Solder ball capable of resisting electronic interference

Abstract

The utility model discloses an electronic interference resistant solder ball, which relates to the technical field of solder balls and comprises an anti-oxidation resin layer and a nickel-plated metal layer, a solder ball surface layer is arranged on the inner side of the anti-oxidation resin layer, the nickel-plated metal layer is additionally arranged on the inner side of the solder ball surface layer, and a heat insulation layer is arranged on the inner side of the nickel-plated metal layer. And meanwhile, a titanium alloy ball center is arranged in the heat insulation layer, a damping ball is arranged at the middle end in the titanium alloy ball center, a telescopic adjusting rod is installed outside the damping ball, and a reset spring is connected outside the telescopic adjusting rod. According to the tin ball capable of resisting electronic interference, the tin ball can have the use performance of resisting electronic interference in the use process through the nickel-plated metal layer, the subsequent tin ball is prevented from influencing normal use of an integrated circuit, the overall practicability and the use efficiency of the tin ball are improved, meanwhile, the tin ball has the damping performance through the damping ball, and the service life of the tin ball is prolonged. Damage caused by careless falling of the solder ball is avoided, and the overall service life of the solder ball is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of solder balls, in particular to a solder ball with anti-electromagnetic interference. Background Technique

[0002] Solder balls are widely used in tinplate, flux, organic synthesis, chemical production, alloy manufacturing, and the assembly of multiple integrated circuits in the electronics industry. They are also used as reagents for determining arsenic and phosphates, reducing agents, tin-plated products, etc. High-quality BGA solder balls must have characteristics such as true roundness, brightness, good electrical conductivity and mechanical connection performance, small ball diameter tolerance, and low oxygen content. Solder balls are not only the key materials for connecting different electronic components but also the key factors in promoting the development of electronic devices towards smaller size and higher performance. In order to improve the welding efficiency in the electronics industry, a type of solder ball is required. However, the existing solder balls still have the following deficiencies:

[0003] For example, the utility model with the publication number CN218657413U discloses a lead-free solder ball including a solder ball body and a buffer device. The utility model absorbs the impact force from the collision body through the elasticity of the buffer device to protect the solder ball body. However, for comparative documents similar to the above application, when the existing solder balls are in use, since most solder balls do not have the performance of anti-electromagnetic interference, it is easy to affect the normal use of integrated circuits during the subsequent use of the solder balls, resulting in the problems of decreased practicality and reduced use efficiency of the solder balls.

[0004] Therefore, in view of this, research and improvement are carried out on the existing structure and deficiencies, and a solder ball with anti-electromagnetic interference is proposed. Content of the Utility Model

[0005] The purpose of the utility model is to provide a solder ball with anti-electromagnetic interference to solve the problems raised in the above background technique.

[0006] To achieve the above purpose, the utility model provides the following technical solution: A solder ball with anti-electromagnetic interference includes an antioxidant resin layer and a nickel-plated metal layer. The inner side of the antioxidant resin layer is provided with a solder ball surface layer, and a nickel-plated metal layer is additionally provided inside the solder ball surface layer. The inner side of the nickel-plated metal layer is provided with a heat insulation layer. At the same time, a titanium alloy ball core is arranged inside the heat insulation layer. In the middle of the titanium alloy ball core, a shock-absorbing ball is arranged. An expansion and contraction adjusting rod is installed outside the shock-absorbing ball, and a return spring is connected to the outside of the expansion and contraction adjusting rod.

[0007] Further, nickel-plated metal layers and antioxidant resin layers are respectively arranged on the inner and outer sides of the solder ball surface layer, and the solder ball surface layer is arranged and restricted between the nickel-plated metal layer and the antioxidant resin layer.

[0008] Further, the internal size of the nickel-plated metal layer is adapted to the external size of the heat insulation layer, and the heat insulation layer is embedded in the nickel-plated metal layer.

[0009] Further, titanium alloy spheres and nickel-plated metal layers are respectively arranged on both the inner and outer sides of the heat insulation layer, and the heat insulation layer is arranged and restricted between the titanium alloy spheres and the nickel-plated metal layers.

[0010] Further, the internal size of the heat insulation layer is adapted to the external size of the titanium alloy sphere, and the inner side of the heat insulation layer is closely attached to the outer side of the titanium alloy sphere.

[0011] Further, the telescopic adjusting rods and the shock-absorbing balls are vertically distributed, and the telescopic adjusting rods are equidistantly distributed outside the shock-absorbing balls.

[0012] Further, the shock-absorbing balls are embedded in the titanium alloy spheres, and the shock-absorbing balls are elastically connected to the titanium alloy spheres through return springs.

[0013] The present utility model provides a tin ball with anti-electromagnetic interference, having the following beneficial effects:

[0014] 1. Through the setting of the nickel-plated metal layer, when the tin ball with anti-electromagnetic interference is in use, the oxidation of the surface of the tin ball can be avoided by the antioxidant resin layer arranged on the outer layer of the tin ball surface after long-term contact with air. At the same time, the nickel-plated metal layer arranged on the inner layer of the tin ball surface can absorb the energy in the electromagnetic field, thereby reducing the intensity of electromagnetic interference received by the tin ball during use. The heat insulation layer is fixedly installed inside the nickel-plated metal layer, and the titanium alloy sphere is protected by the heat insulation layer to avoid damage to the internal components of the titanium alloy sphere caused by high temperature, improving the safety during the use of the tin ball.

[0015] 2. Through the setting of the shock-absorbing balls, when the tin ball with anti-electromagnetic interference is in use, the telescopic adjusting rods are fixedly installed outside the shock-absorbing balls by bonding, and the shock-absorbing balls are elastically connected to the titanium alloy spheres by using the return springs in cooperation with the telescopic adjusting rods. At the same time, the shock-absorbing balls and the return springs have a shock-absorbing effect during the use of the tin ball, and can reduce the damage received by the tin ball after it accidentally falls, extending the overall service life of the tin ball. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a three-dimensional sectional structure schematic diagram of a tin ball with anti-electromagnetic interference according to the present utility model;

[0017] Figure 2 is a three-dimensional sectional top view structure schematic diagram of a tin ball with anti-electromagnetic interference according to the present utility model;

[0018] Figure 3 is a three-dimensional sectional bottom view structure schematic diagram of a tin ball with anti-electromagnetic interference according to the present utility model.

[0019] In the figure: 1. Antioxidant resin layer; 2. Solder ball surface layer; 3. Nickel-plated metal layer; 4. Heat insulation layer; 5. Titanium alloy ball core; 6. Shock-absorbing ball; 7. Telescopic adjustment rod; 8. Return spring. Specific embodiments

[0020] The following further describes in detail the embodiments of the present utility model in conjunction with the accompanying drawings and embodiments. The following embodiments are used to illustrate the present utility model, but cannot be used to limit the scope of the present utility model.

[0021] As Figures 1 to 3 shown, a solder ball resistant to electronic interference includes an antioxidant resin layer 1 and a nickel-plated metal layer 3. Inside the antioxidant resin layer 1, there is a solder ball surface layer 2, and a nickel-plated metal layer 3 is additionally provided inside the solder ball surface layer 2. And a heat insulation layer 4 is provided inside the nickel-plated metal layer 3. At the same time, a titanium alloy ball core 5 is provided inside the heat insulation layer 4. On both the inner and outer sides of the solder ball surface layer 2, there are a nickel-plated metal layer 3 and an antioxidant resin layer 1 respectively. And the solder ball surface layer 2 is arranged and restricted between the nickel-plated metal layer 3 and the antioxidant resin layer 1. The internal size of the nickel-plated metal layer 3 is adapted to the external size of the heat insulation layer 4, and the heat insulation layer 4 is embeddedly connected with the nickel-plated metal layer 3. On both the inner and outer sides of the heat insulation layer 4, there are a titanium alloy ball core 5 and a nickel-plated metal layer 3 respectively. And the heat insulation layer 4 is arranged and restricted between the titanium alloy ball core 5 and the nickel-plated metal layer 3. The internal size of the heat insulation layer 4 is adapted to the external size of the titanium alloy ball core 5, and the inner side of the heat insulation layer 4 is closely attached to the outer side of the titanium alloy ball core 5. By means of the antioxidant resin layer 1 provided outside the solder ball surface layer 2, the oxidation of the surface of the solder ball after long-term contact with air is avoided. At the same time, the nickel-plated metal layer 3 provided inside the solder ball surface layer 2 can absorb the energy in the electromagnetic field, thereby reducing the intensity of electromagnetic interference received by the solder ball during use. The heat insulation layer 4 is fixedly installed inside the nickel-plated metal layer 3, and the heat insulation layer 4 is used to protect the titanium alloy ball core 5, avoiding damage to the internal components of the titanium alloy ball core 5 caused by high temperature, and improving the safety during the use of the solder ball.

[0022] As Figures 1 to 3 shown, a shock-absorbing ball 6 is provided in the middle of the titanium alloy ball core 5, and a telescopic adjustment rod 7 is installed outside the shock-absorbing ball 6. And a return spring 8 is connected to the outside of the telescopic adjustment rod 7. The telescopic adjustment rod 7 and the shock-absorbing ball 6 are vertically distributed, and the telescopic adjustment rod 7 is equidistantly distributed outside the shock-absorbing ball 6. The shock-absorbing ball 6 is embeddedly connected with the titanium alloy ball core 5, and the shock-absorbing ball 6 is elastically connected to the titanium alloy ball core 5 through the return spring 8. The telescopic adjustment rod 7 is fixedly installed outside the shock-absorbing ball 6 by means of bonding, and the return spring 8 is used in cooperation with the telescopic adjustment rod 7 to elastically connect the shock-absorbing ball 6 and the titanium alloy ball core 5. At the same time, the shock-absorbing ball 6 and the return spring 8 have a shock-absorbing effect during the use of the solder ball, and can reduce the damage received by the solder ball after it accidentally falls, and extend the overall service life of the solder ball.

[0023] In summary, when the anti-electromagnetic interference solder ball is in use, first, the antioxidant resin layer 1 provided outside the solder ball surface layer 2 prevents the surface of the solder ball from oxidizing after long-term contact with air. At the same time, the nickel-plated metal layer 3 provided inside the solder ball surface layer 2 can absorb the energy in the electromagnetic field, thereby reducing the intensity of electromagnetic interference received by the solder ball during use. The heat insulation layer 4 is fixedly installed inside the nickel-plated metal layer 3 to protect the titanium alloy ball core 5 with the heat insulation layer 4 and prevent the internal components of the titanium alloy ball core 5 from being damaged by high temperature. Then, the telescopic adjusting rod 7 is fixedly installed outside the shock-absorbing ball 6 by bonding, and the shock-absorbing ball 6 is elastically connected to the titanium alloy ball core 5 by using the return spring 8 in cooperation with the telescopic adjusting rod 7. At the same time, the shock-absorbing ball 6 and the return spring 8 have a shock-absorbing effect during the use of the solder ball, and can reduce the damage received by the solder ball after it accidentally falls, extending the overall service life of the solder ball.

[0024] The embodiments of the present invention are given for purposes of illustration and description, and are not exhaustive or limit the present invention to the disclosed form. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are chosen and described in order to better illustrate the principles of the present invention and its practical application, and to enable those of ordinary skill in the art to understand the present invention and design various embodiments with various modifications suitable for specific purposes.

Claims

1. A tin ball resistant to electronic interference, comprising an antioxidant resin layer (1) and a nickel-plated metal layer (3), characterized in that, An inner side of the antioxidant resin layer (1) is provided with a tin ball layer (2), and a nickel-plated metal layer (3) is additionally provided on an inner side of the tin ball layer (2). And a heat insulation layer (4) is provided on an inner side of the nickel-plated metal layer (3). Meanwhile, a titanium alloy ball core (5) is provided inside the heat insulation layer (4). A shock-absorbing ball (6) is provided at a middle end inside the titanium alloy ball core (5). A telescopic adjusting rod (7) is installed outside the shock-absorbing ball (6). And a return spring (8) is connected to an outside of the telescopic adjusting rod (7).

2. The solder ball for anti-electromagnetic interference according to claim 1, characterized in that, Nickel-plated metal layers (3) and antioxidant resin layers (1) are respectively provided on inner and outer sides of the tin ball layer (2). And the tin ball layer (2) is arranged and restricted between the nickel-plated metal layer (3) and the antioxidant resin layer (1).

3. The solder ball with anti-electromagnetic interference according to claim 1, characterized in that, An inner dimension of the nickel-plated metal layer (3) is adapted to an outer dimension of the heat insulation layer (4). And the heat insulation layer (4) is connected with the nickel-plated metal layer (3) in an embedded manner.

4. A solder ball for anti-electromagnetic interference according to claim 1, wherein The titanium alloy ball core (5) and the nickel-plated metal layer (3) are respectively provided on inner and outer sides of the heat insulation layer (4). And the heat insulation layer (4) is arranged and restricted between the titanium alloy ball core (5) and the nickel-plated metal layer (3).

5. The solder ball for anti-electromagnetic interference according to claim 1, characterized in that An inner dimension of the heat insulation layer (4) is adapted to an outer dimension of the titanium alloy ball core (5). And an inner side of the heat insulation layer (4) is closely attached to an outer side of the titanium alloy ball core (5).

6. The solder ball for anti-electromagnetic interference according to claim 1, wherein The telescopic adjusting rod (7) and the shock-absorbing ball (6) are vertically distributed. And the telescopic adjusting rods (7) are equidistantly distributed outside the shock-absorbing ball (6).

7. The solder ball for anti-electronic interference according to claim 1, wherein The shock-absorbing ball (6) is connected with the titanium alloy ball core (5) in an embedded manner. And the shock-absorbing ball (6) is elastically connected with the titanium alloy ball core (5) through the return spring (8).

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