Power panel heat dissipation device and double-cavity oven

Abstract

The utility model discloses a power panel heat dissipation device which is applied to a double-cavity oven, the double-cavity oven comprises an oven body, a rear heat insulation plate is arranged in the oven body, and an installation cavity is formed between the rear heat insulation plate and a rear shell of the oven body. A power panel and a baffle are arranged in the mounting cavity, the baffle is arranged above the power panel, and the edge of the baffle covers the two sides of the power panel. The baffle is provided with an air inducing device, an air inlet is formed in the upper wall of the rear shell, and air outlets are formed in the lower wall and / or the two side walls of the rear shell. Cold air introduced by the air inducing device enters the mounting cavity from the air inlet and is blown to the power panel under the driving of the air inducing device, and the cold air passing through the power panel is exhausted from the air outlet. Therefore, the power panel and the baffle are arranged in the mounting cavity, and the air inducing device is mounted on the baffle, so that the mounting problem of the power panel in the double-cavity oven can be solved, heat dissipation and cooling of the power panel in the baking process of the double-cavity oven can be guaranteed, normal work of electronic devices on the power panel is guaranteed, and then normal baking of the double-cavity oven is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation devices, and more specifically, to a power board heat dissipation device and a double-chamber oven. Background Art

[0002] Currently, due to the limited space inside the double-chamber oven, it is difficult to place the power board within the limited space of the double-chamber oven. This is because the oven releases heat during the baking process, and if the power board is overheated, it will affect the normal operation of the electronic components on the power board, and in severe cases, it will cause abnormalities in the double-chamber oven during baking. Summary of the Utility Model

[0003] The utility model provides a power board heat dissipation device and a double-chamber oven, which can solve the problem of installing the power board in the double-chamber oven, and can ensure the heat dissipation and cooling of the power board during the baking of the double-chamber oven to ensure the normal operation of the electronic components on the power board, and further ensure the normal baking of the double-chamber oven. The specific technical solutions are as follows:

[0004] In a first aspect, the utility model provides a power board heat dissipation device applied to a double-chamber oven. The double-chamber oven includes a box body, and a rear heat insulation board is provided inside the box body. An installation cavity is formed between the rear heat insulation board and the rear shell of the box body:

[0005] A power board and a baffle are provided in the installation cavity. The baffle is arranged above the power board, and the edges of the baffle cover both sides of the power board;

[0006] An air guiding device is installed on the baffle. An air inlet is provided on the upper wall of the rear shell, and air outlets are provided on the lower wall and / or both side walls of the rear shell;

[0007] The cold air introduced by the air guiding device enters the installation cavity from the air inlet. The cold air is blown towards the power board under the drive of the air guiding device, and the cold air passing through the power board is discharged from the air outlet.

[0008] Optionally, the front side edge of the baffle is connected to the back surface of the rear heat insulation board, and the rear side edge of the baffle is close to the rear wall of the rear shell.

[0009] Optionally, a downward-extending folding edge is provided on the rear side edge of the baffle.

[0010] Optionally, the baffle includes an installation part and two guiding parts;

[0011] The two guiding parts are respectively arranged on the left and right sides of the installation part, and the guiding part extends upward close to the upper wall of the rear shell.

[0012] Optionally, an obtuse angle is formed between the guiding part and the installation part.

[0013] Optionally, the installation part is provided with an installation hole, and the part of the air guiding device located inside the installation hole is clamped or in interference fit with the installation hole, and the part of the air guiding device located outside the installation hole is fixedly connected to the installation part.

[0014] Optionally, the above power board heat dissipation device further includes a plastic mounting bracket;

[0015] The front side edge of the plastic mounting bracket is connected to the back surface of the rear heat insulation plate, and a gap is left between the power board and the front side edge of the plastic mounting bracket.

[0016] Optionally, the front side edge of the plastic mounting bracket is provided with a baffle extending backward, the baffle is arranged below the power board, and the edge of the baffle covers both sides of the power board.

[0017] Optionally, the air inlet includes a plurality of long strip through holes arranged in an array, and the air outlet includes a plurality of long strip through holes arranged in an array.

[0018] In a second aspect, the present utility model provides a double-chamber oven, which includes a box body. A rear heat insulation plate is arranged inside the box body, and an installation cavity is formed between the rear heat insulation plate and the rear shell of the box body. The installation cavity is provided with the power board heat dissipation device according to any one of the first aspect;

[0019] A first baking cavity and a second baking cavity are arranged inside the box body, and the first baking cavity and the second baking cavity work independently or simultaneously.

[0020] As can be seen from the above, the power board heat dissipation device provided by the embodiment of the present utility model is applied to a double-chamber oven. The double-chamber oven includes a box body, and a rear heat insulation board is provided inside the box body. An installation cavity is formed between the rear heat insulation board and the rear shell of the box body. A power board and a baffle are provided in the installation cavity. The baffle is arranged above the power board, and the edges of the baffle cover both sides of the power board. An air guiding device is installed on the baffle. An air inlet is provided on the upper wall of the rear shell, and air outlets are provided on the lower wall and / or both side walls of the rear shell. The cold air introduced by the air guiding device enters the installation cavity from the air inlet. The cold air blows towards the power board under the drive of the air guiding device. The cold air passing through the power board is discharged from the air outlet. By arranging the power board and the baffle in the installation cavity and installing the air guiding device on the baffle, the air guiding device introduces external cold air into the installation cavity through the upper air inlet. The cold air blows towards the power board under the drive of the air guiding device. On the one hand, the external cold air contacts the power board first after entering the installation cavity, which is beneficial to keeping the power board at a low temperature. On the other hand, the cold air entering from above flows downward under the drive of the air guiding device, squeezing downward the hot air that wants to flow upward, thereby reducing the upward flow of hot air, and then reducing the increase in the heat of the power board caused by the hot air. The heat dissipation and cooling effect on the power board is good. Moreover, since the edges of the baffle cover both sides of the power board, the cold air can pass through both sides of the power board, thereby improving the cooling effect. Then the cold air passing through the power board becomes hot air and is squeezed downward and discharged from the air outlet. It can solve the installation problem of the power board in the double-chamber oven and ensure the heat dissipation and cooling of the power board during the baking of the double-chamber oven to ensure the normal operation of the electronic devices on the power board, and further ensure the normal baking of the double-chamber oven.

[0021] The innovation points of the embodiment of the present utility model include:

[0022] 1. By arranging the power board and the baffle in the installation cavity and installing the air guiding device on the baffle, the air guiding device introduces external cold air into the installation cavity through the upper air inlet. The cold air blows towards the power board under the drive of the air guiding device. On the one hand, the external cold air contacts the power board first after entering the installation cavity, which is beneficial to keeping the power board at a low temperature. On the other hand, the cold air entering from above flows downward under the drive of the air guiding device, squeezing downward the hot air that wants to flow upward, thereby reducing the upward flow of hot air, and then reducing the increase in the heat of the power board caused by the hot air. The heat dissipation and cooling effect on the power board is good. Moreover, since the edges of the baffle cover both sides of the power board, the cold air can pass through both sides of the power board, thereby improving the cooling effect. Then the cold air passing through the power board becomes hot air and is squeezed downward and discharged from the air outlet. It can solve the installation problem of the power board in the double-chamber oven and ensure the heat dissipation and cooling of the power board during the baking of the double-chamber oven to ensure the normal operation of the electronic devices on the power board, and further ensure the normal baking of the double-chamber oven.

[0023] 2. By fixing the baffle to the rear heat insulation plate and arranging the rear side edge of the baffle close to the rear wall of the rear case, there is no gap between the baffle and the front side of the installation cavity, and the gap between the baffle and the rear wall of the rear case can be reduced, so as to block the wind below the baffle from blowing above the baffle and avoid interfering with the cooling effect of the cold air on the power supply board.

[0024] 3. By arranging a hem that extends downward at the rear side edge of the baffle, it plays a role in strengthening and stabilizing, and at the same time reduces costs.

[0025] 4. By arranging two guiding parts on the left and right sides of the installation part respectively, and each guiding part extends upward close to the upper wall of the rear case, the wind below the baffle cannot flow above the baffle from the left and right sides, and at the same time it is beneficial to introduce external cold air into the installation cavity through the air inlet when the air guiding device is started, and better realize the function of introducing external cold air.

[0026] 5. By arranging the part of the air guiding device located in the installation hole to be clamped or in interference fit with the installation hole, the wind below the baffle cannot flow above the baffle from the installation hole, and avoid interfering with the cooling effect of the cold air on the power supply board.

[0027] 6. By arranging a gap between the power supply board and the front side edge of the plastic mounting bracket, the cold air can pass through both sides of the power supply board, thereby improving the cooling effect; and, using a plastic mounting bracket to mount the power supply board to avoid direct contact between the power supply board and the metal rear heat insulation plate, so as to avoid obvious temperature rise of the power supply board caused by heat transfer through the metal and improve the heat dissipation and cooling effect of the power supply board.

[0028] 7. By arranging a shielding plate that extends backward at the front side edge of the plastic mounting bracket, the shielding plate is arranged below the power supply board, and the edge of the shielding plate covers both sides of the power supply board, the heat dissipated from the rear heat insulation plate cannot flow to the power supply board from below the shielding plate, avoiding excessive heating of the power supply board to ensure the normal operation of the electronic devices on the power supply board, and thus ensuring the normal baking of the double-chamber oven.

[0029] 8. An embodiment of the present utility model provides a double - cavity oven, which includes a box body. A rear heat insulation plate is arranged inside the box body. An installation cavity is formed between the rear heat insulation plate and the rear shell of the box body. The power board heat dissipation device provided in any one of the above - mentioned embodiments is arranged in the installation cavity. The box body is provided with a first baking cavity and a second baking cavity, and the first baking cavity and the second baking cavity can work independently or simultaneously. Since the heat dissipation device is configured by arranging a power board and a baffle in the installation cavity, and by installing an air - guiding device on the baffle, the air - guiding device introduces external cold air into the installation cavity through the upper air inlet. The cold air is blown towards the power board under the drive of the air - guiding device. On the one hand, the external cold air contacts the power board first after entering the installation cavity, which is conducive to keeping the power board at a low temperature. On the other hand, the cold air entering from above flows downward under the drive of the air - guiding device, squeezing the hot air that wants to flow upward, thereby reducing the upward flow of hot air, and then reducing the increase in the heat of the power board caused by the hot air, and having a good heat dissipation and cooling effect on the power board. Moreover, since the edge of the baffle covers both sides of the power board, the cold air can pass through both sides of the power board, thus improving the cooling effect. Then, the cold air passing through the power board becomes hot air and is squeezed downward and discharged from the air outlet. It can solve the installation problem of the power board in the double - cavity oven, and ensure the heat dissipation and cooling of the power board during the baking of the double - cavity oven to ensure the normal operation of the electronic devices on the power board, and further ensure the normal baking of the double - cavity oven.

[0030] Of course, when implementing any product or method of the present utility model, it is not necessarily required to achieve all the above - mentioned advantages simultaneously. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0032] Figure 1 It is a schematic structural diagram of the power board heat dissipation device provided in the embodiment of the present utility model from the first angle;

[0033] Figure 2 It is a schematic structural diagram of the power board heat dissipation device provided in the embodiment of the present utility model from the second angle;

[0034] Figure 3 It is a schematic structural diagram of the power board heat dissipation device provided in the embodiment of the present utility model from the third angle;

[0035] Figure 4 For Figure 3 It is a partial enlarged view of area A in

[0036] Figures 1 - 4In it, there is a box body 1, a rear heat insulation plate 2, a rear shell 3, an upper wall 31 of the rear shell, an air inlet 32, a lower wall 33, side walls 34, and an air outlet 35, a power supply board 4, a baffle 5, a folded edge 51 of the baffle, a mounting portion 52, a guiding portion 53, an air guiding device 6, a plastic mounting bracket 7, a shielding plate 71 of the plastic mounting bracket, and a stud 8. Specific embodiments

[0037] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0038] It should be noted that the terms "include" and "have" and any variations thereof in the embodiments of the present invention and the accompanying drawings are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products, or devices.

[0039] The embodiments of the present invention disclose a power supply board heat dissipation device and a double-chamber oven, which can solve the installation problem of the power supply board in the double-chamber oven and ensure the heat dissipation and cooling of the power supply board during the baking of the double-chamber oven to ensure the normal operation of the electronic devices on the power supply board, and further ensure the normal baking of the double-chamber oven. The embodiments of the present invention will be described in detail below.

[0040] Figure 1 It is a schematic structural diagram of the power supply board heat dissipation device provided by the embodiment of the present invention from the first angle. Figure 2 It is a schematic structural diagram of the power supply board heat dissipation device provided by the embodiment of the present invention from the second angle. Figure 3 It is a schematic structural diagram of the power supply board heat dissipation device provided by the embodiment of the present invention from the third angle.

[0041] See Figures 1 - 3 , the power supply board heat dissipation device provided by the embodiment of the present invention is applied to a double-chamber oven. The double-chamber oven includes a box body 1. There is a rear heat insulation plate 2 inside the box body 1. An installation cavity is formed between the rear heat insulation plate 2 and the rear shell 3 of the box body 1. In this embodiment, the double-chamber oven means that there are two baking cavities in the box body 1, and the two baking cavities can work independently or simultaneously to realize baking different ingredients in one oven at the same time. Specifically, in this embodiment, the direction facing the user is the front, that is, the direction where the oven door is located in the double-chamber oven is the front; correspondingly, the direction away from the oven door is the rear, that is, the direction where the rear shell 3 of the box body 1 is located is the rear.

[0042] The installation cavity is provided with a power supply board 4 and a baffle 5. The baffle 5 is arranged above the power supply board 4, and the edge of the baffle 5 covers both sides of the power supply board 4. Refer to Figure 4 . When viewed from the side, the power supply board 4 is within the projection of the baffle 5, so that the baffle 5 can extend to the front and rear sides of the power supply board 4, enabling cold air to flow through the front and rear sides of the power supply board 4 under the action of the baffle 5, thereby improving the heat dissipation and cooling effect of the power supply board 4. In one implementation, the baffle 5 and the power supply board 4 are arranged substantially perpendicular to each other.

[0043] The baffle 5 is installed with an air guiding device 6. The upper wall 31 of the rear case 3 is provided with an air inlet 32, and the lower wall 33 and / or the side walls 34 of the rear case 3 are provided with air outlets 35. Exemplarily, the air guiding device 6 can be a DC fan. Of course, the air guiding device 6 can also be other types of fans or motors, etc. The air inlet 32 can include a plurality of long strip-shaped through holes arranged in an array. The air outlets 35 can include a plurality of long strip-shaped through holes arranged in an array. It should also be understood that the arrangement and shape of the air inlet 32 and the air outlets 35 can be adjusted according to needs and are not specifically limited herein.

[0044] The cold air introduced by the air guiding device 6 enters the installation cavity from the air inlet 32. The cold air is blown towards the power supply board 4 under the drive of the air guiding device 6, and the cold air passing through the power supply board 4 is discharged from the air outlet 35.

[0045] The working principle of the power supply board heat dissipation device provided by the embodiment of the present invention is as follows: Since hot air has a natural tendency to flow upward, the baffle 5 is arranged above the power supply board 4. The air guiding device 6 introduces external cold air into the installation cavity through the upper air inlet 32. The cold air is blown towards the power supply board 4 under the drive of the air guiding device 6. On the one hand, the external cold air contacts the power supply board 4 first after entering the installation cavity, which is beneficial to keeping the power supply board 4 at a low temperature. On the other hand, the cold air entering from above flows downward under the drive of the air guiding device 6, squeezing the hot air that wants to flow upward, thereby reducing the upward flow of hot air, and then reducing the increase in the heat of the power supply board 4 caused by the hot air, and having a good heat dissipation and cooling effect on the power supply board 4. Moreover, since the edge of the baffle 5 covers both sides of the power supply board 4, the cold air can pass through the two sides of the power supply board 4, thereby improving the cooling effect. Then, the cold air passing through the power supply board 4 becomes hot air and is squeezed downward and discharged from the air outlet 35.

[0046] In summary, the power board heat dissipation device provided by the embodiment of the present utility model is applied to a double - cavity oven. The double - cavity oven includes a box body 1, and a rear heat insulation board 2 is arranged inside the box body 1. An installation cavity is formed between the rear heat insulation board 2 and the rear shell 3 of the box body 1. A power board 4 and a baffle 5 are arranged in the installation cavity. The baffle 5 is arranged above the power board 4, and the edge of the baffle 5 covers both sides of the power board 4. An air - guiding device 6 is installed on the baffle 5. An air inlet 32 is arranged on the upper wall 31 of the rear shell 3, and air outlets 35 are arranged on the lower wall 33 and / or both side walls 34 of the rear shell 3. The cold air introduced by the air - guiding device 6 enters the installation cavity from the air inlet 32. The cold air is blown towards the power board 4 under the drive of the air - guiding device 6, and the cold air passing through the power board 4 is discharged from the air outlet 35. By arranging the power board 4 and the baffle 5 in the installation cavity and installing the air - guiding device 6 on the baffle 5, the air - guiding device 6 introduces external cold air into the installation cavity through the upper air inlet 32, and the cold air is blown towards the power board 4 under the drive of the air - guiding device 6. On the one hand, the external cold air contacts the power board 4 first after entering the installation cavity, which is conducive to keeping the power board 4 at a low temperature. On the other hand, the cold air entering from above flows downward under the drive of the air - guiding device 6, squeezing the hot air that wants to flow upward, thereby reducing the upward flow of hot air, and then reducing the increase in the heat of the power board 4 caused by the hot air, and having a good heat dissipation and cooling effect on the power board 4. Moreover, since the edge of the baffle 5 covers both sides of the power board 4, the cold air can pass through both sides of the power board 4, thereby improving the cooling effect. Then, the cold air passing through the power board 4 becomes hot air and is squeezed downward and discharged from the air outlet 35. It can solve the installation problem of the power board 4 in the double - cavity oven, and ensure the heat dissipation and cooling of the power board 4 during the baking of the double - cavity oven to ensure the normal operation of the electronic devices on the power board 4, and further ensure the normal baking of the double - cavity oven.

[0047] Continuing to refer to Figure 1 , the front side edge of the baffle 5 is connected to the back surface of the rear heat insulation board 2. Specifically, the connection method between the two can be screw installation. Of course, other common connection methods such as welding and pin connection are also possible. The rear side edge of the baffle 5 is close to the rear wall of the rear shell 3. Among them, the back surface of the rear heat insulation board 2 refers to the side surface away from the baking cavity inside the box body 1.

[0048] Thus, by fixing the baffle 5 to the rear heat insulation board 2 and arranging the rear side edge of the baffle 5 close to the rear wall of the rear shell 3, there is no gap between the baffle 5 and the front side of the installation cavity, and the gap between the baffle 5 and the rear wall of the rear shell 3 can be reduced, thereby blocking the wind below the baffle 5 from blowing above the baffle 5 and avoiding interfering with the cooling effect of the cold air on the power board 4.

[0049] Continuing to refer to Figure 2 , a downward - extending folded edge 51 is arranged on the rear side edge of the baffle 5. Among them, the folded edge 51 can be of a sheet - metal structure. The main reason for arranging the folded edge 51 on the rear side edge of the baffle 5 is to increase the strength.

[0050] The hemming 51 is arranged substantially perpendicular to the baffle 5, and the length of the downward extension of the hemming 51 can be adjusted according to actual requirements and will not be specifically limited here.

[0051] Thus, by arranging the downwardly extending hemming 51 on the rear side of the baffle 5, it plays a role in strengthening and stabilizing, while reducing costs.

[0052] Continue to refer to Figure 2 , the baffle 5 includes a mounting portion 52 and two guiding portions 53. The two guiding portions 53 are respectively arranged on the left and right sides of the mounting portion 52, and each guiding portion 53 extends upward and approaches the upper wall 31 of the rear case 3.

[0053] Among them, the two guiding portions 53 can be symmetrically arranged on the left and right sides of the mounting portion 52, and the angle between the guiding portion 53 and the mounting portion 52 can be adjusted according to actual requirements and will not be specifically limited here. Exemplarily, the guiding portion 53 and the mounting portion 52 are arranged at an obtuse angle.

[0054] Thus, by arranging the two guiding portions 53 on the left and right sides of the mounting portion 52 respectively, and each guiding portion 53 extends upward and approaches the upper wall 31 of the rear case 3, the wind below the baffle 5 cannot flow from the left and right sides to above the baffle 5, and at the same time, it is beneficial to introduce external cold air into the installation cavity through the air inlet 32 when the air guiding device 6 is started, better realizing the function of introducing external cold air.

[0055] Among them, the mounting portion 52 is provided with a mounting hole, and the air guiding device 6 is installed in the mounting hole. Specifically, the part of the air guiding device 6 located in the mounting hole is clamped or in interference fit with the mounting hole, and the part of the air guiding device 6 located outside the mounting hole is fixedly connected to the mounting portion 52. Among them, the fixed connection method can be screw connection, and of course, other common connection methods such as welding and pin connection can also be used.

[0056] The part of the air guiding device 6 located in the mounting hole is provided with an air inlet device, and the cold air above the mounting portion 52 is introduced below the mounting portion 52 through the air inlet device. Exemplarily, the air inlet device can be a fan blade.

[0057] Clamping or interference fitting the part of the air guiding device 6 located in the mounting hole with the mounting hole makes there be no gap between the part of the air guiding device 6 located in the mounting hole and the mounting hole, avoiding the wind below the baffle 5 from flowing through the mounting hole to above the baffle 5.

[0058] Thus, by arranging the part of the air guiding device 6 located in the mounting hole to be clamped or in interference fit with the mounting hole, the wind below the baffle 5 cannot flow through the mounting hole to above the baffle 5, avoiding interfering with the cooling effect of the cold air on the power board 4.

[0059] Figure 4 is Figure 3 a partial enlarged view of area A in Figures 1 - 4 , the heat dissipation device of the power supply board of the double-chamber oven provided by the embodiment of the present utility model may further include a plastic mounting bracket 7.

[0060] The front side of the plastic mounting bracket 7 is connected to the back surface of the rear heat insulation plate 2. Among them, the connection method can be screw connection. Of course, other common connection methods such as welding and pin connection can also be used. There is a gap between the power supply board 4 and the front side of the plastic mounting bracket 7.

[0061] Among them, the way of leaving a gap between the power supply board 4 and the front side of the plastic mounting bracket 7 can be that the two are fixedly connected by a stud 8 to leave a gap. Among them, the rear heat insulation plate 2 is made of metal.

[0062] Thus, the plastic mounting bracket 7 is used to mount the power supply board 4 to avoid direct contact between the power supply board 4 and the rear heat insulation plate 2 made of metal, so as to avoid obvious temperature rise of the power supply board 4 caused by heat transfer through the metal and improve the heat dissipation and cooling effect of the power supply board 4.

[0063] Moreover, by setting a gap between the power supply board 4 and the front side of the plastic mounting bracket 7, cold air can pass through both sides of the power supply board 4, thereby improving the cooling effect.

[0064] Continue to refer to Figure 2 and Figure 4 , a shielding plate 71 extending backward is provided on the front side of the plastic mounting bracket 7. The shielding plate 71 is arranged below the power supply board 4, and the edge of the shielding plate 71 covers both sides of the power supply board 4.

[0065] Refer to Figure 4 , when viewed from the side, the power supply board 4 is within the upward projection of the shielding plate 71, so that the shielding plate 71 can extend to the front and rear sides of the power supply board 4, so that the heat dissipated from the rear heat insulation plate 2 cannot flow from below the shielding plate 71 to the power supply board 4, avoiding excessive heating of the power supply board 4 to ensure the normal operation of the electronic devices on the power supply board, and further ensuring the normal baking of the double-chamber oven. In one implementation, the shielding plate 71 is substantially perpendicular to the power supply board 4.

[0066] Thus, by providing a shielding plate 71 extending backward on the front side of the plastic mounting bracket 7, the shielding plate 71 is arranged below the power supply board 4, and the edge of the shielding plate 71 covers both sides of the power supply board 4, the heat dissipated from the rear heat insulation plate 2 cannot flow from below the shielding plate 71 to the power supply board 4, avoiding excessive heating of the power supply board 4 to ensure the normal operation of the electronic devices on the power supply board, and further ensuring the normal baking of the double-chamber oven.

[0067] Continue to refer to Figure 1, an embodiment of the present utility model provides a double - cavity oven, which includes a box body 1. A rear heat insulation plate 2 is arranged inside the box body 1. An installation cavity is formed between the rear heat insulation plate 2 and the rear shell 3 of the box body 1. The power board heat dissipation device provided in any of the above - mentioned embodiments is arranged in the installation cavity.

[0068] The box body is provided with a first baking cavity and a second baking cavity, and the first baking cavity and the second baking cavity can work independently or simultaneously.

[0069] Therefore, an embodiment of the present utility model provides a double - cavity oven, which includes a box body 1. A rear heat insulation plate 2 is arranged inside the box body 1. An installation cavity is formed between the rear heat insulation plate 2 and the rear shell 3 of the box body 1. The power board heat dissipation device provided in any of the above - mentioned embodiments is arranged in the installation cavity. The box body is provided with a first baking cavity and a second baking cavity, and the first baking cavity and the second baking cavity can work independently or simultaneously. Since the heat dissipation device sets a power board 4 and a baffle 5 in the installation cavity, and installs an air - guiding device 6 on the baffle 5, the air - guiding device 6 introduces external cold air into the installation cavity through the upper air inlet 32. The cold air is blown towards the power board 4 under the drive of the air - guiding device 6. On the one hand, the external cold air contacts the power board 4 first after entering the installation cavity, which is conducive to keeping the power board 4 at a low temperature. On the other hand, the cold air entering from above flows downward under the drive of the air - guiding device 6, squeezing the hot air that wants to flow upward, thereby reducing the upward flow of hot air, and then reducing the increase in the heat of the power board 4 caused by the hot air, and having a good heat dissipation and cooling effect on the power board 4. Moreover, since the edge of the baffle 5 covers both sides of the power board 4, the cold air can pass through both sides of the power board 4, thereby improving the cooling effect. Then, the cold air passing through the power board 4 becomes hot air and is squeezed downward and discharged from the air outlet 35. It can solve the installation problem of the power board 4 in the double - cavity oven, and can ensure the heat dissipation and cooling of the power board 4 during the baking of the double - cavity oven, so as to ensure the normal operation of the electronic devices on the power board 4, and further ensure the normal baking of the double - cavity oven.

[0070] Those of ordinary skill in the art can understand that: The drawings are only schematic diagrams of an embodiment, and the modules or processes in the drawings are not necessarily essential for implementing the present utility model.

[0071] Those of ordinary skill in the art can understand that: The modules in the device in the embodiment can be distributed in the device of the embodiment according to the description of the embodiment, or can be correspondingly changed and located in one or more devices different from this embodiment. The modules of the above - mentioned embodiment can be combined into one module, or can be further split into multiple sub - modules.

[0072] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A power board heat dissipation device is applied to a double - cavity oven. The double - cavity oven includes a box body, and a rear heat insulation board is arranged in the box body. An installation cavity is formed between the rear heat insulation board and the rear shell of the box body. It is characterized in that: The installation cavity is provided with a power board and a baffle. The baffle is arranged above the power board, and the edge of the baffle covers both sides of the power board. The baffle is installed with an air - guiding device. An air inlet is provided on the upper wall of the rear shell, and air outlets are provided on the lower wall and / or both side walls of the rear shell. The cold air introduced by the air - guiding device enters the installation cavity from the air inlet. The cold air is blown towards the power board under the drive of the air - guiding device, and the cold air passing through the power board is discharged from the air outlet.

2. The power board heat dissipation device according to claim 1, characterized in that, The front side edge of the baffle is connected to the back surface of the rear heat insulation board, and the rear side edge of the baffle is close to the rear wall of the rear shell.

3. The heat dissipation device for a power supply board according to claim 2, wherein The rear side edge of the baffle is provided with a downward - extending folded edge.

4. The power board heat dissipation device according to claim 1, wherein The baffle includes an installation part and two guiding parts. The two guiding parts are respectively arranged on the left and right sides of the installation part, and the guiding parts extend upward close to the upper wall of the rear shell.

5. The power board heat dissipation device according to claim 4, wherein, An obtuse angle is formed between the guiding part and the installation part.

6. The power board heat dissipation device according to claim 4, characterized in that, The installation part is provided with an installation hole. The part of the air - guiding device located in the installation hole is clamped or in interference fit with the installation hole, and the part of the air - guiding device located outside the installation hole is fixedly connected to the installation part.

7. The power board heat dissipation device according to claim 1, characterized in that, It further includes a plastic mounting bracket. The front side edge of the plastic mounting bracket is connected to the back surface of the rear heat insulation board, and a gap is left between the power board and the front side edge of the plastic mounting bracket.

8. The power board heat dissipation device according to claim 7, characterized in that, The front side edge of the plastic mounting bracket is provided with a rear - extending shielding plate. The shielding plate is arranged below the power board, and the edge of the shielding plate covers both sides of the power board.

9. The power supply board heat dissipation device according to claim 1, wherein The air inlet includes a plurality of long - strip through - holes arranged in an array, and the air outlet includes a plurality of long - strip through - holes arranged in an array.

10. A double-chamber oven, characterized in that, It includes a box body. A rear heat insulation board is arranged in the box body. An installation cavity is formed between the rear heat insulation board and the rear shell of the box body. The installation cavity is provided with the power board heat dissipation device according to any one of claims 1 - 9. A first baking cavity and a second baking cavity are arranged in the box body, and the first baking cavity and the second baking cavity work independently or simultaneously.

Images