Gateway based on multi-communication protocol conversion

Abstract

The utility model discloses a gateway based on multi-communication protocol conversion. The gateway mainly solves the problem that data summarization of existing different fire-fighting detection devices is not changed. The gateway comprises an MCU main control chip, a plurality of communication modules connected with the MCU main control chip through serial ports, a communication isolation circuit connected with the MCU main control chip, and a power supply circuit connected with the MCU main control chip. The plurality of communication modules comprise a WIFI module, a Bluetooth module, an infrared module, an LORA module and a 5G module. Through the above design, the gateway provided by the utility model is designed based on multi-communication protocol conversion, and achieves the function of analyzing or transmitting the data measured by the measuring equipment to a PC terminal through four different wireless communication modes. The design is small in size and suitable for being carried outdoors.

Description

Technical Field

[0001] The utility model relates to a gateway, specifically to a gateway based on multi - communication protocol conversion. Background Art

[0002] Due to the diversification of fire detection and reconnaissance equipment and different communication methods, when referring to and comprehensively evaluating data, it is necessary to separately copy the data of various devices and import them into a computer for processing. Often at the scene of a fire or other accidents, various types of data need to be viewed simultaneously, and the correct judgment of the on - site situation and timely corresponding measures need to be taken in the shortest time. There is simply not enough time to separately copy the measurement data of various devices.

[0003] Therefore, it is considered to design a data gateway that is compatible with multiple wireless transmission modes, which can timely collect various types of data of on - site devices and transmit them to the same computer. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a gateway based on multi - communication protocol conversion, mainly solving the problem of inconvenient data aggregation of existing different fire detection and reconnaissance devices.

[0005] To achieve the above - mentioned purpose, the technical solution adopted by the utility model is as follows:

[0006] A gateway based on multi - communication protocol conversion includes an MCU main control chip, multiple communication modules connected to the MCU main control chip through serial ports, a communication isolation circuit connected to the MCU main control chip, and a power supply circuit connected to the MCU main control chip; the multiple communication modules include a WIFI module, a Bluetooth module, an infrared module, a LORA module, and a 5G module.

[0007] Further, in the utility model, the model of the MCU main control chip is STM32F407, and this chip has an internal ARM Cortex - M4 32 - bit RISC core.

[0008] Further, in the present utility model, the communication isolation circuit includes an optocoupler isolation chip U1, a resistor R2 with one end connected to the first pin of the isolation chip U1, resistors R1, R3, and a capacitor C1 with one end connected to the first pin of the isolation chip U1, a resistor R5 connected to the other end of the resistor R2, a resistor R4 with one end connected to the other end of the resistor R5, a capacitor C2 with one end connected to the fourth pin of the isolation chip U1, a triode T1 with its base connected to the third pin of the isolation chip U1 and its collector connected to the common end of the resistor R5 and the resistor R2, and resistors R6 and a capacitor C3 with one end connected to the emitter of the triode T1. Among them, the other ends of the resistors R1, R3, R4, R6 and the capacitors C1, C2, C3 are grounded; the second pin of the isolation chip U1 and the common end of the resistors R1 and R3 are also connected to the MCU main control chip.

[0009] Further, in the present utility model, the power supply circuit includes an external power input circuit, an MCU power circuit, a communication module power circuit, and a 5G module power circuit connected to the external power input circuit; among them, the communication module power circuit supplies power to the WIFI module, the Bluetooth module, the infrared module, and the LORA module.

[0010] Further, in the present utility model, the MCU power circuit includes a DCDC buck chip U4 of model TPS563200, a capacitor C20 with one end connected to the third pin of the DCDC buck chip U4 and the other end grounded, a resistor R22 with one end connected to the fifth pin of the DCDC buck chip U4 and the other end connected to the external input power supply VSYS, a capacitor C6 with one end connected to the sixth pin of the DCDC buck chip U4, an inductor L3 connected to the other end of the capacitor C6, a capacitor C18 connected between the inductor L3 and the fourth pin of the DCDC buck chip U4, a resistor R17 connected in parallel across the capacitor C18, a resistor R20 with one end connected to the first pin of the DCDC buck chip U4, a sliding rheostat RV2 with one fixed end connected to the other end of the resistor R20 and the other fixed end and the sliding end connected to the fourth pin of the DCDC buck chip U4, inductors L4, capacitors C21 and C22 with one end connected to the common end of the capacitor C18 and the inductor L3, a capacitor C23 with one end connected to the other end of the inductor L4 and the other end grounded, an LDO chip U5 with its second pin connected to the common end of the inductor L4 and the capacitor C23, a resistor R24 connected between the first and third pins of the LDO chip U5, and a capacitor C27 with one end connected to the fifth pin of the LDO chip U5 and the other end grounded; among them, the other ends of the capacitors C21 and C22 are connected and then grounded, the first pin of the DCDC buck chip U4 is grounded, and the third pin of the DCDC buck chip U4 is connected to the external input power supply VSYS.

[0011] Further, in the present utility model, the communication module power supply circuit includes an LDO chip U12 whose first pin is connected to the common terminal of an inductor L4 and a capacitor C23 in an external power supply input circuit, a capacitor C39 connected between the first and second pins of the LDO chip U12, a resistor R48 with one end connected to the third pin of the LDO chip U12 and the other end connected to the GPO_LORA_PWR pin of the MCU main control chip, and a capacitor C40 with one end connected to the fifth pin of the LDO chip U12 and the other end grounded; wherein, the fifth pin of the LDO chip U12 outputs a 3.3V voltage to supply power to the LORA module;

[0012] An LDO chip U11 whose first pin is connected to the common terminal of an inductor L4 and a capacitor C23 in the MCU power supply circuit, a capacitor C37 connected between the first and second pins of the LDO chip U12, a resistor R42 with one end connected to the third pin of the LDO chip U12 and the other end connected to the GPO_WIFI_PWR pin of the MCU main control chip, and a capacitor C38 with one end connected to the fifth pin of the LDO chip U12 and the other end grounded; wherein, the fifth pin of the LDO chip U11 outputs a 3.3V voltage to supply power to the WIFI module.

[0013] Further, in the present utility model, the 5G module power supply circuit includes a DCDC buck chip U3 of model TPS563200, a capacitor C19 with one end connected to the third pin of the DCDC buck chip U3 and the other end grounded, a resistor R21 with one end connected to the fifth pin of the DCDC buck chip U3 and the other end connected to the GPO_5g_EN pin of the MCU main control chip, a capacitor C15 with one end connected to the sixth pin of the DCDC buck chip U3, an inductor L2 connected to the other end of the capacitor C15, a capacitor C17 connected between the inductor L2 and the fourth pin of the DCDC buck chip U3, a resistor R16 connected in parallel across the two ends of the capacitor C17, a resistor R19 with one end connected to the first pin of the DCDC buck chip U3, a sliding rheostat RV1 with one fixed end connected to the other end of the resistor R19 and the other fixed end and the sliding end connected to the fourth pin of the DCDC buck chip U3, an inductor L1, a capacitor C24 and a capacitor C25 with one end connected to the common terminal of the capacitor C17 and the inductor L2, and a capacitor C26 with one end connected to the other end of the inductor L1 and the other end grounded; wherein, the other ends of the capacitor C24 and the capacitor C25 are connected and then grounded, and the third pin of the DCDC buck chip U3 is connected to an external input power supply VSYS.

[0014] Compared with the prior art, the present utility model has the following beneficial effects:

[0015] (1) The gateway of the present utility model is designed based on multi - communication protocol conversion, realizing the function of parsing or transmitting the data measured by the measuring device to the PC side through 4 different wireless communication methods; this design is small in size and suitable for carrying around in the wild.

[0016] (2) Through the design of the power supply circuit of the present utility model, for the power supply voltages of each communication module (the 5G module has a relatively large power consumption and is independently powered), which are all 3.3V and have relatively low power consumption, the TPS563200 chip with a relatively large load capacity (up to 3A) is used, enabling the common use of 3.7V, which is regulated by LDO and supplied to each communication module for use, so that each communication module can maintain stable power supply, facilitating data parsing and transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is the schematic diagram of the communication isolation circuit in an embodiment of the present utility model.

[0018] Figure 2 It is the schematic diagram of the MCU main control chip in an embodiment of the present utility model.

[0019] Figure 3 It is the schematic diagram of the external input power supply circuit in an embodiment of the present utility model.

[0020] Figure 4 It is the schematic diagram of the MCU power supply circuit in an embodiment of the present utility model.

[0021] Figure 5 It is the schematic diagram of the power supply of the LORA module in the communication module in an embodiment of the present utility model.

[0022] Figure 6 It is the schematic diagram of the power supply of the WIFI module in the communication module in an embodiment of the present utility model.

[0023] Figure 7 It is the schematic diagram of the 5G module power supply circuit in an embodiment of the present utility model.

[0024] Figure 8 It is the schematic diagram of the level conversion chip in an embodiment of the present utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0025] The present utility model will be further described below in conjunction with the drawings and embodiments. The implementation manners of the present utility model include but are not limited to the following embodiments.

[0026] Embodiment

[0027] A gateway based on multi - communication protocol conversion disclosed by the utility model includes an MCU main control chip, multiple communication modules connected to the MCU main control chip through serial ports, a communication isolation circuit connected to the MCU main control chip, and a power supply circuit connected to the MCU main control chip; the multiple communication modules include a WIFI module, a Bluetooth module, an infrared module, a LORA module, and a 5G module. This gateway can support multiple wireless transmission modes simultaneously, including data reception and transmission of wireless transmission modules such as WIFI, Bluetooth, infrared, and Lora modules. This gateway can receive data from each detection device through each wireless communication module, parse the received data packet on the premise of knowing the communication protocols of each device, and send the parsing result to the PC side through the 5G communication module.

[0028] Meanwhile, this gateway can also communicate with the PC side through the 5G communication module, receive instructions sent by the computer, parse the instructions through software, and then send the instructions to the corresponding detection devices through each wireless communication module.

[0029] In this embodiment, the model of the MCU main control chip is STM32F407, and this chip has an in - built 32 - bit RISC core of ARM Cortex - M4. As Figure 2 shown, this chip has 6 serial ports (4 USARTs and 2 UARTs), 3 SPI channels, 3 I2C channels, etc. The communication interfaces are sufficient for this design, without the need to use an external expansion chip for communication interfaces, reducing the design difficulty and improving the system stability at the same time.

[0030] In this embodiment, as Figure 1 shown, the communication isolation circuit includes an optocoupler isolation chip U1, a resistor R2 with one end connected to the 1st pin of the isolation chip U1, resistors R1, R3, and a capacitor C1 with one end connected to the 1st pin of the isolation chip U1, a resistor R5 connected to the other end of the resistor R2, a resistor R4 with one end connected to the other end of the resistor R5, a capacitor C2 with one end connected to the 4th pin of the isolation chip U1, a triode T1 with the base connected to the 3rd pin of the isolation chip U1 and the collector connected to the common end of the resistor R5 and the resistor R2, and resistors R6 and a capacitor C3 with one end connected to the emitter of the triode T1. Among them, the other ends of the resistors R1, R3, R4, R6 and the capacitors C1, C2, C3 are grounded; the 2nd pin of the isolation chip U1 and the common end of the resistors R1, R3 are also connected to the MCU main control chip.

[0031] In this embodiment, the power supply circuit includes an external power input circuit, an MCU power circuit, a communication module power circuit, and a 5G module power circuit connected to the external power input circuit; among them, the communication module power circuit supplies power to the WIFI module, Bluetooth module, infrared module, and LORA module. As Figure 3As shown, the external power input uses a DC 5V, and the interface is a popular TYPE-C port. It can be powered by a supporting 5V adapter (or a common mobile phone charger), or by a mobile 5V power source (power bank).

[0032] In this embodiment, the MCU power supply circuit includes a DCDC buck chip U4 of model TPS563200, a capacitor C20 with one end connected to the 3rd pin of the DCDC buck chip U4 and the other end grounded, a resistor R22 with one end connected to the 5th pin of the DCDC buck chip U4 and the other end connected to the external input power supply VSYS, a capacitor C6 with one end connected to the 6th pin of the DCDC buck chip U4, an inductor L3 connected to the other end of the capacitor C6, a capacitor C18 connected between the inductor L3 and the 4th pin of the DCDC buck chip U4, a resistor R17 connected in parallel across the two ends of the capacitor C18, a resistor R20 with one end connected to the 1st pin of the DCDC buck chip U4, a sliding rheostat RV2 with one fixed end connected to the other end of the resistor R20 and the other fixed end and the sliding end connected to the 4th pin of the DCDC buck chip U4, an inductor L4, a capacitor C21 and a capacitor C22 with one end connected to the common end of the capacitor C18 and the inductor L3, a capacitor C23 with one end connected to the other end of the inductor L4 and the other end grounded, an LDO chip U5 with its 2nd pin connected to the common end of the inductor L4 and the capacitor C23, a resistor R24 connected between the 1st and 3rd pins of the LDO chip U5, and a capacitor C27 with one end connected to the 5th pin of the LDO chip U5 and the other end grounded; wherein, the other ends of the capacitor C21 and the capacitor C22 are connected and then grounded, the 1st pin of the DCDC buck chip U4 is grounded, and the 3rd pin of the DCDC buck chip U4 is connected to the external input power supply VSYS. The power supply voltage of the MCU is 3.3V, and the externally input 5VDC needs to be stepped down.

[0033] As Figure 4 shown, first use a buck switching power supply to step down the 5V DC voltage to about 3.7V through the DCDC chip TPS563200, and then use an LDO to step down and regulate the voltage to 3.3V. This can not only ensure the efficiency of the power supply, but also limit the ripple of the MCU power supply.

[0034] TPS563200 is a 3A synchronous buck converter using a 6-pin SOT-23 package, which internally integrates FETs field effect MOS transistors with ultra-low impedance (only 68mΩ) and has excellent performance.

[0035] In this embodiment, the power supply circuit of the communication module includes an LDO chip U12 whose first pin is connected to the common terminal of the inductor L4 and the capacitor C23 in the external power supply input circuit, a capacitor C39 connected between the first and second pins of the LDO chip U12, a resistor R48 whose one end is connected to the third pin of the LDO chip U12 and the other end is connected to the GPO_LORA_PWR pin of the MCU main control chip, and a capacitor C40 whose one end is connected to the fifth pin of the LDO chip U12 and the other end is grounded; wherein, the fifth pin of the LDO chip U12 outputs a 3.3V voltage to supply power to the LORA module; the power supply voltages of each communication module (the 5G module has a large power consumption and is powered separately) are all 3.3V, and the power consumption is not large, while the load capacity of the TPS563200 is relatively large (up to 3A), so 3.7V can be used in common and is supplied to each communication module after being regulated by the LDO. As Figure 5 shown is the connection schematic diagram of the power supply circuit of the communication module and the LORA module.

[0036] An LDO chip U11 whose first pin is connected to the common terminal of the inductor L4 and the capacitor C23 in the MCU power supply circuit, a capacitor C37 connected between the first and second pins of the LDO chip U12, a resistor R42 whose one end is connected to the third pin of the LDO chip U12 and the other end is connected to the GPO_WIFI_PWR pin of the MCU main control chip, and a capacitor C38 whose one end is connected to the fifth pin of the LDO chip U12 and the other end is grounded; wherein, the fifth pin of the LDO chip U11 outputs a 3.3V voltage to supply power to the WIFI module. As Figure 6 shown is the connection schematic diagram of the power supply circuit of the communication module and the WIFI module.

[0037] In this embodiment, since the VCC power supply voltage range of the 5G communication module is 3.3 - 4.4V, and the typical power supply voltage is 3.7V. The 5G communication module has a large power consumption and uses a separate DCDC. As Figure 7As shown in the figure, the power supply circuit of the 5G module includes a DCDC buck chip U3 of model TPS563200, a capacitor C19 with one end connected to the 3rd pin of the DCDC buck chip U3 and the other end grounded, a resistor R21 with one end connected to the 5th pin of the DCDC buck chip U3 and the other end connected to the GPO_5g_EN pin of the MCU main control chip, a capacitor C15 with one end connected to the 6th pin of the DCDC buck chip U3, an inductor L2 connected to the other end of the capacitor C15, a capacitor C17 connected between the inductor L2 and the 4th pin of the DCDC buck chip U3, a resistor R16 connected in parallel across the capacitor C17, a resistor R19 with one end connected to the 1st pin of the DCDC buck chip U3, a slide rheostat RV1 with one fixed end connected to the other end of the resistor R19 and the other fixed end and the sliding end connected to the 4th pin of the DCDC buck chip U3, an inductor L1, a capacitor C24 and a capacitor C25 with one end connected to the common end of the capacitor C17 and the inductor L2, and a capacitor C26 with one end connected to the other end of the inductor L1 and the other end grounded; wherein, the other ends of the capacitor C24 and the capacitor C25 are connected and then grounded, and the 3rd pin of the DCDC buck chip U3 is connected to an external input power supply VSYS. In this embodiment, since the IO port of the 5G communication module only supports a level of 1.8V, a level conversion chip must be added between the MCU and the 5G communication module. As Figure 8 shown, in this embodiment, TXB0108 is selected as the level conversion chip.

[0038] The Bluetooth module and the infrared module perform full-duplex communication with the MCU through a serial cable, and the circuit is simple, which will not be elaborated here.

[0039] In this embodiment, 5 indicator lights are also designed, namely a power indicator light, a Bluetooth communication indicator light, a WIFI communication indicator light, a LORA communication indicator light, and a 5G communication indicator light. The power indicator light is always on after the external power supply is connected. The other indicator lights respectively represent the communication status of their corresponding modules. If the corresponding module is communicating, the indicator light is on, otherwise it is off. The indicator lights are selected as ultra-low-power high-brightness LED lights and can be directly driven by the output of the IO port of the MCU.

[0040] Through the above design, the gateway of the present utility model is designed based on multi-communication protocol conversion, and realizes the function of parsing or transmitting the data measured by the measuring device to the PC side through 4 different wireless communication methods; this design is small in size and suitable for carrying around in the wild.

[0041] The above embodiments are only one of the preferred embodiments of the present utility model and should not be used to limit the protection scope of the present utility model. Any meaningless changes or touch-ups made on the main design idea and spirit of the present utility model, as long as the technical problems solved are still the same as those of the present utility model, should be included in the protection scope of the present utility model.

Claims

1. A gateway based on multi-communication protocol conversion, characterized in that, It includes an MCU main control chip, multiple communication modules connected to the MCU main control chip through a serial port, a communication isolation circuit connected to the MCU main control chip, and a power supply circuit connected to the MCU main control chip; the multiple communication modules include a WIFI module, a Bluetooth module, an infrared module, a LORA module, and a 5G module.

2. The gateway based on multi - communication protocol conversion according to claim 1, characterized in that, The model of the MCU main control chip is STM32F407, and this chip has an embedded ARM Cortex-M4 32-bit RISC core.

3. The gateway based on multi-communication protocol conversion according to claim 2, characterized in that The communication isolation circuit includes an optocoupler isolation chip U1, a resistor R2 with one end connected to the first pin of the isolation chip U1, resistors R1, R3, and a capacitor C1 with one end connected to the first pin of the isolation chip U1, a resistor R5 connected to the other end of the resistor R2, a resistor R4 with one end connected to the other end of the resistor R5, a capacitor C2 with one end connected to the fourth pin of the isolation chip U1, a triode T1 with the base connected to the third pin of the isolation chip U1 and the collector connected to the common end of the resistor R5 and the resistor R2, and a resistor R6 and a capacitor C3 with one end connected to the emitter of the triode T1. Among them, the other ends of the resistors R1, R3, R4, R6 and the capacitors C1, C2, C3 are grounded; the second pin of the isolation chip U1 and the common end of the resistors R1, R3 are also connected to the MCU main control chip.

4. The gateway based on multi - communication protocol conversion according to claim 3, wherein, The power supply circuit includes an external power input circuit, an MCU power circuit, a communication module power circuit, and a 5G module power circuit connected to the external power input circuit; among them, the communication module power circuit supplies power to the WIFI module, the Bluetooth module, the infrared module, and the LORA module.

5. The gateway based on multi-communication protocol conversion according to claim 4, characterized in that The MCU power supply circuit includes a DCDC buck chip U4 of model TPS563200, a capacitor C20 with one end connected to the 3rd pin of the DCDC buck chip U4 and the other end grounded, a resistor R22 with one end connected to the 5th pin of the DCDC buck chip U4 and the other end connected to an external input power supply VSYS, a capacitor C6 with one end connected to the 6th pin of the DCDC buck chip U4, an inductor L3 connected to the other end of the capacitor C6, a capacitor C18 connected between the inductor L3 and the 4th pin of the DCDC buck chip U4, a resistor R17 connected in parallel across the capacitor C18, a resistor R20 with one end connected to the 1st pin of the DCDC buck chip U4, a potentiometer RV2 with one fixed end connected to the other end of the resistor R20 and the other fixed end and the sliding end connected to the 4th pin of the DCDC buck chip U4, an inductor L4, a capacitor C21 and a capacitor C22 with one end connected to the common end of the capacitor C18 and the inductor L3, a capacitor C23 with one end connected to the other end of the inductor L4 and the other end grounded, an LDO chip U5 with its 2nd pin connected to the common end of the inductor L4 and the capacitor C23, a resistor R24 connected between the 1st and 3rd pins of the LDO chip U5, and a capacitor C27 with one end connected to the 5th pin of the LDO chip U5 and the other end grounded; wherein, the other ends of the capacitor C21 and the capacitor C22 are connected and then grounded, the 1st pin of the DCDC buck chip U4 is grounded, and the 3rd pin of the DCDC buck chip U4 is connected to the external input power supply VSYS.

6. The gateway based on multi-communication protocol conversion according to claim 5, characterized in that, The communication module power supply circuit includes an LDO chip U12 with its 1st pin connected to the common end of the inductor L4 and the capacitor C23 in the external power supply input circuit, a capacitor C39 connected between the 1st and 2nd pins of the LDO chip U12, a resistor R48 with one end connected to the 3rd pin of the LDO chip U12 and the other end connected to the GPO_LORA_PWR pin of the MCU main control chip, and a capacitor C40 with one end connected to the 5th pin of the LDO chip U12 and the other end grounded; wherein, the 5th pin of the LDO chip U12 outputs a 3.3V voltage to supply power to the LORA module; An LDO chip U11 with its 1st pin connected to the common end of the inductor L4 and the capacitor C23 in the MCU power supply circuit, a capacitor C37 connected between the 1st and 2nd pins of the LDO chip U12, a resistor R42 with one end connected to the 3rd pin of the LDO chip U12 and the other end connected to the GPO_WIFI_PWR pin of the MCU main control chip, and a capacitor C38 with one end connected to the 5th pin of the LDO chip U12 and the other end grounded; wherein, the 5th pin of the LDO chip U11 outputs a 3.3V voltage to supply power to the WIFI module.

7. The gateway based on multi-communication protocol conversion according to claim 6, characterized in that, The 5G module power supply circuit includes a DCDC buck chip U3 of model TPS563200, a capacitor C19 with one end connected to the 3rd pin of the DCDC buck chip U3 and the other end grounded, a resistor R21 with one end connected to the 5th pin of the DCDC buck chip U3 and the other end connected to the GPO_5g_EN pin of the MCU main control chip, a capacitor C15 with one end connected to the 6th pin of the DCDC buck chip U3, an inductor L2 connected to the other end of the capacitor C15, a capacitor C17 connected between the inductor L2 and the 4th pin of the DCDC buck chip U3, a resistor R16 connected in parallel across the capacitor C17, a resistor R19 with one end connected to the 1st pin of the DCDC buck chip U3, a slide rheostat RV1 with one fixed end connected to the other end of the resistor R19 and the other fixed end and the sliding end connected to the 4th pin of the DCDC buck chip U3, an inductor L1, a capacitor C24 and a capacitor C25 with one end connected to the common end of the capacitor C17 and the inductor L2, and a capacitor C26 with one end connected to the other end of the inductor L1 and the other end grounded; wherein, the other ends of the capacitor C24 and the capacitor C25 are connected and then grounded, and the 3rd pin of the DCDC buck chip U3 is connected to an external input power supply VSYS.

Images