Conductive paste prime coat structure and printed antenna

Abstract

The utility model belongs to the technical field of radio frequency antennas, and particularly relates to a conductive paste prime coat structure and a printed antenna. The conductive film comprises a base material layer, a conductive slurry layer and a coating, the conductive slurry layer is arranged on the base material layer, and a blank area is reserved around the base material layer; the coating is arranged between the base material layer and the conductive slurry layer, and the outer contour size of the coating is larger than the outer contour of the conductive slurry layer and smaller than the outer contour of the base material layer. The printed antenna is used for solving the problems that the coating in the printed antenna is warped and the cost is relatively high. The size of the coating and the size of the conductive slurry layer are controlled, the outer contour of the coating is set to be larger than that of the conductive slurry layer and smaller than that of the base material layer, the back coating is omitted, the front coating is reduced, the use amount of the coating is greatly reduced, the overall thickness is reduced, and meanwhile the use amount of the coating is reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of radio frequency antennas, and particularly relates to a conductive paste undercoat structure and a printed antenna. Background Art

[0002] A printed antenna is an antenna formed by printing on different substrates. Compared with traditional etched antennas, it has the advantages of flexible shape design, lightness and thinness, relatively low production cost, high production efficiency, and good compatibility with various substrates.

[0003] At present, there are two coating methods for the conductive paste undercoat in printed antennas. One is to fully coat the surface of the substrate layer and then apply the conductive paste on the coating. This method is simple to operate. However, since one side of the substrate layer is fully coated, during sintering, the moisture absorption effects of the substrate layer and the coating are different, which easily causes the substrate layer to warp towards the coated surface. The other is to apply another full coating on the side of the substrate layer away from the coating in order to avoid warping of the substrate layer during sintering. Both sides of the substrate layer are fully coated with the coating, which can effectively avoid the warping problem during sintering of the substrate layer and the conductive paste. However, this coating method results in more use of coating materials, higher costs, and more complex processes. Summary of the Utility Model

[0004] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide a conductive paste undercoat structure and a printed antenna for solving the problems of warping caused by the coating in printed antennas and high costs.

[0005] On the one hand, the technical solution of the utility model for solving the above technical problem is as follows: A conductive paste undercoat structure, which comprises:

[0006] A substrate layer;

[0007] A conductive paste layer, which is arranged on the substrate layer and has a blank area left around the substrate layer;

[0008] A coating, which is arranged between the substrate layer and the conductive paste layer. The outer contour size of the coating is larger than the outer contour of the conductive paste layer and smaller than the outer contour of the substrate layer.

[0009] Compared with the prior art, the above technical solution has the following beneficial effects:

[0010] By controlling the sizes of the coating and the conductive paste layer, the outer contour of the coating is set to be larger than the conductive paste layer and smaller than the substrate layer. At this time, compared with the substrate layer with a single-sided full coating, the problem of warping of the substrate layer after moisture absorption can be avoided. At the same time, compared with the substrate layer with a double-sided full coating, since the back coating is cancelled and the front coating is reduced, the usage amount of the coating is greatly reduced, not only reducing the overall thickness, but also reducing the usage amount of the coating.

[0011] Based on the above technical solutions, the embodiments of the present application can also be improved as follows:

[0012] In one embodiment, the outer contour size of the coating is more than 1 mm larger than the outer contour of the conductive paste layer.

[0013] To reduce the difficulty of register printing, the outer contour of the coating is set to be more than 1 mm larger than that of the conductive paste layer. At the same time, it can completely carry the conductive paste layer and ensure that warping caused by moisture absorption of the substrate layer is avoided to the greatest extent during sintering.

[0014] In one embodiment, the outer contour size of the coating is more than 1 mm larger than that of the conductive paste layer in the length and width directions of the conductive paste layer.

[0015] Since the pattern shape of the conductive paste layer is approximately rectangular, the length and width directions here are the longest length direction and the widest width direction of the conductive paste coating. That is, the outer contour of the coating is based on these two longest lengths and width directions, and is more than 1 mm larger on this basis to ensure that the coating completely carries the conductive paste layer, facilitate subsequent cutting, and at the same time ensure the integrity of the conductive paste layer.

[0016] In one embodiment, the coating is a coating with a three-layer structure.

[0017] In one embodiment, the coating is a three-layer resin coating.

[0018] In one embodiment, the thickness of the coating is greater than the thickness of the conductive paste layer, and the thickness of the coating is not less than 3 μm.

[0019] On the other hand, the present utility model also discloses a printed antenna, which includes the above conductive paste undercoat structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the specific embodiments of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0021] Figure 1 It is a schematic structural diagram of the present utility model.

[0022] Figure 2 It is a top view structural diagram of the present utility model.

[0023] Reference numerals:

[0024] 1. Substrate layer; 2. Conductive paste layer; 3. Coating layer. Detailed implementation manners

[0025] The embodiments of the technical solutions of the present utility model will be described in detail below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solutions of the present utility model, so they are only examples and cannot be used to limit the protection scope of the present utility model.

[0026] It should be noted that unless otherwise specified, the technical terms or scientific terms used in this application should have the ordinary meanings understood by those skilled in the art to which the present utility model belongs.

[0027] In the description of this application, it should be understood that the orientation or positional relationships indicated by the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present utility model.

[0028] In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. In the description of the present utility model, "a plurality of" means two or more unless otherwise specifically defined.

[0029] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0030] Embodiment 1

[0031] As Figure 1-2 shown, a conductive paste undercoat structure provided by the present utility model includes: a substrate layer 1, a coating layer 3, and a conductive paste layer 2 arranged in sequence.

[0032] The substrate layer 1 can specifically adopt a paper substrate layer 1. The conductive paste layer 2 is disposed on the substrate layer 1 with a blank area left around the substrate layer 1. The coating layer 3 is disposed between the substrate layer 1 and the conductive paste layer 2. The outer contour size of the coating layer 3 is larger than that of the conductive paste layer 2 and smaller than that of the substrate layer 1. The outer contour of the area where the conductive paste layer 2 is mapped on the substrate layer 1 is within the outer contour of the area where the coating layer 3 is mapped on the substrate layer 1. At the same time, the coating layer 3 also leaves a blank area around the substrate layer 1.

[0033] By controlling the sizes of the coating layer 3 and the conductive paste layer 2, the outer contour of the coating layer 3 is set to be larger than the conductive paste layer 2 and smaller than the substrate layer 1. At this time, compared with the substrate layer 1 with single-sided full coating, the problem that the substrate layer 1 warps after absorbing moisture can be avoided. At the same time, compared with the substrate layer 1 with double-sided full coating, since the back coating layer 3 is cancelled and the front coating layer 3 is reduced, the usage amount of the coating layer 3 is greatly reduced, which not only reduces the overall thickness but also reduces the usage amount of the coating layer 3.

[0034] Specifically, to reduce the difficulty of register printing, the outer contour size of the coating layer 3 is more than 1 mm larger than the outer contour of the conductive paste layer 2. At this time, the coating layer 3 can completely carry the conductive paste layer 2, and since the exceeded distance of the outer contour is at least 1 mm, it can ensure that the warping caused by the substrate layer 1 absorbing moisture is avoided to the greatest extent during sintering.

[0035] Since the pattern shape of the conductive paste layer 2 is roughly rectangular, the outer contour size of the coating layer 3 is more than 1 mm larger than that of the conductive paste layer 2 in the length and width directions of the conductive paste layer 2. Here, the length and width directions refer to the longest length direction and the widest width direction of the conductive paste coating layer 3, that is, the outer contour of the coating layer 3 is based on these two longest length and width directions, and on this basis, it is more than 1 mm larger. The length and width of the outer contour of the coating layer 3 are both 1 mm more than the length and width of the conductive paste layer 2 to ensure that the coating layer 3 completely carries the conductive paste layer 2, which is convenient for subsequent cutting, and at the same time ensures the integrity of the conductive paste layer 2 and is convenient for the machine to perform multi-layer register printing.

[0036] In this embodiment, the coating layer 3 is a coating layer 3 with a three-layer structure, that is, the coating layer 3 is formed by three printings, and this coating layer 3 is a three-layer resin coating layer 3.

[0037] In this embodiment, the thickness of the coating layer 3 is larger than that of the conductive paste layer 2, and the thickness of the coating layer 3 is not less than 3 μm. Since the coating layer 3 with a three-layer structure has a thickness of about 1 - 2 μm for each layer, the thickness of the coating layer 3 after printing is about 6 μm, and at this time the thickness of the conductive paste layer 2 is about 2 μm.

[0038] By reducing the coating 3 on the back surface of the substrate layer 1, the thickness of the antenna and the thickness of the conductive paste area are reduced by 6%, and the thickness of the non-conductive paste area is reduced by 13%. At the same time, about 75% of the coating 3 is saved.

[0039] Embodiment 2

[0040] The present utility model also discloses a printed antenna, which comprises the above-mentioned conductive paste undercoat structure.

[0041] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present utility model, rather than to limit it; although the present utility model has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present utility model.

Claims

1. A conductive paste undercoat structure, characterized in that, Comprising: Substrate layer; Conductive paste layer, disposed on the substrate layer and leaving a blank area around the substrate layer; Coating layer, disposed between the substrate layer and the conductive paste layer, the outer contour dimension of the coating layer being larger than the outer contour of the conductive paste layer and smaller than the outer contour of the substrate layer.

2. The conductive paste undercoat structure according to claim 1, wherein, The outer contour dimension of the coating layer is more than 1 mm larger than the outer contour of the conductive paste layer.

3. The conductive paste undercoat structure according to claim 2, wherein, The outer contour dimension of the coating layer is more than 1 mm larger than that of the conductive paste layer in the length and width directions of the conductive paste layer.

4. The conductive paste undercoat structure according to claim 1, wherein The coating layer is a coating layer with a three-layer structure.

5. The conductive paste undercoat structure according to claim 4, wherein The coating layer is a three-layer resin coating layer.

6. The conductive paste undercoat structure according to claim 1, wherein, The thickness of the coating layer is larger than the thickness of the conductive paste layer, and the thickness of the coating layer is not less than 3 μm.

7. A printed antenna, characterized in that, Comprising the conductive paste undercoat structure according to any one of claims 1-6.

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