Screen printing system

Abstract

The utility model discloses a silk-screen printing system which comprises a base, a printing assembly and an image acquisition device, the base is used for placing a silicon wafer, the printing assembly comprises a screen printing plate and a first lifting mechanism, the screen printing plate is used for printing the silicon wafer and is provided with a contact surface used for abutting against the silicon wafer, and the first lifting mechanism is arranged on the base. The screen printing plate is arranged on the first lifting mechanism, the first lifting mechanism is used for moving the screen printing plate in the first direction so that the contact face can abut against or be separated from the silicon wafer, the image collection device is arranged on the base and comprises a first camera, and the first camera is configured to conduct image collection on the contact face when the contact face is separated from the silicon wafer so as to obtain a first image. By adopting the scheme of the utility model, the contact surface of the screen printing plate can be shot, so that the damage or pollution of the screen printing plate can be detected in time, the abnormal condition of the screen printing plate can be processed in time, and the yield of silicon wafers can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaic, in particular to a screen printing system. Background Art

[0002] In the photovoltaic industry, screen printing is a link in the preparation process of solar cells. In the related art, screen printing usually uses a screen plate of a screen printing device to print a silicon wafer. However, during the use of the screen plate, its own structure may be damaged or contaminated by a thinner or a paste, etc., resulting in uneven thickness of grid lines, broken grids, edge burrs, appearance dirt, etc. on the printed silicon wafer, seriously affecting the product quality. Summary of the Utility Model

[0003] An embodiment of the utility model discloses a screen printing system, which can photograph the contact surface of the screen plate, so as to realize the timely detection of damage or contamination of the screen plate, which is beneficial to timely handle the abnormal situation of the screen plate and improve the yield rate of silicon wafers.

[0004] In order to achieve the above purpose, the utility model discloses a screen printing system, including:

[0005] A base for placing a silicon wafer;

[0006] A printing assembly, including a screen plate and a first lifting mechanism, the screen plate is used for printing the silicon wafer, the screen plate has a contact surface for abutting against the silicon wafer, the first lifting mechanism is arranged on the base, the screen plate is arranged on the first lifting mechanism, and the first lifting mechanism is used for moving the screen plate along a first direction so that the contact surface abuts against or separates from the silicon wafer; and

[0007] An image acquisition device, the image acquisition device is arranged on the base, the image acquisition device includes a first camera, and the first camera is configured to acquire an image of the contact surface when the contact surface is separated from the silicon wafer to obtain a first image.

[0008] As an optional implementation manner, in an embodiment of the utility model, the screen printing system further includes a first moving device, the first moving device is arranged on the base, the first camera is arranged on the first moving device, and the first moving device is used for adjusting the position of the first camera.

[0009] As an optional implementation manner, in an embodiment of the utility model, the first moving device includes a first moving mechanism, the first moving mechanism is arranged on the base, the first camera is arranged on the first moving mechanism, and the first moving mechanism is used for moving the first camera in a plane perpendicular to the first direction, and / or;

[0010] The first movable device includes a rotating mechanism, the rotating mechanism is arranged on the base, the first camera is arranged on the rotating mechanism, and the rotating mechanism is used to drive the first camera to rotate so as to change the angle of the first camera relative to the contact surface.

[0011] As an optional implementation, in an embodiment of the present utility model, the screen printing system also includes a control device and a cleaning device, the control device is electrically connected to the first camera, and the control device is configured to control the cleaning device to clean the contact surface according to the first image captured by the first camera.

[0012] As an optional implementation, in an embodiment of the present utility model, the control device is also configured to control the first camera to perform secondary image capture on a part of the contact surface based on the first image to obtain a second image, and to control the cleaning device to clean the contact surface based on the second image.

[0013] As an optional implementation, in an embodiment of the utility model, the screen printing system also includes a second movable device, the second movable device is arranged on the base, the cleaning device is arranged on the second movable device, the control device is electrically connected to the second movable device, and the control device is also configured to control the second movable device to drive the cleaning device to move according to the first image captured by the first camera so as to adjust the position of the cleaning device relative to the contact surface.

[0014] As an optional implementation, in an embodiment of the utility model, the second movable device includes a second moving mechanism, the control device is electrically connected to the second moving mechanism, the cleaning device includes a roller and a wiping member, the roller is rotatably connected to the second moving mechanism, the wiping member is sleeved on the outer circumference of the roller, and the second moving mechanism is configured to move the roller in a plane perpendicular to the first direction under the control of the control device, so that the wiping member wipes the contact surface.

[0015] As an optional implementation, in an embodiment of the utility model, the second movable device also includes a second lifting mechanism, the second lifting mechanism is arranged on the base, the second moving mechanism is arranged on the second lifting mechanism, and the second lifting mechanism is used to move the second moving mechanism along the first direction to make the wiping member approach or move away from the contact surface.

[0016] As an alternative embodiment, in the embodiment of the present utility model, a sensor is provided on the second movable device, and the sensor is used to detect the contact condition between the wiping member and the contact surface. The control device is electrically connected to the sensor and the second lifting mechanism, and the control device is further configured to control the second lifting mechanism to drive the wiping member to move according to the contact condition detected by the sensor.

[0017] As an alternative embodiment, in the embodiment of the present utility model, the image acquisition device further includes a second camera, and the second camera is configured to perform image acquisition on the printed silicon wafer.

[0018] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0019] The screen printing system provided by the embodiment of the present utility model has a base for placing a silicon wafer. The first lifting mechanism can drive the screen plate to move in a first direction, so that the screen plate moves towards the silicon wafer and the contact surface of the screen plate abuts against the silicon wafer, thereby enabling printing on the silicon wafer. After completing the printing of the silicon wafer, the first lifting mechanism can drive the screen plate to move in the first direction, so that the screen plate moves away from the silicon wafer and the contact surface of the screen plate is separated from the silicon wafer. At the same time, by providing a first camera on the base, the first camera can capture the contact surface of the screen plate. When the screen plate is separated from the silicon wafer, at this time, the contact surface of the screen plate is not blocked by the silicon wafer and has a certain distance from the base, which is beneficial to the image acquisition of the first camera. By identifying the first image captured by the first camera (for example, it can be manual identification or machine identification), it is possible to detect whether there are abnormal conditions such as damage or contamination on the screen plate, which is beneficial to timely handling of the abnormal conditions of the screen plate, and further beneficial to improving the yield rate of the silicon wafer. Description of the Drawings

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the following-described drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0021] Figure 1 It is a side view of the screen printing system (only showing the base, the printing component and the first camera) disclosed in the embodiment of the present application;

[0022] Figure 2 It is a top view of the screen printing system disclosed in the embodiment of the present application.

[0023] Icons: 1. Screen printing system; 10. Base; 100. Transport device; 11. Printing assembly; 110. Screen plate; 110a. Contact surface; 111. First lifting mechanism; 12. Image acquisition device; 120. First camera; 121. Second camera; 13. First movable device; 130. First moving mechanism; 130a. First connecting rod; 130b. Second connecting rod; 131. Rotating mechanism; 14. Cleaning device; 140. Roller; 141. Wiping member; 15. Second movable device; 150. Second moving mechanism; 151. Second lifting mechanism; 16. Sensor; 17. Second camera; 2. Wafer; X. First direction. Detailed implementation manners

[0024] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0025] Next, the technical solutions of the present invention will be further described in conjunction with the embodiments and the accompanying drawings.

[0026] Please refer to Figure 1 , the embodiment of the present invention provides a screen printing system 1. The screen printing system 1 includes a base 10, a printing assembly 11, and an image acquisition device 12 (as Figure 2 shown). The base 10 is used to place the wafer 2. The printing assembly 11 includes a screen plate 110 and a first lifting mechanism 111. The screen plate 110 is used to print the wafer 2. The screen plate 110 has a contact surface 110a for abutting against the wafer 2. The first lifting mechanism 111 is provided on the base 10, and the screen plate 110 is provided on the first lifting mechanism 111. The first lifting mechanism 111 is used to move the screen plate 110 along the first direction X so that the contact surface 110a abuts against or separates from the wafer 2. The image acquisition device 12 is provided on the base 10. The image acquisition device 12 includes a first camera 120. The first camera 120 is configured to acquire an image of the contact surface 110a when the contact surface 110a is separated from the wafer 2 to obtain a first image.

[0027] The screen printing system 1 provided by the embodiment of the present utility model has a base 10 for placing a silicon wafer 2. A first lifting mechanism 111 can drive a screen plate 110 to move along a first direction X, so that the screen plate 110 moves towards the silicon wafer 2 and the contact surface 110a of the screen plate 110 abuts against the silicon wafer 2, thereby enabling printing on the silicon wafer 2. After completing the printing on the silicon wafer 2, the first lifting mechanism 111 can drive the screen plate 110 to move along the first direction X, so that the screen plate 110 moves away from the silicon wafer 2 and the contact surface 110a of the screen plate 110 is separated from the silicon wafer 2. At the same time, by providing a first camera 120 on the base 10, the first camera 120 can photograph the contact surface 110a of the screen plate 110. When the screen plate 110 is separated from the silicon wafer 2, at this time, the contact surface 110a of the screen plate 110 is not blocked by the silicon wafer 2 and has a certain distance from the base 10, which is beneficial to the image acquisition of the first camera 120. By identifying the first image taken by the first camera 120 (for example, it can be manual identification or machine identification), it is possible to detect whether there are abnormal conditions such as damage or contamination of the screen plate 110, which is beneficial to promptly handling the abnormal conditions of the screen plate 110, and further beneficial to improving the yield rate of the silicon wafer 2.

[0028] It can be understood that the above-mentioned first direction X can be the height direction of the screen printing system, that is, the direction perpendicular to the horizontal plane.

[0029] Optionally, the first lifting mechanism 111 can be a linear drive motor or a hydraulic push rod, etc., and can be specifically selected according to the actual situation, and is not specifically limited in this embodiment.

[0030] Please refer to Figure 2 , in some embodiments, a transport device 100 is provided on the base 10, and the transport device 100 is used to transport the silicon wafer 2.

[0031] In this way, the transport mechanism can transport the silicon wafer 2. After first transporting the silicon wafer 2 to the lower part of the screen plate 110 by the transport mechanism, the first lifting mechanism 111 then makes the contact surface 110a of the screen plate 110 abut against the silicon wafer 2, thereby enabling printing on the silicon wafer 2. After completing the printing on the silicon wafer 2, the first lifting mechanism 111 separates the contact surface 110a of the screen plate 110 from the silicon wafer 2, and then continues to transport the silicon wafer 2 through the transport mechanism. By repeating this step, continuous printing of different silicon wafers 2 can be achieved.

[0032] Optionally, the transport device 100 can be a conveyor belt or a turntable, etc., and can be specifically selected according to the actual situation, and is not specifically limited in this embodiment.

[0033] In some embodiments, the screen printing system 1 further includes a first moving device 13. The first moving device 13 is provided on the base 10, and the first camera 120 is provided on the first moving device 13. The first moving device 13 is used to adjust the position of the first camera 120.

[0034] In this way, by setting the first moving device 13, the first moving device 13 can adjust the position of the first camera 120, making the position of the first camera 120 relatively flexible. The position of the first camera 120 relative to the stencil 110 can be changed by adjusting the position of the first camera 120, thereby changing the shooting position and shooting angle of the first camera 120, which is beneficial to obtaining a first image with better clarity.

[0035] Optionally, the first moving device 13 can drive the first camera 120 to move in a plane perpendicular to the first direction X, or drive the first camera 120 to move in the first direction X, or drive the first camera 120 to rotate relative to the contact surface 110a. The specific selection can be made according to the actual situation and is not specifically limited in this embodiment. Hereinafter, an example in which the first moving device 13 includes a first moving mechanism 130 and / or a rotating mechanism 131 will be briefly described.

[0036] In one example, the first moving device 13 includes a first moving mechanism 130. The first moving mechanism 130 is disposed on the base 10, and the first camera 120 is disposed on the first moving mechanism 130. The first moving mechanism 130 is used to move the first camera 120 in a plane perpendicular to the first direction X.

[0037] In this way, by setting the first moving mechanism 130, the first moving mechanism 130 can drive the first camera 120 to move in a plane perpendicular to the first direction X. On the one hand, the position of the first camera 120 relative to the stencil 110 can be changed by adjusting the position of the first camera 120, thereby changing the shooting position of the first camera 120, which is beneficial to obtaining a first image with better clarity. On the other hand, since moving the first camera 120 below the contact surface 110a of the stencil 110 can usually make the first camera 120 in a better shooting position, the first moving mechanism 130 can also move the first camera 120 to a position avoiding the stencil 110 after the first camera 120 finishes shooting, so that the first camera 120 does not affect the contact between the contact surface 110a of the stencil 110 and the silicon wafer 2.

[0038] Optionally, the first moving mechanism 130 may include a first connecting rod 130a and a second connecting rod 130b. One end of the first connecting rod 130a is rotatably connected to the base 10, the other end of the first connecting rod 130a is rotatably connected to the second connecting rod 130b, and the first camera 120 is disposed on the second connecting rod 130b. The first camera 120 can be moved in a plane perpendicular to the first direction X by rotating the first connecting rod 130a and the second connecting rod 130b. Alternatively, the first moving mechanism 130 may include a first slide rail mechanism and a second slide rail mechanism. The first slide rail mechanism is disposed in a plane perpendicular to the first direction X, the second slide rail mechanism is slidably connected to the first slide rail mechanism and is disposed perpendicular to the first slide rail mechanism, and the first camera 120 is slidably connected to the second slide rail mechanism. The first camera 120 can be moved in a plane perpendicular to the first direction X by sliding the second slide rail mechanism or the first camera 120.

[0039] In another example, the first movable device 13 includes a rotating mechanism 131. The rotating mechanism 131 is disposed on the base 10, and the first camera 120 is disposed on the rotating mechanism 131. The rotating mechanism 131 is used to drive the first camera 120 to rotate so as to change the angle of the first camera 120 relative to the contact surface 110a.

[0040] In this way, the rotating mechanism 131 can drive the first camera 120 to rotate and adjust the angle of the first camera 120 relative to the contact surface 110a of the stencil 110. When the field of view angle of the first camera 120 is limited, the entire contact surface 110a of the stencil 110 can be photographed by changing the shooting angle of the first camera 120, so as to realize the detection of the entire contact surface 110a.

[0041] Optionally, the rotating mechanism 131 may be a single-axis rotating mechanism 131, a biaxial rotating mechanism 131, a triaxial rotating mechanism 131, a spherical pair mechanism, etc., which can be specifically selected according to actual situations and are not specifically limited in this embodiment.

[0042] In still another example, the first movable device 13 includes a first moving mechanism 130 and a rotating mechanism 131. The first moving mechanism 130 is disposed on the base 10, the rotating mechanism 131 is disposed on the first moving mechanism 130. The first moving mechanism 130 is used to move the rotating mechanism 131 in a plane perpendicular to the first direction X, and the first camera 120 is disposed on the rotating mechanism 131. The rotating mechanism 131 is used to drive the first camera 120 to rotate so as to change the angle of the first camera 120 relative to the contact surface 110a.

[0043] In this way, the first moving mechanism 130 can drive the rotating mechanism 131 to move, and can adjust the position of the first camera 120 in a plane perpendicular to the first direction X. At the same time, through the rotating mechanism 131, the first camera 120 can be driven to rotate, so that the shooting position of the first camera 120 can be adjusted, and the shooting angle of the first camera 120 can also be adjusted, making the use of the first camera 120 more flexible and conducive to obtaining a first image with better clarity. In addition, since moving the first camera 120 below the contact surface 110a of the stencil 110 can usually place the first camera 120 in a better shooting position, the first moving mechanism 130 can also move the first camera 120 to a position avoiding the stencil 110 after the first camera 120 finishes shooting, so that the first camera 120 does not affect the contact between the contact surface 110a of the stencil 110 and the next silicon wafer 2.

[0044] In this embodiment, the first moving mechanism 130 can first move the first camera 120 to the middle position corresponding to the stencil 110, adjust the first camera 120 to a larger focal length, and then cooperate with the rotating mechanism 131 to adjust the angle of the first camera 120 relative to the contact surface 110a to photograph the entire contact surface 110a of the stencil 110 for rough recognition. Then, move the first camera 120 to a position on the stencil 110 where there may be abnormal conditions, adjust the first camera 120 to a smaller focal length, photograph a local area of the stencil 110 for fine recognition, and further determine whether there are abnormal conditions at this position on the stencil 110, so as to detect the abnormal conditions of the stencil 110 more accurately. If there are abnormal conditions on the stencil 110, then deal with the abnormal conditions of the stencil 110.

[0045] The abnormal conditions of the stencil 110 mentioned above include but are not limited to: 1. Due to the long service time of the stencil 110, the mesh hole positions of the stencil 110 are worn and deformed, and part of the paste will get stuck at the worn and deformed places, resulting in poor appearance of the printed electrode grid lines, showing an uneven thickness state; 2. Due to the volatilization of the diluent in the paste, the viscosity of the paste becomes higher, and it adheres to the squeegee and the flood bar of the screen printing system 1, causing some paste to become agglomerated small particles. During the squeegee printing or flood bar inking process, these small particles will get stuck in the mesh holes of the stencil 110, resulting in missing parts of the printed electrode grid lines, forming broken grids; 3. Too much diluent is added to the paste, and part of the diluent seeps out and flows through the mesh holes of the stencil 110 and adheres to the contact surface 110a of the stencil 110; 4. There are contaminants on the surface of the silicon wafer before printing, and the contaminants adhere to the contact surface 110a of the stencil during printing. When the above abnormal conditions occur, the treatment for the first abnormal condition is to replace the entire stencil 110, and the treatment for the second, third, and fourth abnormal conditions is to clean the stencil 110.

[0046] Optionally, the handling of abnormal conditions of the stencil 110 can be manually processed by a human, for example, the stencil 110 can be manually cleaned, or it can be automatically processed by a machine, for example, the stencil 110 can be cleaned by a machine. Specifically, it can be selected according to the actual situation and is not specifically limited in this embodiment.

[0047] In some embodiments, the screen printing system 1 further includes a control device (not shown) and a cleaning device 14. The control device is electrically connected to the first camera 120 and is configured to control the cleaning device 14 to clean the contact surface 110a according to the first image collected by the first camera 120.

[0048] In this way, the control device can receive the first image collected by the first camera 120 and perform image recognition on the first image. If it is recognized that there is contamination on the contact surface 110a of the stencil 110, the control device controls the cleaning device 14 to clean the contact surface 110a, improving the automation degree of the screen printing system 1.

[0049] Optionally, the control device can be a computer, a single-chip microcomputer, etc., and can be specifically selected according to the actual situation and is not specifically limited in this embodiment.

[0050] Optionally, the cleaning device 14 can be a flushing device or a wiping member 141 (such as polyester cloth, cotton cloth or paper, etc.), and can be specifically selected according to the actual situation and is not specifically limited in this embodiment.

[0051] In some embodiments, the control device is further configured to control the first camera 120 to perform secondary image acquisition on a local area of the contact surface 110a according to the first image to obtain a second image, and further, control the cleaning device 14 to clean the contact surface 110a according to the second image.

[0052] In this way, after the control device recognizes the first image (i.e., the image of the entire contact surface 110a of the stencil 110) captured by the first camera 120, if it is detected that there may be an abnormal condition at a certain position of the contact surface 110a, the first camera 120 is controlled to perform image acquisition on a local area of the contact surface 110a (when the first moving mechanism 130 is provided, the first camera 120 can be moved to the lower part of the position where the contact surface 110a may have an abnormal condition through the first moving mechanism 130, so that the first camera 120 can capture the local area of the contact surface 110a where there may be an abnormal condition), obtain a second image, and perform secondary recognition on the second image. Through the above two recognitions, the contamination on the contact surface 110a can be detected more accurately. If it is detected that there is contamination on the contact surface 110a, the control device controls the cleaning device 14 to clean the contact surface 110a.

[0053] In some embodiments, the screen printing system 1 further includes a second moving device 15. The second moving device 15 is disposed on the base 10. The cleaning device 14 is disposed on the second moving device 15. The control device is electrically connected to the second moving device 15. The control device is further configured to control the second moving device 15 to drive the cleaning device 14 to move according to the first image collected by the first camera 120, so as to adjust the position of the cleaning device 14 relative to the contact surface 110a.

[0054] In this way, under the control of the control device, the second moving device 15 can drive the cleaning device 14 to move, so that the position of the cleaning device 14 relative to the contact surface 110a is relatively flexible, so that the cleaning device 14 can better clean different positions of the contact surface 110a and improve the cleaning effect on the contact surface 110a.

[0055] Optionally, the second moving device 15 can drive the cleaning device 14 to move in a plane perpendicular to the first direction X, or can drive the cleaning device 14 to move in the first direction X, or can both drive the cleaning device 14 to move in a plane perpendicular to the first direction X and drive the cleaning device 14 to move in the first direction X. Specifically, it can be selected according to the actual situation and is not specifically limited in this embodiment.

[0056] In some embodiments, the second moving device 15 includes a second moving mechanism 150. The control device is electrically connected to the second moving mechanism 150. The cleaning device 14 includes a roller 140 and a wiping member 141. The roller 140 is rotatably connected to the second moving mechanism 150. The wiping member 141 is sleeved on the outer periphery of the roller 140. The second moving mechanism 150 is configured to move the roller 140 in a plane perpendicular to the first direction X under the control of the control device, so that the wiping member 141 wipes the contact surface 110a.

[0057] In this way, by setting the second moving mechanism 150, when the control device recognizes that the contact surface 110a is contaminated, the control device controls the second moving mechanism 150 to drive the roller 140 to move in a plane perpendicular to the first direction X, thereby driving the wiping member 141 sleeved on the roller 140 to move in a plane perpendicular to the first direction X, so that the wiping member 141 wipes the contact surface 110a, thereby cleaning the contact surface 110a. At the same time, the wiping member 141 rubs against the contact surface 110a during the movement, so that the roller 140 rotates relative to the second moving mechanism 150, and the wiping member 141 and the contact surface 110a are in line contact and rolling friction, which can make the mutual force between the wiping surface and the contact surface 110a smaller, and reduce the damage to the screen 110 during the wiping process of the wiping member 141. In addition, since the wiping member 141 needs to be moved below the contact surface 110a of the screen 110 when wiping the contact surface 110a of the screen 110, by providing a second moving mechanism 150, the wiping member 141 can be moved to a position avoiding the screen 110 after the wiping member 141 finishes wiping, so that the wiping member 141 will not affect the contact surface 110a of the screen 110 and the abutment with the silicon wafer 2.

[0058] Optionally, the second moving mechanism 150 can move in one direction within the plane, such as a linear drive motor or a hydraulic push rod, or can move within the plane. The setting can refer to the first moving mechanism 130. The specific selection can be made according to actual conditions and is not specifically limited in this embodiment.

[0059] In other embodiments, the cleaning device 14 may also include a supporting plate and a wiping member 141. The supporting plate is connected to the second moving mechanism 150. The wiping member 141 is arranged on the supporting plate. The supporting plate can also be moved in a plane perpendicular to the first direction X through the second moving mechanism 150, so that the wiping member 141 wipes the contact surface 110a.

[0060] In some embodiments, the second movable device 15 further includes a second lifting mechanism 151, which is disposed on the base 10, and the second moving mechanism 150 is disposed on the second lifting mechanism 151. The second lifting mechanism 151 is used to move the second moving mechanism 150 along the first direction X to move the wiping member 141 closer to or away from the contact surface 110a.

[0061] In this way, by setting up the second lifting mechanism 151, the second lifting mechanism 151 can drive the second moving mechanism 150 to move in the first direction X, so that the wiping member 141 can be moved closer to or away from the contact surface 110a according to needs, so that the wiping member 141 and the contact surface 110a have a more appropriate contact condition, thereby improving the cleaning effect of the wiping member 141 on the contact surface 110a, and at the same time avoiding the wiping member 141 and the contact surface 110a. Too close contact, which may cause damage to the contact surface 110a.

[0062] Optionally, the first lifting mechanism 111 may be a linear drive motor, a hydraulic push rod, etc., and can be specifically selected according to the actual situation, and is not specifically limited in this embodiment.

[0063] In some embodiments, a sensor 16 is provided on the second moving device 15. The sensor 16 is used to detect the contact situation between the wiper 141 and the contact surface 110a. The control device is electrically connected to the sensor 16 and the second lifting mechanism 151. The control device is further configured to control the second lifting mechanism 151 to drive the wiper 141 to move according to the contact situation detected by the sensor 16.

[0064] In this way, by providing the sensor 16, the sensor 16 can detect the contact situation between the wiper 141 and the contact surface 110a. The control device can analyze the contact situation and control the second lifting mechanism 151 to drive the second moving mechanism 150 to move in the first direction X, so that the wiper 141 moves away from or closer to the contact surface 110a according to the current contact situation, making the contact situation between the wiper 141 and the contact surface 110a more appropriate, thereby improving the cleaning effect of the wiper 141 on the contact surface 110a, and at the same time avoiding the contact between the wiper 141 and the contact surface 110a being too tight, which may cause damage to the contact surface 110a. In addition, through such a solution, the entire cleaning process and the adjustment process are automated, facilitating the use of the screen printing system 1.

[0065] Optionally, the sensor 16 may be a distance sensor 16. The distance sensor 16 is provided on the second moving mechanism 150. The distance sensor 16 can move with the second moving mechanism 150 and detect the distance between itself and the contact surface 110a in the first direction X, so as to calculate the distance between the wiper 141 and the contact surface 110a. The sensor 16 may also be a pressure sensor 16. The pressure sensor 16 is provided between the second lifting mechanism 151 and the second moving mechanism 150. The pressure sensor 16 can detect the sum of the gravity of the second moving mechanism 150, the roller 140, the wiper 141 and the pressure between the wiper 141 and the contact surface 110a, so as to calculate the pressure between the wiper 141 and the contact surface 110a through calculation. The distance sensor 16 and the pressure sensor 16 can also be set at the same time, and can be specifically selected according to the actual situation, and are not specifically limited in this embodiment.

[0066] When the sensor 16 is a distance sensor 16, when the wiper 141 abuts against the contact surface 110a, the height of the wiper 141 in the first direction X is h1. When the wiper 141 wipes the contact surface 110a, the height of the wiper 141 in the first direction X is h, and h satisfies the relation: h1 ≤ h ≤ h1 + 100 μm. In this way, it can be ensured that the wiper 141 abuts against the contact surface 110a, and there is a certain pressing force between the wiper 141 and the contact surface 110a, so that the wiper 141 has a better cleaning effect on the contact surface 110a, and at the same time, the wiper 141 is prevented from damaging the contact surface 110a.

[0067] When the sensor 16 is a pressure sensor 16, when the wiper 141 wipes the contact surface 110a, the pressure between the wiper 141 and the contact surface 110a is F, and F satisfies the relation: 0N ≤ F ≤ 50N. In this way, it can be ensured that the wiper 141 abuts against the contact surface 110a, and there is a certain pressing force between the wiper 141 and the contact surface 110a, so that the wiper 141 has a better cleaning effect on the contact surface 110a, and at the same time, the wiper 141 is prevented from damaging the contact surface 110a.

[0068] In some embodiments, the image acquisition device 12 further includes a second camera 121, and the second camera 121 is configured to acquire an image of the printed silicon wafer 2.

[0069] In this way, by providing the second camera 121, the second camera 121 can acquire an image of the printed silicon wafer 2, and the image can be recognized by the control device, so as to detect the printing quality of the silicon wafer 2. In addition, when it is detected that the printing quality of the silicon wafer 2 is abnormal, the control device can control the first camera 120 to acquire an image of the contact surface 110a, so as to analyze whether the abnormal printing quality of the silicon wafer 2 is caused by the abnormality of the screen plate 110.

[0070] The above has introduced the screen printing system disclosed in the embodiments of the present invention in detail. Specific examples are used in this article to elaborate on the principle and implementation manner of the present invention. The description of the above embodiments is only used to help understand the screen printing system of the present invention and its core idea; at the same time, for those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present invention.

Claims

1. A screen printing system, characterized in that, Comprising: A base for placing a silicon wafer; A printing assembly including a screen plate and a first lifting mechanism. The screen plate is used for printing the silicon wafer. The screen plate has a contact surface for abutting against the silicon wafer. The first lifting mechanism is provided on the base, and the screen plate is provided on the first lifting mechanism. The first lifting mechanism is used to move the screen plate in a first direction so that the contact surface abuts against or separates from the silicon wafer; And An image acquisition device provided on the base. The image acquisition device includes a first camera configured to acquire an image of the contact surface when the contact surface is separated from the silicon wafer to obtain a first image.

2. The screen printing system according to claim 1, wherein The screen printing system further includes a first moving device provided on the base, and the first camera is provided on the first moving device. The first moving device is used to adjust the position of the first camera.

3. The screen printing system according to claim 2, characterized in that, The first moving device includes a first moving mechanism provided on the base, and the first camera is provided on the first moving mechanism. The first moving mechanism is used to move the first camera in a plane perpendicular to the first direction, and / or; The first moving device includes a rotating mechanism provided on the base, and the first camera is provided on the rotating mechanism. The rotating mechanism is used to drive the first camera to rotate to change the angle of the first camera relative to the contact surface.

4. The screen printing system according to any one of claims 1-3, characterized in that, The screen printing system further includes a control device and a cleaning device. The control device is electrically connected to the first camera and is configured to control the cleaning device to clean the contact surface according to the first image acquired by the first camera.

5. The screen printing system according to claim 4, characterized in that, The control device is further configured to control the first camera to perform secondary image acquisition on a part of the contact surface according to the first image to obtain a second image, and to control the cleaning device to clean the contact surface according to the second image.

6. The screen printing system according to claim 4, wherein The screen printing system further includes a second moving device provided on the base, and the cleaning device is provided on the second moving device. The control device is electrically connected to the second moving device and is further configured to control the second moving device to drive the cleaning device to move according to the first image acquired by the first camera to adjust the position of the cleaning device relative to the contact surface.

7. The screen printing system according to claim 6, wherein The second moving device includes a second moving mechanism. The control device is electrically connected to the second moving mechanism. The cleaning device includes a roller and a wiping member. The roller is rotatably connected to the second moving mechanism, and the wiping member is sleeved on the outer periphery of the roller. The second moving mechanism is configured to move the roller in a plane perpendicular to the first direction under the control of the control device so that the wiping member wipes the contact surface.

8. The screen printing system according to claim 7, wherein The second movable device further includes a second lifting mechanism, the second lifting mechanism is disposed on the base, the second moving mechanism is disposed on the second lifting mechanism, and the second lifting mechanism is configured to move the second moving mechanism along the first direction so that the wiping member approaches or moves away from the contact surface.

9. The screen printing system according to claim 8, characterized in that, A sensor is provided on the second movable device, the sensor is configured to detect the contact situation between the wiping member and the contact surface, the control device is electrically connected to the sensor and the second lifting mechanism, and the control device is further configured to control the second lifting mechanism to drive the wiping member to move according to the contact situation detected by the sensor.

10. The screen printing system according to any one of claims 1 to 3, characterized in that, The image acquisition device further includes a second camera, and the second camera is configured to perform image acquisition on the printed silicon wafer.

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