Organic tail gas purification treatment device in integrated circuit industry

Abstract

The utility model discloses an organic tail gas purification treatment device in the integrated circuit industry, which comprises a gas inlet main pipe and a gas outlet main pipe, two waste gas adsorption units which are arranged in parallel are arranged between the gas inlet main pipe and the gas outlet main pipe, the two waste gas adsorption units work alternately, and the gas inlet end and the gas outlet end of each waste gas adsorption unit are respectively provided with a valve. The gas outlet end of the waste gas adsorption unit is also provided with a tail gas on-line monitor for detecting the purified gas, and the valve and the tail gas on-line monitor are both connected with the controller; the waste gas adsorption units alternately work to adsorb low-concentration tail gas, and the adsorbent filler layer subjected to adsorption saturation can be subjected to high-temperature combustion reduction, so that the waste gas adsorption device can be repeatedly used, and the use cost is effectively reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of purification of electronic special gas tail gas, in particular to an organic tail gas purification and treatment device for the integrated circuit industry. Background Technique

[0002] As the core of the electronic information industry, the integrated circuit industry plays a crucial role in promoting scientific and technological progress and economic development. However, during the manufacturing process of integrated circuits, a large amount of organic waste gas is generated. The sources of these organic waste gases are extensive, including multiple process links such as lithography, etching, and cleaning. The waste gas components are complex and diverse, and common ones include volatile organic compounds (VOCs) such as benzene series (such as benzene, toluene, xylene), alcohols (such as methanol, ethanol), ketones (such as acetone), esters (such as ethyl acetate), etc.

[0003] With the rapid development of the integrated circuit industry, the production scale is continuously expanding, the process technology is constantly updated, and the emissions of organic waste gas show a significant upward trend. If these waste gases are directly discharged into the atmosphere without effective treatment, it will pose a serious threat to environmental quality and human health.

[0004] Traditional methods for treating organic waste gas, such as activated carbon adsorption and thermal combustion, face many challenges when dealing with organic waste gas in integrated circuits. Activated carbon adsorption has problems such as limited adsorption capacity, easy saturation, and the need for frequent replacement; thermal combustion has high energy consumption and may cause secondary pollution. Therefore, it has become an urgent task to explore and develop more advanced, efficient, economical, and environmentally friendly technologies for treating organic waste gas in integrated circuits, which is of great significance for the sustainable development of the integrated circuit industry and environmental protection. Content of the Utility Model

[0005] To solve the defect in the prior art that a catalytic combustion device is used to burn gas, but due to the low concentration of waste gas, it consumes a large amount of energy during combustion, the utility model provides an organic tail gas purification and treatment for the integrated circuit industry.

[0006] To solve the above technical problems, the utility model provides the following technical solutions:

[0007] An organic tail gas purification and treatment device for the integrated circuit industry of the utility model includes an intake main pipe and an exhaust main pipe, and two parallel waste gas adsorption units are arranged between the intake main pipe and the exhaust main pipe, and the two waste gas adsorption units work alternately. Valves are arranged at the intake end and the exhaust end of the waste gas adsorption unit. A tail gas on-line monitor for detecting the purified gas is also arranged at the exhaust end of the waste gas adsorption unit. The device also includes a controller, and the valves and the tail gas on-line monitor are both connected to the controller;

[0008] And the waste gas adsorption unit includes a housing, a packing rack is arranged inside the housing, a plurality of adsorbent packing layers are placed in the packing rack, and a pushing mechanism for pushing out the packing rack is further arranged inside the housing.

[0009] As a preferred technical solution of the present invention, the packing rack includes a bottom plate, vertical plates are oppositely arranged on both sides of the bottom plate, and a plurality of partition plates are installed between the bottom plate and the vertical plates. Insertion cavities for vertically inserting the adsorbent packing layers are formed between adjacent partition plates, and ventilation openings are arranged on each partition plate.

[0010] As a preferred technical solution of the present invention, sealing plates are arranged between the two ends of the housing and the packing rack.

[0011] As a preferred technical solution of the present invention, the pushing mechanism includes a smooth rod and a lead screw arranged in parallel at the bottom of the outer cavity of the housing. A sliding block moving along the smooth rod is arranged on the smooth rod, a moving block moving along the lead screw is arranged on the lead screw, a moving seat is installed between the moving block and the sliding block, and a pushing rod is installed between the moving seat and the vertical plate.

[0012] As a preferred technical solution of the present invention, the outer vertical plate extends outwards to form a sealing cover plate.

[0013] As a preferred technical solution of the present invention, the adsorbent packing layer is honeycomb-shaped.

[0014] The beneficial effects of the present invention are:

[0015] In this organic tail gas purification and treatment device for the integrated circuit industry, through the waste gas adsorption units arranged in parallel, the waste gas adsorption units work alternately to adsorb the low-concentration tail gas, and the adsorbent packing layer after adsorption saturation can be subjected to high-temperature combustion reduction, so that it can be reused, effectively reducing the use cost. A pushing mechanism for pushing out the packing rack is further arranged inside the housing, so that the packing rack is pushed out, thereby facilitating the replacement of the adsorbent packing layer.

[0016] In this organic tail gas purification and treatment device for the integrated circuit industry, by setting a specific packing rack, insertion cavities for vertically inserting the adsorbent packing layers are formed between adjacent partition plates, and ventilation openings are arranged on each partition plate, which facilitates the replacement of the adsorbent packing layer.

[0017] In this organic tail gas purification and treatment device for the integrated circuit industry, by setting a specific pushing mechanism, when the motor drives the lead screw to rotate, the moving seat is driven by the lead screw, so as to realize the pushing out and storage of the packing rack, thereby facilitating the replacement of the adsorbent packing layer. Description of the Drawings

[0018] The accompanying drawings are used to provide a further understanding of the present utility model and form a part of the specification. Together with the embodiments of the present utility model, they are used to explain the present utility model and do not constitute a limitation to the present utility model. In the drawings:

[0019] Figure 1 is a schematic structural view of an organic tail gas purification and treatment device for the integrated circuit industry of the present utility model;

[0020] Figure 2 is a schematic structural view of a packing rack of an organic tail gas purification and treatment device for the integrated circuit industry of the present utility model;

[0021] Figure 3 is a schematic structural view of a pushing mechanism of an organic tail gas purification and treatment device for the integrated circuit industry of the present utility model;

[0022] Figure 4 is an installation schematic view of a push rod of an organic tail gas purification and treatment device for the integrated circuit industry of the present utility model.

[0023] In the figure: 1, intake main pipe; 2, outlet main pipe; 3, adsorption unit; 4, valve; 5, on-line tail gas monitor; 7, housing; 8, packing rack; 9, adsorbent packing layer; 10, pushing mechanism; 11, bottom plate; 12, vertical plate; 13, partition board; 14, insertion cavity; 15, ventilation opening; 16, sealing plate;; 18, optical rod; 19, lead screw; 20, sliding block; 21, movable block; 22, moving seat; 23, sealing cover plate; 24, push rod. Specific embodiments

[0024] The following describes the preferred embodiments of the present utility model with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present utility model and are not used to limit the present utility model.

[0025] Embodiment: As Figure 1 、 Figure 2 shown in the figure, the pushing mechanism 10 includes an optical rod 18 and a lead screw 19 which are arranged in parallel at the bottom of the outer cavity of the housing 7, and a sliding block 20 which moves along the optical rod 18 is arranged on the optical rod 18, a movable block 21 which moves along the lead screw 19 is arranged on the lead screw 19, and a moving seat 22 is installed between the movable block 21 and the sliding block 20, and a push rod 24 and Figure 3As shown in the figure, a device for purifying organic tail gas in the integrated circuit industry according to the present utility model includes an intake main pipe 1 and an exhaust main pipe 2, and two parallel exhaust gas adsorption units 3 are provided between the intake main pipe 1 and the exhaust main pipe 2, and the two exhaust gas adsorption units 3 work alternately. Valves 4 are provided at both the intake end and the exhaust end of the exhaust gas adsorption unit 3. A tail gas on-line monitor 5 for detecting the purified gas is further provided at the exhaust end of the exhaust gas adsorption unit 3. The device further includes a controller, and the valves 4 and the tail gas on-line monitor 5 are both connected to the controller;

[0026] And the exhaust gas adsorption unit 3 includes a housing 7. An adsorbent packing rack 8 is provided in the housing 7. A plurality of adsorbent packing layers 9 are placed in the adsorbent packing rack 8. A pushing mechanism 10 for pushing out the adsorbent packing rack 8 is further provided in the housing 7. Through the parallel exhaust gas adsorption units 3, where the exhaust gas adsorption units 3 work alternately, the low-concentration tail gas is adsorbed. The adsorbent packing layer 9 after adsorption saturation can be subjected to high-temperature combustion reduction, so that it can be reused, effectively reducing the use cost. A pushing mechanism 10 for pushing out the adsorbent packing rack 8 is further provided in the housing, so as to push out the adsorbent packing rack, thus facilitating the replacement of the adsorbent packing layer.

[0027] When the detection value of the tail gas on-line monitor 5 reaches the set over-limit value, through the action of the controller, the two parallel valves 4 automatically switch to realize the alternate operation of the two exhaust gas adsorption units 3.

[0028] Wherein, the adsorbent packing rack 8 includes a bottom plate 11. Vertical plates 12 are oppositely provided on both sides of the bottom plate 11. A plurality of partition plates 13 are installed between the bottom plate 11 and the vertical plates 12. Insertion cavities 14 for vertically inserting the adsorbent packing layers are formed between adjacent partition plates 13. Ventilation openings 15 are provided on each partition plate 13. By providing the specific adsorbent packing rack 8, insertion cavities 14 for vertically inserting the adsorbent packing layers are formed between adjacent partition plates 13, and ventilation openings are provided on each partition plate, which facilitates the replacement of the adsorbent packing layer.

[0029] Wherein, sealing plates are provided between the two end parts of the housing 7 and the adsorbent packing rack 8.

[0030] Among them, the pushing mechanism 10 includes a smooth rod 18 and a lead screw 19 which are arranged in parallel at the bottom of the outer cavity of the housing 7. A sliding block 20 which moves along the smooth rod 18 is arranged on the smooth rod 18. A movable block 21 which moves along the lead screw 19 is arranged on the lead screw 19. A moving seat 22 is installed between the movable block 21 and the sliding block 20. A pushing rod 24 is installed between the moving seat 22 and the vertical plate 12. By using a motor to drive the lead screw to rotate, the moving seat is driven by the lead screw, and the moving seat drives the filler rack to expand and contract through the pushing rod, so as to realize the pushing and storage of the filler rack, thus facilitating the replacement of the adsorbent filler layer. The smooth rod plays a role in linearly limiting the moving seat.

[0031] Among them, the outer vertical plate 12 extends outwards to form a sealing cover plate 23, so as to have better sealing performance at the connection between the filler rack and the housing.

[0032] Among them, the adsorbent filler layer 9 is honeycomb-shaped.

[0033] During operation, for this organic waste gas purification and treatment device in the integrated circuit industry, through the parallelly arranged waste gas adsorption units 3, where the waste gas adsorption units 3 work alternately to adsorb low-concentration waste gas, and the adsorbent filler layer 9 after adsorption saturation can be subjected to high-temperature combustion reduction, so that it can be reused, effectively reducing the use cost. A pushing mechanism 10 for pushing out the filler rack 8 is also arranged in the housing, so as to push out the filler rack, thus facilitating the replacement of the adsorbent filler layer.

[0034] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An organic tail gas purification and treatment device for the integrated circuit industry, characterized in that, It includes an intake main pipe (1) and an outlet main pipe (2), and there are two waste gas adsorption units (3) arranged in parallel between the intake main pipe (1) and the outlet main pipe (2), and the two waste gas adsorption units (3) work alternately. Valves (4) are provided at both the intake end and the outlet end of the waste gas adsorption unit (3). A tail gas on-line monitor (5) for detecting the purified gas is also provided at the outlet end of the waste gas adsorption unit (3). It further includes a controller, and both the valve (4) and the tail gas on-line monitor (5) are connected to the controller; And the waste gas adsorption unit (3) includes a housing (7). A packing rack (8) is provided in the housing (7), and a plurality of adsorbent packing layers (9) are placed in the packing rack (8). A pushing mechanism (10) for pushing out the packing rack (8) is also provided in the housing (7).

2. The organic tail gas purification and treatment device for the integrated circuit industry according to claim 1, wherein The packing rack (8) includes a bottom plate (11). Vertical plates (12) are oppositely provided on both sides of the bottom plate (11), and a plurality of partition plates (13) are installed between the bottom plate (11) and the vertical plates (12). Insertion cavities (14) for vertically inserting the adsorbent packing layers are formed between adjacent partition plates (13), and ventilation openings (15) are provided on each partition plate (13).

3. An organic tail gas purification and treatment device for the integrated circuit industry according to claim 2, characterized in that, Sealing plates are provided between the two ends of the housing (7) and the packing rack (8).

4. An organic tail gas purification and treatment device for the integrated circuit industry according to claim 2, characterized in that, The pushing mechanism (10) includes a smooth rod (18) and a lead screw (19) arranged in parallel at the bottom of the outer cavity of the housing (7). A sliding block (20) moving along the smooth rod (18) is provided on the smooth rod (18). A moving block (21) moving along the lead screw (19) is provided on the lead screw (19). A moving seat (22) is installed between the moving block (21) and the sliding block (20). A pushing rod (24) is installed between the moving seat (22) and the vertical plate (12).

5. The organic tail gas purification and treatment device for the integrated circuit industry according to claim 2, wherein The outer vertical plate (12) extends outwards to form a sealing cover plate (23).

6. The organic tail gas purification and treatment device for the integrated circuit industry according to claim 1, wherein The adsorbent packing layer (9) is honeycomb-shaped.

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