Semiconductor chip two-dimensional code acquisition equipment

Abstract

The utility model relates to the technical field of semiconductor chips, in particular to semiconductor chip two-dimensional code acquisition equipment, which comprises a machine table. The machine table is provided with a feeding mechanism; the machine table is sequentially provided with a feeding mechanism, a scanning mechanism and a discharging mechanism. The scanning mechanism comprises a supporting column, a cross rod and a camera; the scanning mechanism further comprises a first positioning assembly and a second positioning assembly. The first positioning assembly and the second positioning assembly are arranged at the bottom of the camera; the first positioning assembly and the second positioning assembly are arranged in the feeding direction of the feeding mechanism. According to the utility model, through the arrangement of the feeding mechanism, the scanning mechanism, the discharging mechanism and the feeding mechanism, a plurality of chips of the charging tray can be scanned, and the working efficiency is greatly improved; in addition, through the arrangement of the first positioning assembly and the second positioning assembly, the device can be suitable for long trays, and the working efficiency is improved; and only one camera is needed for scanning, so that the cost is effectively saved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chips, and particularly relates to a semiconductor chip two-dimensional code acquisition device. Background Art

[0002] In the production of semiconductor chips, due to the small size of the chips, it is impossible to directly reflect the complete resume on the chips. At present, the industry generally adopts laser engraving two-dimensional codes on the chips and cooperating with cameras for scanning to achieve the function of complete resume traceability. This technical solution meets the requirements of chip resume traceability to a certain extent.

[0003] However, the existing technical solutions have some obvious deficiencies. First of all, the small size of semiconductor chips results in relatively small two-dimensional code sizes. If manual scanning is carried out one by one, not only is the efficiency low, but also the shaking of the chips during the scanning process will bring great difficulties to scanning. In addition, the manual scanning method is difficult to meet the requirements of large-scale production of modern semiconductor chips, seriously affecting the production efficiency and the stability of product quality. Moreover, manual operations are prone to problems such as mis-scanning and missed scanning, further reducing the accuracy of resume traceability. Content of the Utility Model

[0004] The purpose of the utility model is to provide a semiconductor chip two-dimensional code acquisition device for the above deficiencies in the prior art.

[0005] The purpose of the utility model is achieved through the following technical solutions: A semiconductor chip two-dimensional code acquisition device includes a machine table; a feeding mechanism is provided on the machine table; a loading mechanism, a scanning mechanism, and an unloading mechanism are sequentially arranged on the machine table along the feeding direction of the feeding mechanism; a tray is arranged between the loading mechanism, the feeding mechanism, and the unloading mechanism;

[0006] The scanning mechanism includes a support column arranged on the machine table, a cross bar arranged on the support column, and a camera arranged on the cross bar; the camera is arranged on the top of the feeding mechanism; the scanning mechanism further includes a first positioning component and a second positioning component; both the first positioning component and the second positioning component are arranged at the bottom of the camera; the first positioning component and the second positioning component are arranged in a row along the feeding direction of the feeding mechanism.

[0007] The utility model is further arranged such that the feeding mechanism includes a first feeding seat and a second feeding seat oppositely arranged on the machine table; a first conveyor belt is movably arranged on the first feeding seat; a second conveyor belt is movably arranged on the second feeding seat; both the first positioning component and the second positioning component are arranged between the first feeding seat and the second feeding seat.

[0008] The present utility model is further configured such that the loading mechanism includes a loading base provided on the machine table, a first loading plate provided at one end of the loading base, and a second loading plate provided at the other end of the loading base; the trays are stacked between the first loading plate and the second loading plate; both the first loading plate and the second loading plate are provided on the tops of the first feeding base and the second feeding base;

[0009] The loading mechanism further includes a material separating component provided on the loading base; the loading mechanism further includes a loading lifting component provided between the first feeding base and the second feeding base.

[0010] The present utility model is further configured such that the material separating component includes a first material separating plate and a second material separating plate movably provided on both sides of the loading base; both the first material separating plate and the second material separating plate are movably provided between the first loading plate and the second loading plate; both the first material separating plate and the second material separating plate are provided with material separating blocks; the material separating blocks are provided with material separating inclined surfaces;

[0011] Both sides of the loading base are respectively provided with a first material separating cylinder and a second material separating cylinder; the output ends of the first material separating cylinder and the second material separating cylinder are respectively connected to the first material separating plate and the second material separating plate.

[0012] The present utility model is further configured such that the loading lifting component includes a loading lifting rod movably provided between the first feeding base and the second feeding base in a lifting manner; the loading lifting rod is movably provided between the bottoms of the first loading plate and the second loading plate in a lifting manner.

[0013] The present utility model is further configured such that the first positioning component includes a first positioning block movably provided between the first feeding base and the second feeding base in a lifting manner and a first positioning cylinder provided between the first feeding base and the second feeding base; the output end of the first positioning cylinder is connected to the first positioning block; the second positioning component includes a second positioning block movably provided between the first feeding base and the second feeding base in a lifting manner and a second positioning cylinder provided between the first feeding base and the second feeding base; the output end of the second positioning cylinder is connected to the second positioning block;

[0014] The first positioning block and the second positioning block are arranged along the length direction of the first feeding base;

[0015] The support column is provided with a light source.

[0016] The present utility model is further configured such that the unloading mechanism includes an unloading base provided on the machine table, a first unloading plate provided at one end of the unloading base, and a second unloading plate provided at the other end of the unloading base; the trays are stacked between the first unloading plate and the second unloading plate; both the first unloading plate and the second unloading plate are provided on the tops of the first feeding base and the second feeding base;

[0017] The blanking mechanism further includes a material pressing component disposed on the blanking base; the blanking mechanism further includes a blanking lifting component disposed between the first feeding base and the second feeding base.

[0018] The present utility model is further configured such that the material pressing component includes a first material pressing plate and a second material pressing plate movably disposed on both sides of the blanking base; both the first material pressing plate and the second material pressing plate are movably disposed between the first blanking plate and the second blanking plate; first material pressing cylinders and second material pressing cylinders are respectively disposed on both sides of the blanking base; the output ends of the first material pressing cylinder and the second material pressing cylinder are respectively connected to the first material pressing plate and the second material pressing plate.

[0019] The present utility model is further configured such that the blanking lifting component includes a blanking lifting rod that is liftably movable between the first feeding base and the second feeding base; the blanking lifting rod is liftably movable between the bottom of the first blanking plate and the bottom of the second blanking plate.

[0020] The present utility model is further configured such that the second blanking plate is provided with an opening; a blanking cylinder is provided on the second blanking plate; a blanking blocking plate is provided at the output end of the blanking cylinder; the blanking blocking plate is movably disposed at the opening; a discharging roller is provided on the machine table at the opening.

[0021] The beneficial effects of the present utility model: By providing a feeding mechanism, a scanning mechanism, a blanking mechanism, and a feeding mechanism, the present utility model can scan multiple chips on the tray, greatly improving the working efficiency; in addition, by providing a first positioning component and a second positioning component, it can be applicable to trays with longer lengths, improving the working efficiency; only one camera is needed for scanning, effectively saving costs. Description of the Drawings

[0022] The present utility model will be further described with reference to the accompanying drawings, but the embodiments in the drawings do not constitute any limitation to the present utility model. For those of ordinary skill in the art, other drawings can be obtained according to the following drawings without creative efforts.

[0023] Figure 1 is a schematic structural diagram of the present utility model;

[0024] Figure 2 is a schematic structural diagram of the present utility model after hiding the machine table and the discharging roller;

[0025] Figure 3 is a schematic structural diagram of the cooperation between the feeding mechanism and the feeding mechanism of the present utility model;

[0026] Figure 4 is a schematic structural diagram of the cooperation between the blanking mechanism and the feeding mechanism of the present utility model;

[0027] Wherein: 1. Machine platform; 11. Tray; 2. Support column; 21. Cross bar; 22. Camera; 23. Light source; 31. First feeding seat; 32. Second feeding seat; 33. First conveyor belt; 34. Second conveyor belt; 4. Loading seat; 41. First loading plate; 42. Second loading plate; 43. First material dividing plate; 44. Second material dividing plate; 45. Material dividing block; 46. Material dividing inclined plane; 47. First material dividing cylinder; 48. Second material dividing cylinder; 49. Loading lifting rod; 51. First positioning block; 52. Second positioning block; 53. First positioning cylinder; 54. Second positioning cylinder; 6. Unloading seat; 61. First unloading plate; 62. Second unloading plate; 63. First material pressing plate; 64. Second material pressing plate; 66. First material pressing cylinder; 67. Second material pressing cylinder; 68. Unloading lifting rod; 7. Opening; 71. Unloading cylinder; 72. Unloading blocking plate; 8. Discharging roller. Detailed implementation mode

[0028] The present utility model will be further described in conjunction with the following embodiments.

[0029] It can be known from Figures 1 to 4 that a semiconductor chip two-dimensional code acquisition device described in this embodiment includes a machine platform 1; a feeding mechanism is provided on the machine platform 1; a loading mechanism, a scanning mechanism and an unloading mechanism are sequentially arranged on the machine platform 1 along the feeding direction of the feeding mechanism; a tray 11 is arranged between the loading mechanism, the feeding mechanism and the unloading mechanism.

[0030] The scanning mechanism includes a support column 2 arranged on the machine platform 1, a cross bar 21 arranged on the support column 2 and a camera 22 arranged on the cross bar 21; the camera 22 is arranged on the top of the feeding mechanism; the scanning mechanism further includes a first positioning component and a second positioning component; both the first positioning component and the second positioning component are arranged at the bottom of the camera 22; the first positioning component and the second positioning component are arranged in a row along the feeding direction of the feeding mechanism.

[0031] Specifically, when the semiconductor chip two-dimensional code acquisition device described in this embodiment is in use, first, a plurality of chips are placed on the tray 11, and then a plurality of trays 11 are stacked in the loading mechanism; then the loading mechanism gradually places the tray 11 in the feeding mechanism, and the feeding mechanism drives the tray 11 to move to the position of the first positioning component. The camera 22 first scans the chips in the first half of the tray 11. After the scanning is completed, the feeding mechanism drives the tray 11 to move to the position of the second positioning component, and the camera 22 scans the chips in the second half of the tray 11. After the scanning is completed, the feeding mechanism drives the tray 11 to move into the unloading mechanism for unloading.

[0032] In this embodiment, by providing a loading mechanism, a scanning mechanism, a unloading mechanism and a feeding mechanism, it is possible to scan multiple chips on the tray 11, greatly improving the working efficiency. In addition, by providing a first positioning component and a second positioning component to scan the chips in the first half of the tray 11 and the chips in the second half of the tray 11 respectively, it is applicable to trays 11 with a longer length, improving the working efficiency. Secondly, there is no need to use two cameras 22, effectively saving costs.

[0033] For a semiconductor chip two-dimensional code acquisition device described in this embodiment, the feeding mechanism includes a first feeding seat 31 and a second feeding seat 32 oppositely arranged on the machine table 1; the first feeding seat 31 is movably provided with a first conveyor belt 33; the second feeding seat 32 is movably provided with a second conveyor belt 34; the first positioning component and the second positioning component are both arranged between the first feeding seat 31 and the second feeding seat 32. Specifically, through the above settings, the two sides of the tray 11 are respectively placed on the first conveyor belt 33 and the second conveyor belt 34, which can drive the tray 11 to move.

[0034] For a semiconductor chip two-dimensional code acquisition device described in this embodiment, the loading mechanism includes a loading seat 4 arranged on the machine table 1, a first loading plate 41 arranged at one end of the loading seat 4, and a second loading plate 42 arranged at the other end of the loading seat 4; the tray 11 is stacked between the first loading plate 41 and the second loading plate 42; both the first loading plate 41 and the second loading plate 42 are arranged on the tops of the first feeding seat 31 and the second feeding seat 32; the loading mechanism further includes a material distribution component arranged on the loading seat 4; the loading mechanism further includes a loading lifting component arranged between the first feeding seat 31 and the second feeding seat 32. For a semiconductor chip two-dimensional code acquisition device described in this embodiment, the material distribution component includes a first material distribution plate 43 and a second material distribution plate 44 movably arranged on both sides of the loading seat 4; both the first material distribution plate 43 and the second material distribution plate 44 are movably arranged between the first loading plate 41 and the second loading plate 42; both the first material distribution plate 43 and the second material distribution plate 44 are provided with material distribution blocks 45; the material distribution blocks 45 are provided with material distribution inclined surfaces 46; both sides of the loading seat 4 are respectively provided with a first material distribution cylinder 47 and a second material distribution cylinder 48; the output ends of the first material distribution cylinder 47 and the second material distribution cylinder 48 are respectively connected to the first material distribution plate 43 and the second material distribution plate 44. For a semiconductor chip two-dimensional code acquisition device described in this embodiment, the loading lifting component includes a loading lifting rod 49 that is liftably and movably arranged between the first feeding seat 31 and the second feeding seat 32; the loading lifting rod 49 is liftably and movably arranged between the bottom of the first loading plate 41 and the bottom of the second loading plate 42; among them, the loading lifting rod 49 can be lifted by a motor screw structure.

[0035] Specifically, in the semiconductor chip two-dimensional code acquisition device of this embodiment, after the first material distribution cylinder 47 and the second material distribution cylinder 48 extend, they push the first material distribution plate 43 and the second material distribution plate 44 closer to each other, so that the trays 11 are stacked on the material distribution block 45; when it is necessary to load the trays 11, first drive the loading lifting rod 49 to rise. After the loading lifting rod 49 contacts the bottommost tray 11, the first material distribution cylinder 47 and the second material distribution cylinder 48 retract, so that the trays 11 are no longer stacked on the material distribution block 45 but on the loading lifting rod 49; when the loading lifting rod 49 descends a certain height, the first material distribution cylinder 47 and the second material distribution cylinder 48 extend again, pushing the first material distribution plate 43 and the second material distribution plate 44 closer to each other. Under the action of the material distribution inclined surface 46, the material distribution block 45 is inserted between the bottommost tray 11 and the second bottommost tray 11, so as to distribute the bottommost tray 11. Then the loading lifting rod 49 continues to descend until the bottommost tray 11 is placed between the first conveyor belt 33 and the second conveyor belt 34, thus completing the individual loading of the trays 11.

[0036] In a semiconductor chip two-dimensional code acquisition device of this embodiment, the first positioning assembly includes a first positioning block 51 that is vertically movably arranged between the first feeding seat 31 and the second feeding seat 32 and a first positioning cylinder 53 that is arranged between the first feeding seat 31 and the second feeding seat 32; the output end of the first positioning cylinder 53 is connected to the first positioning block 51; the second positioning assembly includes a second positioning block 52 that is vertically movably arranged between the first feeding seat 31 and the second feeding seat 32 and a second positioning cylinder 54 that is arranged between the first feeding seat 31 and the second feeding seat 32; the output end of the second positioning cylinder 54 is connected to the second positioning block 52; the first positioning block 51 and the second positioning block 52 are arranged side by side along the length direction of the first feeding seat 31; the support column 2 is provided with a light source 23. By providing the first positioning cylinder 53 and the second positioning cylinder 54, it is convenient to block the position of the trays 11.

[0037] A semiconductor chip QR code acquisition device according to this embodiment, the blanking mechanism includes a blanking seat 6 provided on the machine table 1, a first blanking plate 61 provided at one end of the blanking seat 6, and a second blanking plate 62 provided at the other end of the blanking seat 6; the material trays 11 are stacked between the first blanking plate 61 and the second blanking plate 62; both the first blanking plate 61 and the second blanking plate 62 are provided on the tops of the first feeding seat 31 and the second feeding seat 32; the blanking mechanism further includes a material pressing component provided on the blanking seat 6; the blanking mechanism further includes a blanking lifting component provided between the first feeding seat 31 and the second feeding seat 32. A semiconductor chip QR code acquisition device according to this embodiment, the material pressing component includes a first material pressing plate 63 and a second material pressing plate 64 movably provided on both sides of the blanking seat 6; both the first material pressing plate 63 and the second material pressing plate 64 are movably provided between the first blanking plate 61 and the second blanking plate 62; first material pressing cylinders 66 and second material pressing cylinders 67 are respectively provided on both sides of the blanking seat 6; the output ends of the first material pressing cylinder 66 and the second material pressing cylinder 67 are respectively connected to the first material pressing plate 63 and the second material pressing plate 64. A semiconductor chip QR code acquisition device according to this embodiment, the blanking lifting component includes a blanking lifting rod 68 that is liftably and movably provided between the first feeding seat 31 and the second feeding seat 32; the blanking lifting rod 68 is liftably and movably provided between the bottom of the first blanking plate 61 and the bottom of the second blanking plate 62; wherein the blanking lifting rod 68 can be lifted and lowered through a motor screw structure.

[0038] Specifically, when the material tray 11 moves to the top of the blanking lifting rod 68, the blanking lifting rod 68 rises until it rises between the first blanking plate 61 and the second blanking plate 62, and then the first material pressing cylinder 66 and the second material pressing cylinder 67 extend to drive the first material pressing plate 63 and the second material pressing plate 64 to approach each other, and the material tray 11 can be placed on the first material pressing plate 63 and the second material pressing plate 64.

[0039] A semiconductor chip QR code acquisition device according to this embodiment, the second blanking plate 62 is provided with an opening 7; the second blanking plate 62 is provided with a blanking cylinder 71; the output end of the blanking cylinder 71 is provided with a blanking blocking plate 72; the blanking blocking plate 72 is movably provided at the opening 7; the machine table 1 is provided with a discharging roller 8 at the opening 7. Specifically, when there are enough stacked material trays 11 between the first blanking plate 61 and the second blanking plate 62, the blanking cylinder 71 drives the blanking blocking plate 72 to move, so that the opening 7 is opened, and the stacked material trays 11 enter the discharging roller 8 through the opening 7 for discharging.

[0040] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present utility model, rather than limiting the protection scope of the present utility model. Although the present utility model has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present utility model can be modified or equivalently replaced without departing from the essence and scope of the technical solutions of the present utility model.

Claims

1. A semiconductor chip two-dimensional code acquisition device, characterized in that: It includes a machine platform; a feeding mechanism is provided on the machine platform; an upper feeding mechanism, a scanning mechanism, and a lower feeding mechanism are successively arranged on the machine platform along the feeding direction of the feeding mechanism; a tray is arranged between the upper feeding mechanism, the feeding mechanism, and the lower feeding mechanism; The scanning mechanism includes a support column provided on the machine platform, a cross bar provided on the support column, and a camera provided on the cross bar; the camera is provided on the top of the feeding mechanism; the scanning mechanism further includes a first positioning component and a second positioning component; both the first positioning component and the second positioning component are provided at the bottom of the camera; the first positioning component and the second positioning component are arranged in sequence along the feeding direction of the feeding mechanism.

2. The semiconductor chip two-dimensional code acquisition device according to claim 1, characterized in that: The feeding mechanism includes a first feeding seat and a second feeding seat oppositely provided on the machine platform; a first conveyor belt is movably provided on the first feeding seat; a second conveyor belt is movably provided on the second feeding seat; both the first positioning component and the second positioning component are provided between the first feeding seat and the second feeding seat.

3. The semiconductor chip QR code acquisition device according to claim 2, characterized in that: The upper feeding mechanism includes an upper feeding seat provided on the machine platform, a first upper feeding plate provided at one end of the upper feeding seat, and a second upper feeding plate provided at the other end of the upper feeding seat; the trays are stacked between the first upper feeding plate and the second upper feeding plate; both the first upper feeding plate and the second upper feeding plate are provided on the tops of the first feeding seat and the second feeding seat; The upper feeding mechanism further includes a material distributing component provided on the upper feeding seat; the upper feeding mechanism further includes an upper feeding lifting component provided between the first feeding seat and the second feeding seat.

4. The semiconductor chip two-dimensional code acquisition device according to claim 3, characterized in that: The material distributing component includes a first material distributing plate and a second material distributing plate movably provided on both sides of the upper feeding seat; both the first material distributing plate and the second material distributing plate are movably provided between the first upper feeding plate and the second upper feeding plate; both the first material distributing plate and the second material distributing plate are provided with material distributing blocks; the material distributing blocks are provided with material distributing inclined surfaces. A first material distributing cylinder and a second material distributing cylinder are respectively provided on both sides of the upper feeding seat; the output ends of the first material distributing cylinder and the second material distributing cylinder are respectively connected to the first material distributing plate and the second material distributing plate.

5. The semiconductor chip two-dimensional code acquisition device according to claim 3, characterized in that: The upper feeding lifting component includes an upper feeding lifting rod that is vertically movably provided between the first feeding seat and the second feeding seat; the upper feeding lifting rod is vertically movably provided between the bottoms of the first upper feeding plate and the second upper feeding plate.

6. The semiconductor chip two-dimensional code acquisition device according to claim 2, characterized in that: The first positioning component includes a first positioning block that is vertically movably provided between the first feeding seat and the second feeding seat and a first positioning cylinder provided between the first feeding seat and the second feeding seat; the output end of the first positioning cylinder is connected to the first positioning block; the second positioning component includes a second positioning block that is vertically movably provided between the first feeding seat and the second feeding seat and a second positioning cylinder provided between the first feeding seat and the second feeding seat; the output end of the second positioning cylinder is connected to the second positioning block; The first positioning block and the second positioning block are arranged in sequence along the length direction of the first feeding seat; The support column is provided with a light source.

7. The semiconductor chip two-dimensional code acquisition device according to claim 2, characterized in that: The lower feeding mechanism includes a lower feeding seat provided on the machine platform, a first lower feeding plate provided at one end of the lower feeding seat, and a second lower feeding plate provided at the other end of the lower feeding seat; the trays are stacked between the first lower feeding plate and the second lower feeding plate; both the first lower feeding plate and the second lower feeding plate are provided on the tops of the first feeding seat and the second feeding seat; The blanking mechanism further includes a material pressing component disposed on the blanking seat; the blanking mechanism further includes a blanking lifting component disposed between the first feeding seat and the second feeding seat.

8. A semiconductor chip two-dimensional code acquisition device according to claim 7, characterized in that: The material pressing component includes a first material pressing plate and a second material pressing plate movably disposed on both sides of the blanking seat; both the first material pressing plate and the second material pressing plate are movably disposed between the first blanking plate and the second blanking plate; a first material pressing cylinder and a second material pressing cylinder are respectively disposed on both sides of the blanking seat; the output ends of the first material pressing cylinder and the second material pressing cylinder are respectively connected to the first material pressing plate and the second material pressing plate.

9. A semiconductor chip two-dimensional code acquisition device according to claim 7, characterized in that: The blanking lifting component includes a blanking lifting rod that is vertically movably disposed between the first feeding seat and the second feeding seat; the blanking lifting rod is vertically movably disposed between the bottom of the first blanking plate and the bottom of the second blanking plate.

10. A semiconductor chip two-dimensional code acquisition device according to claim 7, characterized in that: The second blanking plate is provided with an opening; the second blanking plate is provided with a blanking cylinder; the output end of the blanking cylinder is provided with a blanking blocking plate; the blanking blocking plate is movably disposed at the opening; the machine table is provided with a discharge roller at the opening.

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