Automatic liquid supplementing system applied to semiconductor equipment and semiconductor equipment

Abstract

The utility model discloses an automatic liquid supplementing system applied to semiconductor equipment and the semiconductor equipment. The system comprises a source bottle, a source supply end and an air pressure adjusting mechanism, the source bottle comprises an air inlet end, an air outlet end and a liquid supplementing end; the gas inlet end of the source bottle is connected with the carrier gas injection pipeline, the gas outlet end of the source bottle is used for being communicated with the reaction chamber, and the source bottle is used for containing a liquid reaction source and providing a gaseous reaction source for the reaction chamber; the source supply end is communicated with the liquid supplementing end of the source bottle and is used for providing a liquid reaction source for the source bottle; the air pressure adjusting mechanism is used for adjusting the air pressure of the source bottle when liquid needs to be supplemented to the source bottle, so that the air pressure in the source bottle is lower than the air pressure of the source supply end, and the liquid reaction source at the source supply end can be sucked into the source bottle. According to the utility model, the working efficiency of semiconductor process equipment and the cleanliness of a liquid reaction source can be improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor equipment, and more specifically, to an automatic liquid replenishment system and a semiconductor equipment applied to semiconductor equipment. Background Art

[0002] A variety of processes of semiconductor process equipment require high-purity liquids (such as high-purity water, isopropyl alcohol and other liquids with low toxicity and weak volatility) to participate in the process reaction as reaction sources. Source bottles are equipped on the equipment as containers for reaction sources. The carrier gas passes through the source bottle and then carries the reaction source in a vapor state into the process chamber to complete the relevant process. For example, the coating process of an Atomic Layer Deposition (ALD) equipment requires high-purity water as a water reaction source to participate in the process reaction. A water source bottle is equipped on the equipment as a container for the water reaction source. The carrier gas passes through the water source bottle and then carries the water reaction source in a vapor state into the process chamber to carry out a chemical reaction and complete the coating process. Limited by the equipment size, the source bottle generally has a small volume, and the reaction source needs to be replenished in time after consumption. As a chemical source for participating in coating and the like, the reaction source has extremely high requirements for cleanliness. However, at present, it is necessary to manually disassemble the source bottle to fill and replenish the source bottle. In actual application, the reaction source is often contaminated to varying degrees during the process of filling the reaction source, resulting in a deterioration of the coating process result, affecting the stability of the equipment operation. At the same time, the machine cannot work during the replenishment of the reaction source, resulting in low working efficiency of the machine. Summary of the Utility Model

[0003] The purpose of the utility model is to provide an automatic liquid replenishment system and a semiconductor equipment applied to semiconductor equipment, so as to improve the working efficiency of semiconductor process equipment and the cleanliness of the reaction source.

[0004] To achieve the above purpose, in the first aspect, the utility model provides an automatic liquid replenishment system applied to semiconductor equipment. The automatic liquid replenishment system is used to provide a reaction source for a reaction chamber of the semiconductor equipment. The automatic liquid replenishment system includes: a source bottle, a source replenishment end and a pressure regulating mechanism;

[0005] The source bottle includes an air inlet end, an air outlet end and a liquid replenishment end;

[0006] The air inlet end of the source bottle is connected to a carrier gas injection pipeline. The air outlet end of the source bottle is used to communicate with the reaction chamber. The source bottle is used to contain a liquid reaction source and provide a gaseous reaction source for the reaction chamber;

[0007] The source replenishment end is communicated with the liquid replenishment end of the source bottle. The source replenishment end is used to provide the liquid reaction source for the source bottle;

[0008] The air pressure regulating mechanism is used to regulate the air pressure of the source bottle when replenishing the source bottle, so that the air pressure in the source bottle is lower than the air pressure at the source replenishment end, so that the liquid reaction source at the source replenishment end can be inhaled into the source bottle.

[0009] Optionally, the air pressure regulating mechanism is an air extraction assembly, and the air extraction assembly is communicated with the source bottle, and is used to extract air from the source bottle when replenishing the source bottle, so that the air pressure at the source replenishment end is higher than the air pressure in the source bottle.

[0010] Optionally, the air outlet end of the source bottle is connected to the reaction chamber through an air outlet pipeline, and a first valve and a second valve are arranged on the air outlet pipeline;

[0011] The air extraction assembly is connected to the air outlet pipeline between the first valve and the second valve through an air extraction pipeline, and a third valve is arranged on the air extraction pipeline.

[0012] Optionally, a pressure sensor is arranged on the air extraction pipeline, and the pressure sensor is connected to the air extraction pipeline through a fourth valve. The pressure sensor is used to measure the pressure in the source bottle when the air extraction mechanism evacuates the source bottle.

[0013] Optionally, the source replenishment end is connected to the liquid replenishment end of the source bottle through a liquid replenishment pipeline, and a fifth valve is arranged on the liquid replenishment pipeline.

[0014] Optionally, the liquid replenishment end of the source bottle includes a liquid replenishment connecting pipe, a liquid injection valve is arranged on the liquid replenishment connecting pipe, one end of the liquid replenishment connecting pipe is connected to the liquid replenishment port of the source bottle, and the other end of the liquid replenishment connecting pipe is connected to the liquid replenishment pipeline through a liquid replenishment connection port.

[0015] Optionally, a liquid level sensor is further arranged at the top of the source bottle, and the liquid level sensor is used to detect the liquid level of the reaction source in the source bottle.

[0016] In a second aspect, the present invention proposes a semiconductor device, and the semiconductor device includes a reaction chamber and the automatic liquid replenishment system applied to the semiconductor device according to the first aspect.

[0017] Optionally, the exhaust end of the reaction chamber is connected to an exhaust pump through an exhaust pipeline;

[0018] The air pressure regulating mechanism is an air extraction assembly, the air extraction assembly is communicated with the source bottle, and the air extraction assembly includes an air extraction pump;

[0019] The exhaust pump is reused as the air extraction pump, and the source bottle is connected to the exhaust pipeline of the reaction chamber through an air extraction pipeline.

[0020] The beneficial effects of the present invention are as follows:

[0021] The automatic liquid replenishment system of the present utility model adds a liquid replenishment end to the source bottle, and at the same time adds a reaction source replenishment end and a pressure regulating mechanism. Connect the air inlet end of the source bottle to the carrier gas injection pipeline, and connect the air outlet end of the source bottle to the process chamber. Connect the source replenishment end to the liquid replenishment end of the source bottle. Provide the reaction source for the source bottle through the source replenishment end, and adjust the pressure of the source bottle through the pressure regulating mechanism when the source bottle needs to be replenished with liquid, so that the pressure in the source bottle is lower than the pressure of the source replenishment end, so that the liquid reaction source at the source replenishment end can be sucked into the source bottle. This system realizes the function of automatically replenishing the reaction source in the source bottle when it is insufficient. During the entire liquid replenishment process, the source bottle does not need to be disassembled and installed at all, avoiding the pollution of the reaction source during the replacement process, thereby greatly improving the process stability of semiconductor process equipment, while improving the working efficiency of the equipment, saving the actions of shutting down and restarting the machine every time the source bottle is replaced, and saving labor costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] By describing the exemplary embodiments of the present utility model in more detail in conjunction with the drawings, the above and other objects, features and advantages of the present utility model will become more obvious. In the exemplary embodiments of the present utility model, the same reference numerals generally represent the same components.

[0023] Figure 1 Shows a schematic diagram of the water reaction source pipeline of the existing atomic layer deposition equipment.

[0024] Figure 2 Shows a schematic diagram of the structure of the existing water source bottle.

[0025] Figure 3 Shows a schematic diagram of the structure of an automatic liquid replenishment system applied to a semiconductor device according to an embodiment of the present utility model.

[0026] Figure 4 Shows a schematic diagram of the structure of the source bottle in an embodiment of the present utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0027] For the water source bottle and pipeline of the existing atomic layer deposition equipment, when the process water source is consumed, the water source bottle needs to be removed, and the water source is poured into a container through the liquid injection port. Figure 1 Is a schematic diagram of the water reaction source pipeline of the existing atomic layer deposition equipment, Figure 2Schematic diagram of the structure of the existing water source bottle. Among them, 101 is the carrier gas injection pipeline, 102 is the bypass pipeline that does not pass through the water source bottle, 103, 105, 106, and 109 are pneumatic diaphragm valves, 104 and 118 are the gas paths leading to the reaction chamber, 107, 108, and 110 are manual diaphragm valves, 116 is the carrier gas pipeline entering the water source bottle, 117 is the pipeline coming out of the water source bottle, 112 is the reaction chamber, 113 is the pressure control butterfly valve, 114 is the angle valve, 115 is the dry pump, 119 is the liquid level sensor, 120 is the intake VCR interface, and 121 is the outlet VCR interface.

[0028] When the atomic layer deposition equipment starts the coating process, the carrier gas carries the water reaction source in the form of water vapor to the chamber 112. At this time, the pneumatic diaphragm 103 is closed, the manual valves 108 and 110 are in the open state, the manual valve 107 is closed, and the pneumatic diaphragm valves 106, 109, and 105 are in the open state. The carrier gas enters the water reaction source container 111 through the pipeline 101, the diaphragm valve 106, and the hand valve 108. After carrying the water reaction source, it passes through the manual valve 110 and the pneumatic valve 109, and then enters the reaction chamber 112 through the pipeline 104, the pneumatic valve 105, and the pipeline 118. At this time, the gas carrying the excess water reaction source is pumped into the dry pump 115 through the butterfly valve 113 and the angle valve 114.

[0029] After the water source in the water source bottle is consumed, it is necessary to close all the pneumatic diaphragm valves 103, 105, 106, and 109, close the hand valves 108 and 110 in sequence, and at the same time ensure that the bypass hand valve 107 is in the closed state. Loosen the two VCR joints at the connection of the water source bottle to disconnect the water source bottle from the equipment pipeline. Lower the position of the water source bottle, and detach the water source bottle joint from the pipeline joint by adjusting the position of the tray. Hold the rear bases of the intake / outlet hand valves 108 and 110 with both hands to remove the water source bottle. Take the removed water source bottle to the DI water sink in the Fab, open the intake and outlet hand valves 108 and 110, pour out the remaining water source in the water source bottle from the outlet 121, and weigh the empty water source bottle. Inject the water reaction source through the intake port 120, and control the addition amount of the water source by adding liquid in small amounts multiple times. After the weight reaches the standard, the addition of the water source is completed. Install the water source bottle according to the disassembly steps. After each installation of the water source bottle, it is necessary to perform a helium leak detection on the pipeline. If the leak rate is unqualified, it needs to be disassembled and reinstalled.

[0030] The existing technology has the following disadvantages:

[0031] 1. The water source in the water source bottle participates in the atomic layer coating process reaction, so the cleanliness requirements for the water source are extremely high. Referring to the above process of manually filling the water source, it will cause varying degrees of pollution to the water source, such as metal debris from the disassembly and assembly of VCR (120 / 121), the environment in the FAB, and the human body.

[0032] 2. The process of the filling source is cumbersome. According to normal consumption, the water source needs to be filled several times a month. Each time, operations such as controlling the system to open and close the valve, disassembling the source bottle, weighing the filled source, and leak detection are required, which consumes a great deal of manpower. Moreover, during the filling period, the machine cannot work properly, resulting in low working efficiency of the machine and failing to meet the usage requirements of the FAB.

[0033] In view of the above problems, the present utility model proposes an automatic liquid replenishment system and a semiconductor device applied to semiconductor equipment, which can automatically replenish the reaction source to the source bottle, improving the working efficiency and the cleanliness of the reaction source of the semiconductor equipment.

[0034] The present utility model will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present utility model are shown in the drawings, it should be understood that the present utility model can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present utility model more thorough and complete, and to fully convey the scope of the present utility model to those skilled in the art.

[0035] Embodiment 1

[0036] As Figure 3 shown, this embodiment provides an automatic liquid replenishment system applied to semiconductor equipment. The automatic liquid replenishment system is used to provide a reaction source to the reaction chamber of the semiconductor equipment. The automatic liquid replenishment system includes: a source bottle 209, a source replenishment end 217, and a pressure adjustment mechanism 221;

[0037] The source bottle 209 includes an air inlet end, an air outlet end, and a liquid replenishment end;

[0038] The air inlet end of the source bottle 209 is connected to the carrier gas injection pipeline 201. The air outlet end of the source bottle 209 is used to communicate with the reaction chamber 218. The source bottle 209 is used to contain the liquid reaction source and provide the gaseous reaction source to the reaction chamber;

[0039] The source replenishment end 217 is communicated with the liquid replenishment end of the source bottle 209. The source replenishment end 217 is used to provide the liquid reaction source for the source bottle 209;

[0040] The pressure adjustment mechanism 221 is used to make the air pressure in the source bottle 209 lower than the air pressure of the source replenishment end 217 when it is necessary to replenish the source bottle 209, so that the liquid reaction source at the source replenishment end 217 can be sucked into the source bottle 209 to complete the automatic replenishment of the reaction source.

[0041] In this embodiment, the liquid reaction source is a water reaction source, the source bottle 209 is a water source bottle, the source supply end 217 is the water reaction source provided by the factory facility, and the semiconductor process equipment is an atomic layer deposition equipment. In other embodiments, the liquid reaction source can also be other non-toxic liquids with relatively weak volatility, such as isopropyl alcohol, etc. Correspondingly, the source bottle 209 can also be a source bottle for containing other liquids, and the source supply end 217 is used to provide the corresponding liquid reaction source.

[0042] In this embodiment, the air pressure regulating mechanism 221 is an air extraction component (such as an air extraction pump, etc.). The air extraction component is connected to the source bottle 209 and is used to extract air from the source bottle 209 when it is necessary to replenish the source bottle 209, so that the air pressure at the source supply end 217 is higher than the air pressure inside the source bottle 209.

[0043] In this embodiment, the gas outlet end of the source bottle 209 is connected to the reaction chamber 218 through an outlet pipeline 223. A first valve 210 and a second valve 204 are provided on the outlet pipeline 223;

[0044] The air extraction component is connected to the outlet pipeline 223 between the first valve 210 and the second valve 204 through an air extraction pipeline 225. A third valve 213 is provided on the air extraction pipeline 225.

[0045] An air pressure sensor 216 is provided on the air extraction pipeline 225. The air pressure sensor 216 is connected to the air extraction pipeline 225 through a fourth valve 215. The air pressure sensor 216 is used to measure the pressure inside the source bottle 209 when the air extraction mechanism 221 evacuates the source bottle 209; The air pressure sensor 216 is preferably a vacuum gauge.

[0046] In this embodiment, the source supply end 217 is connected to the liquid replenishment end of the source bottle through a liquid replenishment pipeline 224. A fifth valve 214 is provided on the liquid replenishment pipeline 224.

[0047] In this embodiment, the carrier gas injection pipeline 201 is connected to the gas inlet end of the source bottle 209 through an inlet pipeline 222. A sixth valve 206 is provided on the inlet pipeline 222.

[0048] Furthermore, as Figure 4 shown, in this embodiment, the gas inlet end, gas outlet end and liquid replenishment end of the source bottle 209 are arranged at the top of the source bottle 209;

[0049] The gas inlet end of the source bottle 209 includes an inlet connection pipe 203. An inlet valve 208 is provided on the inlet connection pipe 203. One end of the inlet connection pipe 203 is connected to the gas inlet of the source bottle 209, and the other end of the inlet connection pipe 203 is connected to the inlet pipeline 222 through an inlet connection port 227;

[0050] The gas outlet end of the source bottle 209 includes a gas outlet connecting pipe 205, on which a gas outlet valve 212 is provided. One end of the gas outlet connecting pipe 205 is connected to the gas outlet of the source bottle 209, and the other end of the gas outlet connecting pipe 205 is connected to the gas outlet pipeline 223 through a gas outlet connection port 230;

[0051] The liquid replenishing end of the source bottle 209 includes a liquid replenishing connecting pipe 233, on which a liquid injection valve 211 is provided. One end of the liquid replenishing connecting pipe 233 is connected to the liquid replenishing port of the source bottle 209, and the other end of the liquid replenishing connecting pipe 233 is connected to the liquid replenishing pipeline 224 through a liquid replenishing connection port 229.

[0052] Among them, the intake connection port 227, the outlet connection port 230, and the liquid replenishing connection port 229 are all VCR interfaces. In this solution, the source bottle is redesigned so that the source bottle can realize the related functions of automatically replenishing the reaction source without changing the diameter, maximum height, intake port, and outlet port, by adding a liquid replenishing port and a liquid injection valve 211. In addition, the pneumatic diaphragm valve (liquid injection valve 211) on the reaction source replenishing pipeline is integrated onto the source bottle 209, shortening the distance between the liquid injection valve 211 and the source bottle 209, enabling fast control of the liquid injection timing, and saving installation space.

[0053] In this embodiment, a liquid level sensor 216 is further provided at the top of the source bottle 209, and the liquid level sensor 216 is used to detect the liquid level of the reaction source in the source bottle 209.

[0054] In addition, in this embodiment, a first bypass pipe 228 is provided between the intake connecting pipe 203 and the outlet connecting pipe 205, and a first bypass valve 207 is provided on the first bypass pipe 228; one end of the first bypass pipe 228 is connected to the intake connecting pipe 203 between the intake valve 208 and the intake connection port 227, and the other end of the first bypass pipe 228 is connected to the outlet connecting pipe 205 between the outlet valve 212 and the outlet connection port 230.

[0055] In this embodiment, the exhaust end of the reaction chamber 218 is connected to an exhaust pump through an exhaust pipeline 232;

[0056] The air extraction assembly 221 of the automatic liquid replenishing system includes an air extraction pump;

[0057] The exhaust pump is reused as the air extraction pump of the automatic liquid replenishing system, and the source bottle 209 is connected to the exhaust pipeline 232 of the reaction chamber through an air extraction pipeline 225.

[0058] A normally open butterfly valve 219 and an angle valve 220 are further provided on the exhaust pipeline 232.

[0059] In this embodiment, the exhaust pump of the reuse reaction chamber 218 is selected as the air extraction mechanism 221 of the source bottle 209. In other embodiments, a separate air extraction pipeline 225 and air extraction mechanism 221 can also be provided to evacuate the source bottle 209.

[0060] In this embodiment, a second bypass pipeline 231 is further included. One end of the second bypass pipeline 231 is connected to the carrier gas injection pipeline 201, and the other end of the second bypass pipeline 231 is connected to the gas outlet pipeline 223 between the first valve 210 and the second valve 204.

[0061] A second bypass valve 202 is provided on the second bypass pipeline 231.

[0062] Preferably, in this embodiment, the first valve 210, the second valve 204, the liquid injection valve 211, the third valve 213, the fourth valve 215, the sixth valve 206, and the second bypass valve 202 are all pneumatic diaphragm valves.

[0063] The intake valve 208, the outlet valve 212, the fifth valve 214, and the first bypass valve 207 are all manual diaphragm valves.

[0064] The working process of the automatic liquid replenishment system in this embodiment includes:

[0065] When the reaction source in the source bottle 209 is sufficient and the semiconductor process equipment is normally performing the process, the first bypass valve 207, the second bypass valve 202, the liquid injection valve 211, and the third valve 213 are closed, and the rest of the valves are all opened. At this time, the carrier gas enters the source bottle 209 through the carrier gas injection pipeline 201 and the intake pipeline 222, carries the vapor of the liquid reaction source, and then enters the reaction chamber 218 through the gas outlet pipeline 223.

[0066] When the liquid reaction source in the source bottle 209 is lower than the set liquid level, the outlet valve 212, the first valve 210, the third valve 213, and the fourth valve 215 are opened, and the rest of the valves are all closed. At this time, the source bottle 209 is evacuated to the set pressure through the air extraction mechanism 221.

[0067] When the pressure in the source bottle 209 reaches the set pressure, the liquid injection valve 211 and the fifth valve 214 are opened, and the rest of the valves are all closed. At this time, the liquid reaction source in the source supply end 217 is sucked into the source bottle 209 to complete the automatic replenishment of the liquid reaction source.

[0068] Specifically, four liquid level sensing points are set in the source bottle 209, such as Figure 3As shown, D is the low alarm point LL, C is the low point L, B is the high point H, and A is the high alarm point HH. When there is sufficient liquid reaction source in the source bottle 209 and the equipment is operating normally, the first bypass valve 207, the second bypass valve 202, the liquid injection valve 211, and the third valve 213 are closed, and the other pneumatic diaphragm valves are open. The carrier gas enters the source bottle 209 through the sixth valve 206 via the pipeline 201, carries the liquid reaction source vapor, and then enters the process reaction chamber 218 through the outlet pipeline 223 after passing through the first valve 210. At this time, the excess carrier liquid reaction source gas is pumped into the dry pump 221 through the butterfly valve 219 and the angle valve 220.

[0069] This solution completes the liquid supplement by means of vacuum negative pressure. When the liquid reaction source needs to be injected, the source bottle is first evacuated to a vacuum negative pressure state, and the vacuum gauge is used to measure the vacuum degree of the container to determine whether to perform the next action. When the liquid level in the source bottle 209 is lower than the limit set point, the action of automatically supplementing the liquid reaction source is started. First, the source bottle 209 needs to be evacuated to a vacuum low pressure state. At this time, the outlet valve 212, the first valve 210, the third valve 213, and the fourth valve 215 are opened, and the other pneumatic valves are all closed. The air extraction mechanism 221 evacuates the source bottle 209 to a vacuum negative pressure state. Preferably, the set pressure for vacuum extraction is 1 Pa - 20 Pa. The gas in the source bottle 209 passes through the first valve 210 and then enters the air extraction mechanism 221 (dry pump) through the outlet pipeline 223, the air extraction pipeline 225, and the third valve 213. The vacuum degree in the source bottle 209 is judged by the pressure sensor 216 (vacuum gauge). After being evacuated to the specified vacuum degree, the action of injecting the liquid reaction source is started.

[0070] When starting to supplement the liquid reaction source solution, the first valve 210 is closed, the liquid injection valve 211 and the fifth valve 214 are opened, and the liquid reaction source for injection enters the source bottle 209 through the liquid supplement pipeline 224. This action utilizes the pressure difference between the vacuum degree in the source bottle and the plant service pressure, and can suck the liquid reaction source provided by the plant service into the interior of the source bottle 209, thereby reducing the pressure limit on the liquid reaction source at the plant service end (if the interior of the source bottle is not in a vacuum environment, the liquid reaction source can only be pressed into the container by increasing the pressure of the liquid reaction source at the plant service end. As the liquid reaction source continuously enters the interior of the container, the gas pressure in the container will increase sharply until the gas pressure in the container is equal to the plant service water pressure, at which time the plant service water will not be able to flush into the container).

[0071] When the liquid level inside the source bottle 209 reaches the set position and triggers a control signal, the liquid injection valve 211 is closed, and the action of supplementing the liquid reaction source in the source bottle 209 is completed.

[0072] In summary, during the entire liquid replenishment process of the system, the source bottle does not need to be disassembled and installed at all, avoiding the contamination of the reaction source during the replacement process, thereby greatly improving the process stability of the semiconductor process equipment. At the same time, the system effectively improves the working efficiency of the semiconductor equipment, saves the actions of shutting down and restarting the machine when replacing the source bottle each time, and saves labor costs.

[0073] Embodiment 2

[0074] This embodiment provides a semiconductor device, which includes a reaction chamber and the automatic liquid replenishment system applied to the semiconductor device described in Embodiment 1.

[0075] Due to the adoption of the automatic liquid replenishment system of Embodiment 1, the semiconductor device of this embodiment can achieve automatic liquid replenishment of the liquid reaction source, effectively avoid the contamination of the reaction source, and improve the process stability and the working efficiency of the equipment.

[0076] The embodiments of the present invention have been described above. The above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations are obvious to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments.

Claims

1. An automatic liquid replenishment system applied to semiconductor equipment, characterized in that, The automatic liquid replenishment system is used to provide a reaction source to the reaction chamber of the semiconductor device. The automatic liquid replenishment system includes: a source bottle, a source replenishment end, and a pressure regulating mechanism; The source bottle includes an air inlet end, an air outlet end, and a liquid replenishment end; The air inlet end of the source bottle is connected to the carrier gas injection pipeline. The air outlet end of the source bottle is used to communicate with the reaction chamber. The source bottle is used to store the liquid reaction source and provide the gaseous reaction source to the reaction chamber; The source replenishment end is communicated with the liquid replenishment end of the source bottle. The source replenishment end is used to provide the liquid reaction source for the source bottle; The pressure regulating mechanism is used to regulate the pressure of the source bottle when liquid replenishment of the source bottle is required, so that the pressure inside the source bottle is lower than the pressure of the source replenishment end, so that the liquid reaction source at the source replenishment end can be sucked into the source bottle.

2. The automatic liquid replenishment system according to claim 1, wherein The pressure regulating mechanism is an air extraction component. The air extraction component is communicated with the source bottle and is used to extract air from the source bottle when liquid replenishment of the source bottle is required, so that the pressure of the source replenishment end is higher than the pressure inside the source bottle.

3. The automatic liquid replenishment system according to claim 2, characterized in that, The air outlet end of the source bottle is connected to the reaction chamber through an outlet pipeline. A first valve and a second valve are provided on the outlet pipeline; The air extraction component is connected to the outlet pipeline between the first valve and the second valve through an air extraction pipeline. A third valve is provided on the air extraction pipeline; 4. The automatic liquid replenishment system according to claim 3, characterized in that A pressure sensor is provided on the air extraction pipeline. The pressure sensor is connected to the air extraction pipeline through a fourth valve. The pressure sensor is used to measure the pressure inside the source bottle when the air extraction component evacuates the source bottle.

5. The automatic liquid replenishment system according to claim 1, wherein The source replenishment end and the liquid replenishment end of the source bottle are connected through a liquid replenishment pipeline. A fifth valve is provided on the liquid replenishment pipeline; 6. The automatic liquid replenishment system according to claim 5, characterized in that, The liquid replenishment end of the source bottle includes a liquid replenishment connecting pipe. A liquid injection valve is provided on the liquid replenishment connecting pipe. One end of the liquid replenishment connecting pipe is connected to the liquid replenishment port of the source bottle, and the other end of the liquid replenishment connecting pipe is connected to the liquid replenishment pipeline through a liquid replenishment connection port; 7. The automatic liquid replenishment system according to claim 1, wherein, A liquid level sensor is further provided at the top of the source bottle. The liquid level sensor is used to detect the liquid level of the reaction source in the source bottle; 8. A semiconductor device, characterized in that, The semiconductor device includes a reaction chamber and the automatic liquid replenishment system applied to the semiconductor device according to any one of claims 1-7.

9. The semiconductor device according to claim 8, wherein, The exhaust end of the reaction chamber is connected to an exhaust pump through an exhaust pipeline; The pressure regulating mechanism is an air extraction component. The air extraction component is communicated with the source bottle. The air extraction component includes an air extraction pump; The exhaust pump is reused as the air extraction pump. The source bottle is connected to the exhaust pipeline of the reaction chamber through an air extraction pipeline.

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