Silicon wafer transportation device and transportation system
By introducing vibration detection structure and flexible contact parts into the silicon wafer transportation device, the problems of inaccurate counting and fragmentation during silicon wafer transportation are solved, and the effect of accurate counting and reducing damage is achieved.
Patent Information
- Application Number
- CN202422307017.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-20
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2034-09-20
AI Technical Summary
When existing silicon wafer transportation devices transport silicon wafers to flower baskets, they cannot effectively distinguish the complete silicon wafers from fragments, resulting in abnormal counting and affecting production efficiency. The silicon wafers are prone to fragmentation due to inertia collision with flower baskets during transportation.
The vibration detection structure is adopted, including flexible contact parts and vibration sensors, to distinguish the complete silicon wafer from fragments by detecting the difference in vibration frequency when the silicon wafer comes into contact with the contact parts, and to use flexible materials to buffer the motion inertia of the silicon wafer to avoid collisions.
Accurate counting of the number of silicon wafers is achieved, which avoids the incorrect counting of silicon wafer debris, improves production efficiency, and reduces damage to silicon wafers during transportation.
Smart Images
Figure CN223140745U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of solar cell processing, and particularly to a wafer transportation device and a transportation system. Background Art
[0002] In the related art, when a wafer is transferred from a transportation device to a carrier, the transportation device not only needs to load the wafer into the carrier, but also count the wafers.
[0003] However, wafer fragments may be generated during the transportation of wafers. The existing wafer transportation device will count the wafer fragments as a complete wafer when transporting the wafers to the carrier, and the wafer fragments cannot be excluded, resulting in abnormal wafer counting and affecting wafer production. Summary of the Utility Model
[0004] Embodiments of the present application disclose a wafer transportation device and a transportation system for improving the counting effect of the wafer transportation device on wafers.
[0005] To achieve the above object, in a first aspect, the present application discloses a wafer transportation device, including:
[0006] A support;
[0007] A transportation structure, the transportation structure is installed on the support, the transportation structure has a transportation surface, and the transportation surface is configured to transport wafers;
[0008] A vibration detection structure, the vibration detection structure is installed on the support, the vibration detection structure is located at one end of the transportation structure along the transportation direction of the transportation structure, the vibration detection structure includes a contact component and a vibration sensor, the vibration sensor is arranged inside the contact component, the contact component is configured to be flexible, and the contact component is configured to be contacted by the wafer, and the vibration sensor is configured to detect the vibration generated when the wafer contacts the contact component.
[0009] As an optional implementation manner, the contact component protrudes from the transportation surface, and the thickness of the contact component is greater than the thickness of the wafer.
[0010] As an optional implementation manner, an end surface of the contact component in the height direction of the support is inclined relative to the transportation surface along the transportation direction, so that the thickness of a first end of the contact component is less than the thickness of a second end of the contact component;
[0011] Wherein, the first end and the second end are two ends of the contact component along the transportation direction.
[0012] As an alternative implementation, the height by which the first end protrudes from the transport surface along the height direction of the support is 200 μm - 300 μm.
[0013] As an alternative implementation, the material of the contact member is a flexible disordered hyperuniform elastic metamaterial.
[0014] As an alternative implementation, the transport structure includes two conveyor belts arranged at intervals, and the two conveyor belts are respectively arranged on two opposite sides of the support, and the vibration detection structure is located in the middle area between the two conveyor belts.
[0015] As an alternative implementation, the wafer transport device further includes an alarm, the alarm is electrically connected to the vibration sensor, and the alarm is configured to issue an alarm according to the vibration condition of the wafer detected by the vibration sensor.
[0016] In a second aspect, the present application also discloses a wafer transport system, including:
[0017] A flower basket and the wafer transport device as described in the first aspect;
[0018] One end of the wafer transport device provided with the vibration detection structure is located inside the flower basket.
[0019] As an alternative implementation, the flower basket includes two connecting plates, a plurality of first rods and a plurality of second rods. Both ends of the first rods and both ends of the second rods are respectively connected to the edge sides of the two connecting plates along the height direction of the flower basket. The connecting plates, the first rods and the second rods enclose a placement space, and one end of the wafer transport device provided with the vibration detection structure is located inside the placement space;
[0020] A plurality of the first rods are located behind the vibration detection structure along the transport direction of the wafer transport device, and a plurality of the second rods are located on both sides of the wafer transport device along the transport direction.
[0021] As an alternative implementation, a plurality of first flower basket teeth are provided on the first rod, and a plurality of second flower basket teeth are provided on the second rod. The plurality of first flower basket teeth are arranged at intervals along the length direction of the first rod. The first flower basket teeth are located below the wafer transport device along the length direction of the first rod, and the first flower basket teeth are located in the placement space and extend along the transport direction;
[0022] A plurality of the second flower basket teeth are arranged at intervals along the length direction of the second rod. The second flower basket teeth are located in the placement space and are arranged towards the wafer transport device. Each of the second flower basket teeth corresponds to each of the first flower basket teeth respectively. The first flower basket teeth and the second flower basket teeth at the same height are jointly configured to support the wafer on the wafer transport device.
[0023] Compared with the prior art, the beneficial effects of the present application are as follows:
[0024] The present application discloses a wafer transport device and a transport system. The wafer transport device includes a support, a transport structure, and a vibration detection structure. Through the arrangement of the vibration detection structure, the vibration detection structure includes a vibration sensor and a contact component. The vibration sensor is arranged inside the contact component, and the contact component is flexible. Since vibration will be generated when two objects come into contact or collide, when the transport structure of the wafer transport device disclosed in the present application transports the wafer to the flower basket, the wafer will come into contact with the contact component of the vibration detection structure. The vibration generated when the wafer comes into contact with the vibration detection structure will be detected by the vibration sensor. Since the vibration frequencies generated when a complete wafer comes into contact with the contact component and when a wafer fragment comes into contact with the contact component are different, the vibration sensor can judge the shape of the wafer according to the vibration frequency. In this way, a complete wafer and a wafer fragment can be distinguished, thereby improving the accuracy of calculating the number of wafers. In addition, the contact component used to contact the wafer is configured as a flexible component. When the wafer comes into contact with the contact component, it can buffer the inertia generated during wafer transportation to avoid the situation of the wafer being damaged. Description of the Drawings
[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0026] Figure 1 It is a schematic structural diagram of the wafer transport device disclosed in the embodiment of the present application;
[0027] Figure 2 It is a schematic structural diagram of the vibration detection structure disclosed in the embodiment of the present application;
[0028] Figure 3 It is a schematic structural diagram of the wafer transport system disclosed in the embodiment of the present application;
[0029] Figure 4 It is a schematic structural diagram of the flower basket disclosed in the embodiment of the present application;
[0030] Figure 5Schematic diagram of the position of the silicon wafer transport device and the first flower basket tooth disclosed in the embodiments of the present application.
[0031] Explanation of reference numerals:
[0032] 100, silicon wafer transport device; 1, support; 2, transport structure; 3, vibration detection structure; 31, contact component; 311, first end; 312, second end; 32, vibration sensor; 200, silicon wafer; 300, flower basket; 301, connecting plate; 302, first rod; 303, second rod; 300a, placement space; 300b, first flower basket tooth; 300c, second flower basket tooth. Detailed implementation manners
[0033] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.
[0034] In the present application, the orientation or positional relationship indicated by terms such as "upper", "lower", "front", "rear", "inner", "outer", "middle", etc. is based on the orientation or positional relationship shown in the accompanying drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit that the indicated device, element or component must have a specific orientation, or be constructed and operated in a specific orientation.
[0035] Moreover, in addition to being able to represent the orientation or positional relationship, some of the above terms may also be used to represent other meanings. For example, the term "upper" may also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in the present application can be understood according to specific situations.
[0036] In addition, the terms "installation", "setting", "provided with", "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there is an internal connection between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.
[0037] In addition, terms such as "first", "second", etc. are mainly used to distinguish different devices, components or parts (specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, components or parts. Unless otherwise specified, the meaning of "a plurality of" is two or more.
[0038] In the battery production process, a silicon wafer transport device needs to transport silicon wafers into a carrier, and the carrier is used to load the silicon wafers. In this process, the silicon wafer transport device not only needs to effectively load the silicon wafers into the carrier, but also needs to count the number of silicon wafers before loading them into the carrier. During the production and transportation of silicon wafers, silicon wafers may break and generate silicon wafer fragments, and these silicon wafer fragments will be transported to the feeding position of the silicon wafer transport device and the carrier during transportation. In the related art, sensors are mostly set on the silicon wafer transport device to realize silicon wafer counting by using the sensors. However, the sensors of the silicon wafer transport device usually count these silicon wafer fragments as complete silicon wafers as well. For example, when using a laser sensor for counting, silicon wafer fragments or silicon wafers with cracks will block the light of the laser sensor in the same way as normal silicon wafers to realize counting, so that these defective silicon wafers cannot be effectively excluded. In this way, it may lead to incorrect silicon wafer counting and affect the entire silicon wafer production process. In addition, since the silicon wafers will generate motion inertia when being transported along with the transport structure, when the transport structure transports the silicon wafers into the carrier and stops, the silicon wafers still maintain a certain motion inertia, which may cause the silicon wafers to be over-transported and bump into the carrier, resulting in the situation of silicon wafer breakage.
[0039] Based on this, the present application discloses a silicon wafer transport device and a transport system. The silicon wafer transport device adopts a vibration detection structure, and judges whether the silicon wafer is complete by detecting different vibration frequencies generated when different silicon wafers contact it. In this way, the silicon wafer transport device can accurately count the silicon wafers loaded into the carrier. In addition, the vibration detection structure can also buffer the motion inertia of the silicon wafers, avoiding the situation that the silicon wafers are damaged due to still maintaining a motion trend after the transport structure stops.
[0040] The technical solutions of the present application will be further described below in conjunction with embodiments and drawings.
[0041] In a first aspect, please refer to Figure 1 and Figure 2, this application discloses a silicon wafer transportation device 100, which includes a support 1, a transportation structure 2, and a vibration detection structure 3. Among them, both the transportation structure 2 and the vibration detection structure 3 are installed on the support 1. The vibration detection structure 3 is located at one end of the transportation structure 2 along the transportation direction X of the transportation structure 2. The transportation structure 2 transports the silicon wafer 200 from the other end to the end where the vibration detection structure 3 is provided, so that the silicon wafer 200 contacts the vibration detection structure 3. Specifically, the vibration detection structure 3 includes a contact component 31 and a vibration sensor 32, and the vibration sensor 32 is arranged inside the contact component 31. The contact component 31 is configured to be flexible. That is to say, the contact component 31 can be made of a flexible material, so as to be able to cover the outside of the vibration sensor 32 and serve as a component that contacts the silicon wafer 200. When the transportation structure 2 transports the silicon wafer 200 to the vibration detection structure 3, the silicon wafer 200 contacts the contact component 31, so that the inertia of the silicon wafer 200 caused by transportation can be buffered through the contact component 31. At the same time, since vibration is generated when the two contact, the vibration is transmitted to the vibration sensor 32, so that the vibration frequency can be detected by the vibration sensor 32 to judge the type of the silicon wafer 200 that contacts the contact component 31.
[0042] This application is based on the principle that different-shaped silicon wafers 200 generate different vibrations when contacting the same object. That is, the vibration frequencies generated when a complete silicon wafer, a silicon wafer fragment, and a silicon wafer with cracks contact the contact component 31 are all different. In this way, the silicon wafer fragments and the silicon wafers with cracks (defective silicon wafers) can be excluded by the vibration sensor 32, so as to effectively count the complete silicon wafers 200 and avoid the occurrence of overcounting and undercounting. In addition, the contact component 31 is made of a flexible material, which can effectively buffer the transportation inertia generated when the silicon wafer 200 is transported, so that the silicon wafer 200 can stop stably when it enters the flower basket, and avoid the situation that the silicon wafer 200 collides with the flower basket and breaks due to overtransportation.
[0043] Considering the application of flexible materials such as sponge and cotton to the contact component, although the contact component 31 made of these flexible materials can effectively buffer the silicon wafer 200 when contacting the silicon wafer 200, these materials may also absorb the energy of the vibration generated when the contact component 31 contacts the silicon wafer 200, resulting in possible influence on the vibration detection of the vibration sensor 32. Optionally, the material of the contact component 31 can be a flexible disordered hyperuniform elastic metamaterial. It can be understood that the flexible disordered hyperuniform elastic metamaterial is a material obtained by inserting rigid cylinders into a soft material matrix (silicone, rubber) according to an optimized special disordered distribution. The rigid cylinders located inside the soft material matrix can act as reflectors, and the rigid cylinders can concentrate the elastic waves (such as waves generated by vibration) input into the soft material matrix to a position of the soft material matrix.
[0044] In some examples, the contact component 31 made of a flexible disordered hyperuniform elastic metamaterial can be wrapped around the outer periphery of the vibration sensor 32, and one side of the contact component 31 facing the vibration sensor 32 is set as an elastic wave focusing point. In this way, the vibration generated when the silicon wafer 200 contacts the contact component 31 can be focused, thereby improving the detection effect of the vibration sensor 32. In addition, the contact component 31 made of a flexible material wraps the vibration sensor 32, enabling the contact component 31 to better protect the vibration sensor 32 and also preventing the silicon wafer 200 from directly contacting the vibration sensor 32 and causing bumps. In other examples, the contact component 31 can also directly use a soft material matrix, such as silicone, rubber and other materials, and the contact component 31 is centrally arranged on the side of the vibration sensor 32 facing the incoming silicon wafer 200, so that the vibration generated after the silicon wafer 200 contacts the contact component 31 is concentrated and transmitted from one side to the vibration sensor 32 to achieve vibration focusing.
[0045] In some embodiments, the contact component 31 protrudes from the transport surface along the height direction of the support 1, and the thickness of the contact component 31 is greater than the thickness of the silicon wafer 200. It can be understood that the thickness direction of the contact component 31 is the same as the height direction Y of the support. Specifically, when the silicon wafer 200 is transported towards the vibration detection structure 3, the part of the contact component 31 protruding from the transport surface can block the silicon wafer 200, so that the silicon wafer 200 stops moving when it is transported to the vibration detection structure 3, avoiding the situation where the silicon wafer 200 collides with the flower basket due to the inertia generated during transportation. Also considering that if the thickness of the contact component 31 is less than the thickness of the silicon wafer 200, the silicon wafer 200 may cross the contact component 31 and rush out of the transport structure 2 with the movement inertia. Therefore, the thickness of the contact component 31 is set to be greater than the thickness of the silicon wafer, so that the contact component 31 can effectively block the silicon wafer 200.
[0046] It can be understood that in Figure 1 the direction shown by X in the example shown is the transport direction X of the transport structure, and the direction shown by Y in the example is the height direction of the support or the thickness direction of the silicon wafer.
[0047] Please refer to Figure 2, optionally, the end face of the contact member 31 along the height direction of the support 1 is inclined relative to the transport surface in the transport direction, so that the thickness of the first end 311 of the contact member 31 is smaller than the thickness of the second end 312 of the contact member 31. Wherein, the first end 311 and the second end 312 are two ends of the contact member 31 in the transport direction, and the first end 311 is located in front of the second end 312 in the transport direction. In other words, the contact member 31 has an inclined surface, and the inclined direction of the inclined surface is inclined downward from the second end 312 to the first end 311. Specifically, when the wafer 200 is transported by the transport structure 2 to contact the contact member 31, the wafer 200 first contacts the first end 311, and then the wafer 200 can slide onto the end face of the contact member 31 from the first end 311, and can keep sliding along the end face of the contact member 31. By setting the end face of the contact member 31 to be inclined in this application, the wafer 200 can slide onto the end face of the contact member 31 after contacting the first end 311 under the action of inertia, and then slide a certain distance on the end face of the contact member 31, thereby buffering the movement inertia of the wafer 200, and thus preventing the wafer 200 from crossing the vibration detection structure 3 and rushing out of the transport structure 2.
[0048] Optionally, the height by which the first end 311 protrudes from the transport surface along the height direction of the support 1 is 200 μm - 300 μm. For example, the height of the first end 311 can be 200 μm, 210 μm, 220 μm, 230 μm, 240 μm, 250 μm, 260 μm, 270 μm, 280 μm, 290 μm, 300 μm, etc. It can be understood that the thickness of the wafer 200 is usually 150 μm - 170 μm. In this application, the height of the first end 311 is set to be slightly higher than the thickness of the wafer 200, so that the wafer 200 can contact the first end 311 and at the same time rush onto the inclined end face for buffering, thereby avoiding the inertia of the wafer 200 being borne by the first end 311, and thus reducing the impact of the first end 311 on the wafer 200.
[0049] In some embodiments, the transport structure 2 may include two spaced conveyor belts for transporting the wafer 200. The two conveyor belts are respectively arranged on two opposite sides of the support 1, and the vibration detection structure 3 is located in the middle area between the two conveyor belts. Specifically, the conveyor belts are arranged on both sides of the support along the transport direction, and then the conveyor belts are driven by a rotating shaft or rollers to transport the wafer. It can be understood that the conveyor belts are usually belts. In some examples, when driving the belt to transport by a rotating shaft, a rotating shaft is respectively arranged at both ends of the support along the transport direction, and the two ends of the belt are respectively sleeved on the outer circumferences of the two rotating shafts, so that the rotating shaft drives the belt to transport the wafer. In other examples, along the transport direction, a row of rollers is respectively arranged on both sides of the support 1, and a belt is arranged around the outer circumferences of the whole row of rollers, and the belt is driven to move by the successive rolling of the rollers.
[0050] In the present application, the two conveying members are arranged at intervals, leaving a certain setting space. Arranging the vibration detection structure 3 between the two conveyor belts can reduce the space occupied by the vibration detection structure 3 in the original device. Considering that if the vibration detection structure 3 is arranged in a region deviated from the middle, when the silicon wafer 200 is transported by the conveyor belt to contact the vibration detection structure 3, the contact part between the silicon wafer 200 and the vibration detection structure 3 may be displaced, causing the silicon wafer 200 to deviate from the conveyor belt due to unbalanced force on the contact part, resulting in the silicon wafer 200 not being accurately transported into the flower basket. Therefore, in the present application, the vibration detection structure 3 is arranged in the middle region between the two conveyor belts, so that the silicon wafer 200 can be smoothly received by the vibration detection structure when transported by the belt to the vibration detection structure 3, preventing the situation that the silicon wafer 200 is thrown out from the transport structure 2 after contacting the vibration detection structure 3.
[0051] Since the silicon wafer fragments and defective silicon wafers cannot be transported into the flower basket, it may cause the accumulation of silicon wafer fragments and defective silicon wafers on the transport structure 2, and further may cause the subsequent transported silicon wafers to bump into these defective silicon wafers and silicon wafer fragments, resulting in the damage of the good silicon wafers. Therefore, when silicon wafer fragments appear, technicians need to clean the silicon wafers accumulated on the transport structure in time. In some embodiments, the silicon wafer transport device 100 further includes an alarm (not shown), and the alarm is electrically connected to the vibration sensor 32. The alarm is used to issue an alarm when the vibration sensor 32 detects the vibration generated when the silicon wafer fragments or defective silicon wafers contact the contact member 31. Specifically, when the silicon wafer fragments and defective silicon wafers contact the contact member 31, the vibration generated by their contact is transmitted to the vibration sensor 32. The vibration sensor 32 determines that the vibration comes from the silicon wafer fragments or defective silicon wafers, cancels the count, and instead sends a control signal to the alarm to control the alarm to issue an alarm, so as to remind the technician to turn off the silicon wafer transport device 100, and thus the technician can clean the silicon wafer fragments and defective silicon wafers on the transport structure 2.
[0052] Optionally, after the vibration sensor 32 detects the silicon wafer fragments or defective silicon wafers, it can control the alarm to issue an alarm and at the same time control the transport structure 2 to stop working. In this way, the operation steps of the technician can be reduced, which is convenient for the technician to clean the silicon wafer fragments and defective silicon wafers in time.
[0053] In a second aspect, please refer to Figure 3 and Figure 4, this application also discloses a silicon wafer transportation system, including a carrier 300 and the silicon wafer transportation device 100 disclosed in the first aspect. One end of the silicon wafer transportation device 100 provided with the vibration detection structure 3 is located in the carrier 300. It can be understood that the silicon wafer transportation device 100 needs to extend one end into the carrier 300 to facilitate placing the silicon wafers 200 in the carrier 300. In this application, the silicon wafer transportation device 100 transports the silicon wafers into the carrier 300. Before transporting the silicon wafers 200 into the carrier 300, the silicon wafer transportation device 100 first counts the complete silicon wafers, and can also exclude silicon wafer fragments and defective silicon wafers, so as to avoid loading silicon wafer fragments or defective silicon wafers into the carrier.
[0054] Optionally, the carrier 300 may be provided with a lifting mechanism (not shown). Through the lifting mechanism, the carrier 300 moves upward relative to the silicon wafer transportation device 100 along its own height direction, so that the silicon wafers 200 are loaded into the carrier 300 one by one from top to bottom along the height direction of the carrier 300, facilitating the loading of the silicon wafers 200 into the carrier 300.
[0055] It should be noted that the height direction of the support 1 is the same as the height direction of the carrier 300. In Figure 3 the illustrated example, the direction indicated by Y can be either the height direction of the support 1 or the height direction of the carrier 300.
[0056] In some embodiments, the carrier 300 includes two connecting plates 301, multiple first rods 302 and multiple second rods 303. The two ends of each first rod 302 and second rod 303 are respectively connected to the edge sides of the two connecting plates 301 along the height direction of the carrier 300, so that the connecting plates 301, the first rods 302 and the second rods 303 enclose a placement space 300a for placing the silicon wafers 200. One end of the silicon wafer transportation device 100 provided with the vibration detection structure 3 is located in the placement space 300a. Multiple first rods 302 are located behind the vibration detection structure 3 along the transportation direction of the silicon wafer transportation device 100, and multiple second rods 303 are located on both sides of the silicon wafer transportation device 100 along the transportation direction. Considering that when the silicon wafers 100 are transported into the carrier 300, it is necessary to avoid the silicon wafers 200 from colliding with the first rods 302 of the carrier 300. In this application, the vibration detection structure 3 of the silicon wafer transportation device 100 receives the transported silicon wafers 200, and uses the flexible contact member 31 of the vibration detection structure 3 to buffer the movement inertia generated by the silicon wafers 200 during transportation, thereby avoiding the silicon wafers 200 from colliding with the first rods 302 of the carrier 300 and causing damage to the silicon wafers 200.
[0057] Optionally, the first rod 302 is provided with a plurality of first basket teeth 300b, and the second rod 303 is provided with a plurality of second basket teeth 300c. The plurality of first basket teeth 300b are arranged at intervals along the length direction of the first rod 302, and the plurality of second basket teeth 300c are arranged at intervals along the length direction of the second rod 303. The first basket teeth 300b and the second basket teeth 300c are located below the silicon wafer transport device 100 along the length direction of the first rod 302 and are both located in the placement space 300a. Each first basket tooth 300b is arranged corresponding to each second basket tooth 300c, and the first basket teeth 300b and the second basket teeth 300c located at the same height are used together to support the silicon wafer 200 on the silicon wafer transport device 100. In the present application, a first flower basket tooth 300 b and a second flower basket tooth 300 c are respectively arranged on the first rod 302 and the second rod 303 . When the silicon wafer transporting device 100 transports the silicon wafer 200 to the flower basket 300 , the first flower basket tooth 300 b and the second flower basket tooth 300 c are used to support the silicon wafer 200 so as to load the silicon wafer 200 into the flower basket.
[0058] It should be noted that in Figure 4 The direction indicated by Y in the example can be the length direction of the first rod 302 and the second rod 303 and can also be the height direction of the flower basket.
[0059] It can be understood that the silicon wafer 200 is supported by the silicon wafer transport device 100 before being supported by the first flower basket teeth 300b and the second flower basket teeth 300c. Then, the flower basket 300 is lifted by the lifting mechanism, and the silicon wafer 200 is supported by the first flower basket teeth 300b and the second flower basket teeth 300c at the same height. Specifically, when the silicon wafer 200 is transported to the flower basket 300, the silicon wafer 200 is located on the transport structure 2 of the silicon wafer transport device 100, and the vibration detection structure 3 is used to receive the silicon wafer 200 to buffer the movement inertia. At the same time, the first flower basket teeth 300b and the second flower basket teeth 300c located below the vibration detection structure 3 move upward with the flower basket 300 as a whole, thereby lifting the silicon wafer 200, and completing the loading of the silicon wafer 200 in the flower basket 300. After completing the loading of a silicon wafer 200, the silicon wafer transport device 100 will be located above the first turnbuckle 300b and the second turnbuckle 300c of the next layer, and the above steps will be repeated to load the next silicon wafer 200, which will not be repeated here.
[0060] Optionally, see Figure 5 The first flower basket tooth 300b is arranged corresponding to the vibration detection structure 3, and the first flower basket tooth is extended along the transport direction. Figure 5As shown in the figure, when observed from the side of the wafer transportation system, the first flower basket tooth 300b is at least partially located in front of the vibration detection structure 3 along the transportation direction. Considering that the wafers 200 on the wafer transportation device 100 need to be received by the vibration detection structure 3 and also within the supporting range of the flower basket teeth 300b of the first rod 302 of the flower basket 300, so that the first flower basket teeth 300b can support the wafers 200. Therefore, in this application, while the first flower basket teeth 300b are correspondingly arranged with the vibration detection structure 3, the first flower basket teeth 300b are also extended forward along the transportation direction, so that at least part of the flower basket teeth 300b are located in front of the vibration detection structure 3 in the transportation direction. When the transportation structure 2 transports the wafers 200 to in front of the vibration detection structure 3, the wafers first enter the supporting range of the first flower basket teeth 300b. In this way, it is possible to avoid the situation where the vibration detection structure 3 blocks the wafers in advance and the wafers 200 cannot be located within the supporting range of the first flower basket teeth 300b, thereby preventing the situation where the wafers 200 are supported only on the second flower basket teeth 300c and resulting in unstable support.
[0061] The wafer transportation device and transportation system disclosed in the embodiments of the present application have been introduced in detail above. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the wafer transportation device and transportation system of the present application and its core idea; at the same time, for those of ordinary skill in the art, according to the idea of the present application, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present application.
Claims
1. A silicon wafer transport device, characterized in that, Comprising: A support; A transportation structure installed on the support, the transportation structure having a transportation surface configured to transport silicon wafers; A vibration detection structure installed on the support, the vibration detection structure being located at one end of the transportation structure along the transportation direction of the transportation structure. The vibration detection structure includes a contact component and a vibration sensor. The vibration sensor is disposed inside the contact component. The contact component is configured to be flexible and is configured to be contacted by the silicon wafer. The vibration sensor is configured to detect the vibration generated when the silicon wafer contacts the contact component.
2. The silicon wafer transport device according to claim 1, wherein, The contact component protrudes from the transportation surface, and the thickness of the contact component is greater than the thickness of the silicon wafer.
3. The silicon wafer transportation device according to claim 2, characterized in that, The end surface of the contact component in the height direction of the support is inclined relative to the transportation surface along the transportation direction, so that the thickness of the first end of the contact component is less than the thickness of the second end of the contact component; Wherein, the first end and the second end are two ends of the contact component along the transportation direction.
4. The silicon wafer transport device according to claim 3, wherein, The height by which the first end protrudes from the transportation surface in the height direction of the support is 200 μm - 300 μm.
5. The silicon wafer transport device according to claim 1, characterized in that, The material of the contact component is a flexible disordered hyperuniform elastic metamaterial.
6. The silicon wafer transportation device according to any one of claims 1-5, characterized in that, The transportation structure includes two spaced conveyor belts respectively disposed on two opposite sides of the support, and the vibration detection structure is located in the middle region between the two conveyor belts.
7. The silicon wafer transportation device according to any one of claims 1-5, characterized in that, The silicon wafer transportation device further includes an alarm electrically connected to the vibration sensor, and the alarm is configured to issue an alarm according to the vibration condition of the silicon wafer detected by the vibration sensor.
8. A silicon wafer transportation system, characterized in that, Comprising: A carrier basket and the silicon wafer transportation device according to any one of claims 1 - 7; One end of the silicon wafer transportation device provided with the vibration detection structure is located inside the carrier basket.
9. The silicon wafer transportation system according to claim 8, wherein, The carrier basket includes two connecting plates, a plurality of first rods and a plurality of second rods. Both ends of the first rods and both ends of the second rods are respectively connected to the edge sides of the two connecting plates along the height direction of the carrier basket. The connecting plates, the first rods and the second rods enclose a placement space, and one end of the silicon wafer transportation device provided with the vibration detection structure is located inside the placement space; A plurality of the first rods are located behind the vibration detection structure along the transportation direction of the silicon wafer transportation device, and a plurality of the second rods are located on both sides of the silicon wafer transportation device along the transportation direction.
10. The silicon wafer transportation system according to claim 9, characterized in that, A plurality of first carrier basket teeth are provided on the first rods, and a plurality of second carrier basket teeth are provided on the second rods. The plurality of first carrier basket teeth are spaced along the length direction of the first rods. The first carrier basket teeth are located below the silicon wafer transportation device along the length direction of the first rods. The first carrier basket teeth are located in the placement space and extend along the transportation direction; A plurality of the second flower basket teeth are arranged at intervals along the length direction of the second rod. The second flower basket teeth are located in the placement space and are arranged towards the wafer transport device. Each of the second flower basket teeth corresponds to each of the first flower basket teeth respectively. The first flower basket teeth and the second flower basket teeth at the same height are jointly configured to support the wafer on the wafer transport device.