High-power jet liquid cooling heat dissipation plate adopting Archimedes spiral flow channel

Abstract

The utility model relates to a high-power jet liquid cooling heat dissipation plate adopting an Archimedes spiral flow channel, which belongs to the field of liquid cooling heat dissipation plates and comprises a liquid cooling heat dissipation plate main body, a heat exchange mechanism is arranged in the liquid cooling heat dissipation plate main body, a heat exchange assembly is arranged on the outer side of the liquid cooling heat dissipation plate main body, and the liquid cooling heat dissipation plate main body is internally provided with a heat exchange mechanism. And a plurality of mounting holes are formed in the outer side of the liquid cooling heat dissipation plate main body. According to the high-power jet flow liquid cooling heat dissipation plate adopting the Archimedean spiral flow channel, liquid needing heat exchange is guided into the liquid inlet flow channel through the liquid inlet, then the liquid flows to the center of the Archimedean spiral flow channel groove to directly scour a heating surface and rapidly surrounds the whole heat source surface to flow out, the jet flow heat dissipation effect is generated, the heat exchange coefficient is increased, and the heat exchange efficiency is improved. The Archimedes spiral flow channel grooves are formed in the liquid cooling heat dissipation plate body, so that the heat exchange efficiency is improved, liquid outlet work is conducted through the liquid outlet, liquid entering the liquid cooling heat dissipation plate body can rapidly flow to conduct heat exchange, the Archimedes spiral flow channel grooves are formed close to the heating face, and the heat exchange effect can be achieved with the maximum efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of liquid cooling heat dissipation plates, in particular to a high-power jet liquid cooling heat dissipation plate with an Archimedean spiral flow channel. Background Technique

[0002] The copper substrate is the most expensive one among metal substrates, and its heat conduction effect is many times better than that of aluminum substrates and iron substrates. It is suitable for high-frequency circuits, areas with large high and low temperature changes, heat exchange of precision communication equipment, and the building decoration industry.

[0003] The use of the heat exchange copper substrate is usually for the rapid heat exchange of liquids. By introducing the liquid into the heat dissipation plate, the purpose of efficient heat exchange can be achieved. At present, the shape of the flow channel in the heat dissipation plate is usually S-shaped. By allowing the liquid to pass through the flow channel and exchange heat with the heat exchange substrate, the purpose of heat exchange can be achieved. However, the flow resistance of the liquid in the flow channel is relatively large, which easily causes the liquid to flow slowly at some parts of the flow channel, reducing the heat exchange efficiency. Therefore, this application proposes a high-power jet liquid cooling heat dissipation plate with an Archimedean spiral flow channel to solve the above problems. Content of the Utility Model

[0004] Aiming at the deficiencies of the prior art, the utility model provides a high-power jet liquid cooling heat dissipation plate with an Archimedean spiral flow channel, which has the advantage of high heat exchange efficiency and solves the problem of low heat exchange efficiency.

[0005] To achieve the above object, the utility model provides the following technical solution: A high-power jet liquid cooling heat dissipation plate with an Archimedean spiral flow channel, including a liquid cooling heat dissipation plate main body. An internal heat exchange mechanism is provided inside the liquid cooling heat dissipation plate main body, a heat exchange assembly is provided outside the liquid cooling heat dissipation plate main body, and a plurality of mounting holes are opened on the outside of the liquid cooling heat dissipation plate main body;

[0006] The heat exchange mechanism includes a liquid inlet opened on the front side of the liquid cooling heat dissipation plate main body, a liquid outlet is opened on the front side of the liquid cooling heat dissipation plate main body, and an Archimedean spiral flow channel groove is opened inside the inner cavity of the liquid cooling heat dissipation plate main body;

[0007] The heat exchange assembly includes a transfer layer coated on the upper surface of the liquid cooling heat dissipation plate main body, a heat conduction layer is bonded to the upper surface of the transfer layer, a conduction layer is bonded to the upper surface of the liquid cooling heat dissipation plate main body, and a heat transfer layer is bonded to the lower surface of the conduction layer.

[0008] Further, the trajectory of the Archimedean spiral flow channel groove is a trajectory generated when a point uniformly leaves a fixed point and at the same time rotates around the fixed point at a fixed angular velocity.

[0009] Further, a liquid inlet flow channel communicating with the center of the Archimedean spiral flow channel groove is opened on the back side of the liquid inlet.

[0010] Further, a liquid outlet channel communicating with the right side of the Archimedes spiral channel groove is formed on the dorsal side of the liquid outlet.

[0011] Further, a plurality of the mounting holes are respectively formed on the left side and the dorsal side of the liquid cooling heat dissipation plate body.

[0012] Further, the transfer layer is a heat-conductive silica gel film layer, and the heat-conductive layer is an insulating heat-conductive adhesive layer.

[0013] Further, the conduction layer is a heat-conductive silica gel sheet layer, and the heat transfer layer is a heat-conductive insulating silicone grease layer.

[0014] Compared with the prior art, the technical solution of the present application has the following beneficial effects:

[0015] 1. For the high-power jet liquid cooling heat dissipation plate adopting the Archimedes spiral channel, the liquid to be heat-exchanged is introduced into the interior of the liquid inlet channel through the liquid inlet, and then the liquid flows to the center of the Archimedes spiral channel groove to directly wash the heating surface and quickly surround the entire heat source surface and then flow out, generating a jet heat dissipation effect, improving the heat transfer coefficient, thereby enhancing the heat exchange efficiency, and performing the liquid outlet work through the liquid outlet, enabling the liquid entering the liquid cooling heat dissipation plate body to flow quickly for heat exchange, and the Archimedes spiral channel groove is arranged close to the heating surface, so as to achieve the heat exchange effect with the highest efficiency.

[0016] 2. For the high-power jet liquid cooling heat dissipation plate adopting the Archimedes spiral channel, through the composition of each material in the heat exchange assembly, the high-power jet liquid cooling heat dissipation plate adopting the Archimedes spiral channel has good heat conduction and heat exchange functions and excellent high and low temperature resistance performance, and has excellent heat conduction performance and good electrical insulation. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a schematic structural diagram of the present utility model;

[0018] Figure 2 is a schematic diagram of the heat exchange mechanism of the present utility model;

[0019] Figure 3 is a schematic diagram of the heat exchange assembly of the present utility model.

[0020] In the figure: 1 liquid cooling heat dissipation plate body, 2 heat exchange mechanism, 201 liquid inlet, 202 liquid outlet, 203 Archimedes spiral channel groove, 3 mounting hole, 4 heat exchange assembly, 401 transfer layer, 402 heat-conductive layer, 403 conduction layer, 404 heat transfer layer. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0022] Please refer to Figure 1 , a high-power jet liquid cooling heat dissipation plate with an Archimedean spiral flow channel in this embodiment includes a liquid cooling heat dissipation plate main body 1. An internal heat exchange mechanism 2 is provided inside the liquid cooling heat dissipation plate main body 1. A heat exchange assembly 4 is provided outside the liquid cooling heat dissipation plate main body 1. A plurality of mounting holes 3 are opened on the outside of the liquid cooling heat dissipation plate main body 1, and the plurality of mounting holes 3 are respectively opened on the left side and the back side of the liquid cooling heat dissipation plate main body 1.

[0023] Please refer to Figure 2 , in order to improve the heat exchange efficiency, the heat exchange mechanism 2 in this embodiment includes a liquid inlet 201 opened on the front side of the liquid cooling heat dissipation plate main body 1. A liquid outlet 202 is opened on the front side of the liquid cooling heat dissipation plate main body 1. An Archimedean spiral flow channel groove 203 is opened inside the cavity of the liquid cooling heat dissipation plate main body 1. The Archimedean spiral flow channel groove 203 hides the pipeline inside the flow channel by means of multi-layer brazing, and no additional pipeline needs to be added.

[0024] In this example, the trajectory of the Archimedean spiral flow channel groove 203 is a trajectory generated when a point uniformly leaves a fixed point and at the same time rotates around the fixed point at a fixed angular velocity. Using the Archimedean spiral for the flow channel can make its flow resistance small and the heat exchange efficiency high. A liquid inlet flow channel communicating with the center of the Archimedean spiral flow channel groove 203 is opened on the back side of the liquid inlet 201. A liquid outlet flow channel communicating with the right side of the Archimedean spiral flow channel groove 203 is opened on the back side of the liquid outlet 202. The liquid to be heat-exchanged is introduced into the inside of the liquid inlet flow channel through the liquid inlet 201. Subsequently, the liquid flows to the center of the Archimedean spiral flow channel groove 203 to directly wash the heating surface and quickly surround the entire heat source surface and then flow out, generating a jet heat dissipation effect, improving the heat transfer coefficient, thereby enhancing the heat exchange efficiency, and performing liquid outlet work through the liquid outlet 202. It can enable the liquid entering the liquid cooling heat dissipation plate main body 1 to flow quickly for heat exchange, effectively solve the core functional devices of the high heat flux density power electronic control circuit, effectively reduce the heat of the external IGBT module, enable the electronic device to operate normally, and the Archimedean spiral flow channel groove 203 is arranged close to the heating surface, and can achieve the heat exchange effect with the highest efficiency.

[0025] It should be noted that the liquid to be heat-exchanged is introduced into the interior of the liquid inlet channel through the liquid inlet 201. Subsequently, the liquid flows to the center of the Archimedes spiral channel groove 203 and quickly surrounds the entire heat source surface before flowing out, and the liquid outlet work is carried out through the liquid outlet 202, which can enable the liquid entering the liquid cooling heat dissipation plate body 1 to flow quickly for heat exchange.

[0026] Please refer to Figure 3 , in order to make it have better heat conduction performance, the heat exchange component 4 in this embodiment includes a transfer layer 401 coated on the upper surface of the liquid cooling heat dissipation plate body 1. A heat conduction layer 402 is bonded to the upper surface of the transfer layer 401, a conduction layer 403 is bonded to the upper surface of the liquid cooling heat dissipation plate body 1, and a heat transfer layer 404 is bonded to the lower surface of the conduction layer 403.

[0027] In this example, the transfer layer 401 is a heat-conductive silicone film layer, which is composed of the heat-conductive silicone film of the transfer layer 401 and is used to transfer heat. The heat conduction layer 402 is an insulating heat-conductive adhesive layer, which is composed of the insulating heat-conductive adhesive of the heat conduction layer 402 and has the characteristics of convenient use, high bonding strength, being an elastomer after curing, anti-impact, and anti-vibration. At the same time, the cured product also has good heat conduction and heat exchange functions and excellent high and low temperature resistance. The conduction layer 403 is a heat-conductive silicone sheet layer, which is composed of the heat-conductive silicone sheet of the conduction layer 403. The heat-conductive silicone sheet can effectively improve the heat transfer efficiency and also play roles such as insulation, shock absorption, and sealing. The heat transfer layer 404 is a heat-conductive insulating silicone grease layer, which is composed of the heat-conductive insulating silicone grease of the heat transfer layer 404 and has excellent heat conduction performance and good electrical insulation, and is widely coated on various electronic products.

[0028] It should be noted that through the composition of each material in the heat exchange component 4, the high-power jet liquid cooling heat dissipation plate adopting the Archimedes spiral channel has good heat conduction and heat exchange functions and excellent high and low temperature resistance, and has excellent heat conduction performance and good electrical insulation.

[0029] It can be understood that in the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood through specific situations. At the same time, those parts not detailed in the present invention are all well-known technologies in the art.

[0030] The working principle of the above embodiment is:

[0031] (1) When the high-power jet liquid-cooled heat dissipation plate with an Archimedean spiral flow channel needs to be used, the liquid to be heat-exchanged is introduced into the interior of the liquid inlet channel through the liquid inlet 201. Subsequently, the liquid flows to the center of the Archimedean spiral flow channel groove 203, directly flushes the heating surface, and then quickly surrounds the entire heat source surface and flows out, generating a jet heat dissipation effect, improving the heat transfer coefficient, thereby enhancing the heat transfer efficiency. And the liquid outlet work is carried out through the liquid outlet 202, enabling the liquid entering the liquid-cooled heat dissipation plate body 1 to flow quickly for heat exchange. Moreover, the Archimedean spiral flow channel groove 203 is arranged close to the heating surface, and the heat exchange effect can be achieved with the highest efficiency.

[0032] (2) Through the composition of various materials in the heat exchange component 4, it is composed of the thermally conductive silicone film of the transfer layer 401 for heat transfer, the insulating thermally conductive adhesive of the thermally conductive layer 402, which has the characteristics of convenient use, high bonding strength, being an elastomer after curing, anti-impact, anti-vibration, etc. At the same time, the cured product also has good heat conduction, heat exchange functions and excellent high and low temperature resistance. It is composed of the thermally conductive silicone sheet of the conduction layer 403. The thermally conductive silicone sheet can effectively improve the heat transfer efficiency and also play roles such as insulation, shock absorption and sealing. It is composed of the thermally conductive insulating silicone grease of the heat transfer layer 404, which has excellent heat conduction performance and good electrical insulation, and is widely coated on various electronic products.

[0033] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising a..." does not exclude the existence of additional identical elements in the process, method, article or device comprising the element.

[0034] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention.

Claims

1. A high-power jet liquid cooling heat dissipation plate with an Archimedean spiral flow channel, comprising a liquid cooling heat dissipation plate main body (1), characterized in that: The interior of the liquid-cooled heat dissipation plate body (1) is provided with a heat exchange mechanism (2), the outside of the liquid-cooled heat dissipation plate body (1) is provided with a heat exchange component (4), and a plurality of mounting holes (3) are formed in the outside of the liquid-cooled heat dissipation plate body (1); The heat exchange mechanism (2) includes a liquid inlet (201) formed in the front side of the liquid-cooled heat dissipation plate body (1), a liquid outlet (202) formed in the front side of the liquid-cooled heat dissipation plate body (1), and an Archimedes spiral flow channel groove (203) formed in the interior of the inner cavity of the liquid-cooled heat dissipation plate body (1); The heat exchange component (4) includes a transfer layer (401) coated on the upper surface of the liquid-cooled heat dissipation plate body (1), a heat conduction layer (402) bonded to the upper surface of the transfer layer (401), a conduction layer (403) bonded to the upper surface of the liquid-cooled heat dissipation plate body (1), and a heat transfer layer (404) bonded to the lower surface of the conduction layer (403).

2. The high-power jet liquid cooling heat dissipation plate with an Archimedes spiral flow channel according to claim 1, characterized in that: The trajectory of the Archimedes spiral flow channel groove (203) is a trajectory generated when a point uniformly leaves a fixed point and at the same time rotates around the fixed point at a fixed angular velocity.

3. The high-power jet liquid cooling heat dissipation plate with an Archimedes spiral flow channel according to claim 1, wherein: A liquid inlet flow channel communicating with the center of the Archimedes spiral flow channel groove (203) is formed on the back side of the liquid inlet (201).

4. A high-power jet liquid-cooled heat dissipation plate with an Archimedean spiral flow channel according to claim 1, characterized in that: A liquid outlet flow channel communicating with the right side of the Archimedes spiral flow channel groove (203) is formed on the back side of the liquid outlet (202).

5. A high-power jet liquid cooling heat dissipation plate with an Archimedean spiral flow channel according to claim 1, characterized in that: The plurality of mounting holes (3) are respectively formed in the left side and the back side of the liquid-cooled heat dissipation plate body (1).

6. The high-power jet liquid cooling heat dissipation plate with an Archimedean spiral flow channel according to claim 1, wherein: The transfer layer (401) is a heat-conductive silicone film layer, and the heat conduction layer (402) is an insulating heat-conductive adhesive layer.

7. The high-power jet liquid cooling heat dissipation plate with an Archimedes spiral flow channel according to claim 1, wherein: The conduction layer (403) is a heat-conductive silicone sheet layer, and the heat transfer layer (404) is a heat-conductive insulating silicone grease layer.

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