Electronic device

Abstract

An electronic device is provided. An electronic device includes a display panel foldable about a virtual folding axis and a support plate disposed under the display panel and including a porous substrate. The porous substrate includes a base material of metal, a first porous membrane disposed on the base material, and a second porous membrane disposed under the base material.

Description

[0001] Cross - reference to related applications

[0002] This application claims the priority and all benefits derived therefrom of Korean Patent Application No. 10 - 2023 - 0093312, filed on July 18, 2023, the content of which is incorporated herein by reference in its entirety. Technical field

[0003] Embodiments of the present disclosure described herein relate to an electronic device, and more particularly, to a flexible electronic device. Background art

[0004] Electronic devices such as smartphones, digital cameras, laptop computers, automotive navigation units, smart TVs, etc., which provide images to a user, include a display device for displaying an image. The display device generates an image and provides the image to the user through a display screen.

[0005] With the development of display device technology, various forms of display devices are being developed. For example, various display devices that can be bent, folded, or curled are being developed. The display device can be easily portable and can improve user convenience.

[0006] The flexible display device may include a flexible display panel and a support plate disposed under the display panel and supporting the display panel. Summary of the utility model

[0007] Embodiments of the present disclosure provide an electronic device with improved reliability for reducing or preventing damage caused by external shocks and damage or deformation caused by repeated folding operations by improving shear stress, impact resistance, and elastic recovery force inside the electronic device.

[0008] According to an embodiment, the electronic device includes: a display panel foldable about a virtual folding axis and a support plate disposed under the display panel and including a porous substrate. The porous substrate includes a metal base material, a first porous film disposed on the base material, and a second porous film disposed under the base material.

[0009] Each of the metal oxide included in the first porous film and the metal oxide included in the second porous film may be an oxide of the metal included in the base material.

[0010] The first porous film and the second porous film may be formed by an anodization process.

[0011] Each of the pores in the first porous film and the pores in the second porous film may have a column shape extending in the thickness direction in a cross - sectional view.

[0012] The porous substrate may further include a third porous membrane disposed between the substrate and the first porous membrane and a fourth porous membrane disposed between the substrate and the second porous membrane. The third porous membrane may have a porosity lower than that of the first porous membrane, and the fourth porous membrane may have a porosity lower than that of the second porous membrane.

[0013] The third porous membrane may have a hardness higher than that of the first porous membrane, and the fourth porous membrane may have a hardness higher than that of the second porous membrane.

[0014] Each of the metal oxide included in the first porous membrane and the metal oxide included in the second porous membrane may be an oxide of the metal included in the substrate, and each of the third porous membrane and the fourth porous membrane may include: an oxide of the metal included in the substrate.

[0015] The first to fourth porous membranes may be formed by a plasma electrolytic oxidation process.

[0016] Each of the pores in the first porous membrane, the pores in the second porous membrane, the pores in the third porous membrane, and the pores in the fourth porous membrane may have a column shape extending in the thickness direction in a sectional view.

[0017] The metal included in the substrate may include one of aluminum, magnesium, and titanium.

[0018] The support plate may further include a first sealant filling the pores in the first porous membrane and a second sealant filling the pores in the second porous membrane.

[0019] Each of the first sealant and the second sealant may include one of a dye and an elastic material.

[0020] The support plate may further include a first cover substrate disposed on the first porous membrane and a second cover substrate disposed under the second porous membrane.

[0021] Each of the first cover substrate and the second cover substrate may include stainless steel (“SUS”).

[0022] The support plate may further include a first adhesive support layer disposed between the first cover substrate and the first porous membrane and a second adhesive support layer disposed between the second cover substrate and the second porous membrane.

[0023] The display panel may include a foldable region foldable about a folding axis and a first non-foldable region and a second non-foldable region spaced apart from each other across the foldable region in a second direction intersecting a first direction.

[0024] The support plate may include a first support portion overlapping with the first non-folded region, a second support portion overlapping with the second non-folded region, and a third support portion overlapping with the folded region, and the third support portion may define an opening penetrating the support plate from the front surface of the support plate to the rear surface of the support plate.

[0025] The openings may be arranged in a grid pattern in a plan view.

[0026] The support plate may include a first support portion overlapping with the first non-folded region, a second support portion overlapping with the second non-folded region, and a third support portion overlapping with the folded region, and the third support portion may define a groove on the rear surface of the support plate.

[0027] The support plate may further include a filling member containing an elastic material. A plurality of porous substrates may be provided, and the plurality of porous substrates may include a first plate overlapping with the first non-folded region and a second plate overlapping with the second non-folded region and spaced apart from the first plate. The filling member may overlap with the folded region and may be disposed between the first plate and the second plate.

[0028] The support plate may further include a first sealing layer disposed on and covering the first porous membrane and a second sealing layer disposed under and covering the second porous membrane, and each of the first sealing layer and the second sealing layer may include an elastic material.

[0029] The support plate may include a first support portion overlapping with the first non-folded region, a second support portion overlapping with the second non-folded region, and a third support portion overlapping with the folded region, and the third support portion may overlap with the entire folded region.

[0030] The electronic device may further include a first lower plate disposed under the support plate and overlapping with the first non-folded region and a part of the folded region, and a second lower plate disposed under the support plate and overlapping with the second non-folded region and another part of the folded region, the second lower plate being spaced apart from the first lower plate. Each of the first lower plate and the second lower plate may include a lower substrate containing a metal, a fifth porous membrane disposed on the lower substrate and including a metal oxide, and a sixth porous membrane disposed under the lower substrate and including a metal oxide.

[0031] The fifth porous membrane and the sixth porous membrane may be formed by an anodization process.

[0032] Each of the first lower plate and the second lower plate may further include a seventh porous membrane disposed between the lower substrate and the fifth porous membrane and an eighth porous membrane disposed between the lower substrate and the sixth porous membrane, and the fifth to eighth porous membranes may be formed by a plasma electrolytic oxidation process.

[0033] The seventh porous membrane may have a hardness higher than that of the fifth porous membrane, and the eighth porous membrane may have a hardness higher than that of the sixth porous membrane.

[0034] Each of the first lower plate and the second lower plate may further include a third covering substrate disposed on the fifth porous film and a fourth covering substrate disposed under the sixth porous film, and each of the third covering substrate and the fourth covering substrate may include a metal.

[0035] Each of the first lower plate and the second lower plate may further include a first lower adhesive layer disposed between the third covering substrate and the fifth porous film and a second lower adhesive layer disposed between the fourth covering substrate and the sixth porous film.

[0036] The electronic device may further include an electronic module disposed under the display panel and at least partially inserted into a hole defined in the support plate.

[0037] According to an embodiment, an electronic device includes a display panel foldable about a virtual folding axis and a support plate disposed under the display panel and including a porous substrate. The porous substrate includes a base material containing a metal, a first oxide film disposed on the base material and defining a first void therein, and a second oxide film disposed under the base material and defining a second void therein.

[0038] The first oxide film and the second oxide film may be formed by an anodization process.

[0039] The porous substrate may further include a third oxide film disposed between the base material and the first oxide film and defining a third void therein and a fourth oxide film disposed between the base material and the second oxide film and defining a fourth void therein. The third oxide film may have a porosity lower than that of the first oxide film, and the fourth oxide film may have a porosity lower than that of the second oxide film.

[0040] The first to fourth oxide films may be formed by a plasma electrolytic oxidation process.

[0041] According to an embodiment, a method of manufacturing an electronic device includes: forming a support plate under a display panel that is foldable about a virtual folding axis extending in a first direction, wherein forming the support plate includes: forming a first porous film and a second porous film including a metal oxide, wherein, in forming the first porous film and the second porous film, the first porous film is formed on the base material and the second porous film is formed under the base material.

[0042] Forming the first porous film and the second porous film may be performed by an anodization process.

[0043] In forming the first porous film and the second porous film, a third porous film may further be formed between the base material and the first porous film, and a fourth porous film may further be formed between the base material and the second porous film.

[0044] The formation of the first porous film and the second porous film can be performed by a plasma electrolytic oxidation process. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] The above and other aspects and features of the present disclosure will become apparent by describing embodiments of the present disclosure in detail with reference to the accompanying drawings.

[0046] Figure 1 is a perspective view of an electronic device according to an embodiment of the present disclosure.

[0047] Figure 2 and Figure 3 is a perspective view of a folded electronic device according to an embodiment of the present disclosure.

[0048] Figure 4 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0049] Figure 5 is a block diagram of an electronic device according to an embodiment of the present disclosure.

[0050] Figure 6 is a cross-sectional view showing a display device according to an embodiment of the present disclosure.

[0051] Figure 7 is a cross-sectional view of a display panel according to an embodiment of the present disclosure.

[0052] Figure 8 is a perspective view of a support plate according to an embodiment of the present disclosure.

[0053] Figure 9 is Figure 8 an enlarged plan view of region AA' of

[0054] Figure 10A is a cross-sectional view of a support plate according to an embodiment of the present disclosure.

[0055] Figure 10B is a cross-sectional view showing a part of a method of manufacturing a support plate according to an embodiment of the present disclosure.

[0056] Figures 11A to 11C is Figure 10A an enlarged cross-sectional view of region BB' of

[0057] Figure 12A is a cross-sectional view of a support plate according to another embodiment of the present disclosure.

[0058] Figure 12B is a cross-sectional view showing a part of a method of manufacturing Figure 12A the support plate of

[0059] Figures 13A to 13C isFigure 12A An enlarged sectional view of the region CC'.

[0060] Figure 14 It is a sectional view of a support plate according to another embodiment of the present disclosure.

[0061] Figure 15 It is a sectional view of a support plate according to still another embodiment of the present disclosure.

[0062] Figure 16 It is a sectional view of a support plate according to another embodiment of the present disclosure.

[0063] Figure 17 It is a sectional view of a support plate according to another embodiment of the present disclosure.

[0064] Figure 18A It is a sectional view of a support plate according to still another embodiment of the present disclosure.

[0065] Figure 18B is Figure 18A An enlarged sectional view of the region DD'.

[0066] Figure 19A and Figure 19B are sectional views showing a part of a lower plate according to an embodiment of the present disclosure.

[0067] Figure 20A and Figure 20B are sectional views showing a part of a lower plate according to an embodiment of the present disclosure. Detailed Embodiments

[0068] In this specification, when it is mentioned that a component (or region, layer, part, etc.) is said to be "on", "connected to" or "coupled to" another component, this means that the component can be directly on the other component, directly connected to or directly coupled to the other component, or there may be a third component therebetween.

[0069] Identical reference numerals indicate identical components. In addition, in the drawings, for effective description, the thickness, ratio and dimensions of the components are exaggerated. The terms used herein are for the purpose of describing particular embodiments only and are not intended to be limiting. Unless the context clearly indicates otherwise, as used herein, "a", "an", "the" and "at least one" do not denote a limitation of quantity and are intended to include both the singular and the plural. For example, unless the context clearly indicates otherwise, "element" has the same meaning as "at least one element". "At least one" will not be construed as limited to "one" or "a". "Or" means "and / or". As used herein, the term "and / or" includes all of one or more combinations defined by the related components.

[0070] Terms such as "first", "second", etc. may be used to describe various components, but the components should not be limited by the terms. The terms may be used only to distinguish one component from other components. For example, without departing from the scope of the present disclosure, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component. Unless otherwise stated, terms in the singular form may include the plural form.

[0071] In addition, terms such as "below", "beneath", "above", and "on top" are used to describe the relationship of components shown in the drawings. The terms are relative concepts and are described based on the directions shown in the drawings.

[0072] It should be understood that terms such as "comprising", "including", and "having", when used herein, specify the presence of the stated features, numbers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0073] Unless otherwise defined, all terms (including technical or scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. Such terms as those defined in a commonly used dictionary will be interpreted to have the same meaning as the context meaning in the relevant technical field, and will not be interpreted to have an idealized or overly rigid meaning unless explicitly defined as having such a meaning in the present application.

[0074] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings.

[0075] Figure 1 is a perspective view of an electronic device according to an embodiment of the present disclosure.

[0076] Referring to Figure 1 , an electronic device ED according to an embodiment of the present disclosure may have a rectangular shape including a long side extending in a first direction DR1 and a short side extending in a second direction DR2 intersecting the first direction DR1. However, it is not limited thereto, and the electronic device ED may have various shapes such as a circular shape, other polygonal shapes, etc. The electronic device ED may be a flexible display device.

[0077] Hereinafter, a direction substantially perpendicular to the plane defined by the first direction DR1 and the second direction DR2 is defined as a third direction DR3. In addition, the expression "from above the plane" used herein may mean observing it along the third direction DR3 (i.e., the plan view).

[0078] The electronic device ED may include a folding area FA and a plurality of non-folding areas NFA1 and NFA2. The non-folding areas NFA1 and NFA2 may include a first non-folding area NFA1 and a second non-folding area NFA2. The folding area FA may be disposed between the first non-folding area NFA1 and the second non-folding area NFA2. The first non-folding area NFA1, the folding area FA, and the second non-folding area NFA2 may be arranged in a second direction DR2. The folding area FA may be referred to as a foldable area, and the first non-folding area NFA1 and the second non-folding area NFA2 may be referred to as a first non-foldable area and a second non-foldable area.

[0079] Although one folding area FA and two non-folding areas NFA1 and NFA2 are shown as examples in Figure 1 , the number of the folding area FA and the number of the non-folding areas NFA1 and NFA2 are not limited thereto. For another example, the electronic device ED may include more than two non-folding areas and a plurality of folding areas, with each of the plurality of folding areas disposed between the non-folding areas.

[0080] The upper surface of the electronic device ED may be defined as a display surface DS, and the display surface DS may have a plane defined by a first direction DR1 and a second direction DR2. An image IM generated by the electronic device ED may be provided to a user through the display surface DS.

[0081] The display surface DS may include a display area DA and a non-display area NDA around the display area DA. The display area DA may display an image, and the non-display area NDA may not display an image. The non-display area NDA may surround the display area DA and may define a boundary of the electronic device ED printed in a predetermined color.

[0082] A sensor area ED-SA may be defined in the display area DA of the electronic device ED. Although one sensor area ED-SA is shown as an example in Figure 1 , the number of the sensor area ED-SA is not limited thereto. The sensor area ED-SA may be a part of the display area DA. Thus, the electronic device ED may display an image through the sensor area ED-SA. However, the present disclosure is not limited thereto. For another example, a portion of the display panel corresponding to the sensor area ED-SA may be removed, and the sensor area ED-SA may not display an image.

[0083] An electronic module may be disposed in a region overlapping with the sensor region ED-SA. The electronic module may receive an external input transmitted through the sensor region ED-SA or may provide an output through the sensor region ED-SA. In an embodiment, for example, the electronic module may be a camera module, a sensor for measuring distance (e.g., a proximity sensor), a sensor for identifying a part of a user's body (e.g., fingerprint, iris, or face), or a small light that outputs light, but is not particularly limited thereto. Hereinafter, it will be exemplified that the electronic module overlapping with the sensor region ED-SA is a camera module.

[0084] Figure 2 and Figure 3 are perspective views of a folded electronic device according to an embodiment of the present disclosure. Figure 2 and Figure 3 show Figure 1 the folded state of the electronic device shown in

[0085] Referring to Figure 2 and Figure 3 , the electronic device ED may be a foldable or unfoldable foldable electronic device. In an embodiment, for example, the folding region FA may be bent about a virtual folding axis FX parallel to the first direction DR1, and the electronic device ED may be folded accordingly. The folding axis FX may be defined as a long axis parallel to the long side of the electronic device ED.

[0086] When the electronic device ED is folded, the first non-folding region NFA1 and the second non-folding region NFA2 may face each other, and the electronic device ED may be folded in an inward folding manner such that the display surface DS (refer to Figure 1 ) is not exposed to the outside. However, the embodiments of the present disclosure are not limited thereto. For another example, the electronic device ED may be folded in an outward folding manner about the folding axis FX such that the display surface DS is exposed to the outside.

[0087] The folding region FA may be bent to have a curvature radius R1. As shown in Figure 2 , the distance between the first non-folding region NFA1 and the second non-folding region NFA2 may be substantially the same as twice the curvature radius R1 (e.g., the diameter). In this case, the electronic device ED may be folded into a "U" shape.

[0088] However, it is not limited thereto. As shown in Figure 3 , the distance between the first non-folding region NFA1 and the second non-folding region NFA2 may be less than twice the curvature radius R1. In this case, the electronic device ED may be folded into a dumbbell shape.

[0089] Figure 4 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure. Figure 5 is a block diagram of an electronic device according to an embodiment of the present disclosure.

[0090] Referring to Figure 4 and Figure 5 , the electronic device ED may include a display device DD, a first electronic module EM1, a second electronic module EM2, a power module PM, and housings EDC1 and EDC2. Although not shown separately, the electronic device ED may further include a mechanical structure (e.g., a hinge) for controlling the folding operation of the display device DD.

[0091] The display device DD may include a window module WM, a display module DM, and a lower module LM. The window module WM may provide the front surface of the electronic device ED. The window module WM may be disposed on the display module DM and may protect the display module DM. The window module WM may transmit light generated from the display module DM and may provide the light to the user.

[0092] The display module DM may at least include a display panel DP. The display module DM generates an image and detects an external input. In Figure 4 , the display module DM is shown to be the same as the display panel DP. However, the display module DM may substantially be a stacked structure in which a plurality of components including the display panel DP are stacked. The stacked structure of the display module DM will be described in detail below.

[0093] The display panel DP may generate an image. The display panel DP may include a display area DP-DA (refer to Figure 1 ) and a non-display area DP-NDA (refer to Figure 1 ) corresponding to the display area DA (refer to

[0094] ) and the non-display area NDA (refer to Figure 1 ) of the electronic device ED, respectively. The display area DP-DA may generate an image, and the non-display area DP-NDA may not generate an image. The expression “one area / part corresponds to another area / part” used herein means that the areas / parts overlap each other and is not limited to having the same area.

[0095] The first region A1 may have a transmittance higher than that of the second region A2. Alternatively, the first region A1 may have a resolution lower than that of the second region A2. However, the present disclosure is not limited thereto. For another example, the first region A1 may have a transmittance higher than that of the second region A2, but may have a resolution substantially the same as that of the second region A2. The first region A1 may overlap with a camera module CMM described below. In an embodiment of the present disclosure, a portion of the display panel DP corresponding to the first region A1 may be removed. Accordingly, an image may not be displayed on the first region A1.

[0096] The display panel DP may include a display layer 110 and a sensor layer 120.

[0097] The display layer 110 may be a component that substantially generates an image. The display layer 110 may be an emissive display layer. In an embodiment, for example, the display layer 110 may be an organic light-emitting display layer, an inorganic light-emitting display layer, an organic-inorganic light-emitting display layer, a quantum dot display layer, a micro LED display layer, or a nano LED display layer.

[0098] The sensor layer 120 may sense an external input applied from the outside. The external input may be a user input. The user input may include various types of external inputs, such as a part of a user's body, light, heat, a pen, or pressure.

[0099] The display module DM may include a driver IC DIC disposed in the non-display area DP-NDA. The display module DM may further include a flexible circuit film FCB coupled to the non-display area DP-NDA.

[0100] The driver IC DIC may include a driving element (e.g., a data driving circuit) for driving pixels of the display panel DP. Although Figure 4 a structure in which the driver IC DIC is mounted on the display panel DP is shown, the present disclosure is not limited thereto. For another example, the driver IC DIC may be mounted on the flexible circuit film FCB.

[0101] The lower module LM may be disposed below the display module DM. The lower module LM may be a component that supports the display module DM. The lower module LM may have a module hole MH defined therein. The module hole MH may correspond to a hole penetrating the lower module LM. Although the lower module LM is briefly shown as a single component, the lower module LM may be a stacked structure in which a plurality of components are stacked. The module hole MH may be defined to penetrate a plurality of components of the lower module LM. The module hole MH may overlap with the first region A1 of the display area DP-DA. The stacked structure of the lower module LM will be described in detail below.

[0102] The power supply module PM supplies power for the overall operation of the electronic device ED. The power supply module PM may include a conventional battery module.

[0103] The first electronic module EM1 and the second electronic module EM2 include various functional modules for operating the electronic device ED. The first electronic module EM1 and the second electronic module EM2 can be directly mounted on the motherboard electrically connected to the display panel DP, or can be mounted on a separate substrate and electrically connected to the motherboard through a connector (not shown).

[0104] The first electronic module EM1 may include a control module CM, a wireless communication module TM, an image input module IIM, a sound input module AIM, a memory MM, and an external interface IF.

[0105] The control module CM controls the overall operation of the electronic device ED. The control module CM can be a microprocessor. In an embodiment, for example, the control module CM activates or deactivates the display panel DP. The control module CM can control other modules such as the image input module IIM or the sound input module AIM based on the touch signal received from the display panel DP.

[0106] The wireless communication module TM can communicate with an external electronic device through a first network (e.g., a short-range communication network such as Bluetooth, WiFi Direct, or Infrared Data Association (“IrDA”)) or a second network (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., “LAN” or “WAN”)). The communication module included in the wireless communication module TM can be integrated into one component (e.g., a single chip), or can be implemented using multiple separate components (e.g., multiple chips). The wireless communication module TM can use a common communication line to transmit / receive sound signals. The wireless communication module TM may include a transmitter TM1 that modulates the signal to be transmitted and transmits the modulated signal, and a receiver TM2 that demodulates the received signal.

[0107] The image input module IIM processes the image signal to convert the image signal into image data that can be displayed on the display panel DP. The sound input module AIM receives an external sound signal through a microphone in a voice recording mode or a voice recognition mode, and converts the external sound signal into electrical voice data.

[0108] The external interface IF may include a connector capable of physically connecting the electronic device ED and an external electronic device. In an embodiment, for example, the external interface IF serves as an interface for connecting to an external charger, a wired / wireless data port, or a card (e.g., a memory card or a SIM / UIM card) slot.

[0109] The second electronic module EM2 may include a sound output module AOM, a light emitting module LTM, a light receiving module LRM, and a camera module CMM. The sound output module AOM converts sound data received from the wireless communication module TM or sound data stored in the memory MM, and outputs the converted data to the outside.

[0110] The light emitting module LTM generates and outputs light. The light emitting module LTM may output infrared light. The light emitting module LTM may include an LED element. The light receiving module LRM may sense infrared light. When infrared light above a predetermined level is sensed, the light receiving module LRM may be activated. The light receiving module LRM may include a CMOS sensor. After the infrared light generated by the light emitting module LTM is output, the infrared light may be reflected by an external object (e.g., a user's finger or face), and the reflected infrared light may be incident on the light receiving module LRM.

[0111] The camera module CMM may capture still images and videos. The camera module CMM may include a plurality of camera modules CMM. A part of the plurality of camera modules CMM may overlap with the first area A1. At least a part of the camera module CMM that overlaps with the first area A1 may be inserted into the module hole MH. An external input (e.g., light) may be provided to the camera module CMM through the first area A1. In an embodiment, for example, the camera module CMM may capture an external image by receiving natural light passing through the first area A1.

[0112] The housings EDC1 and EDC2 may accommodate the display module DM, the lower module LM, the first electronic module EM1, the second electronic module EM2, and the power module PM. The housings EDC1 and EDC2 protect the components such as the display module DM, the lower module LM, the first electronic module EM1, the second electronic module EM2, and the power module PM accommodated in the housings EDC1 and EDC2. Although Figure 4 two separate housings EDC1 and EDC2 are shown, the present disclosure is not limited thereto. Although not shown, in another embodiment, the electronic device ED may further include a hinge structure for connecting the two housings EDC1 and EDC2. The housings EDC1 and EDC2 may be coupled to the window module WM.

[0113] Figure 6 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure. As used herein, a "cross-sectional view" is a view of an object cut by a plane (e.g., the second direction DR2 and the third direction DR3) parallel to the thickness direction (i.e., the third direction DR3) of the display panel DP. Figure 7 is a cross-sectional view of a display panel according to an embodiment of the present disclosure. Figure 8 is a perspective view of a support plate according to an embodiment of the present disclosure. Figure 9 is Figure 8Enlarged plan view of region AA' of. In Figure 6 FIG. 1 shows a cross-section of the display device DD observed in the first direction DR1. As used herein, a "plan view" is a view in the thickness direction of the display panel DP (i.e., the third direction DR3). For convenience of description, in Figure 6 FIG. 1, the protruding portions of the driver IC DIC shown in Figure 4 FIG. 2 and the flexible circuit film FCB connected to the protruding portions of the display panel DP are omitted.

[0114] Referring to Figure 6 FIG. 3, the display device DD may include a window module WM, a display module DM, a lower module LM, and adhesive layers 20 and 50. The display device DD may include a first non-foldable region NFA1, a second non-foldable region NFA2, and a foldable region FA. The first non-foldable region NFA1, the second non-foldable region NFA2, and the foldable region FA of the display device DD may correspond to the first non-foldable region NFA1, the second non-foldable region NFA2, and the foldable region FA of the electronic device ED described above with reference to Figure 1 FIG. 2.

[0115] The window module WM may include a window WIN, a window protection layer WP, a hard coat HC, a border pattern PT, and a first adhesive layer 10.

[0116] The window WIN may be disposed on the display module DM. The window WIN may protect the display module DM from external impacts or scratches. The window WIN may include an optically transparent material. In an embodiment, for example, the window WIN may include glass or a synthetic resin film.

[0117] The window WIN may have a single-layer structure or a multi-layer structure. In an embodiment, for example, the window WIN may include a plurality of synthetic resin films joined by an adhesive, or may include a glass film and a synthetic resin film joined by an adhesive.

[0118] The window protection layer WP may be disposed on the window WIN. The first adhesive layer 10 may be disposed between the window WIN and the window protection layer WP, and may join the window WIN and the window protection layer WP. The first adhesive layer 10 may be a pressure-sensitive adhesive ("PSA") film or an optically clear adhesive ("OCA") member. The adhesive layers described below may also be the same as the first adhesive layer 10, and may include a conventional adhesive. However, it is not limited thereto, and the first adhesive layer 10 may be omitted, and the window protection layer WP may be directly disposed on the window WIN.

[0119] The window protective layer WP may include an organic material. In an embodiment, for example, the window protective layer WP may include at least one of polyimide, polycarbonate, polyamide, polymethyl methacrylate, polyethylene terephthalate, triacetyl cellulose, thermoplastic polyurethane (“TPU”), thermosetting polyurethane (“TSU”), polyether block amide (“PEBA”), and copolyester thermoplastic elastomer (“COPE”). However, the material of the window protective layer WP is not limited to the above examples.

[0120] The hard coat HC may be disposed on the window protective layer WP. The hard coat HC may be disposed at the top of the window module WM. The hard coat HC may be directly coated on the upper surface of the window protective layer WP. However, not limited thereto, the hard coat HC may be coupled to the window protective layer WP through a separate adhesive.

[0121] The hard coat HC may include a hard coat agent including at least one of an organic composition, an inorganic composition, and an organic-inorganic composite composition. In an embodiment, for example, the hard coat HC may include an acrylic compound, an epoxy compound, a siloxane compound, or a urethane-based compound. The hard coat HC may improve the durability of the window module WM, may prevent scratches caused by external factors, and may provide a flat upper surface.

[0122] The hard coat HC may further include additional functional layers, such as an anti-fingerprint layer, an anti-static layer, or an anti-pollution layer. However, not limited thereto, the hard coat HC may be provided as a single layer and may also include functional materials, such as an anti-fingerprint coating agent (such as a fluorine-containing compound), an anti-reflection agent, or an anti-glare agent.

[0123] The border pattern PT may be disposed on the lower surface of the window protective layer WP. However, the position where the border pattern PT is formed is not limited thereto, and in another embodiment, the border pattern PT may be disposed on the upper surface or the lower surface of the window WIN. The border pattern PT may be adjacent to the periphery of the window protective layer WP. The region where the border pattern PT is disposed may correspond to the non-display area DP-NDA of the display panel DP (refer to Figure 4 ). The border pattern PT may correspond to a layer formed by coating or printing a colored material. The border pattern PT may prevent components of the display module DM arranged to overlap the border pattern PT in a plan view from being visible from the outside.

[0124] The second adhesive layer 20 may be disposed between the window module WM and the display module DM and may couple the window module WM and the display module DM.

[0125] The display module DM may include an anti-reflection member ARM, a display panel DP, a lower protective film LPF, a third adhesive layer 30, and a fourth adhesive layer 40.

[0126] The anti-reflection member ARM may be referred to as an anti-reflection layer. The anti-reflection member ARM may reduce the reflectance of external light incident on the display panel DP. In an embodiment, the anti-reflection member ARM may include a polarizer film. The polarizer film may include a phase retarder and / or a polarizer.

[0127] In an embodiment, the anti-reflection member ARM may include color filters having a predetermined arrangement. In an embodiment, for example, the color filters may be arranged to correspond to the colors of light emitted by pixels included in the display panel DP. The color filters may reduce the reflectance of external light by filtering the external light to the colors of light emitted by the pixels. In addition, the anti-reflection member ARM may further include a black matrix adjacent to the color filters.

[0128] The third adhesive layer 30 may be disposed between the anti-reflection member ARM and the display panel DP, and may couple the anti-reflection member ARM and the display panel DP. However, it is not limited thereto, and the third adhesive layer 30 may be omitted, and the anti-reflection member ARM may be directly disposed on the display panel DP.

[0129] The display panel DP may include a first non-folded area DP-NFA1 corresponding to the first non-folded area NFA1 of the display device DD, a second non-folded area DP-NFA2 corresponding to the second non-folded area NFA2 of the display device DD, and a folded area DP-FA corresponding to the folded area FA of the display device DD.

[0130] Refer to Figure 7 , the display panel DP may be a component that generates an image and senses an input applied from the outside. In an embodiment, for example, the display panel DP may include a display layer 110 and a sensor layer 120.

[0131] The display layer 110 may be a component that substantially generates an image. The display layer 110 may be an emissive display layer. In an embodiment, for example, the display layer 110 may be an organic light-emitting display layer, a quantum dot display layer, or a micro-LED display layer.

[0132] The display layer 110 may include a base layer 111, a circuit layer 112, a light-emitting element layer 113, and a packaging layer 114.

[0133] The base layer 111 may include a synthetic resin film. The synthetic resin film may include a thermosetting resin. The base layer 111 may have a multi-layer structure. In an embodiment, for example, the base layer 111 may have a three-layer structure including a synthetic resin layer, an adhesive layer, and a synthetic resin layer. In particular, the synthetic resin layer may be a polyimide resin layer, and its material is not particularly limited. The synthetic resin layer may include at least one of an acrylic resin, a methacrylic resin, a polyisoprene resin, a vinyl resin, an epoxy resin, a urethane-based resin, a cellulose resin, a siloxane-based resin, a polyamide resin, and a perylene-based resin. In addition, the base layer 111 may include a glass substrate, an organic / inorganic composite substrate, etc.

[0134] The circuit layer 112 may be disposed on the base layer 111. The circuit layer 112 may include an insulating layer, a semiconductor pattern, a conductive pattern, and signal lines. The insulating layer, the semiconductor layer, and the conductive layer may be disposed on the base layer 111 by a process such as coating or deposition, and may be selectively patterned by performing a photolithography process multiple times. Thereafter, the semiconductor pattern, the conductive pattern, and the signal lines included in the circuit layer 112 may be formed.

[0135] The light-emitting element layer 113 may be disposed on the circuit layer 112. The light-emitting element layer 113 may include light-emitting elements. In an embodiment, for example, the light-emitting element layer 113 may include an organic light-emitting material, quantum dots, quantum rods, or micro LEDs.

[0136] The encapsulation layer 114 may be disposed on the light-emitting element layer 113. The encapsulation layer 114 may include an inorganic layer, an organic layer, and an inorganic layer sequentially stacked on top of each other. However, the layers constituting the encapsulation layer 114 are not limited thereto.

[0137] The inorganic layer may protect the light-emitting element layer 113 from moisture and oxygen, and the organic layer may protect the light-emitting element layer 113 from foreign substances such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer may include, but is not limited to, an acrylic organic layer.

[0138] The sensor layer 120 may be disposed on the display layer 110. The sensor layer 120 may sense an external input applied from the outside. The external input may be a user input. The user input may include various types of external inputs, such as a part of the user's body, light, heat, a pen, or pressure.

[0139] The sensor layer 120 can be arranged on the display layer 110 through a continuous process. In this case, the sensor layer 120 can be represented as being directly arranged on the display layer 110. When the sensor layer 120 is directly arranged on the display layer 110, this can mean that no third component is arranged between the sensor layer 120 and the display layer 110. That is to say, no separate adhesive member may be arranged between the sensor layer 120 and the display layer 110.

[0140] Alternatively, the sensor layer 120 can be coupled to the display layer 110 through an adhesive member. The adhesive member can include a conventional adhesive or a viscous substance.

[0141] Referring again to Figure 6 , the lower protective film LPF can be coupled to the rear surface of the display panel DP through the fourth adhesive layer 40. The lower protective film LPF can prevent scratches on the rear surface of the display panel DP during the manufacturing process of the display panel DP. The lower protective film LPF can be a colored polyimide film. In an embodiment, for example, the lower protective film LPF can be an opaque yellow film, but is not limited thereto.

[0142] The lower module LM can be arranged below the display panel DP. The lower module LM can include a pad member CSM, a support plate SPT, a cover layer CVL, a lower plate LPT, a sixth adhesive layer 60, and a seventh adhesive layer 70.

[0143] The pad member CSM can be arranged below the lower protective film LPF. The fifth adhesive layer 50 can be arranged between the lower protective film LPF and the pad member CSM, and can couple the lower protective film LPF and the pad member CSM.

[0144] The pad member CSM can protect the display panel DP from the impact transmitted from below. The impact resistance characteristics of the display device DD can be improved by the pad member CSM.

[0145] The pad member CSM can include a barrier film BRF and a cushion layer CSL. The components included in the pad member CSM are not limited to the above components. At least a part of the above components can be omitted, and other components can be added.

[0146] The barrier film BRF can improve the impact resistance performance. The barrier film BRF can be used to prevent the deformation of the display panel DP. The barrier film BRF can be a synthetic resin film, for example, a polyimide film, but is not limited thereto.

[0147] The cushion layer CSL can include, for example, an expanded foam or a sponge. The expanded foam can include a polyurethane foam or a thermoplastic polyurethane foam. When the cushion layer CSL includes an expanded foam, the cushion layer CSL can be formed using the barrier film BRF as a base layer. In an embodiment, for example, the cushion layer CSL can be formed by foaming a foaming agent on the barrier film BRF.

[0148] At least one of the barrier film BRF and the cushion layer CSL may have a light-absorbing color. In an embodiment, for example, at least one of the barrier film BRF and the cushion layer CSL may be black. In this case, components disposed under the pad member CSM can be prevented from being visible from the outside.

[0149] In the present embodiment, a plurality of support plates for supporting the display panel DP may be disposed under the display panel DP. The plurality of support plates may include a support plate SPT and a lower plate LPT.

[0150] The support plate SPT may be disposed under the pad member CSM. A sixth adhesive layer 60 may be disposed between the pad member CSM and the support plate SPT and may couple the pad member CSM and the support plate SPT.

[0151] In the present embodiment, the support plate SPT may include a first support portion SA1 overlapping with a first non-folded region DP-NFA1 of the display panel DP, a second support portion SA2 overlapping with a second non-folded region DP-NFA2 of the display panel DP, and a third support portion SA3 overlapping with a folded region DP-FA of the display panel DP. The third support portion SA3 may be disposed between the first support portion SA1 and the second support portion SA2. That is, the first support portion SA1 and the second support portion SA2 may be spaced apart from each other in a second direction DR2 with the third support portion SA3 therebetween. The third support portion SA3 together with the folded region DP-FA of the display panel DP may be foldable about a virtual folding axis extending in a first direction DR1.

[0152] In the present embodiment, the third support portion SA3 may have an opening OP defined therein. That is, the opening OP may be defined in a region overlapping with the folded region DP-FA of the display panel DP. The opening OP may be formed through the support plate SPT from a front surface F-SPT of the support plate SPT to a back surface B-SPT of the support plate SPT. The front surface F-SPT of the support plate SPT may be adjacent to the display module DM, and the back surface B-SPT of the support plate SPT may face away from the front surface F-SPT and may be adjacent to the lower plate LPT described below. A part of the support plate SPT may be more easily deformed through the opening OP.

[0153] Refer to Figure 8 and Figure 9 , a plurality of openings OP may be defined in the third support portion SA3 in a grid pattern. The openings OP may be arranged according to a predetermined rule. Since the openings OP are defined in the third support portion SA3, the area of the third support portion SA3 may be reduced, and thus the stiffness in the third support portion SA3 may be lowered. When the openings OP are defined in the third support portion SA3, the flexibility in the third support portion SA3 of the support plate SPT may be improved as compared with when the openings OP are not defined in the third support portion SA3. Therefore, the support plate SPT may be more easily bent.

[0154] The openings OP can be arranged in a first direction DR1 and a second direction DR2. The openings OP can extend longer in the first direction DR1 than in the second direction DR2. In an embodiment, for example, the openings OP arranged in the h-th column and the openings OP arranged in the (h + 1)-th column can be staggered with respect to each other. "h" can be a natural number greater than 0, and the columns can correspond to the first direction DR1.

[0155] The support plate SPT can have holes SPT-MH defined therein. The holes SPT-MH can be defined to penetrate the support plate SPT. The holes SPT-MH of the support plate SPT can form part of the module holes MH (refer to Figure 4 ) of the lower module LM (refer to Figure 4 ). At least a part of the camera module CMM (refer to Figure 4 ) can be disposed in the holes SPT-MH of the support plate SPT. According to the present embodiment, the lower module LM includes a support plate SPT having high shear stress and improved impact resistance and elastic recovery force. Therefore, even if the support plate SPT has holes SPT-MH defined therein and an external impact is applied to a portion adjacent to the sensor area ED-SA (refer to Figure 1 ) of the electronic device ED, damage to the support plate SPT can be reduced or prevented.

[0156] Referring again to Figure 6 , the cover layer CVL can be attached to the bottom of the support plate SPT. The cover layer CVL can be attached to the third support portion SA3 of the support plate SPT. The cover layer CVL can cover the openings OP of the support plate SPT. Therefore, the cover layer CVL can prevent foreign substances from penetrating into the openings OP.

[0157] The cover layer CVL can include a material having an elastic modulus lower than that of the support plate SPT. In an embodiment, for example, the cover layer CVL can include thermoplastic polyurethane, but is not limited thereto.

[0158] The lower plate LPT can be disposed under the support plate SPT. The lower plate LPT can include a plurality of lower plates. The lower plate LPT can include a first lower plate LPT1 and a second lower plate LPT2. The first lower plate LPT1 can be disposed to overlap with a first non-folded area DP-NFA1 of the display panel DP and a part of the folded area DP-FA, and the second lower plate LPT2 can be disposed to overlap with a second non-folded area DP-NFA2 of the display panel DP and another part of the folded area DP-FA.

[0159] The first lower plate LPT1 and the second lower plate LPT2 may be spaced apart from each other. However, the first lower plate LPT1 and the second lower plate LPT2 may be positioned as close to each other as possible and may support the region of the support plate SPT in which the opening OP is formed. In an embodiment, for example, the first lower plate LPT1 and the second lower plate LPT2 may prevent the region of the support plate SPT in which the opening OP is defined from deforming due to pressure applied from above. A detailed description of the lower plate LPT will be given below.

[0160] The seventh adhesive layer 70 may be disposed between the support plate SPT and the lower plate LPT and may couple the support plate SPT and the lower plate LPT. The seventh adhesive layer 70 may include a first portion 70-1 disposed between the support plate SPT and the first lower plate LPT1 and a second portion 70-2 disposed between the support plate SPT and the second lower plate LPT2.

[0161] In an embodiment, a functional layer may be additionally disposed below the lower plate LPT. The functional layer may include a heat dissipation layer, an insulating layer, and the like.

[0162] Figure 10A is a cross-sectional view of a support plate according to an embodiment of the present disclosure. Figure 10B is a cross-sectional view showing a part of a method of manufacturing a support plate according to an embodiment of the present disclosure. Figures 11A to 11C is Figure 10A an enlarged cross-sectional view of the region BB'.

[0163] Referring to Figure 10A , in the present embodiment, the support plate SPT may include a porous substrate PRS. The porous substrate PRS may include a base material BM, a first porous membrane PL1, and a second porous membrane PL2. The first porous membrane PL1 and the second porous membrane PL2 may be spaced apart from each other in the thickness direction (i.e., the third direction DR3) with the base material BM interposed therebetween.

[0164] The base material BM may include a metal. That is, the base material BM may be a metal substrate. In an embodiment, for example, the base material BM may include one of aluminum, magnesium, and titanium. However, without being limited thereto, the base material BM may include a material capable of undergoing anodic oxidation (or anodization) or plasma electrolytic oxidation (“PEO”) described below. In an embodiment, the base material BM may include a light metal.

[0165] The first porous membrane PL1 may be formed on the front surface F-BM of the base material BM. The first porous membrane PL1 may include a metal oxide. The metal oxide included in the first porous membrane PL1 may be an oxide of the metal included in the base material BM. The first porous membrane PL1 may be an oxide film formed on the front surface F-BM of the base material BM. The first porous membrane PL1 may be referred to as the “first oxide film”. In an embodiment, for example, the first porous membrane PL1 may be an alumina film, a magnesia film, or a titania film.

[0166] The second porous film PL2 can be formed on the rear surface B-BM of the substrate BM. The second porous film PL2 may include a metal oxide. The metal oxide included in the second porous film PL2 may be an oxide of the metal included in the substrate BM. The second porous film PL2 may be an oxide film formed on the rear surface B-BM of the substrate BM. The second porous film PL2 may be referred to as the "second oxide film". In an embodiment, for example, the second porous film PL2 may be an alumina film, a magnesia film, or a titania film.

[0167] In the present embodiment, the first porous film PL1 and the second porous film PL2 can be formed by anodizing the substrate BM.

[0168] Figure 10B is a schematic diagram showing the process of anodizing the working substrate BM-W. In Figure 10B the anodizing apparatus PD is briefly shown.

[0169] Referring to Figure 10B , the working substrate BM-W can be a metal substrate provided for forming the porous films PL1 and PL2 (refer to Figure 10A ). The anodizing apparatus PD may include a power supply PWS for applying a voltage, an electrolytic cell ELZ filled with an electrolyte ELT, a cooling device CLS for maintaining the temperature of the electrolyte ELT, and a bubble generator ARB for minimizing the concentration difference in the electrolyte ELT and supplementing the oxygen ions consumed during the electrolytic oxidation. During the anodizing process, the power supply PWS may apply a voltage of 15V to 50V.

[0170] The working substrate BM-W may be connected to the positive electrode of the power supply PWS, and the auxiliary electrode AXE may be connected to the negative electrode of the power supply PWS. The working substrate BM-W and the auxiliary electrode AXE may be immersed in the electrolyte ELT. When electrolysis is performed in this state, the surface of the working substrate BM-W can be oxidized by the oxygen (O2) generated at the positive electrode, and an oxide film can be formed on the working substrate BM-W. The oxide film formed on the working substrate BM-W may correspond to Figure 10A the first porous film PL1 and the second porous film PL2.

[0171] Referring again to Figure 10A , in the present embodiment, the opening OP defined in the support plate SPT (refer to Figure 6 ) may correspond to the opening OP1 defined in the porous substrate PRS. Each of the substrate BM, the first porous film PL1, and the second porous film PL2 may have in the display panel DP (refer to Figure 6A through-opening defined therein in the thickness direction. The opening OPb of the first porous film PL1, the opening OPa of the base material BM, and the opening OPc of the second porous film PL2 can be aligned in the third direction DR3 to form an opening OP1 defined in the porous substrate PRS.

[0172] In an embodiment, the opening OP1 of the porous substrate PRS can be formed by a photolithography process. A photoresist or a dry film resist (“DFR”) can be used in the photolithography process for forming the opening OP1 of the porous substrate PRS.

[0173] Referring to Figures 10A to 11B , pores can be included in each of the first porous film PL1 and the second porous film PL2.

[0174] The pores defined in the first porous film PL1 (hereinafter referred to as the first pores PR1) can be formed by removing a portion of the first porous film PL1 in the thickness direction (i.e., the third direction DR3). The first pores PR1 can be formed in a shape similar to a column shape.

[0175] The pores defined in the second porous film PL2 (hereinafter referred to as the second pores PR2) can be formed by removing a portion of the second porous film PL2 in the thickness direction (i.e., the third direction DR3). The second pores PR2 can be formed in a shape similar to a column shape.

[0176] In an embodiment, as Figure 11A shown, in a cross-sectional view, the first pores PR1 and the second pores PR2 can extend in a corrugated shape in the thickness direction. However, the present disclosure is not limited thereto. As Figure 11B shown, in another embodiment of the present disclosure, in a cross-sectional view, the first pores PR1 and the second pores PR2 can extend in a straight line in the thickness direction.

[0177] According to the present embodiment, when an external impact is applied toward the display device DD (refer to Figure 4 ), empty spaces that can be squeezed can be provided through the pores PR1 and PR2 in the porous films PL1 and PL2. Therefore, the time of applying the impact can be increased, and the amount of impact applied to the display device DD (refer to Figure 4 ) can be reduced. Therefore, the impact resistance of the support plate SPT against external impacts can be improved, and damage to the display device DD (refer to Figure 4 ) due to external impacts can be effectively reduced or prevented.

[0178] According to the present embodiment, the porous films PL1 and PL2 can be arranged not only on the front surface F-BM of the base material BM, but also on the back surface B-BM. Therefore, the support plate SPT can easily return from the state in which the first porous film PL1 and the second porous film PL2 are squeezed by an external impact to its original state. That is, the elastic restoring force of the support plate SPT can be improved, and accordingly, the deformation of the display device DD (refer to Figure 4 ) can be effectively reduced or prevented.

[0179] According to the present embodiment, the porous substrate PRS can include a base material BM of metal and porous films PL1 and PL2 formed on the front surface F-BM and the back surface B-BM of the base material BM of metal, respectively. Therefore, the support plate SPT can have a high shear stress through the base material BM of metal and can have improved impact resistance through the porous films PL1 and PL2. When applying a metal plate to the support plate, it is desired to control the shear stress and the impact resistance by changing the basic physical properties, dimensions, specific gravity, and / or thickness of the metal material included in the metal plate. However, there is a trade-off between the shear stress and the impact resistance of the metal material, and thus it is difficult to improve both the shear stress and the impact resistance. In contrast, in the present embodiment, the porous films PL1 and PL2 can be formed by anodizing the base material BM of metal. Therefore, the support plate SPT can have a high shear stress and improved impact resistance. Therefore, the reliability of the support plate SPT can be effectively improved. In addition, according to the present embodiment, the base material BM of metal can include a light metal. Therefore, the support plate SPT can be made lightweight.

[0180] Refer to Figure 11C , in the present embodiment, the support plate SPT can include a porous substrate PRS, a first sealant SM1, and a second sealant SM2. That is, when compared with the support plate SPT in the embodiment described with reference to Figure 11A , the support plate SPT can further include a first sealant SM1 and a second sealant SM2.

[0181] The first sealant SM1 can fill the first pores PR1 in the first porous film PL1. That is, the first sealant SM1 can be arranged in the first pores PR1. The second sealant SM2 can fill the second pores PR2 in the second porous film PL2. That is, the second sealant SM2 can be arranged in the second pores PR2.

[0182] In an embodiment, each of the first sealant SM1 and the second sealant SM2 may include a colorant. In an embodiment, for example, the colorant may include an organic pigment, an inorganic pigment, or an organic dye. Each of the first sealant SM1 and the second sealant SM2 may have a color. In an embodiment, for example, the first sealant SM1 and the second sealant SM2 may be black. Thus, light incident from outside the electronic device ED (refer to Figure 4 ) can be prevented from being reflected, and thus when the electronic device ED (refer to Figure 4 ) is viewed from above the window module WM (refer to Figure 4 ), the support plate SPT and the components arranged below the support plate SPT may be invisible to the user.

[0183] In an embodiment, each of the first sealant SM1 and the second sealant SM2 may include an elastic material. In an embodiment, for example, each of the first sealant SM1 and the second sealant SM2 may include a silicone-based elastic material. Alternatively, each of the first sealant SM1 and the second sealant SM2 may include thermoplastic polyurethane (TPU). Each of the first sealant SM1 and the second sealant SM2 may include a gel-type material. By filling the elastic material in the pores PR1 and PR2, the impact resistance and elastic resilience of the support plate SPT can be further improved.

[0184] Figure 12A is a cross-sectional view of a support plate according to another embodiment of the present disclosure. Figure 12B is a cross-sectional view showing a part of a method of manufacturing a support plate according to an embodiment of the present disclosure. Figure 12A is a cross-sectional view showing a part of a method of manufacturing a support plate according to an embodiment of the present disclosure. Figures 13A to 13C is Figure 12A an enlarged cross-sectional view of the region CC' of

[0185] Refer to Figure 12A , in the present embodiment, the support plate SPT-1 may include a porous substrate PRS-1. The porous substrate PRS-1 according to the present embodiment may include a base material BM, a first porous membrane PL1, a second porous membrane PL2, a third porous membrane PL3, and a fourth porous membrane PL4.

[0186] The first porous membrane PL1 and the third porous membrane PL3 may be arranged on the base material BM, and the second porous membrane PL2 and the fourth porous membrane PL4 may be arranged below the base material BM. The third porous membrane PL3 may be arranged between the base material BM and the first porous membrane PL1, and the fourth porous membrane PL4 may be arranged between the base material BM and the second porous membrane PL2.

[0187] After the first porous film PL1 and the second porous film PL2 are respectively formed on the front surface F-BM and the back surface B-BM of the substrate BM, a third porous film PL3 can be formed at the interface between the substrate BM and the first porous film PL1, and a fourth porous film PL4 can be formed at the interface between the substrate BM and the second porous film PL2. Therefore, a porous substrate PRS-1 including the substrate BM and the first porous film PL1 to the fourth porous film PL4 can be formed.

[0188] The third porous film PL3 may include a metal oxide. The metal oxide included in the third porous film PL3 may be an oxide of the metal included in the substrate BM. The third porous film PL3 may be an oxide film formed at the interface between the substrate BM and the first porous film PL1. The third porous film PL3 may be referred to as the "third oxide film".

[0189] The fourth porous film PL4 may include a metal oxide. The metal oxide included in the fourth porous film PL4 may be an oxide of the metal included in the substrate BM. The fourth porous film PL4 may be an oxide film formed at the interface between the substrate BM and the second porous film PL2. The fourth porous film PL4 may be referred to as the "fourth oxide film".

[0190] In the present embodiment, the first porous film PL1 to the fourth porous film PL4 can be formed by performing a plasma electrolytic oxidation (PEO) process on the substrate BM.

[0191] Figure 12B is a schematic diagram showing a process of subjecting the working substrate BM-Wa to plasma electrolytic oxidation. In Figure 12B a plasma electrolytic oxidation apparatus PDa is briefly shown.

[0192] Referring to Figure 12B , the working substrate BM-Wa may be a metal substrate provided for forming the porous films PL1 to PL4 (refer to Figure 12A ). The plasma electrolytic oxidation apparatus PDa may include a power supply PWSa for applying a voltage, an electrolytic cell ELZa filled with an electrolyte ELTa, a cooling device CLSa for maintaining the temperature of the electrolyte ELTa, and a bubble generator ARBa for minimizing the concentration difference in the electrolyte ELTa and supplementing the oxygen ions consumed during electrolytic oxidation. During the plasma electrolytic oxidation process, the power supply PWSa may apply a voltage of 350V to 550V. When performing the plasma electrolytic oxidation process, a voltage higher than that when performing the anodic oxidation process can be provided.

[0193] The working substrate BM-Wa can be connected to the positive electrode of the power supply PWSa, and the auxiliary electrode AXEa can be connected to the negative electrode of the power supply PWSa. The working substrate BM-Wa and the auxiliary electrode AXEa can be immersed in the electrolyte ELTa. When electrolysis is performed in this state, the surface of the working substrate BM-Wa can be oxidized by oxygen (O2) generated at the positive electrode, and an oxide film can be formed on the working substrate BM-Wa. At this time, a locally formed strong current field can generate plasma PLS (or arc or spark) from oxygen (O2) reacting inside the formed oxide film, and the instantaneously formed oxides can be welded accordingly. When compared with the previously formed oxide film, the oxide film formed by the welding of the instantaneously formed oxides can have high-density characteristics. The previously formed oxide film can correspond to the first porous film PL1 and the second porous film PL2 (refer to Figure 12A ), and the oxide film formed by the welding of the instantaneously formed oxides can correspond to the third porous film PL3 and the fourth porous film PL4 (refer to Figure 12A ).

[0194] Referring again to Figure 12A , in the present embodiment, the opening OP defined in the support plate SPT-1 (refer to Figure 6 ) can correspond to the opening OP1-1 defined in the porous substrate PRS-1. Each of the substrate BM and the first to fourth porous films PL1 to PL4 can have a through-opening defined therein in the thickness direction. The opening OPb of the first porous film PL1, the opening OPd of the third porous film PL3, the opening OPa of the substrate BM, the opening OPe of the fourth porous film PL4, and the opening OPc of the second porous film PL2 can be aligned in the third direction DR3 to form the opening OP1-1 defined in the porous substrate PRS-1.

[0195] In the embodiment, the opening OP1-1 of the porous substrate PRS-1 can be formed by a photolithography process. A photoresist or a dry film resist (DFR) can be used in the photolithography process for forming the opening OP1-1 of the porous substrate PRS-1.

[0196] Referring to Figures 12A to 13B , pores can be included in each of the first to fourth porous films PL1 to PL4. The description given above with reference to Figure 11A can be similarly applied to the pores formed in the first porous film PL1 (i.e., the first pores PR1) and the pores formed in the second porous film PL2 (i.e., the second pores PR2).

[0197] The pores defined in the third porous membrane PL3 (hereinafter referred to as the third pores PR3) can be formed by removing a portion of the third porous membrane PL3 in the thickness direction (i.e., the third direction DR3). The third pores PR3 can be formed in a shape similar to a column shape.

[0198] The pores defined in the fourth porous membrane PL4 (hereinafter referred to as the fourth pores PR4) can be formed by removing a portion of the fourth porous membrane PL4 in the thickness direction (i.e., the third direction DR3). The fourth pores PR4 can be formed in a shape similar to a column shape.

[0199] The third pores PR3 in the third porous membrane PL3 can be smaller than the first pores PR1 in the first porous membrane PL1. In an embodiment, for example, in a sectional view, the width of the third pores PR3 in the second direction DR2 can be smaller than the width of the first pores PR1 in the second direction DR2. The third pores PR3 can have a volume smaller than the volume of the first pores PR1. The porosity of the third porous membrane PL3 can be lower than the porosity of the first porous membrane PL1. The density of the third porous membrane PL3 can be higher than the density of the first porous membrane PL1. The first porous membrane PL1 can be referred to as the first low-density membrane, and the third porous membrane PL3 can be referred to as the first high-density membrane. The hardness of the third porous membrane PL3 can be higher than the hardness of the first porous membrane PL1.

[0200] The fourth pores PR4 in the fourth porous membrane PL4 can be smaller than the second pores PR2 in the second porous membrane PL2. In an embodiment, for example, in a sectional view, the width of the fourth pores PR4 in the second direction DR2 can be smaller than the width of the second pores PR2 in the second direction DR2. The fourth pores PR4 can have a volume smaller than the volume of the second pores PR2. The porosity of the fourth porous membrane PL4 can be lower than the porosity of the second porous membrane PL2. The density of the fourth porous membrane PL4 can be higher than the density of the second porous membrane PL2. The second porous membrane PL2 can be referred to as the second low-density membrane, and the fourth porous membrane PL4 can be referred to as the second high-density membrane. The hardness of the fourth porous membrane PL4 can be higher than the hardness of the second porous membrane PL2.

[0201] In an embodiment, as Figure 13A shown, in a sectional view, the first pores PR1 to the fourth pores PR4 can extend in a corrugated shape in the thickness direction. However, the embodiments of the present disclosure are not limited thereto. As Figure 13B shown, in another embodiment of the present disclosure, in a sectional view, the first pores PR1 to the fourth pores PR4 can extend linearly in the thickness direction.

[0202] According to the present embodiment, a porous substrate PRS-1 including high-density films PL3 and PL4 located between a substrate BM and low-density films PL1 and PL2 can be provided by plasma electrolytic oxidation. The high-density films PL3 and PL4 can improve the adhesion between the substrate BM and the low-density films PL1 and PL2. The high-density films PL3 and PL4 can provide a film with relatively high hardness between the substrate BM and the low-density films PL1 and PL2, while providing a space for impact dispersion between the substrate BM and the low-density films PL1 and PL2, thereby reducing or preventing damage to the porous films PL1 to PL4 due to external impact.

[0203] Referring to Figure 13C , in the present embodiment, the support plate SPT-1 can include a porous substrate PRS-1, a first sealant SM1-1, and a second sealant SM2-1. That is, when compared with the support plate SPT-1 in the embodiment described with reference to Figure 13A , the support plate SPT-1 can further include a first sealant SM1-1 and a second sealant SM2-1. The descriptions given above with reference to Figure 11C can be similarly applied to the first sealant SM1-1 and the second sealant SM2-1, and the following description will focus on the differences.

[0204] The first sealant SM1-1 can fill the first pores PR1 in the first porous film PL1. That is, the first sealant SM1-1 can be disposed in the first pores PR1. In an embodiment, some of the third pores PR3 can be connected to the adjacent first pores PR1, and some of the first sealant SM1-1 can fill the third pores PR3 connected to the first pores PR1. In this specification, the mutually connected first pores PR1 and third pores PR3 can refer to pores provided as an integral space.

[0205] The second sealant SM2-1 can fill the second pores PR2 in the second porous film PL2. That is, the second sealant SM2-1 can be disposed in the second pores PR2. In an embodiment, some of the fourth pores PR4 can be connected to the adjacent second pores PR2, and some of the second sealant SM2-1 can fill the fourth pores PR4 connected to the second pores PR2. In this specification, the mutually connected second pores PR2 and fourth pores PR4 can refer to pores provided as an integral space.

[0206] Figure 14 is a cross-sectional view of a support plate according to another embodiment of the present disclosure. Components that are the same as or similar to the components described with reference to Figures 1 to 13C will be assigned the same or similar reference numerals, and repeated descriptions will be omitted.

[0207] Referring to Figure 14, in the present embodiment, the support plate SPT-2 may include a porous substrate PRS, a first cover substrate CPT1, and a second cover substrate CPT2. When compared with those in the embodiments described with reference to Figure 10A and Figure 12A , the support plate SPT-2 may further include a first cover substrate CPT1 and a second cover substrate CPT2. The first cover substrate CPT1 and the second cover substrate CPT2 may be spaced apart from each other in the thickness direction (i.e., the third direction DR3) with the porous substrate PRS therebetween.

[0208] In Figure 14 , the porous substrate PRS is briefly shown. The description given above with reference to Figures 10A to 11B may be applicable to the porous substrate PRS. The porous substrate PRS may include a base material BM, a first porous film PL1, and a second porous film PL2. Alternatively, the description given above with reference to Figures 12A to 13B may be applicable to the porous substrate PRS. The porous substrate PRS may include a base material BM and first to fourth porous films PL1 to PL4.

[0209] The first cover substrate CPT1 may be disposed on the porous substrate PRS. The first cover substrate CPT1 may be directly disposed on the front surface F-PRS of the porous substrate PRS. The second cover substrate CPT2 may be disposed under the porous substrate PRS. The second cover substrate CPT2 may be directly disposed on the back surface B-PRS of the porous substrate PRS. In an embodiment, the first cover substrate CPT1 and the second cover substrate CPT2 may be directly disposed on the porous substrate PRS by a cladding process.

[0210] Each of the first cover substrate CPT1 and the second cover substrate CPT2 may include a first support portion SA1, a second support portion SA2, and a third support portion SA3. The first support portion SA1, the second support portion SA2, and the third support portion SA3 of each of the first cover substrate CPT1 and the second cover substrate CPT2 may correspond to the first support portion SA1, the second support portion SA2, and the third support portion SA3 of the support plate SPT-2.

[0211] The first covering substrate CPT1 may define an opening OP2 in the third support portion SA3. The opening OP2 of the first covering substrate CPT1 may be defined to penetrate the first covering substrate CPT1 in the thickness direction (i.e., the third direction DR3). The second covering substrate CPT2 may define an opening OP3 in the third support portion SA3. The opening OP3 of the second covering substrate CPT2 may be defined to penetrate the second covering substrate CPT2 in the thickness direction (i.e., the third direction DR3). The opening OP2 of the first covering substrate CPT1, the opening OP1 of the porous substrate PRS, and the opening OP3 of the second covering substrate CPT2 may be aligned in the third direction DR3 to form an opening OP-2 defined in the support plate SPT-2.

[0212] Each of the first covering substrate CPT1 and the second covering substrate CPT2 may include a metal. Each of the first covering substrate CPT1 and the second covering substrate CPT2 may be a metal substrate. In an embodiment, the metal included in each of the first covering substrate CPT1 and the second covering substrate CPT2 may include stainless steel (SUS). The covering substrates CPT1 and CPT2 may be disposed on a porous membrane in which pores are defined, and thus damage to the porous membrane may be reduced or prevented. Accordingly, the reliability of the support plate SPT-2 may be effectively improved.

[0213] Figure 15 is a cross-sectional view of a support plate according to another embodiment of the present disclosure. Components that are the same as or similar to the components described with reference to Figures 1 to 14 will be assigned the same or similar reference numerals, and repeated descriptions will be omitted.

[0214] Referring to Figure 15 , in the present embodiment, the support plate SPT-3 may include a porous substrate PRS, a first covering substrate CPT1, a second covering substrate CPT2, a first adhesive support layer SAL1, and a second adhesive support layer SAL2. That is, when compared with the support plate SPT-2 in the embodiment described with reference to Figure 14 , the support plate SPT-3 may further include a first adhesive support layer SAL1 and a second adhesive support layer SAL2.

[0215] The first adhesive support layer SAL1 may be disposed between the porous substrate PRS and the first covering substrate CPT1. The first adhesive support layer SAL1 may couple the porous substrate PRS and the first covering substrate CPT1. The second adhesive support layer SAL2 may be disposed between the porous substrate PRS and the second covering substrate CPT2. The second adhesive support layer SAL2 may couple the porous substrate PRS and the second covering substrate CPT2.

[0216] Each of the first adhesive support layer SAL1 and the second adhesive support layer SAL2 may include a transparent adhesive, such as a pressure-sensitive adhesive (PSA) or an optically clear adhesive (OCA), but is not limited thereto. For another example, each of the first adhesive support layer SAL1 and the second adhesive support layer SAL2 may include thermoplastic polyurethane (TPU).

[0217] The opening OP2 of the first cover substrate CPT1, the opening OP4 of the first adhesive support layer SAL1, the opening OP1 of the porous substrate PRS, the opening OP5 of the second adhesive support layer SAL2, and the opening OP3 of the second cover substrate CPT2 may be aligned in the third direction DR3 to form an opening OP-3 defined in the support plate SPT-3.

[0218] According to the present embodiment, the porous substrate PRS and the cover substrates CPT1 and CPT2 may be attached through the adhesive support layers SAL1 and SAL2, and the bonding force between the porous substrate PRS and the cover substrates CPT1 and CPT2 may be improved. Therefore, even when the folding and unfolding operations of the electronic device ED (refer to Figure 1 ) are repeated, the connection state between the porous substrate PRS and the cover substrates CPT1 and CPT2 may be stably maintained, and damage or deformation of the support plate SPT-3 may be reduced or prevented. Therefore, the reliability of the support plate SPT-3 may be effectively improved.

[0219] Figure 16 is a cross-sectional view of a support plate according to another embodiment of the present disclosure. Components that are the same as or similar to the components described with reference to Figures 1 to 15 will be assigned the same or similar reference numerals, and repeated descriptions will be omitted.

[0220] Referring to Figure 16 , in the present embodiment, the support plate SPT-4 may include a porous substrate PRSa. The descriptions given above with reference to Figures 10A to 11C may be applicable to the porous substrate PRSa, and the porous substrate PRSa may include a base material BM (refer to Figures 10A to 11C ) and a first porous film PL1 and a second porous film PL2 (refer to Figures 10A to 11C ). Alternatively, the descriptions given above with reference to Figures 12A to 13C may be applicable to the porous substrate PRSa, and the porous substrate PRSa may include a base material BM (refer to Figures 12A to 13C ) and a first porous film PL1 to a fourth porous film PL4 (refer to Figures 12A to 13C ).

[0221] The third support portion SA3 of the porous substrate PRSa may define a groove GR therein. In the third support portion SA3, the groove GR may be defined on the rear surface B-PRSa of the porous substrate PRSa. In the third support portion SA3, the groove GR may be defined by removing a portion of the porous substrate PRSa from the rear surface B-PRSa of the porous substrate PRSa in the thickness direction. In an embodiment, for example, the groove GR may be defined by removing the portion of the porous substrate PRSa from the rear surface B-PRSa of the porous substrate PRSa to the midpoint located between the front surface F-PRSa and the rear surface B-PRSa.

[0222] In an embodiment, when the porous substrate PRSa includes the base material BM and the first porous film PL1 and the second porous film PL2 as described above with reference to Figure 10A the groove GR may penetrate the second porous film PL2 and may be formed by removing a portion of the base material BM. Alternatively, in an embodiment, when the porous substrate PRSa includes the base material BM and the first porous film PL1 to the fourth porous film PL4 as described above with reference to Figure 12A the groove GR may penetrate the second porous film PL2 and the fourth porous film PL4 and may be formed by removing a portion of the base material BM.

[0223] The grooves GR may be arranged in a grid pattern in a plan view. The arrangement of the grooves GR in the plan view may be similar to Figure 9 the arrangement of the openings OP in the plan view (i.e., the grid pattern).

[0224] When the electronic device ED (refer to Figure 1 ) is folded in an in-folded manner, compressive stress may be dominant in the portion of the porous substrate PRSa adjacent to the front surface F-PRSa, while tensile stress may be dominant in the portion of the porous substrate PRSa adjacent to the rear surface B-PRSa. According to the present embodiment, the grooves GR are not arranged in the region where compressive stress is dominant, and thus, cracks in the porous substrate PRSa due to compressive stress can be minimized during the process of folding the porous substrate PRSa therein. Therefore, the reliability of the support plate SPT-4 can be effectively improved.

[0225] Figure 17 is a cross-sectional view of a support plate according to another embodiment of the present disclosure. Components that are the same as or similar to the components described with reference to Figures 1 to 15 will be assigned the same or similar reference numerals, and repeated descriptions will be omitted.

[0226] In Figure 17 for convenience of description, the display module DM (refer to Figure 6The regions corresponding to the first non-folded region NFA1, the second non-folded region NFA2, and the folded region FA of ().

[0227] Referring to Figure 17 , in the present embodiment, the support plate SPT-5 may include a porous substrate PRSb and a filling member FM.

[0228] The porous substrate PRSb may include a plurality of porous substrates. The plurality of porous substrates PRSb may include a first plate PT1 overlapping with the first non-folded region NFA1 and a second plate PT2 overlapping with the second non-folded region NFA2. The first plate PT1 and the second plate PT2 may be spaced apart from each other. That is, in the present embodiment, the porous substrate PRSb may not be disposed in the region overlapping with the folded region FA of the display module DM (referring to Figure 6 ).

[0229] The filling member FM may be disposed between the first plate PT1 and the second plate PT2. The filling member FM may overlap with the folded region FA.

[0230] In the present embodiment, the first support portion SA1 of the support plate SPT-5 (referring to Figure 6 ) may correspond to the portion where the first plate PT1 is disposed, the second support portion SA2 of the support plate SPT-5 (referring to Figure 6 ) may correspond to the portion where the second plate PT2 is disposed, and the third support portion SA3 of the support plate SPT-5 (referring to Figure 6 ) may correspond to the portion where the filling member FM is disposed.

[0231] In the present embodiment, the filling member FM may include an elastic material. In an embodiment, for example, the filling member FM may include a silicone-based elastic material. Alternatively, the filling member FM may include thermoplastic polyurethane (TPU). The filling member FM may include a gel-type material.

[0232] According to the present embodiment, the filling member FM may be disposed in the portion overlapping with the folded region FA, and thus the porous substrate PRSb may not include openings or grooves. Therefore, the process of forming openings or grooves in the support plate SPT-5 may be omitted. Therefore, the manufacturing process may be simplified, and the manufacturing cost may be reduced. In addition, when selecting the material of the support plate SPT-5, it is not necessary to consider whether openings or grooves can be formed (for example, whether patterning can be performed by a lithography process), and thus the degree of freedom in material selection may be increased.

[0233] Since the support plate SPT-5 according to the present embodiment does not define openings therein, a cover layer CVL (referring to Figure 6 ) attached to the support plate SPT-5 to prevent the penetration of foreign substances may be omitted.

[0234] AlthoughFigure 17 An example is shown where the support plate SPT-5 includes only the porous substrate PRSb and the filling member FM, but the present disclosure is not limited thereto. In another embodiment, the first cover substrate CPT1 and the second cover substrate CPT2 described above with reference to Figure 14 can additionally be attached to the first plate PT1 and the second plate PT2 of the support plate SPT-5. Alternatively, the first cover substrate CPT1 and the second cover substrate CPT2 can be coupled to the first plate PT1 and the second plate PT2 through the first adhesive support layer SAL1 and the second adhesive support layer SAL2 described above with reference to Figure 15 .

[0235] Figure 18A is a cross-sectional view of a support plate according to another embodiment of the present disclosure. Figure 18B is Figure 18A an enlarged cross-sectional view of the region DD' of Figures 1 to 15 . Components that are the same as or similar to the components described with reference to

[0236] will be assigned the same or similar reference numerals, and repeated descriptions will be omitted. Figure 18A and Figure 18B , in the present embodiment, the support plate SPT-6 can include a porous substrate PRSc, a first sealing layer SLL1, and a second sealing layer SLL2. The first sealing layer SLL1 and the second sealing layer SLL2 can be spaced apart from each other in the thickness direction (i.e., the third direction DR3) across the porous substrate PRSc.

[0237] The first sealing layer SLL1 can be disposed on the porous substrate PRSc. As shown in Figure 18B , the first sealing layer SLL1 can be attached to the first porous membrane PL1 inside the porous substrate PRSc. The first sealing layer SLL1 can cover the first porous membrane PL1. The first sealing layer SLL1 can fill the first pores PR1 of the first porous membrane PL1 and can cover the first porous membrane PL1.

[0238] The second sealing layer SLL2 can be disposed under the porous substrate PRSc. As shown in Figure 18B , the second sealing layer SLL2 can be attached to the second porous membrane PL2 inside the porous substrate PRSc. The second sealing layer SLL2 can cover the second porous membrane PL2. The second sealing layer SLL2 can fill the second pores PR2 of the second porous membrane PL2 and can cover the second porous membrane PL2.

[0239] Although Figure 18B shows an embodiment in which the porous substrate PRSc includes a base material BM and the first porous membrane PL1 and the second porous membrane PL2, the porous substrate PRSc can include as described above with reference to Figure 12AThe described base material BM and the first to fourth porous membranes PL1 to PL4. In this case, the first sealing layer SLL1 may fill some of those exposed from the first porous membrane PL1 in the third pore PR3 (refer to Figure 13A ), and the second sealing layer SLL2 may fill some of those exposed from the second porous membrane PL2 in the fourth pore PR4 (refer to Figure 13A ).

[0240] According to the present embodiment, the first sealing layer SLL1 and the second sealing layer SLL2 may be attached to the porous substrate PRSc. When the support plate SPT-6 is folded in an inward folding manner, the first sealing layer SLL1 may prevent damage to the part where compressive stress is dominant, while the second sealing layer SLL2 may prevent damage to the part where tensile stress is dominant. Therefore, no opening or groove may be defined in the part of the porous substrate PRSc that overlaps with the folding area FA. The third support portion SA3 may overlap with the entire folding area FA. Therefore, the process of forming an opening or groove in the support plate SPT-6 may be omitted. As a result, the manufacturing process may be simplified, the manufacturing cost may be reduced, and the degree of freedom in material selection may be increased.

[0241] Furthermore, since no opening is defined in the support plate SPT-6, the cover layer CVL (refer to Figure 6 ) attached to the support plate SPT-6 to prevent the penetration of foreign matters may be omitted.

[0242] Figure 19A And Figure 19B are cross-sectional views showing a part of the lower plate according to an embodiment of the present disclosure. Figure 20A And Figure 20B are cross-sectional views showing a part of the lower plate according to an embodiment of the present disclosure. In Figures 19A to 20B , only the first lower plates LPT1, LPT1-1, LPT1-2, and LPT1-3 are shown as examples. The following description of the first lower plates LPT1, LPT1-1, LPT1-2, and LPT1-3 given with reference to Figures 19A to 20B may be equally applicable to the second lower plate LPT2 (refer to Figure 6 ). Components that are the same as or similar to the components described with reference to Figures 1 to 15 will be assigned the same or similar reference numerals, and repeated descriptions will be omitted.

[0243] Referring to Figure 19A , in the present embodiment, the first lower plate LPT1 may include a lower porous substrate LPRS. The lower porous substrate LPRS may include a lower base material LBM, a fifth porous membrane PL5, and a sixth porous membrane PL6. The fifth porous membrane PL5 and the sixth porous membrane PL6 may be spaced apart from each other in the thickness direction (i.e., the third direction DR3) with the lower base material LBM therebetween.

[0244] The lower substrate LBM can be a metal substrate. The fifth porous film PL5 can be an oxide film formed on the front surface F-LBM of the lower substrate LBM, and the sixth porous film PL6 can be an oxide film formed on the rear surface B-LBM of the lower substrate LBM. In the present embodiment, the description of the substrate BM given above with reference to Figures 10A to 11C can be similarly applied to the lower substrate LBM, and the description of the first porous film PL1 and the second porous film PL2 given above with reference to Figures 10A to 11C can be similarly applied to the fifth porous film PL5 and the sixth porous film PL6. That is, the fifth porous film PL5 and the sixth porous film PL6 can be formed by anodizing the lower substrate LBM. Each of the fifth porous film PL5 and the sixth porous film PL6 can define pores therein.

[0245] According to the present embodiment, the impact resistance of the lower plate LPT (refer to Figure 6 ) against external impacts can be improved, and damage to the display device DD (refer to Figure 6 ) due to external impacts can be reduced or prevented. The elastic recovery force of the lower plate LPT (refer to Figure 6 ) can be improved, and deformation of the display device DD (refer to Figure 6 ) can be correspondingly reduced or prevented. The lower plate LPT (refer to Figure 6 ) can have high shear stress and improved impact resistance, and the reliability of the lower plate LPT (refer to Figure 6 ) can be effectively improved. In addition, the lower substrate LBM can include light metal. Therefore, the lower plate LPT (refer to Figure 6 ) can be made lightweight.

[0246] In an embodiment, the first lower plate LPT1 may further include a sealant filling the pores in the fifth porous film PL5 and a sealant filling the pores in the sixth porous film PL6. In an embodiment of the present disclosure, the first lower plate LPT1 may further include a sealing layer filling the pores in the fifth porous film PL5 and covering the fifth porous film PL5 and a sealing layer filling the pores in the sixth porous film PL6 and covering the sixth porous film PL6.

[0247] Referring to Figure 19B , in the present embodiment, the first lower plate LPT1-1 may include a lower porous substrate LPRS-1. The lower porous substrate LPRS-1 may include a lower substrate LBM, a fifth porous film PL5, a sixth porous film PL6, a seventh porous film PL7, and an eighth porous film PL8.

[0248] The fifth porous film PL5 and the seventh porous film PL7 may be disposed on the lower substrate LBM, and the sixth porous film PL6 and the eighth porous film PL8 may be disposed below the lower substrate LBM. The seventh porous film PL7 may be disposed between the lower substrate LBM and the fifth porous film PL5, and the eighth porous film PL8 may be disposed between the lower substrate LBM and the sixth porous film PL6.

[0249] In the present embodiment, the description of the substrate BM given above with reference to Figures 12A to 13C may be similarly applicable to the lower substrate LBM, and the description of the first porous film PL1 to the fourth porous film PL4 given above with reference to Figures 12A to 13C may be similarly applicable to the fifth porous film PL5 to the eighth porous film PL8. That is, the fifth porous film PL5 to the eighth porous film PL8 may be formed by plasma electrolytic oxidation of the lower substrate LBM. Each of the fifth porous film PL5 to the eighth porous film PL8 may define pores therein. The seventh porous film PL7 and the eighth porous film PL8 may respectively have a lower porosity, a higher density, and a higher hardness than the fifth porous film PL5 and the sixth porous film PL6. The fifth porous film PL5 and the sixth porous film PL6 may be referred to as low-density films, and the seventh porous film PL7 and the eighth porous film PL8 may be referred to as high-density films.

[0250] According to the present embodiment, the lower porous substrate LPRS-1 may include the high-density films PL7 and PL8, and thus the adhesion between the lower substrate LBM and the low-density films PL5 and PL6 may be effectively improved. The high-density films PL7 and PL8 may provide a film having a relatively high hardness between the lower substrate LBM and the low-density films PL5 and PL6, while providing a space for impact dispersion between the lower substrate LBM and the low-density films PL5 and PL6, thereby reducing or preventing damage to the porous films PL5 to PL8 due to external impact.

[0251] In an embodiment of the present disclosure, the first lower plate LPT1-1 may further include a sealant filling the pores in the fifth porous film PL5 and a sealant filling the pores in the sixth porous film PL6.

[0252] Referring to Figure 20A , in the present embodiment, the first lower plate LPT1-2 may include a lower porous substrate LPRS, a third cover substrate CPT3, and a fourth cover substrate CPT4. When compared with those in the embodiments described with reference to Figure 19A and Figure 19B , the first lower plate LPT1-2 may further include a third cover substrate CPT3 and a fourth cover substrate CPT4. The third cover substrate CPT3 and the fourth cover substrate CPT4 may be spaced apart from each other in the thickness direction (i.e., the third direction DR3) with the lower porous substrate LPRS therebetween.

[0253] In Figure 20A , the lower porous substrate LPRS is briefly shown. The description given above with reference to Figure 19A can be applied to the lower porous substrate LPRS. The lower porous substrate LPRS may include a lower base material LBM and a fifth porous film PL5 and a sixth porous film PL6. Alternatively, the description given above with reference to Figure 19B can be applied to the lower porous substrate LPRS. The lower porous substrate LPRS may include a lower base material LBM and a fifth porous film PL5 to an eighth porous film PL8.

[0254] A third cover substrate CPT3 may be disposed on the lower porous substrate LPRS. The third cover substrate CPT3 may be directly disposed on the front surface F-LPRS of the lower porous substrate LPRS. A fourth cover substrate CPT4 may be disposed below the lower porous substrate LPRS. The fourth cover substrate CPT4 may be directly disposed on the rear surface B-LPRS of the lower porous substrate LPRS.

[0255] Each of the third cover substrate CPT3 and the fourth cover substrate CPT4 may include a metal. Each of the third cover substrate CPT3 and the fourth cover substrate CPT4 may be a metal substrate. In an embodiment, the metal included in each of the third cover substrate CPT3 and the fourth cover substrate CPT4 may include stainless steel (SUS). The cover substrates CPT3 and CPT4 may be disposed on a porous film having pores defined therein, and thus damage to the porous film may be reduced or prevented. Therefore, the reliability of the lower plate LPT (refer to Figure 6 ) can be effectively improved.

[0256] With reference to Figure 20B , in the present embodiment, the first lower plate LPT1-3 may include a lower porous substrate LPRS, a third cover substrate CPT3, a fourth cover substrate CPT4, a first lower adhesive layer LAL1, and a second lower adhesive layer LAL2. That is, when compared with the first lower plate LPT1-2 in the embodiment described with reference to Figure 20A , the first lower plate LPT1-3 may further include a first lower adhesive layer LAL1 and a second lower adhesive layer LAL2.

[0257] The first lower adhesive layer LAL1 may be disposed between the lower porous substrate LPRS and the third cover substrate CPT3. The first lower adhesive layer LAL1 may couple the lower porous substrate LPRS and the third cover substrate CPT3. The second lower adhesive layer LAL2 may be disposed between the lower porous substrate LPRS and the fourth cover substrate CPT4. The second lower adhesive layer LAL2 may couple the lower porous substrate LPRS and the fourth cover substrate CPT4.

[0258] Each of the first lower adhesive layer LAL1 and the second lower adhesive layer LAL2 may include a transparent adhesive, such as a pressure-sensitive adhesive (PSA) or an optically clear adhesive (OCA), but is not limited thereto. For another example, each of the first lower adhesive layer LAL1 and the second lower adhesive layer LAL2 may include thermoplastic polyurethane (TPU).

[0259] According to the present embodiment, even when the folding and unfolding operations of the electronic device ED (refer to Figure 1 ) are repeated, the coupling state of the lower porous substrate LPRS with the covering substrates CPT3 and CPT4 can be stably maintained, and damage or deformation of the lower plate LPT (refer to Figure 6 ) can be reduced or prevented. Therefore, the reliability of the lower plate LPT (refer to Figure 6 ) can be effectively improved.

[0260] According to the present disclosure, the electronic device may include a support plate having high shear stress and improved impact resistance and elastic recovery force. Therefore, damage to the electronic device due to external impact can be reduced or prevented, and damage or deformation of the electronic device due to repeated folding operations can be reduced or prevented. Therefore, the reliability of the electronic device can be effectively improved.

[0261] Although the present disclosure has been described with reference to embodiments of the present disclosure, it will be apparent to those of ordinary skill in the art that various changes and modifications can be made to the present disclosure without departing from the spirit and scope of the present disclosure as set forth in the appended claims.

Claims

1. An electronic device, characterized in that, Comprising: A display panel, the display panel being foldable about a virtual folding axis extending in a first direction; And A support plate, the support plate being disposed under the display panel, the support plate including a porous substrate, Wherein, the porous substrate includes: A metallic base material; A first porous film, the first porous film being disposed on the base material; and A second porous film, the second porous film being disposed under the base material.

2. The electronic device according to claim 1, wherein Each of the pores in the first porous film and the pores in the second porous film has a column shape extending in the thickness direction in a sectional view.

3. The electronic device according to claim 1, characterized in that, The porous substrate further includes: A third porous film, the third porous film being disposed between the base material and the first porous film; and A fourth porous film, the fourth porous film being disposed between the base material and the second porous film, Wherein, the third porous film has a porosity lower than that of the first porous film, and Wherein, the fourth porous film has a porosity lower than that of the second porous film.

4. The electronic device according to claim 3, wherein Each of the pores in the first porous film, the pores in the second porous film, the pores in the third porous film, and the pores in the fourth porous film has a column shape extending in the thickness direction in a sectional view.

5. The electronic device according to claim 1, wherein The support plate further includes: A first sealant, the first sealant filling the pores in the first porous film; and A second sealant, the second sealant filling the pores in the second porous film.

6. The electronic device according to claim 1, wherein The support plate further includes: A first covering substrate, the first covering substrate being disposed on the first porous film; and A second covering substrate, the second covering substrate being disposed under the second porous film.

7. The electronic device according to claim 6, wherein The support plate further includes: A first adhesive support layer, the first adhesive support layer being disposed between the first covering substrate and the first porous film; and A second adhesive support layer, the second adhesive support layer being disposed between the second covering substrate and the second porous film.

8. The electronic device according to claim 1, wherein The display panel includes a folding region and a first non-folding region and a second non-folding region, the folding region being foldable about the folding axis, the first non-folding region and the second non-folding region being spaced apart from each other across the folding region in a second direction intersecting the first direction.

9. The electronic device according to claim 8, wherein The support plate includes a first support portion configured to overlap with the first non-folding region, a second support portion configured to overlap with the second non-folding region, and a third support portion configured to overlap with the folding region, and Wherein, the third support portion defines an opening penetrating the support plate from a front surface of the support plate to a rear surface of the support plate.

10. The electronic device according to claim 8, characterized in that, The support plate includes a first support portion configured to overlap with the first non-folding region, a second support portion configured to overlap with the second non-folding region, and a third support portion configured to overlap with the folding region, and Wherein, the third support portion defines a groove on a rear surface of the support plate.

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