sink. Heat dissipation fins are provided on the upper surface of the lower water-cooling head. The upper surface of the lower water-cooling head is fixedly sealed with the lower installation groove of the water-cooling chamber, and the heat dissipation fins are located in the installation groove.

2. The one-piece double-sided water-cooled heat dissipation device according to claim 1, characterized in that A water pump and a cooling fan are provided on the water-cooling radiator, and the water inlet pipe and the water outlet pipe are respectively connected to the water-cooling radiator through a water-cooling pipe.

3. An integrated double-sided water-cooled heat dissipation device according to claim 1 or 2, characterized in that The upper surface of the upper water-cooling head is attached to the CPU chip and fixed together by screws; the lower surface of the lower water-cooling head is attached to the GPU chip and fixed together by screws.

4. The one-piece double-sided water-cooled heat dissipation device according to claim 3, wherein, Thermal grease is applied between the upper water-cooling head and the CPU chip, and thermal grease is applied between the lower water-cooling head and the GPU chip.

5. An integrated double-sided water-cooled heat dissipation device according to claim 1 or 2, characterized in that, Fixed elastic pieces are provided on the side surface of the water-cooling chamber, and the water-cooling chamber is installed on the mainframe housing through the fixed elastic pieces.

6. The integrated double-sided water-cooled heat dissipation device according to claim 1 or 2, characterized in that The heat dissipation medium is a water-cooling liquid.

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