Radio frequency chip integrated packaging module

Abstract

The radio frequency chip integrated packaging module comprises a PCB, a substrate welded on the PCB, radio frequency chips, a glass adapter plate welded on the substrate and patch antennas of which the number is equal to that of the radio frequency chips, an RDL layer is arranged on the glass adapter plate, TGV transmission holes connected with the RDL layer are formed in the glass adapter plate, the radio frequency chips and the patch antennas are respectively mounted on the glass adapter plate in a surface mounting manner, and the radio frequency chips and the patch antennas are welded on the substrate. The radio frequency chip and the patch antenna are connected through the RDL layer and the TGV transmission hole, a groove is formed in the top surface of the substrate, and the radio frequency chip mounted on the bottom surface of the glass adapter plate is arranged in the groove. According to the radio frequency chip integrated packaging module, the distance of a connecting circuit between the patch antenna and the radio frequency chip is shortened, and the connecting circuit is integrated on the glass adapter plate, so that the current loss is reduced, the signal transmission speed and stability are ensured, the reliability of the radio frequency chip integrated packaging module is improved, the thickness of the packaging module is reduced, and the area of the packaging module is reduced. And the packaging module with high integration level and reliable packaging structure is formed.

Description

Technical Field

[0001] The utility model relates to a radio frequency chip integrated packaging module, belonging to the technical field of chip packaging. Background Art

[0002] Due to different functions and chip substrate materials, radio frequency chips have low power consumption, and heat generation is not a key issue. Generally, the thickness of the chips is relatively thick. With the development of radio frequency front-end chip integration and modularization, chips with different functions need to be integrated in the same system-level packaging module. Among various system-level packagings, the substrate technology provides the shortest connection distance, the smallest pad size and center pitch from the chip to the chip and from the chip to the PCB board. Bumps are provided on the chip. The chip is first welded to the substrate through the bumps, and then solder balls are implanted on the end face of the substrate opposite to the chip. Finally, it is welded to the PCB board through the solder balls. However, when the above packaging structure is applied to the packaging of radio frequency chips, due to the large thickness of the substrate and the chip, and the large area of the chip, the size of the packaged module is relatively large, which is not conducive to the integration between circuits and devices.

[0003] Furthermore, the antenna connected to the PCB of the radio frequency chip is generally welded to the PCB and interconnected with the radio frequency chip through a circuit. The circuit connection between the antenna and the radio frequency chip is relatively long, not only the data flow of the current transmission is large, resulting in large current loss, but also affecting the signal transmission speed and stability. Summary of the Utility Model

[0004] The radio frequency chip integrated packaging module provided by the utility model shortens the distance of the connection circuit between the patch antenna and the radio frequency chip and integrates the connection circuit on the glass interposer, reduces the current loss, ensures the signal transmission speed and stability, improves the reliability of the radio frequency chip integrated packaging module, reduces the thickness of the packaging module, reduces the area of the packaging module, and forms a packaging module with high integration and reliable packaging structure.

[0005] To achieve the above object, the technical solution adopted by the utility model is:

[0006] The radio frequency chip integrated packaging module includes a PCB board, a substrate welded to the PCB board, and a radio frequency chip. It also includes a glass interposer welded to the substrate and patch antennas equal in number to the radio frequency chips. An RDL layer is arranged on the glass interposer, and TGV transmission holes connected to the RDL layer are opened. The radio frequency chip and the patch antennas are respectively mounted on the glass interposer, and the radio frequency chip and the patch antennas are connected through the RDL layer and the TGV transmission holes. A groove is opened on the top surface of the substrate, and the radio frequency chips mounted on the bottom surface of the glass interposer are all arranged in the groove.

[0007] Preferably, RDL layers are disposed on both the top surface and the bottom surface of the glass adapter board. At least one TGV transmission hole connected thereto is opened at each position where the RDL layer is located. The patch antenna and the RF chip are respectively connected to the RDL layer or the TGV transmission hole.

[0008] Preferably, the RF chips are respectively mounted on the bottom surface and the top surface of the glass adapter board, and the RDL layers on the top surface and the bottom surface of the glass adapter board are staggered and not aligned.

[0009] Preferably, the RF chips on the bottom surface and the top surface of the glass adapter board are vertically aligned, the patch antenna is mounted on the top surface of the glass adapter board and symmetrically arranged on both sides of the RF chip.

[0010] Preferably, the RF chips on the bottom surface and the top surface of the glass adapter board are vertically staggered, the RDL layer is vertically aligned with the RF chip, and the patch antenna is mounted at the position where the RDL layer is located.

[0011] Preferably, the RF chips are all mounted on the bottom surface of the glass adapter board, the RDL layer covers the bottom surface and the top surface of the glass adapter board, the patch antenna is mounted on the top surface of the glass adapter board in one-to-one alignment with the RF chip, and there is a plastic sealing layer on the substrate for encapsulating the glass adapter board, the RDL layer, the RF chip and the patch antenna into one body. The plastic sealing layer fills the groove, and the patch antenna exposes from the top surface of the plastic sealing layer.

[0012] The beneficial effects of the present utility model are as follows:

[0013] In the RF chip integrated packaging module of the present utility model, the RDL layer is disposed on the glass adapter board by using the RDL wiring technology, and the TGV transmission hole connected to the RDL layer is opened on the glass adapter board by using the TGV technology. The patch antenna is mounted on the glass adapter board by using the chip mounting process, the RF chip is mounted on the glass adapter board by using the bump welding process, and the RF chip is connected to the patch antenna by the RDL layer and the TGV transmission hole, shortening the distance of the connection circuit between the patch antenna and the RF chip and integrating the connection circuit on the glass adapter board, reducing the current loss, ensuring the speed and stability of signal transmission, and improving the reliability of the RF chip integrated packaging module.

[0014] A groove is opened on the substrate, and the RF chips mounted on the bottom surface of the glass adapter board are all arranged in the groove. The groove is used to accommodate the RF chips, reducing the thickness of the packaging module. The glass adapter board is used to mount the RF chip and the patch antenna, reducing the area of the packaging module. The RDL layer and the TGV transmission hole on the glass adapter are used to connect the RF chip and the patch antenna, improving the integration degree of the packaging module, and forming a packaging module with high integration degree and reliable packaging structure. Description of the Drawings

[0015] Figure 1 It is a schematic diagram of the RF chip integrated packaging module in the first embodiment.

[0016] Figure 2 It is a schematic diagram of the radio frequency chip integrated packaging module in Embodiment 2.

[0017] Figure 3 It is a schematic diagram of the radio frequency chip integrated packaging module in Embodiment 3. Specific Embodiment

[0018] The following will Figures 1 to 3 make a detailed description of the embodiments of the present utility model. Embodiment 1:

[0019] The radio frequency chip integrated packaging module includes a PCB board 1, a substrate 2 soldered on the PCB board 1, and a radio frequency chip 3. It further includes a glass interposer 4 soldered on the substrate 2 and patch antennas 5 equal in number to the radio frequency chips 3. An RDL layer 6 is arranged on the glass interposer, and TGV vias 7 connected to the RDL layer 6 are opened. The radio frequency chip 3 and the patch antennas 5 are respectively mounted on the glass interposer 4. The radio frequency chip 3 and the patch antennas 5 are connected through the RDL layer 6 and the TGV vias 7. A groove 21 is opened on the top surface of the substrate 2, and the radio frequency chips 3 mounted on the bottom surface of the glass interposer 4 are all arranged in the groove 21.

[0020] For the above-mentioned radio frequency chip integrated packaging module, the RDL layer 6 is arranged on the glass interposer 4 by using the RDL wiring technology, and the TGV vias 7 connected to the RDL layer 6 are opened on the glass interposer by using the TGV technology. The patch antennas 5 are mounted on the glass interposer 4 by using the chip mounting process. The radio frequency chips 3 are mounted on the glass interposer 4 by using the bump welding process. The radio frequency chip 3 and the patch antennas 5 are connected through the RDL layer 6 and the TGV vias 7, shortening the distance of the connection circuit between the patch antennas 5 and the radio frequency chip 3 and integrating the connection circuit on the glass interposer 4, reducing the current loss, ensuring the speed and stability of signal transmission, and improving the reliability of the radio frequency chip integrated packaging module. A groove 21 is opened on the substrate 2, and the radio frequency chips 3 mounted on the bottom surface of the glass interposer 4 are all arranged in the groove 21. The groove 21 is used to accommodate the radio frequency chips 3, reducing the thickness of the packaging module. The glass interposer 4 is used to mount the radio frequency chips 3 and the patch antennas 5, reducing the area of the packaging module. The radio frequency chip 3 and the patch antennas 5 are connected through the RDL layer 6 and the TGV vias 7 on the glass interposer 4, improving the integration degree of the packaging module, and forming a packaging module with high integration degree and reliable packaging structure.

[0021] Among them, RDL layers 6 are arranged on both the top surface and the bottom surface of the glass adapter board 4. At least one TGV transmission hole 7 connected thereto is opened at the position where each RDL layer 6 is located. The patch antenna 5 and the RF chip 3 are respectively connected to the RDL layer 6 or the TGV transmission hole 7. The TGV transmission hole 7 is a glass through hole opened on the glass adapter board 4 by TGV technology, so that the patch antenna 5 on the top surface of the glass adapter board can be connected to the RF chip 3 on the bottom surface of the glass adapter board through the RDL layer and the TGV transmission hole 7, and the RF chip 3 on the top surface of the glass adapter board can be connected to the patch antenna 5 on the bottom surface of the glass adapter board through the RDL layer 6 and the TGV transmission hole 7. Therefore, the positions of the RDL layer and the TGV transmission hole 7 on the glass adapter board 4 are determined according to the distribution positions of the RF chip 3 and the patch antenna 5 on the glass adapter board 4, so that the RDL layer 6 and the TGV transmission hole 7 can be arranged to connect the RF chip 3 and the patch antenna 5 on the same surface or different surfaces of the distributed glass adapter board 4.

[0022] Among them, the RF chips 3 are respectively mounted on the bottom surface and the top surface of the glass adapter board 4, and the RDL layers 6 on the top surface and the bottom surface of the glass adapter board 4 are staggered and not aligned. The RF chips 3 are distributed and mounted on the bottom surface and the top surface of the glass adapter board 4 to meet the requirements of the integrated packaging of multiple RF chips 3. The RF chips 3 mounted on the bottom surface of the glass adapter board 4 are located in the grooves 21, reducing the thickness of the entire packaging module and the area of the module.

[0023] Among them, the RF chips 3 on the bottom surface and the top surface of the glass adapter board 4 are aligned vertically, and the patch antenna 5 is mounted on the top surface of the glass adapter board 4 and symmetrically arranged on both sides of the RF chip 3. As Figure 1 shown, when the area of the substrate is small, the grooving area of the groove 21 is small, the RF chips 3 on the top surface and the bottom surface of the glass adapter board 4 are aligned vertically, the number is equal, and the utilization rate of the groove 21 is high. Embodiment 2:

[0024] The difference from Embodiment 1 is that the RF chips 3 on the bottom surface and the top surface of the glass adapter board 4 are staggered vertically, the RDL layer 6 is aligned vertically with the RF chip 3, and the patch antenna 5 is mounted at the position where the RDL layer 6 is located. As Figure 2 shown, the RF chip 3 on the top surface of the glass adapter board 4 is aligned vertically with the RDL layer 6 on the bottom surface of the glass adapter board 4, the RF chip 3 on the bottom surface of the glass adapter board 5 is aligned vertically with the RDL layer 6 on the top surface of the glass adapter board 4, the patch antenna 5 is mounted at the position where the RDL layer 6 is located, the patch antenna 5 is connected to the RDL layer 6, and is connected to the RF chip 3 through the TGV transmission hole 7 connected to the RDL layer 6, which is suitable for a packaging module with a large number of RF chips 3, a large substrate area, and a large grooving area of the groove 21. The RF chips 3 on the bottom surface and the top surface of the glass adapter board 4 are staggered vertically, leaving a part of the space in both the glass adapter board 4 and the groove 21 for air-cooled heat dissipation. Embodiment 3:

[0025] The difference from Embodiment 1 is that the radio frequency chips 3 are all mounted on the bottom surface of the glass adapter board 4, the RDL layer 6 covers the bottom and top surfaces of the glass adapter board 4, the patch antennas 5 are mounted on the top surface of the glass adapter board 4 in one-to-one alignment with the radio frequency chips 3, and there is a plastic encapsulation layer 8 on the substrate 2 that encapsulates the glass adapter board 4, the RDL layer 6, the radio frequency chips 3 and the patch antennas 5 into one body. The plastic encapsulation layer 8 fills the groove 21, and the patch antennas 5 are exposed from the top surface of the plastic encapsulation layer 8. As Figure 3 shown, when the area of the substrate is large, the radio frequency chips 3 are all mounted on the bottom surface of the glass adapter board 4 and arranged in the groove 21. The RDL layer 6 covers the bottom and top surfaces of the glass adapter board 4. The radio frequency chips 3 mounted on the bottom surface of the glass adapter board 4 are connected to the RDL layer on the bottom surface. The patch antennas 5 are mounted on the top surface of the glass adapter board 4 and connected to the RDL layer on the top surface. The RDL layer on the bottom surface and the RDL layer on the top surface are connected through the TGV vias 7 to form a one-to-one correspondence connection between the radio frequency chips 3 and the patch antennas 5. The plastic encapsulation layer 8 positions the radio frequency chips 3 in the groove 21 and increases the thickness of the entire encapsulation module with the plastic encapsulation layer 8 to meet the thickness requirement of the encapsulation module.

[0026] The technical solutions of the embodiments of the present invention are completely described above in conjunction with the accompanying drawings. It should be noted that the described embodiments are only a part of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the protection scope of the present invention.

Claims

1. Radio frequency chip integrated packaging module, including a PCB board, a substrate soldered on the PCB board, and a radio frequency chip, characterized in that: It further includes a glass interposer welded to the substrate and patch antennas equal in number to the RF chips. An RDL layer is disposed on the glass interposer, and TGV vias connected to the RDL layer are formed. The RF chips and the patch antennas are respectively mounted on the glass interposer, and the RF chips and the patch antennas are connected through the RDL layer and the TGV vias. A groove is formed on the top surface of the substrate, and the RF chips mounted on the bottom surface of the glass interposer are all disposed in the groove.

2. The RF chip integrated packaging module according to claim 1, characterized in that: RDL layers are disposed on both the top surface and the bottom surface of the glass interposer, and at least one TGV via connected thereto is formed at each position where the RDL layer is located. The patch antennas and the RF chips are respectively connected to the RDL layer or the TGV vias.

3. The radio frequency chip integrated packaging module according to claim 2, wherein: The RF chips are respectively mounted on the bottom surface and the top surface of the glass interposer, and the RDL layers on the top surface and the bottom surface of the glass interposer are staggered and not aligned.

4. The radio frequency chip integrated packaging module according to claim 3, wherein: The RF chips on the bottom surface and the top surface of the glass interposer are vertically aligned, and the patch antennas are mounted on the top surface of the glass interposer and symmetrically disposed on both sides of the RF chips.

5. The RF chip integrated packaging module according to claim 3, characterized in that: The RF chips on the bottom surface and the top surface of the glass interposer are vertically staggered, the RDL layer is vertically aligned with the RF chips, and the patch antennas are mounted at the positions where the RDL layer is located.

6. The radio frequency chip integrated packaging module according to claim 2, wherein: The RF chips are all mounted on the bottom surface of the glass interposer, the RDL layer covers the bottom surface and the top surface of the glass interposer, the patch antennas are mounted on the top surface of the glass interposer in one-to-one alignment with the RF chips, and there is a plastic encapsulation layer on the substrate that encapsulates the glass interposer, the RDL layer, the RF chips and the patch antennas into one body. The plastic encapsulation layer fills the groove, and the patch antennas expose from the top surface of the plastic encapsulation layer.

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