Radio frequency unit circuit board and remote control radio frequency unit

Abstract

The utility model relates to a radio frequency unit circuit board and a remote control radio frequency unit, the radio frequency unit circuit board comprises a first signal layer, a ground layer, a power supply layer and a second signal layer which are stacked from top to bottom, a first dielectric layer is arranged between the first signal layer and the ground layer, an insulating layer is arranged between the ground layer and the power supply layer, and a second dielectric layer is arranged between the second signal layer and the ground layer. A second dielectric layer is arranged between the power supply layer and the second signal layer, and a copper plating layer is electroplated on the board edge of the radio frequency unit circuit board. The beneficial effects of the utility model lie in that the heat dissipation performance can be improved, and the copper plating layer is prevented from being separated from the dielectric layer.

Description

Technical Field

[0001] The utility model relates to the technical field of remote control radio frequency units, and particularly relates to a radio frequency unit circuit board and a remote control radio frequency unit. Background Art

[0002] Due to the complex internal structure of the circuit board of the remote control radio frequency unit (RRU), which contains many modules and components that require sufficient space for reasonable layout and heat dissipation, although the RRU product is designed with only a two-layer board, the thickness of the product will reach 3.3 mm. This will cause the heat dissipation copper surface on the edge of the circuit board to separate during infrared soldering (IR). The specific process is that the heat dissipation copper surface is heated and then conducts heat to the dielectric layer of the board material. Due to the untimely heat dissipation and the different thermal expansion coefficients of the electroplated copper on the heat dissipation copper surface and the board material dielectric layer, the circuit board will delaminate after passing through IR. It is necessary to design a circuit board that can solve the heat dissipation problem and increase the bonding force between the heat dissipation copper surface and the copper layer on the board material. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a radio frequency unit circuit board and a remote control radio frequency unit that can improve the heat dissipation performance and avoid the separation of the copper plating layer from the dielectric layer.

[0004] A radio frequency unit circuit board includes a first signal layer, a ground layer, a power layer, and a second signal layer stacked from top to bottom. A first dielectric layer is provided between the first signal layer and the ground layer, an insulating layer is provided between the ground layer and the power layer, and a second dielectric layer is provided between the power layer and the second signal layer. The edge of the radio frequency unit circuit board is electroplated with a copper plating layer.

[0005] In the above solution, after the copper plating layer is heated, the heat is conducted to the first signal layer, the first dielectric layer, the ground layer, the insulating layer, the power layer, the second dielectric layer, and the second signal layer. The four-layer stacked structure design is more conducive to the effective conduction of heat compared with the two-layer board, thereby improving the heat dissipation performance of the radio frequency unit circuit board. Since the two intermediate layers are added, the more inner layers the copper plating layer contacts, the better the bonding force, so that the copper plating layer and the first dielectric layer and the second dielectric layer will no longer separate during infrared soldering (IR) of the radio frequency unit circuit board. In addition, the stacked first signal layer, ground layer, power layer, and second signal layer can significantly improve the high-frequency performance of the radio frequency unit circuit board.

[0006] Further, the first signal layer, the ground layer, the power layer, and the second signal layer are all made of High-Tg materials with a TG value between 165 and 175.

[0007] In the above solution, the first signal layer, grounding layer, power supply layer, and second signal layer made of High-Tg materials with TG values between 165 and 175 have good heat dissipation performance and can withstand high temperatures without significant thermal expansion and deformation. In this way, the RF circuit board can conduct and distribute heat more uniformly as a whole, improving the overall heat dissipation effect, and thus reducing the separation of the first dielectric layer and the second dielectric layer from the copper plating layer.

[0008] Further, the thickness of the insulating layer is 64 mil, and both the grounding layer and the power supply layer are covered with copper layers, and the thickness of the copper layer is 1 ounce.

[0009] In the above solution, the 64-mil insulating layer thickness provides good electrical isolation, ensuring stable electrical performance between signal layers and between signal layers and the power supply and grounding layers, reducing the risk of short circuits and interference. The thicker insulating layer helps improve the thermal isolation effect, preventing heat transfer between the grounding layer and the power supply layer, which is beneficial to the overall heat dissipation performance. The copper layer, as a heat-conducting material, can effectively dissipate heat, helping to quickly conduct heat away from the heat source, reducing temperature concentration, and improving the heat dissipation capacity of the entire circuit board. Moreover, the copper layers on the grounding layer and the power supply layer are more stable in combination with the copper plating layer electroplated on the edge of the RF unit circuit board.

[0010] Further, the thickness of the insulating layer is 64 mil, and both the grounding layer and the power supply layer are covered with copper layers, and the thickness of the copper layer is 2 ounces.

[0011] In the above solution, when the infrared reflow soldering (IR) temperature is higher, with the insulating layer thickness remaining unchanged, a copper layer with a thickness of 2 ounces can be used. In this way, the thicker copper layer is more conducive to heat dissipation, and the connection surface between the copper layer and the copper plating layer electroplated on the edge of the RF unit circuit board is larger and more stable.

[0012] Further, the thicknesses of both the first dielectric layer and the second dielectric layer are 32 mil.

[0013] In the above solution, after adding the two-layer structure, the original single dielectric layer is divided into the first dielectric layer and the second dielectric layer, and the thicknesses of the first dielectric layer and the second dielectric layer are 32 mil. In this way, while ensuring the overall thickness of the RF unit circuit board, the heat dissipation performance can be improved, and at the same time, the separation of the copper plating layer electroplated on the edge of the RF unit circuit board from the first dielectric layer and the second dielectric layer is avoided.

[0014] Further, both the first dielectric layer and the second dielectric layer are made of PP materials.

[0015] In the above solution, PP materials have good heat resistance and can withstand relatively high temperature changes within a certain range, making them suitable for high-temperature processes such as infrared reflow soldering.

[0016] Further, both the first dielectric layer and the second dielectric layer are formed by laminating 4 layers of 7228PP material.

[0017] In the above solution, the lamination structure of four layers of 7228PP material can improve the overall thermal stability of the first dielectric layer and the second one, contribute to improving the performance of the circuit board in a high-temperature environment, and further prevent the copper plating layer on the edge of the radio frequency unit circuit board from separating from the first dielectric layer and the second dielectric layer.

[0018] Further, holes for electrical connection are formed on the first signal layer, the ground layer, the power supply layer, and the second signal layer. The minimum copper thickness on the holes is 0.8 microns, and the average copper thickness on the holes is at least 1.0 microns.

[0019] In the above solution, the copper thickness of the holes on the first signal layer, the ground layer, the power supply layer, and the second signal layer is made according to the standard hole copper processing standard of IPC-6012 class III. In this way, the copper layer thickness of the holes meets the high-quality requirements during the manufacturing process, enhances the stability and reliability of electrical connection, reduces the risk of poor contact, and thus is suitable for high-frequency signal transmission.

[0020] Further, the thickness after lamination of the first signal layer, the first dielectric layer, the ground layer, the insulating layer, the power supply layer, the second dielectric layer, and the second signal layer is between 3.06 and 3.54.

[0021] In the above solution, the thickness of the radio frequency unit circuit board between 3.06 and 3.54 helps to ensure the quality of signal transmission, reduce signal attenuation and reflection, improve signal integrity, which is particularly important in high-frequency applications.

[0022] A remote control radio frequency unit includes the radio frequency unit circuit board according to any one of the above solutions.

[0023] A radio frequency unit circuit board and a remote control radio frequency unit of the present utility model have the beneficial effects of being able to improve heat dissipation performance and prevent the separation of the copper plating layer from the dielectric layer. After the copper plating layer is heated, the heat is conducted to the first signal layer, the first dielectric layer, the ground layer, the insulating layer, the power supply layer, the second dielectric layer, and the second signal layer. The four-layer stack structure design is more conducive to the effective conduction of heat compared with a two-layer board, thus being able to improve the heat dissipation performance of the radio frequency unit circuit board. Since the intermediate two-layer structure is added, the more inner layers the copper plating layer contacts, the better the bonding force, so that the copper plating layer and the first dielectric layer, the second dielectric layer no longer separate during infrared reflow soldering (IR) of the radio frequency unit circuit board. Description of the Drawings

[0024] Figure 1 It is a simple schematic diagram of the radio frequency unit circuit board of Embodiment 1.

[0025] Figure 2 It is an IR slice diagram of a circuit board with only two signal layers.

[0026] Figure 3 It is an IR slice diagram of the radio frequency unit circuit board of Embodiment 1.

[0027] Figure 4 It is a simple schematic diagram of the radio frequency unit circuit board of Embodiment 3.

[0028] Explanation of the reference numerals in the drawings: Embodiment 1

[0029] 1. First signal layer; 2. First dielectric layer; 3. Ground layer; 4. Insulating layer; 5. Power supply layer; 6. Second dielectric layer; 7. Second signal layer; 8. Copper plating layer. Embodiment 2

[0030] 9. First signal layer; 10. Dielectric layer; 11. First ground layer; 12. Insulating layer; 13. Power supply layer; 14. Second signal layer; 15. Second ground layer; 16. Third signal layer. Detailed implementation manners

[0031] Next, a radio frequency unit circuit board and a remote control radio frequency unit of the present utility model will be further described in detail in conjunction with specific embodiments and the accompanying drawings. Embodiment 1

[0032] As Figure 1 and Figure 2 shown, in a preferred embodiment, a radio frequency unit circuit board of the present utility model includes a first signal layer 1, a ground layer 3, a power supply layer 5, and a second signal layer 7 stacked from top to bottom. A first dielectric layer 2 is provided between the first signal layer 1 and the ground layer 3, an insulating layer 4 is provided between the ground layer 3 and the power supply layer 5, a second dielectric layer 6 is provided between the power supply layer 5 and the second signal layer 7, and a copper plating layer 8 is electroplated on the edge of the radio frequency unit circuit board. After the copper plating layer 8 is heated, the heat is conducted to the first signal layer 1, the first dielectric layer 2, the ground layer 3, the insulating layer 4, the power supply layer 5, the second dielectric layer 6, and the second signal layer 7. The four-layer stacked structure design is more conducive to the effective conduction of heat than a two-layer board, thereby improving the heat dissipation performance of the radio frequency unit circuit board. Since the intermediate two-layer structure is added, the more inner layers the copper plating layer 8 contacts, the better the bonding force, so that the copper plating layer 8 and the first dielectric layer 2, the second dielectric layer 6 will no longer separate during infrared soldering (IR). In addition, the stacked first signal layer 1, ground layer 3, power supply layer 5, and second signal layer 7 can significantly improve the high-frequency performance of the radio frequency unit circuit board.

[0033] In the above embodiments, the copper plating layer 8 on the edge of the RF unit circuit board is formed in the PNL process, that is, electroplated after the entire circuit board is laminated. Moreover, the copper layers on the first signal layer 1, the ground layer 3, the power layer 5, and the second signal layer 7 need to be roughened first, so that the bonding force between the copper layer and the copper plating layer 8 will be better, avoiding the separation of the copper plating layer 8 from the first dielectric layer 2 and the second dielectric layer 6 during infrared soldering (IR).

[0034] As shown in the figure, in this embodiment, the first signal layer 1, the ground layer 3, the power layer 5, and the second signal layer 7 are all made of High-Tg materials with a TG value between 165 and 175. The first signal layer 1, the ground layer 3, the power layer 5, and the second signal layer 7 made of High-Tg materials with a TG value between 165 and 175 have good heat dissipation performance and can withstand higher temperatures without significant thermal expansion and deformation. In this way, the RF circuit board can conduct and distribute heat more uniformly as a whole, improving the overall heat dissipation effect, and thus reducing the separation of the first dielectric layer 2 and the second dielectric layer 6 from the copper plating layer 8.

[0035] As shown in the figure, in this embodiment, the thickness of the insulating layer 4 is 64 mil. The ground layer 3 and the power layer 5 are both covered with copper layers, and the thickness of the copper layer is 1 ounce. The 64-mil thickness of the insulating layer 4 provides good electrical isolation, ensuring stable electrical performance between the signal layers and between the signal layers and the power and ground layers 3, reducing the risk of short circuits and interference. The thicker insulating layer 4 helps to improve the thermal isolation effect, preventing heat transfer between the ground layer 3 and the power layer 5, which is beneficial to the overall heat dissipation performance. The copper layer, as a heat-conducting material, can effectively dissipate heat, helping to quickly conduct heat from the heat source and reduce temperature concentration, improving the heat dissipation capacity of the entire circuit board. Moreover, the copper layers on the ground layer 3 and the power layer 5 are more stably combined with the copper plating layer 8 electroplated on the edge of the RF unit circuit board.

[0036] In the above embodiments, the copper layers on the ground layer 3 and the power layer 5 are etched to expose the bottom board everywhere except for the copper surfaces or copper PADs reserved for heat dissipation, and the copper layers need to be made as large as possible to facilitate heat dissipation.

[0037] As shown in the figure, in this embodiment, the thicknesses of both the first dielectric layer 2 and the second dielectric layer 6 are 32 mil. After adding the two-layer structure, the original single dielectric layer is divided into the first dielectric layer 2 and the second dielectric layer 6, and the thicknesses of the first dielectric layer 2 and the second dielectric layer 6 are 32 mil. In this way, while ensuring the overall thickness of the RF unit circuit board, the heat dissipation performance can be improved, and at the same time, the separation of the copper plating layer 8 electroplated on the edge of the RF unit circuit board from the first dielectric layer 2 and the second dielectric layer 6 can be avoided.

[0038] As shown in the figure, in this embodiment, both the first dielectric layer 2 and the second dielectric layer 6 are made of PP material. The PP material has good heat resistance and can withstand relatively high temperature changes within a certain range, making it suitable for high-temperature processes such as infrared welding. Of course, in addition to the PP material, other materials with satisfactory performance can also be used.

[0039] As shown in the figure, in this embodiment, both the first dielectric layer 2 and the second dielectric layer 6 are formed by laminating four layers of 7228PP material. The laminated structure of the four layers of 7228PP material can improve the overall thermal stability of the first dielectric layer 2 and the second dielectric layer, helping to improve the performance of the circuit board in a high-temperature environment and further preventing the copper plating layer 8 on the edge of the radio frequency unit circuit board from separating from the first dielectric layer 2 and the second dielectric layer 6.

[0040] As shown in the figure, in this embodiment, the first signal layer 1, the ground layer 3, the power layer 5, and the second signal layer 7 are provided with channels for electrical connection. The minimum copper thickness on the channels is 0.8 microns, and the average copper thickness on the channels is at least 1.0 micron. The copper thickness of the channels on the first signal layer 1, the ground layer 3, the power layer 5, and the second signal layer 7 is made according to the standard hole copper processing standard of IPC-6012 class III. In this way, the copper layer thickness of the channels meets high-quality requirements during the manufacturing process, enhancing the stability and reliability of electrical connections, reducing the risk of poor contact, and thus being suitable for high-frequency signal transmission.

[0041] In the above embodiment, the copper plating layer 8 also needs to comply with the standard of IPC-6012 class III. When the infrared welding (IR) conditions are more stringent, a design with a minimum copper thickness of 1 micron can also be adopted.

[0042] As shown in the figure, in this embodiment, the thickness after laminating the first signal layer 1, the first dielectric layer 2, the ground layer 3, the insulating layer 4, the power layer 5, the second dielectric layer 6, and the second signal layer 7 is between 3.06 and 3.54. The thickness of the radio frequency unit circuit board between 3.06 and 3.54 helps to ensure the quality of signal transmission, reduce signal attenuation and reflection, and improve signal integrity, which is particularly important in high-frequency applications.

[0043] For a radio frequency unit circuit board and the working principle and process of a remote control radio frequency unit according to the present utility model, the radio frequency unit circuit board is formed by laminating the first signal layer 1, the first dielectric layer 2, the ground layer 3, the insulating layer 4, the power layer 5, the second dielectric layer 6, and the second signal layer 7, which helps to improve the heat dissipation performance. The first signal layer 1, the ground layer 3, the power layer 5, and the second signal layer 7 made of High-Tg material with a TG value between 165 and 175 also have better heat dissipation performance. There is more copper layer connected to the copper plating layer 8 on the edge of the radio frequency unit circuit board, which can avoid the separation of the copper plating layer 8 from the first dielectric layer 2 and the second dielectric layer 6. Example 2

[0044] The structure and principle in this example are basically the same as those in Example 1. The difference lies in that the thickness of the insulating layer 4 is 64 mil, and both the grounding layer 3 and the power supply layer 5 are covered with copper layers, and the thickness of the copper layer is 2 ounces. When the temperature of infrared soldering (IR) is higher, with the thickness of the insulating layer 4 remaining unchanged, a copper layer with a thickness of 2 ounces can be used. In this way, the thicker copper layer is beneficial for heat dissipation, and the connection surface between the copper layer and the copper plating layer 8 electroplated on the edge of the RF unit circuit board is larger and more stable. Example 3

[0045] As Figure 3 shown, in this example, the structure and principle in this example are basically the same as those in Example 1. The difference lies in that an additional grounding layer and signal layer are added to the RF unit circuit board, so that the RF unit circuit board includes a first signal layer 9, a first grounding layer 11, a power supply layer 13, a second signal layer 14, a second grounding layer 15, and a third signal layer 16 stacked from top to bottom. An insulating layer 12 is provided between the first grounding layer and the power supply layer. Dielectric layers 10 are provided between the first signal layer 9 and the first grounding layer 11, between the power supply layer 13 and the second signal layer 14, between the second signal layer 14 and the second grounding layer 15, and between the second grounding layer 15 and the third signal layer 16. The design of the six-layer structure enables more positions for the copper plating layer to be connected, and there are also more copper layers for heat dissipation. It is more stable than the four-layer structure during infrared soldering (IR) at a high temperature, and it is less likely for the copper plating layer to separate from the dielectric layer.

[0046] A remote control RF unit includes the RF unit circuit board as described in any one of the above examples.

[0047] In the description of the present utility model, it should be understood that terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model.

[0048] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, the meaning of "a plurality" is two or more, unless otherwise specifically defined.

[0049] In the present utility model, unless otherwise clearly specified and defined, the terms "installation", "connection", "linkage", "fixation", etc. shall be construed in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral one; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediate medium, and it may be the internal communication between two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0050] Although the description of the present utility model is made in conjunction with the above specific embodiments, it is obvious that those skilled in the art can make many substitutions, modifications and variations based on the above content. Therefore, all such substitutions, improvements and variations are included within the spirit and scope of the appended claims.

Claims

1. A radio frequency unit circuit board, characterized in that, It includes a first signal layer, a ground layer, a power supply layer, and a second signal layer stacked from top to bottom. A first dielectric layer is provided between the first signal layer and the ground layer, an insulating layer is provided between the ground layer and the power supply layer, and a second dielectric layer is provided between the power supply layer and the second signal layer. A copper plating layer is electroplated on the edge of the radio frequency unit circuit board.

2. The radio frequency unit circuit board according to claim 1, wherein The first signal layer, the ground layer, the power supply layer, and the second signal layer are all made of High-Tg materials with a TG value between 165 and 175.

3. The RF unit circuit board according to claim 1, wherein The thickness of the insulating layer is 64 mil. The ground layer and the power supply layer are both covered with a copper layer, and the thickness of the copper layer is 1 ounce.

4. The radio frequency unit circuit board according to claim 1, wherein The thickness of the insulating layer is 64 mil. The ground layer and the power supply layer are both covered with a copper layer, and the thickness of the copper layer is 2 ounces.

5. The radio frequency unit circuit board according to claim 1, wherein The thicknesses of the first dielectric layer and the second dielectric layer are both 32 mil.

6. The radio frequency unit circuit board according to claim 5, characterized in that The first dielectric layer and the second dielectric layer are both made of PP materials.

7. The radio frequency unit circuit board according to claim 6, characterized in that, The first dielectric layer and the second dielectric layer are both formed by laminating 4 layers of 7228PP materials.

8. The radio frequency unit circuit board according to claim 1, wherein Holes for electrical connection are formed in the first signal layer, the ground layer, the power supply layer, and the second signal layer. The minimum copper thickness on the holes is 0.8 microns, and the minimum average copper thickness on the holes is 1.0 microns.

9. The radio frequency unit circuit board according to claim 1, characterized in that, The thickness after laminating the first signal layer, the first dielectric layer, the ground layer, the insulating layer, the power supply layer, the second dielectric layer, and the second signal layer is between 3.06 and 3.

54.

10. A remote control radio frequency unit, characterized in that, It includes the radio frequency unit circuit board according to any one of claims 1 to 9.

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