Display module and electronic equipment

Abstract

The utility model discloses a display module and electronic equipment, relates to the technical field of display, and can solve the technical problem that the overall thickness of the display module is reduced. The display module comprises a display panel and a back film assembly, the display panel is provided with a display side and a non-display side which are oppositely arranged, the back film assembly is located on the non-display side of the display panel and comprises a heat dissipation layer and a protective supporting layer which are arranged in a stacked mode, and the heat dissipation layer is connected to the protective supporting layer. According to the display module provided by the embodiment of the invention, the heat dissipation layer used for heat dissipation is integrated into the back film assembly, a heat dissipation film does not need to be independently arranged for the display module, and only the heat dissipation layer capable of conducting heat dissipation and heat transfer needs to be integrated into the back film assembly to be connected with the protective supporting layer to jointly form the back film assembly; the back film assembly carries out heat transfer and heat dissipation while supporting and protecting the display module, so that the overall thickness of the display module is reduced.

Description

Technical Field

[0001] This application relates to the field of display technologies, and in particular, to a display module and an electronic device. Background Art

[0002] With the continuous development of display module technologies for electronic devices such as mobile phones, the trend of the development of display modules is towards being thinner and lighter. In related technologies, in order to transfer heat, it is generally necessary to set up relevant heat dissipation structures such as heat dissipation films in the display module. Restricted by the heat dissipation structure, the overall thickness of the display module is relatively thick and cannot be further thinned. Summary of the Utility Model

[0003] Embodiments of this application provide a display module and an electronic device, which are used to solve the technical problem that the thickness of the display module is relatively thick and cannot be thinned.

[0004] To achieve the above objective, the embodiments of this application adopt the following technical solutions:

[0005] In a first aspect, this application provides a display module, which includes:

[0006] A display panel and a back film assembly. The display module includes a display panel and a back film assembly. The display panel has a display side and a non-display side that are oppositely arranged. The back film assembly is located on the non-display side of the display panel. The back film assembly includes a heat dissipation layer and a protection and support layer that are stacked, and the heat dissipation layer is connected to the protection and support layer.

[0007] In the display module provided by the embodiments of this application, the heat dissipation layer for dissipating heat from the display module is integrated into the back film assembly. While the back film assembly supports and protects the display module, it also transfers heat and dissipates heat. Compared with the technical solution in related technologies where a heat dissipation film is separately provided in the display module to achieve heat dissipation, the display module in the embodiments of this application can achieve the heat dissipation function without additionally setting a heat dissipation film, so that the thickness of the display module is no longer restricted by the heat dissipation film, and the thickness of the display module can be further thinned.

[0008] In a possible design of the first aspect, the orthographic projection of the display panel on the reference plane is located within the orthographic projection of the back film assembly on the reference plane, where the reference plane is perpendicular to the stacking direction of the heat dissipation layer and the protection and support layer. In this way, the back film assembly can completely cover and support the non-display side of the display panel. Thus, the back film assembly can effectively protect and support the outer edge of the display panel, thereby avoiding damage black spots formed by bumps due to ineffective protection at the edge of the display panel.

[0009] In a possible design of the first aspect, the thickness of the heat dissipation layer is less than the thickness of the protection and support layer. On the premise that the manufacturing process permits, the thickness of the heat dissipation layer can be further thinned to overall thin the thickness of the back film assembly.

[0010] In a possible design of the first aspect, the thickness of the heat dissipation layer is greater than or equal to one-third and less than or equal to one-half of the thickness of the back film assembly. For example, the thickness of the heat dissipation layer can be 0.35, 0.4, 0.45, 0.5, etc. of the total thickness of the back film assembly. In this way, on the basis of ensuring the heat dissipation effect of the heat dissipation layer, the overall thickness reduction of the display module is prevented from being affected by the too thick heat dissipation layer.

[0011] In a possible design of the first aspect, the thickness of the heat dissipation layer is less than or equal to 50 μm. While taking into account the heat dissipation effect, the thickness of the heat dissipation layer is minimized as much as possible. Exemplarily, the thickness of the heat dissipation layer can be greater than or equal to 30 μm and less than or equal to 50 μm. For example, the thickness of the heat dissipation layer is 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, etc., so as to balance the heat dissipation effect and the thin and light design of the display module.

[0012] In a possible design of the first aspect, the heat dissipation layer is a metal layer. For example, the heat conduction layer is a copper sheet to provide a good heat conduction and heat transfer effect. When the heat conduction layer is a metal layer, the heat conduction layer can also provide an electromagnetic shielding function in the display module.

[0013] In a possible design of the first aspect, the protective support layer is a polyethylene terephthalate layer. The polyethylene terephthalate layer provides a protective support effect. During the preparation of the display module, the protective support layer and the heat dissipation layer are attached to the display panel as a whole, thereby simplifying the preparation process.

[0014] In a possible design of the first aspect, the heat dissipation layer is located on the side of the protective support layer facing the display panel. That is, the heat dissipation layer is closer to the display panel than the protective support layer. At this time, the protective support layer forms the outer surface of the back film assembly, protecting the display panel and the heat dissipation layer at the same time, and the heat obtained by the heat dissipation layer is transferred through the protective support layer.

[0015] In a possible design of the first aspect, the heat dissipation layer is located on the side of the protective support layer away from the display panel. That is, the heat dissipation layer is farther from the display panel than the protective support layer. At this time, the heat dissipation layer forms the outer surface of the back film assembly to better transfer the heat of the display module.

[0016] In a possible design of the first aspect, the heat dissipation layer is adhesively connected to the protective support layer. For example, the heat dissipation layer and the protective support layer are adhesively connected through a first adhesive layer.

[0017] In a possible design of the first aspect, the back film assembly is adhesively connected to the display panel. During the process of manufacturing the display module, the protective support layer and the heat dissipation layer are first adhesively formed into a whole and then mutually attached to the display panel. Moreover, both the adhesive connection between the heat dissipation layer and the protective support layer and the adhesive connection between the back film assembly and the display panel can adopt planar fitting, which simplifies the manufacturing process and improves the manufacturing efficiency.

[0018] In a possible design of the first aspect, the first adhesive layer is a pressure-sensitive adhesive layer, and the pressure-sensitive adhesive has the characteristics of low light leakage and reusability.

[0019] In a possible design of the first aspect, the second adhesive layer is a pressure-sensitive adhesive layer, and the back film assembly is adhesively connected to the display panel through the second adhesive layer. The second adhesive layer can be disposed on the heat dissipation layer or on the protective support layer.

[0020] In a possible design of the first aspect, the thickness of the first adhesive layer is greater than or equal to 5 μm and less than or equal to 15 μm. For example, the thickness of the first adhesive layer is 3 μm, 5 μm, 12 μm, 15 μm, etc. While meeting the bonding strength, the thickness of the first adhesive layer 2124c can be thinned to further reduce the thickness of the display module.

[0021] In a possible design of the first aspect, the thickness of the second adhesive layer is greater than or equal to 5 μm and less than or equal to 15 μm. For example, the thickness of the second adhesive layer is 5 μm, 8 μm, 13 μm, 15 μm, etc. While meeting the bonding strength, the thickness of the second adhesive layer can be thinned to further reduce the thickness of the display module.

[0022] In a possible design of the first aspect, the thickness of the back film assembly is greater than or equal to 70 μm and less than or equal to 120 μm.

[0023] In a possible design of the first aspect, the display module further includes a light-transmitting cover plate, which is disposed on the side of the polarizer away from the display panel. The light-transmitting cover plate is adhesively connected to the polarizer through a transparent optical adhesive, and the light-transmitting cover plate is mainly used to protect the display screen and prevent dust.

[0024] In a possible design of the first aspect, the light-transmitting cover plate is a 3D cover plate, so that the appearance of the electronic device can be made more beautiful.

[0025] In a possible design of the first aspect, the display panel is a flexible display panel to meet the fitting requirements of the display panel and the 3D cover plate.

[0026] In a possible design of the first aspect, the display module further includes a polarizer, which is located on the display side of the display panel. The polarizer is used to control the polarization direction of the light beam. That is, when natural light passes through the polarizer, the light with the vibration direction perpendicular to the transmission axis of the polarizer will be absorbed, and only the polarized light with the vibration direction parallel to the transmission axis of the polarizer remains after passing through.

[0027] In a second aspect, the present application provides an electronic device, including a display module and a middle frame, and the display module is arranged on the middle frame.

[0028] The electronic device can be a foldable electronic device or a non-foldable electronic device.

[0029] In a possible implementation of the second aspect, the electronic device is a foldable electronic device, which includes a first support member. The first support member includes a display module and a first middle frame. The first middle frame includes a frame, and the frame is arranged around the edge of the display module for one week, and the display module is connected to the frame.

[0030] In a possible implementation of the second aspect, the first middle frame further includes a middle plate. The frame is arranged around the outer periphery of the middle plate. The middle plate is in a plate shape, and the frame is arranged around the outer periphery of the middle plate. The display module is fixedly connected to the frame and spaced apart from the middle plate.

[0031] In a possible implementation of the second aspect, the display module may include a light-transmitting cover plate and a display screen. The light-transmitting cover plate and the display screen are stacked and fixedly connected. The light-transmitting cover plate is mainly used to protect the display screen and prevent dust.

[0032] Among them, for the technical effects brought by any design in the second aspect, reference can be made to the technical effects brought by any design in the first aspect, which will not be elaborated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a three-dimensional view of a foldable electronic device provided by some embodiments of the present application in an unfolded state;

[0034] Figure 2 is Figure 1 a schematic structural diagram of the foldable electronic device shown in a folded state;

[0035] Figure 3 is Figure 1 a cross-sectional view of the foldable electronic device shown at line A-A;

[0036] Figure 4 It is a partial cross-sectional view of a display module provided by some embodiments of the present application;

[0037] Figure 5 is Figure 4Assembly schematic diagram of the back film, polarizer and display panel shown;

[0038] Figure 6 is Figure 4 Partial cross-sectional view of the heat dissipation film of an embodiment in the display module shown;

[0039] Figure 7 is Figure 4 Partial cross-sectional view of the heat dissipation film of another embodiment in the display module shown;

[0040] Figure 8 is Figure 4 Assembly process diagram of the display module shown in;

[0041] Figure 9 Schematic diagram of the fitting of a roller jig for curved surface fitting;

[0042] Figure 10a is Figure 9 Partial cross-sectional view of the third intermediate module obtained after curved surface fitting shown in;

[0043] Figure 10b is Figure 4 The heat dissipation film shown and Figure 9 Partial cross-sectional view after the fitting of the curved surface of the third intermediate module shown;

[0044] Figure 11 Partial cross-sectional view of the display module provided by some other embodiments;

[0045] Figure 12 is Figure 11 Enlarged view of the structure at A in;

[0046] Figure 13 Partial cross-sectional view of the display module provided by some other embodiments of the present application;

[0047] Figure 14 is Figure 13 Partial cross-sectional view of the back film assembly in the display module shown;

[0048] Figure 15 is Figure 14 Assembly schematic diagram of the heat dissipation layer and the protective support layer of the back film assembly in;

[0049] Figure 16 is Figure 13 Assembly schematic diagram of the back film assembly and the display panel shown in;

[0050] Figure 17 is Figure 13 Assembly process diagram of the display module shown in;

[0051] Figure 18 is Figure 13Schematic diagram of the assembly of the polarizer and the display panel in the display module shown;

[0052] Figure 19 is Figure 13 Schematic diagram of the orthographic projection relationship between the back film assembly, the display panel and the reference plane of the display module shown;

[0053] Figure 20 Schematic diagram of the roll-to-roll lamination structure;

[0054] Figure 21 Schematic diagram of the assembly of the back film assembly and the display panel provided by some embodiments of the present application;

[0055] Figure 22 is Figure 21 Schematic diagram of the bonding of the back film assembly and the display panel shown;

[0056] Figure 23 Schematic diagram of the assembly of the back film assembly and the display panel provided by some other embodiments of the present application;

[0057] Figure 24 is Figure 23 Schematic diagram of the bonding of the back film assembly and the display panel shown;

[0058] Reference numerals:

[0059] 100, electronic device;

[0060] 10, folding screen; 10a, first display part; 10b, second display part; 10c, third display part;

[0061] 20, support assembly; 20a, first support; Q1, first accommodation cavity; 20b, second support; Q2, second accommodation cavity; 20c, rotating shaft mechanism;

[0062] 21, display module; 21d, first intermediate module; 21e, second intermediate module; 21n, third intermediate module; 21m, lamination curved surface;

[0063] 211, light-transmitting cover plate; 212, display screen;

[0064] 2121, polarizer; 2122, display panel; 2122a, display side; 2122b, non-display side; 2123, back film; 2124, back film assembly; 2124a, heat dissipation layer; 2124b, protective support layer; 2124c, first adhesive layer; 2124d, second adhesive layer; 2125, heat dissipation film; 2125a, heat conduction layer; 2125b, buffer layer; 2131, bonding adhesive layer; 2132, silicone gel layer; 2133, transparent optical adhesive; 2134, third adhesive layer; 2135, pressure-sensitive adhesive layer;

[0065] 22. First middle frame; 221. Frame; 222. Middle plate; 23. Second middle frame; 24. Second back cover;

[0066] 300. Roller jig; 310. Roller; 320. Carrying platform;

[0067] 410. Heat dissipation coil roller; 411. First support roller; 420. Protective coil roller; 421. Second support roller; 510. First traction mechanism; 520. Second traction mechanism;

[0068] a. Reference plane. Detailed implementation manner

[0069] In the embodiments of the present application, terms such as "exemplary" or "for example" are used to represent examples, illustrations or explanations. Any embodiment or design solution described as "exemplary" or "for example" in the embodiments of the present application should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Rather, the use of terms such as "exemplary" or "for example" is intended to present relevant concepts in a specific manner.

[0070] In the embodiments of the present application, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features.

[0071] In the description of the embodiments of the present application, the term "at least one" means one or more, and "a plurality" means two or more. "At least one of the following" or its similar expressions refer to any combination of these items, including any combination of single item or plural items. For example, at least one of a, b, or c may represent: a, b, c, a - b, a - c, b - c, or a - b - c, where a, b, c may be single or multiple.

[0072] In the description of the embodiments of the present application, the term "and / or" means and encompasses any and all possible combinations of one or more of the associated listed items. The term "and / or" is a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in the present application generally represents an "or" relationship between the front and back associated objects.

[0073] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "coupled" should be understood in a broad sense. For example, "connected" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. Among them, "fixed connection" means that they are connected to each other and the relative positional relationship after connection remains unchanged.

[0074] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, the terms "installed", "connected", and "coupled" should be understood in a broad sense. For example, "connected" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. The directional terms mentioned in the embodiments of the present application, such as "inside", "outside", etc., are only with reference to the direction of the accompanying drawings. Therefore, the directional terms used are for better and clearer description and understanding of the embodiments of the present application, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation on the embodiments of the present application.

[0075] In the description of the embodiments of the present application, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising that element. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising that element.

[0076] The embodiments of the present application provide an electronic device, which includes but is not limited to mobile phones, tablet computers, laptop computers, personal computers, vehicle-mounted devices, e-readers, smart screens (TVs), monitors, speakers, walkmans, radios, wearable devices, medical devices, etc. Among them, wearable devices include but are not limited to augmented reality (AR) glasses, AR helmets, virtual reality (VR) glasses, VR helmets, watches, bracelets, earphones, etc.

[0077] Among them, the electronic device can be a foldable electronic device (such as a folding mobile phone, etc.) or a non-foldable electronic device (such as a straight mobile phone, a tablet computer, etc.). In this embodiment, the electronic device 100 is taken as an example of a folding mobile phone for illustration.

[0078] Please refer to Figure 1 , Figure 1 which is a perspective view of the foldable electronic device 100 provided by some embodiments of the present application in the unfolded state. The foldable electronic device 100 includes a folding screen 10 and a support assembly 20. In this embodiment, the foldable electronic device 100 is approximately in the shape of a rectangular flat plate in the unfolded state. In other embodiments, the shape of the foldable electronic device 100 in the unfolded state can also be a circular flat plate, an oval flat plate, etc.

[0079] The folding screen 10 is used to display information such as images and videos. Please refer to Figure 1 , the folding screen 10 includes a first display portion 10a, a second display portion 10b, and a third display portion 10c. The third display portion 10c is connected between the first display portion 10a and the second display portion 10b. The third display portion 10c of the folding screen 10 is a flexible structure. The first display portion 10a and the second display portion 10b of the folding screen 10 can be flexible structures or rigid structures, and no specific limitation is made here.

[0080] Among them, Figure 1 the first display portion 10a, the second display portion 10b, and the third display portion 10c are schematically divided by dotted lines in, and these dotted lines do not actually exist in the folding screen 10. The same understanding can be made for the dotted lines on other components in the following text, and no further elaboration will be made.

[0081] Please refer to Figure 2 , Figure 2 which is Figure 1 a schematic structural diagram of the foldable electronic device 100 shown in the folded state, and the folding screen 10 in the foldable electronic device 100 is also in the folded state. Specifically, when the folding screen 10 is in the folded state, the first display portion 10a and the second display portion 10b of the folding screen 10 are approximately parallel and opposite to each other, and the third display portion 10c is bent. At this time, the third display portion 10c can be in a U shape, a water droplet shape, etc. In this state, the size of the electronic device 100 is smaller and it is convenient to carry.

[0082] In Figure 2 the embodiment shown, when the foldable electronic device 100 is in the folded state, the support assembly 20 protects the folding screen 10, and the folding screen 10 is not visible to the user. That is, the foldable electronic device 100 is an inward folding electronic device 100. In other embodiments, when the foldable electronic device 100 is in the folded state, the folding screen 10 can also be located outside the support assembly 20, and the folding screen 10 is visible to the user. That is, the foldable electronic device 100 is an outward folding electronic device 100.

[0083] The support assembly 20 is used to carry and support the folding screen 10. Please refer toFigure 3 , Figure 3 is Figure 1 a cross-sectional view of the foldable electronic device 100 shown at line A-A. The support assembly 20 includes a first support member 20a, a second support member 20b, and a rotating shaft mechanism 20c.

[0084] The first support member 20a and the second support member 20b can achieve relative rotation or synchronous rotation through the rotating shaft mechanism 20c. Specifically, the rotating shaft mechanism 20c can switch between an unfolded state and a folded state, thereby allowing the entire foldable electronic device 100 to switch between the unfolded state and the folded state. Among them, when the rotating shaft mechanism 20c is in the folded state, the support assembly 20 and the foldable electronic device 100 are also in the folded state. When the rotating shaft mechanism 20c is in the unfolded state, the support assembly 20 and the foldable electronic device 100 are also in the unfolded state.

[0085] When the foldable electronic device 100 is a foldable screen electronic device, when the foldable electronic device 100 is in the unfolded state, the angle between the first support member 20a and the second support member 20b can be approximately 180 degrees; when the foldable electronic device 100 is in the folded state, the angle between the first support member 20a and the second support member 20b is approximately 0 degrees. It can be understood that in other embodiments, when the foldable electronic device 100 is other devices, the angle between the first support member 20a and the second support member 20b can also be other angles in the unfolded state and the folded state, and the present application does not make specific limitations on this.

[0086] Please continue to refer to Figure 3 , in some embodiments, the first support member 20a includes a display module 21 and a first middle frame 22. The display module 21 is used to display information such as images and videos, and the first middle frame 22 is used to carry and support the display module 21. When the foldable electronic device 100 is in the folded state, the display module 21 of the support assembly 20 is located outside the foldable electronic device 100 and is visible to the user, that is, the user can operate the display module 21 from the outside at this time.

[0087] Please refer to Figure 3 , the first middle frame 22 can include a middle plate 222 and a frame 221. The middle plate 222 is in a plate shape, and the frame 221 surrounds the outer periphery of the middle plate 222. The display module 21 is fixedly connected to the frame 221 and is spaced apart from the middle plate 222. A first accommodation cavity Q1 is formed between the first middle frame 22 and the display module 21. The first support member 20a can be connected to the rotating shaft mechanism 20c by means of the first middle frame 22.

[0088] The second support member 20b may include a second middle frame 23 and a second back cover 24. The second display portion 10b of the folding screen 10 is carried on the second middle frame 23. The second back cover 24 is fixedly connected to a side of the second middle frame 23 away from the second display portion 10b. The second support member 20b may be connected to the rotation shaft mechanism 20c by means of the second middle frame 23 or the second back cover 24. A second accommodation cavity Q2 is formed between the second middle frame 23 and the second back cover 24.

[0089] In some embodiments, the material of the second back cover 24 includes but is not limited to metal, plastic, glass, ceramic, etc. The structure of the second middle frame 23 may be the same as that of the first middle frame 22, which will not be elaborated here. Additionally, in other embodiments, the second back cover 24 may also be replaced with a display module 21.

[0090] Please continue to refer to Figure 3 , the display module 21 may include a light-transmitting cover plate 211 and a display screen 212. The light-transmitting cover plate 211 and the display screen 212 are stacked and fixedly connected. The light-transmitting cover plate 211 is mainly used to protect the display screen 212 and prevent dust. The display module 21 may be fixed to the frame 221 by means of the light-transmitting cover plate 211. The material of the light-transmitting cover plate 211 includes but is not limited to glass, acrylic, etc. The light-transmitting cover plate 211 in this embodiment is a 3D cover plate, so that the appearance of the electronic device 100 can be made more beautiful. In other embodiments, the light-transmitting cover plate 211 may also be a 2D cover plate or a 2.5D cover plate.

[0091] The display screen 212 may be a flexible display screen or a rigid display screen. For example, the display screen 212 may be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode display screen, a micro organic light-emitting diode display screen, a micro-organic light-emitting diode display screen, a quantum dot light-emitting diode (QLED) display screen, or a liquid crystal display (LCD), and so on.

[0092] Please refer toFigure 4 , Figure 4 is a partial cross-sectional view of the display module 21 provided by some embodiments of the present application. The display screen 212 includes a polarizer 2121, a display panel 2122, a back film 2123, and a heat dissipation film 2125.

[0093] Specifically, the polarizer 2121 (polarizer, POL), also known as a polarized light sheet, is used to control the polarization direction of light beams. That is, when natural light passes through the polarizer 2121, the light whose vibration direction is perpendicular to the transmission axis of the polarizer 2121 will be absorbed, and only the polarized light whose vibration direction is parallel to the transmission axis of the polarizer 2121 remains in the transmitted light. The polarizer 2121 can be bonded to one surface of the light-transmitting cover plate 211 facing the display module 21, that is, the light-transmitting cover plate 211 is located on the side of the polarizer 2121 facing away from the display panel 2122.

[0094] Please refer to Figure 5 , Figure 5 is Figure 4 a partial assembly schematic diagram of the back film 2123, the polarizer 2121, and the display panel 2122 shown. The display panel 2122 has a display side 2122a and a non-display side 2122b that are oppositely arranged. The display side 2122a of the display panel 2122 faces the light-transmitting cover plate 211, and the non-display side 2122b of the display panel 2122 faces the middle plate 222.

[0095] Please continue to refer to Figure 5 , the polarizer 2121 is located on the display side 2122a of the display panel 2122, and the back film 2123 (back plane film, BPF) is located on the non-display side 2122b of the display panel 2122. The back film 2123 includes a polyethylene terephthalate (polyethylene terephthalate, PET) layer, and the polyethylene terephthalate layer provides support and protection for the display panel 2122. Specifically, the polarizer 2121 is adhesively connected to the display side 2122a of the display panel 2122 through a transparent optical adhesive 2133, and the back film 2123 is adhesively connected to the non-display side 2122b of the display panel 2122 through a pressure-sensitive adhesive layer 2135 (pressure sensitive adhesive, PSA). The pressure-sensitive adhesive layer 2135 can be integrated into an integral structure with the polyethylene terephthalate layer. That is, the back film 2123 includes a polyethylene terephthalate layer and a pressure-sensitive adhesive layer 2135.

[0096] Exemplarily, provide one such as Figure 5The specifications of the back film 2123 and the pressure-sensitive adhesive layer 2135 shown, wherein the thickness of the polyethylene terephthalate layer can be 65 micrometers (μm), the thickness of the pressure-sensitive adhesive layer 2135 can be 13 μm, and the total thickness of the heat dissipation film 2125 of this specification is 78 μm.

[0097] In some embodiments, please refer to Figure 6 , Figure 6 is Figure 4 A partial cross-sectional view of the heat dissipation film 2125 of an embodiment in the display module 21 shown. The heat dissipation film 2125 helps to quickly dissipate the heat generated when the display screen 212 works. The heat dissipation film 2125 is composed of multiple layers of films laminated together. Specifically, the heat dissipation film 2125 includes a heat conduction layer 2125a and a buffer layer 2125b. The heat conduction layer 2125a is the main structure in the heat dissipation film 2125 for heat conduction. The heat conduction layer 2125a can be a metal layer, a graphite layer, etc. Exemplarily, the heat conduction layer 2125a is a copper foil. When the heat conduction layer 2125a is a metal layer, the heat conduction layer 2125a can also provide an electromagnetic shielding function in the display module 21. The buffer layer 2125b is disposed on one surface of the heat conduction layer 2125a facing the back film 2123. The buffer layer 2125b has elasticity and can play a role in buffering and shock resistance to improve the impact resistance of the display module 21. Exemplarily, the buffer layer 2125b is a foam.

[0098] Please continue to refer to Figure 6 , the heat dissipation film 2125 can be adhered to one surface of the back film 2123 facing away from the display panel 2122 through the adhesive layer 2131. The adhesive layer 2131 can be a pressure-sensitive adhesive layer, and the pressure-sensitive adhesive has the characteristics of low light leakage and reusability. More specifically, the adhesive layer 2131 can be a grid adhesive layer. The adhesive layer 2131 is disposed on one side of the buffer layer 2125b facing away from the heat conduction layer 2125a, that is, the buffer layer 2125b is located between the adhesive layer 2131 and the heat conduction layer 2125a. The adhesive layer 2131 can be integrated on the heat dissipation film 2125. That is, the adhesive layer 2131 and the heat dissipation film 2125 are an integral structure, or the heat dissipation film 2125 includes the heat conduction layer 2125a, the buffer layer 2125b, and the adhesive layer 2131. During assembly, the heat dissipation film 2125 is adhered to the back film 2123 through the adhesive layer 2131, and thus the fixation of the back film 2123 and the heat dissipation film 2125 can be achieved.

[0099] Exemplarily, provide a Figure 6The specifications of the heat dissipation film 2125 shown in the figure, where the thickness of the heat conduction layer 2125a can be 30 μm, the thickness of the buffer layer 2125b can be 120 μm, the thickness of the adhesive layer 2131 can be 40 μm, and the total thickness of the heat dissipation film 2125 with this specification is 200 μm. At this time, the total thickness of the heat dissipation film 2125 and the back film 2123 is 200 μm + the thickness of the back film 2123. Specifically, when the back film 2123 is Figure 5 As shown in an example of 78 μm, the total thickness of the heat dissipation film 2125 and the back film 2123 is 278 μm.

[0100] In some other embodiments, in order to further thin the display module 21, please refer to Figure 7 , Figure 7 is Figure 4 A partial cross-sectional view of the heat dissipation film 2125 of another embodiment in the display module 21 shown. Specifically, the heat dissipation film 2125 includes a heat conduction layer 2125a, and the heat conduction layer 2125a is bonded to the surface of the back film 2123 facing away from the display panel 2122 through a silicone gel layer 2132. The silicone gel layer 2132 can simultaneously achieve a buffering effect and an adhesive effect. The silicone gel layer 2132 can be integrated with the heat dissipation film 2125 into an integral structure. Or rather, the heat dissipation film 2125 includes the heat conduction layer 2125a and the silicone gel layer 2132. During assembly, the heat dissipation film 2125 is bonded to the back film 2123 through the silicone gel layer 2132, thereby realizing the fixation of the back film 2123 and the heat dissipation film 2125.

[0101] In Figure 7 The heat dissipation film 2125 provided in the embodiment shown provides a buffering effect through the silicone gel layer 2132. Compared with Figure 6 The heat dissipation film 2125 in the embodiment shown, the setting of the buffer layer 2125b is reduced, thereby realizing the further thinning of the display module 21.

[0102] Exemplarily, a heat dissipation film 2125 with the specifications shown in Figure 7 is provided, where the thickness of the heat conduction layer 2125a can be 30 μm, the thickness of the silicone gel layer 2132 can be 120 μm, and the total thickness of the heat dissipation film 2125 is 150 μm. At this time, the total thickness of the heat dissipation film 2125 and the back film 2123 is 200 μm + the thickness of the back film 2123. Specifically, when the back film 2123 is Figure 5 As shown in an example of 78 μm, the total thickness of the heat dissipation film 2125 and the back film 2123 is 228 μm, relative to Figure 6 The total thickness of the display module 21 in the embodiment shown, it can be thinned by 50 μm (278 μm - 228 μm).

[0103] In Figure 6 The embodiment shown andFigure 7 In the illustrated embodiment, the light-transmitting cover plate 211 may be a 3D cover plate, and the display panel 2122 may be a flexible display panel. When the heat dissipation film 2125 is attached to the display module 21 including the 3D cover plate, the heat dissipation film 2125 needs to be attached by single-piece curved surface fitting. After the back film 2123, the polarizer 2121 and the light-transmitting cover plate 211 are attached to the display module 21, it is then separately attached to the back film 2123 by curved surface fitting. Due to the constraints of the fitting process, fitting position and its own structure of the heat dissipation film 2125, the thickness of the heat dissipation film 2125 cannot be further reduced, and thus the display module 21 cannot be further thinned.

[0104] Specifically, please refer to Figure 8 , Figure 8 which is Figure 4 the assembly process diagram of the display module 21 shown in

[0105] Step 1: Bond the back film 2123 to the non-display side 2122b of the display panel 2122 to obtain a first intermediate module 21d including the back film 2123 and the display panel 2122;

[0106] Step 2: Bond the polarizer 2121 to the display side 2122a of the display panel 2122 to obtain a second intermediate module 21e including the polarizer 2121, the display panel 2122, and the back film 2123;

[0107] Step 3: Bond the polarizer 2121 to the surface of the light-transmitting cover plate 211 through the transparent optical glue 2133 to obtain a third intermediate module 21n including the light-transmitting cover plate 211, the polarizer 2121, the display panel 2122, and the back film 2123;

[0108] Step 4: Bond the heat dissipation film 2125 to the surface of the back film 2123 facing away from the display panel 2122 to obtain the display module 21 including the light-transmitting cover plate 211, the polarizer 2121, the display panel 2122, the back film 2123, and the heat dissipation film 2125.

[0109] In the actual assembly process, the assembly sequence of Step 1 - Step 2 - Step 3 - Step 4 can be followed, that is, first bond the back film 2123, and then bond the polarizer 2121. Or the assembly sequence of Step 2 - Step 1 - Step 3 - Step 4 can be followed, that is, first bond the polarizer 2121, and then bond the back film 2123. The bonding sequence of the back film 2123 and the polarizer 2121 can be adjusted according to actual requirements.

[0110] In other embodiments, the display module 21 further includes other layers in addition to the back film 2123, the heat dissipation film 2125, and the polarizer 2121. Then, in the actual assembly sequence, according to the specific positions of the other layers, the assembly sequence can be adaptively adjusted, and the present application does not make specific restrictions.

[0111] In some embodiments, the bonding process of the back film 2123 and the polarizer 2121 in Step 1 and Step 2 is planar bonding, which is carried out by a planar bonding process. The planar back film 2123 is bonded to the non-display side 2122b of the display panel 2122 in a planar shape. Specifically, the back film 2123 is adhesively connected to the non-display side 2122b of the display panel 2122. The planar polarizer 2121 is bonded to the display side 2122a of the display panel 2122 in a planar shape. Specifically, the polarizer 2121 is adhesively connected to the display side 2122a of the display panel 2122.

[0112] In Step 3, when the light-transmitting cover plate 211 is a 3D cover plate, the light-transmitting cover plate 211 and the polarizer 2121 need to be bonded by curved surface bonding, which is carried out by a curved surface bonding process. The curved surface bonding includes roller 310 bonding, vacuum bonding, etc. Refer to Figure 9 , Figure 9 A schematic diagram of the roller jig 300 for curved surface bonding is provided. The roller jig 300 at least includes a carrier table 320 and a roller 310. The side of the second intermediate module 21e with the back film 2123 faces upward and away from the carrier table 320. The roller 310 rolls on one side of the back film 2123 to form a curved surface of the second intermediate module 21e and complete the bonding and fixing with the 3D cover plate, obtaining the third intermediate module 21n.

[0113] Refer to Figure 10a , Figure 10a For Figure 9 a partial cross-sectional view of the third intermediate module 21n obtained after the curved surface bonding shown in

[0114] At this time, the basic layers of the display panel 2122 (including but not limited to the polarizer 2121, the back film 2123, etc.) have been bonded. A bonding curved surface 21m is formed on the side of the back film 2123 away from the display panel 2122. And through Step 4, the heat dissipation film 2125 is bonded to the bonding curved surface 21m. It can be understood that at this time, the heat dissipation film 2125 needs to be separately bonded to the bonding curved surface 21m of the back film 2123 through curved surface bonding. Figure 10b , Figure 10b For Figure 4 the heat dissipation film 2125 shown in Figure 9Partial cross-sectional view after the conforming surface 21m of the shown third intermediate module 21n is conformed. The heat dissipation film 2125 includes a buffer layer 2125b. At the position with a small radius of curvature near the left edge of the heat dissipation film 2125, the degree of compression of the buffer layer 2125b is relatively large, the density of the buffer layer 2125b at this position is relatively large, and the thickness of the buffer layer 2125b after being compressed here is B. While at the position with a relatively large radius of curvature near the right edge of the heat dissipation film 2125, the degree of compression of the buffer layer 2125b is relatively small, the density of the buffer layer 2125b at this position is relatively small, and the thickness of the buffer layer 2125b after being compressed here is C, and B is less than C. That is to say, the thickness of the buffer layer 2125b at the position with a small radius of curvature is less than the thickness of the buffer layer 2125b at the position with a large radius of curvature. In other embodiments, the heat dissipation film 2125 may also include a silicone gel layer 2132, and the thickness distribution of the silicone gel layer 2132 is the same as that of the buffer layer 2125b, which will not be elaborated here.

[0115] In order to ensure the conforming effectiveness of the heat dissipation film 2125 at all conforming positions against the conforming surface 21m during the conforming process on the curved surface, the layers of the heat dissipation film 2125 other than the heat conduction layer 2125a (such as the buffer layer 2125b or the silicone gel layer 2132) need to have a certain thickness to ensure that the heat dissipation film 2125 can have a full-coverage buffering effect after conforming. Exemplarily, in Figure 6 the shown embodiment as well as Figure 7 the shown embodiment, in order for the heat dissipation film 2125 to take into account all conforming positions, the thickness of the buffer layer 2125b or the silicone gel layer 2132 cannot be less than 0.1 mm to ensure the buffering effect after conforming the heat dissipation film 2125 on the curved surface. And, in the self-structure of the heat dissipation film 2125, the thickness of the buffer layer 2125b only accounts for 15% of the total thickness of the heat dissipation film 2125, while the thickness of the buffer layer 2125b or the silicone gel layer 2132 occupies more than 80% of the total thickness of the heat dissipation film 2125. Thus, under the multiple restrictions of the conforming process, conforming position and self-structure of the heat dissipation film 2125, the thickness of the heat dissipation film 2125 cannot be further thinned, and the thickness of the display module 21 is also restricted by the thickness of the heat dissipation film 2125 and cannot be further thinned.

[0116] On the other hand, in Figure 8During the bonding process shown, the bonding of the heat dissipation film 2125 in the display module 21 is carried out separately after the bonding of the display panel 2122 in the display module 21 with each basic layer (including but not limited to the polarizer 2121, the back film 2123, etc.) has been completed. That is to say, after the back film 2123 and the polarizer 2121 are integrally bonded by planar bonding, the bonding with the 3D cover plate is completed through curved surface bonding, and then the heat dissipation film 2125 is singly curvedly bonded to the bonding curved surface 21m. In this way, the display module 21 requires at least two curved surface bondings to complete the entire bonding process. Each curved surface bonding will generate a certain bonding error. If the bonding error is too large, the overall outer edge size of the display module 21 will not meet the specifications, resulting in the inability to fit and install between the display module 21 and the first middle frame 22, and reducing the yield rate of the display module 21. Therefore, in order to ensure the yield rate of the display module 21 and the assembly adaptability with the first middle frame 22 after molding, when the heat dissipation film 2125 is bonded to the bonding curved surface 21m, it is necessary to focus on the bonding error of the heat dissipation film 2125 so that the outer edge of the heat dissipation film 2125 does not exceed the outer edge of the display panel 2122.

[0117] Please refer to Figure 11 and Figure 12 , Figure 11 is a partial cross-sectional view of the display module 21 provided for some other embodiments. Figure 12 is Figure 11 the enlarged view of the structure at A in , and since the outer edge of the heat dissipation film 2125 cannot exceed the outer edge of the display panel 2122, the edge of the heat dissipation film 2125 may not be flush with the outer edge of the display panel 2122 and is set to be retracted relative to the outer edge of the display panel 2122. That is to say, the overall size of the heat dissipation film 2125 is smaller than the overall size of the display panel 2122. At this time, a gap F is formed between the edge of the heat dissipation film 2125 and the outer edge of the display panel 2122.

[0118] However, in Figure 11 the embodiment shown, the heat dissipation film 2125 cannot completely cover the display panel 2122, making the outer edge of the display panel 2122 completely exposed and unable to be effectively supported by the heat dissipation film 2125. Specifically, the outer edge of the display panel 2122 cannot be effectively supported by the heat conduction layer 2125a in the heat dissipation film 2125, and the display panel 2122 is prone to being damaged after being knocked and showing display problems such as black spots.

[0119] In order to solve the technical problem that the thickness of the display module 21 cannot be further reduced, please refer to Figure 13 , Figure 13A partial cross-sectional view of the display module 21 provided by other embodiments of the present application. In this embodiment, the display module 21 includes a light-transmitting cover plate 211 and a display screen 212. The display screen 212 includes a polarizer 2121, a display panel 2122, and a back film assembly 2124. The back film assembly 2124 is on the non-display side 2122b of the display panel 2122. In this embodiment, the structures of the light-transmitting cover plate 211, the polarizer 2121, and the display panel 2122 can be the same as those of the Figure 4 light-transmitting cover plate 211, the polarizer 2121, and the display panel 2122 in the illustrated embodiment, and will not be described in detail herein.

[0120] Please refer to Figure 13 and Figure 14 , Figure 14 which is Figure 13 a partial cross-sectional view of the back film assembly 2124 in the illustrated display module 21. The back film assembly 2124 is used to provide support and protection for the display panel 2122 while providing heat transfer and heat dissipation functions. The back film assembly 2124 is composed of at least two layers of films. Specifically, the back film assembly 2124 includes a heat dissipation layer 2124a and a protection and support layer 2124b that are stacked and connected. The heat dissipation layer 2124a helps to quickly dissipate the heat generated when the display screen 212 works. The heat dissipation layer 2124a can be a conductive layer, a metal layer, a graphite layer, etc. Exemplarily, the heat dissipation layer 2124a is a copper foil. When the heat dissipation layer 2124a is a metal layer, the heat dissipation layer 2124a can also provide an electromagnetic shielding function in the display module 21. The structure of the heat dissipation layer 2124a can be the same as that of the Figure 4 thermal conductive layer 2125a in the illustrated embodiment.

[0121] The protection and support layer 2124b can play a role in supporting and protecting the display panel 2122. The protection and support layer 2124b can be a polyethylene terephthalate layer (i.e., a PET layer). During the preparation of the display module 21, the protection and support layer 2124b and the heat dissipation layer 2124a are attached to the display panel 2122 as a whole. That is, first, the protection and support layer 2124b and the heat dissipation layer 2124a are integrated to form the back film assembly 2124, and then the back film assembly 2124 is disposed on the display panel 2122.

[0122] The protection and support layer 2124b can be adhesively connected to the heat dissipation layer 2124a. Please refer to Figure 15 , Figure 15 which is Figure 14 an assembly schematic diagram of the heat dissipation layer 2124a and the protection and support layer 2124b of the back film assembly 2124 in

[0123] The back film assembly 2124 can also be adhesively connected to the display panel 2122. Please refer to Figure 16 , Figure 16 which is Figure 13 the assembly schematic diagram of the back film assembly 2124 and the display panel 2122 shown in. Specifically, the back film assembly 2124 is adhesively bonded to the display panel 2122 through the second adhesive layer 2124d. The second adhesive layer 2124d can be disposed on the heat dissipation layer 2124a or on the protective support layer 2124b. The second adhesive layer 2124d can be integrated on the back film assembly 2124, that is, the second adhesive layer 2124d and the back film assembly 2124 are of an integral structure. Or rather, the back film assembly 2124 includes a heat dissipation layer 2124a, a protective support layer 2124b, and a second adhesive layer 2124d. During assembly, the display panel 2122 can be adhesively bonded to the second adhesive layer 2124d, thereby realizing the fixation of the back film assembly 2124 and the display panel 2122.

[0124] The back film assembly 2124 can be directly adhesively bonded to the non-display side 2122b of the display panel 2122 through the second adhesive layer 2124d. At this time, there is no other layer between the back film assembly 2124 and the display panel 2122. The back film assembly 2124 can also be indirectly adhesively bonded to the non-display side 2122b of the display panel 2122 through the second adhesive layer 2124d. At this time, there are other layers between the back film assembly 2124 and the display panel 2122. The other layers are fixed to the non-display side 2122b of the display panel 2122, and the back film assembly 2124 is adhesively bonded to one surface of the other layers facing away from the display panel 2122.

[0125] In other embodiments, the protective support layer 2124b and the heat dissipation layer 2124a can also be connected by means other than adhesion, and the back film assembly 2124 can also be connected by means other than adhesion.

[0126] Please refer to Figure 17 , Figure 17 which is Figure 13 the assembly process diagram of the display module 21 shown in:

[0127] Step 1: Connect the protective support layer 2124b and the heat dissipation layer 2124a to form the back film assembly 2124;

[0128] Step 2: Adhesively bond the back film assembly 2124 to the non-display side 2122b of the display panel 2122;

[0129] Step 3: Adhesively bond the polarizer 2121 to the display side 2122a of the display panel 2122;

[0130] Step 4: Bond the polarizer 2121 to the surface of the light-transmitting cover plate 211 through the transparent optical adhesive 2133;

[0131] In steps 1, 2, and 3, planar lamination can be adopted. Specifically, the protective support layer 2124b and the heat dissipation layer 2124a are adhesively connected through the first adhesive layer 2124c. For example, planar lamination can be used to bond the protective support layer 2124b and the heat dissipation layer 2124a. Then, the planar back film assembly 2124 is adhesively bonded to the planar non-display side 2122b of the display panel 2122 through planar lamination. Specifically, the back film assembly 2124 realizes the adhesive connection between two planes with the non-display side 2122b of the display panel 2122 through the second adhesive layer 2124d. At this time, the back film assembly 2124 includes the heat dissipation layer 2124a, the protective support layer 2124b, the first adhesive layer 2124c, and the second adhesive layer 2124d. Subsequently, the planar polarizer 2121 is adhesively bonded to the planar display side 2122a of the display panel 2122. Refer to Figure 18 , Figure 18 For Figure 13 the assembly schematic diagram of the polarizer 2121 and the display panel 2122 in the display module 21 shown in

[0132] Figure 17 In the shown embodiment, steps 1, 2, and 3 can be completed through planar lamination. After the display panel 2122 is laminated with other basic layers (including but not limited to the polarizer 2121 and the back film assembly 2124), curved lamination is adopted for step 4 to complete the lamination with the display panel 2122.

[0133] In the display module 21 of the embodiment of the present application, the heat dissipation layer 2124a for dissipating heat from the display module 21 is integrated into the back film assembly 2124. The back film assembly 2124 supports and protects the display module 21 while transferring heat and dissipating heat. Compared with the technical solution of separately arranging a heat dissipation film 2125 in the display module 21 in the related art, the display module 21 in the embodiment of the present application can achieve the heat dissipation function without additionally arranging the heat dissipation film 2125, so that the thickness of the display module 21 is no longer restricted by the heat dissipation film 2125, and the thickness of the display module 21 is further reduced.

[0134] Moreover, the preparation of the back film assembly 2124 of the present application and the connection between the back film assembly 2124 and the display panel 2122 can both be achieved through simple planar lamination, which is beneficial to simplifying the preparation process and improving the preparation efficiency.

[0135] In other embodiments, the display module 21 may not include the transparent cover plate 211, that is, the display module 21 includes a polarizer 2121, a display panel 2122 and a back film assembly 2124. In this case, the non-display side 2122b of the display panel 2122 faces the middle plate 222, and the display side 2122a of the display panel 2122 faces the side away from the middle plate 222.

[0136] In order to solve the problem that the display module 21 is prone to produce damage spots, in some embodiments, refer to Figure 19 , Figure 19 for Figure 13 , a schematic diagram of the orthographic projection relationship between the back film assembly 2124 of the display module 21, the display panel 2122 and the reference plane a is shown in the figure, the orthographic projection of the display panel 2122 on the reference plane a is located within the orthographic projection of the back film assembly 2124 on the reference plane a, wherein the reference plane a is perpendicular to the stacking direction of the heat dissipation layer 2124a and the protective support layer 2124b (that is, Figure 19 in the Z-axis direction).

[0137] The orthographic projection of the back film assembly 2124 on the reference plane a can completely overlap with the orthographic projection of the display panel 2122 on the reference plane a. In this case, the outer edge size of the back film assembly 2124 is the same as the outer edge size of the display panel 2122, and the edge line of the orthographic projection of the display panel 2122 on the reference plane a completely overlaps with the edge line of the orthographic projection of the back film assembly 2124 on the reference plane a. The orthographic projection of the back film assembly 2124 on the reference plane a can also cover and exceed the orthographic projection of the display panel 2122 on the reference plane a. In this case, the orthographic projection of the back film assembly 2124 on the reference plane a includes a first area and a second area. The first area completely overlaps with the orthographic projection of the display panel 2122 on the reference plane a, and the second area is completely staggered with the orthographic projection of the display panel 2122 on the reference plane a.

[0138] In the display module 21 of the embodiment of the present application, the back film assembly 2124 can completely cover and support the non-display side 2122b of the display panel 2122. In this way, the back film assembly 2124 can effectively protect and support the outer edge of the display panel 2122, thereby avoiding the edge of the display panel 2122 from being damaged and formed by bumps due to lack of effective protection.

[0139] In some embodiments, the orthographic projection of the display panel 2122 on the reference plane a is located within the orthographic projection of the heat dissipation layer 2124a on the reference plane a. The back film assembly 2124 effectively protects and supports at least the outer edge of the display panel 2122 through the heat dissipation layer 2124a. In other embodiments, the orthographic projection of the display panel 2122 on the reference plane a is located within the orthographic projection of the protection and support layer 2124b on the reference plane a. The back film assembly 2124 effectively protects and supports at least the outer edge of the display panel 2122 through the protection and support layer 2124b. In still other embodiments, the orthographic projection of the display panel 2122 on the reference plane a may be located within the orthographic projection of the heat dissipation layer 2124a on the reference plane a and also within the orthographic projection of the protection and support layer 2124b on the reference plane a.

[0140] When forming the back film assembly 2124, the heat dissipation layer 2124a and the protection and support layer 2124b can be bonded using a roll-to-roll lamination process. Refer to Figure 20 , Figure 20 , which is a schematic structural diagram of a roll-to-roll lamination. A heat dissipation coil roll 410 and a protection coil roll 420 are provided. The heat dissipation coil roll 410 includes a first support roll 411 and the material of the heat dissipation layer 2124a wound around its outer circumference. The protection coil roll 420 includes a second support roll 421 and the material of the protection and support layer 2124b wound around its outer circumference. While the first support roll 411 and the second support roll 421 are rotating, the heat dissipation layer 2124a is peeled off from the first support roll 411 by a first traction mechanism 510, and the protection and support layer 2124b is peeled off from the second support roll 421 by a second traction mechanism 520. The peeled heat dissipation layer 2124a and protection and support layer 2124b are arranged at intervals in the direction of their own thickness. Then, the heat dissipation layer 2124a and the protection and support layer 2124b approach each other in the direction of their own thickness and are bonded by a set pressing tool. Subsequently, through a laser cutting device, laser integral cutting is performed along the lamination direction of the heat dissipation layer 2124a and the protection and support layer 2124b to obtain the final required back film assembly 2124.

[0141] In Figure 20 , the intermediate processes through which the first traction mechanism 510 peels off the heat dissipation layer 2124a from the first support roll 411 are omitted by dashed lines, and the intermediate processes through which the second traction mechanism 520 peels off the protection and support layer 2124b from the second support roll 421 are also omitted by dashed lines. This dashed line part does not exist in the actual heat dissipation layer 2124a and protection and support layer 2124b.

[0142] In other embodiments, the heat dissipation roll 410 may not include the first support roll 411, in which case the heat dissipation roll 410 is completely formed by winding the material of the heat dissipation layer 2124a. Similarly, the protective roll 420 may not include the second support roll 421, in which case the protective support roll is completely formed by winding the material of the protective support layer 2124b.

[0143] It can be understood that the outer edges of the heat dissipation layer 2124a and the protective support layer 2124b of the back film assembly 2124 obtained by laser cutting completely overlap, that is, the heat dissipation layer 2124a and the protective support layer 2124b are completely identical except for the thickness. The laser cutting equipment needs to be able to cut different materials at the same time, such as copper and polyethylene terephthalate layers.

[0144] On this basis, the display module 21 of this embodiment does not need to be additionally laminated with the heat dissipation film 2125 , thus saving the lamination process and lamination time, improving the overall efficiency, reducing the production cost, and providing better protection for the display panel 2122 .

[0145] In some embodiments, when the heat dissipation layer 2124a and the protective support layer 2124b are connected, a process of setting a corresponding adhesive layer between the heat dissipation layer 2124a and the protective support layer 2124b to achieve adhesion of the heat dissipation layer 2124a and the protective support layer 2124b may be included. For example, a first adhesive layer 2124c is set on the side of the heat dissipation layer 2124a facing the protective support layer 2124b, or a first adhesive layer 2124c is set on the side of the protective support layer 2124b facing the heat dissipation layer 2124a. In other embodiments, after the heat dissipation layer 2124a and the protective support layer 2124b are bonded, a second adhesive layer 2124d may be set on the side of the heat dissipation layer 2124a away from the protective support layer 2124b, or a second adhesive layer 2124d may be set on the side of the protective support layer 2124b away from the heat dissipation layer 2124a, so as to facilitate the subsequent bonding of the back film assembly 2124 and the display panel 2122.

[0146] In some embodiments, the first adhesive layer 2124c is a pressure-sensitive adhesive layer, or the second adhesive layer 2124d is a pressure-sensitive adhesive layer. Exemplarily, a display module 21 is provided, and the display module 21 includes a first adhesive layer 2124c, a second adhesive layer 2124d, a heat dissipation layer 2124a, and a protective support layer 2124b.

[0147] In any of the above embodiments, the material of the first adhesive layer 2124c and the second adhesive layer 2124d may be the same. Exemplarily, the material of the first adhesive layer 2124c and the second adhesive layer 2124d are both pressure-sensitive adhesive layers, thereby achieving a universal setting. When preparing the back film assembly 2124, only one material of adhesive needs to be provided, which is conducive to simplifying the processing process, improving production efficiency, and reducing costs.

[0148] See also Figure 21 , Figure 21 An assembly diagram of a back film assembly 2124 and a display panel 2122 is provided for some embodiments of the present application, wherein the heat dissipation layer 2124a is located on the side of the protective support layer 2124b facing the display panel 2122, that is, the heat dissipation layer 2124a is closer to the display panel 2122 than the protective support layer 2124b. At this time, the protective support layer 2124b forms the outer surface of the back film assembly 2124, and protects and supports the display panel 2122 while protecting the heat dissipation layer 2124a. The heat obtained by the heat dissipation layer 2124a is transferred through the protective support layer 2124b.

[0149] Figure 22 for Figure 21 The schematic diagram of the bonding of the back film assembly 2124 and the display panel 2122 shows that the heat dissipation layer 2124a is bonded and fixed to the display panel 2122 through the second adhesive layer 2124d, and the heat dissipation layer 2124a is bonded and fixed to the protective support layer 2124b through the first adhesive layer 2124c, that is, at this time, the back film assembly 2124 is sequentially provided with the second adhesive layer 2124d, the heat dissipation layer 2124a, the first adhesive layer 2124c and the protective support layer 2124b from the side close to the display panel 2122 to the side far from the display panel 2122.

[0150] See also Figure 23 , Figure 23 The assembly diagram of the back film assembly 2124 and the display panel 2122 provided for some other embodiments of the present application, the heat dissipation layer 2124a is located on the side of the protective support layer 2124b away from the display panel 2122, that is, the heat dissipation layer 2124a is farther away from the display panel 2122 than the protective support layer 2124b. At this time, the heat dissipation layer 2124a forms the outer surface of the back film assembly 2124 to better transfer the heat of the display module 21.

[0151] Figure 24 for Figure 23 The schematic diagram of the bonding of the back film assembly 2124 and the display panel 2122 shows that the protective support layer 2124b is bonded and fixed to the display panel 2122 through the second adhesive layer 2124d, and the protective support layer 2124b is bonded and fixed to the heat dissipation layer 2124a through the first adhesive layer 2124c, that is, at this time, the back film assembly 2124 is sequentially provided with the second adhesive layer 2124d, the protective support layer 2124b, the first adhesive layer 2124c and the heat dissipation layer 2124a from the side close to the display panel 2122 to the side far from the display panel 2122.

[0152] In any of the above embodiments, the thickness of the heat dissipation layer 2124a may be less than that of the protective support layer 2124b. On the premise that the manufacturing process permits, the thickness of the heat dissipation layer 2124a can be further reduced to overall reduce the thickness of the back film assembly 2124.

[0153] In any of the above embodiments, the thickness of the heat dissipation layer 2124a may be greater than or equal to one-third and less than or equal to one-half of the thickness of the back film assembly 2124. For example, the thickness of the heat dissipation layer 2124a can be 0.35, 0.4, 0.45, 0.5, etc. of the total thickness of the back film assembly 2124. In this way, while ensuring the heat dissipation effect of the heat dissipation layer 2124a, it is avoided that the too thick heat dissipation layer 2124a affects the reduction of the overall thickness of the display module 21.

[0154] In any of the above embodiments, in order to balance the heat dissipation effect and the thinness and lightness of the display module 21, the thickness of the heat dissipation layer 2124a is less than or equal to 50 μm. Exemplarily, the thickness of the heat dissipation layer 2124a is 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, etc. Further, the thickness of the heat dissipation layer 2124a can be greater than or equal to 30 μm and less than or equal to 50 μm.

[0155] In any of the above embodiments, the thickness of the first adhesive layer 2124c is greater than or equal to 5 μm and less than or equal to 15 μm. Exemplarily, the thickness of the first adhesive layer 2124c is 3 μm, 5 μm, 12 μm, 15 μm, etc. While meeting the bonding strength, the thickness of the first adhesive layer 2124c can be reduced.

[0156] In any of the above embodiments, the thickness of the second adhesive layer 2124d is greater than or equal to 5 μm and less than or equal to 15 μm. The thickness of the second adhesive layer 2124d is 5 μm, 8 μm, 13 μm, 15 μm, etc. While meeting the bonding strength, the thickness of the second adhesive layer 2124d can be reduced to further reduce the thickness of the display module 21. The thicknesses of the first adhesive layer 2124c and the second adhesive layer 2124d can be the same or different.

[0157] Further, when the protective support layer 2124b is made of a polyethylene terephthalate layer, it can select a common film layer with a specification of 50 μm or 65 μm. On the premise that the process permits, the protective support layer 2124b can also be further thinned.

[0158] On this basis, by restricting the thickness of the heat dissipation layer 2124a, the protective support layer 2124b, the first adhesive layer 2124c, and the specific thickness of the second adhesive layer 2124d, a relatively thin back film assembly 2124 is formed. The total thickness of the back film assembly 2124 is greater than or equal to 70 μm and less than or equal to 120 μm. For example, the total thickness of the back film assembly 2124 is 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, etc. Compared with Figure 4 the total thickness of the display module 21 in the illustrated embodiment, further thinning is achieved.

[0159] Exemplarily, a Figure 22 or Figure 24 The specifications of the back film assembly 2124 shown in are provided. Among them, the heat dissipation layer 2124a is a copper sheet with a thickness of 30 μm, the protective support layer 2124b is a polyethylene terephthalate layer with a thickness of 65 μm, the first adhesive layer 2124c is a pressure-sensitive adhesive layer with a thickness of 12 μm, the second adhesive layer 2124d is a pressure-sensitive adhesive layer with a thickness of 13 μm, and the total thickness of the back film assembly 2124 is 120 μm. Compared with Figure 7 the total thickness of the heat dissipation film 2125 and the back film 2123 in the illustrated embodiment, it can be further thinned by 108 μm, thereby achieving a significant reduction in the thickness of the display module 21 (228 μm - 120 μm).

[0160] It can be understood that in other embodiments of the present application, when the back film assembly 2124 is of other thicknesses within the range of greater than or equal to 70 μm and less than or equal to 120 μm, the back film assembly 2124 is also less than Figure 4 the total thickness of the heat dissipation film 2125 and the back film 2123 of the display module 21 in the illustrated embodiment. Thus, the total thickness of the display module 21 is also less than Figure 4 the total thickness of the display module 21 in the illustrated embodiment.

[0161] In the display module 21 of any embodiment of the present application, on the one hand, the heat dissipation layer 2124a is integrated in the back film assembly 2124, providing a heat transfer and dissipation function, eliminating the need for an additional heat dissipation film 2125, further reducing the overall thickness of the display module 21, simplifying the manufacturing process, improving the yield rate and production efficiency. On the other hand, the outer edge of the display panel 2122 can be effectively supported and protected by the back film assembly 2124, thus avoiding the problem of damage black spots formed by bumps due to ineffective protection at the edge of the display panel 2122.

[0162] In the description of this specification, specific features, structures, materials, or characteristics can be combined in a suitable manner in any one or more embodiments or examples.

[0163] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the various embodiments of the present application.

Claims

1. A display module, characterized in that include: a display panel having opposing display and non-display sides; A back film assembly, the back film assembly being located on the non-display side of the display panel; The back film assembly comprises a heat dissipation layer and a protective support layer which are stacked, and the heat dissipation layer is connected to the protective support layer.

2. The display module according to claim 1, wherein The orthographic projection of the display panel on the reference plane is located within the orthographic projection of the back film assembly on the reference plane; wherein the reference plane is perpendicular to the stacking direction of the heat dissipation layer and the protective support layer.

3. The display module according to claim 1, wherein The thickness of the heat dissipation layer is smaller than the thickness of the protective support layer.

4. The display module according to any one of claims 1-3, characterized in that, The thickness of the heat dissipation layer is greater than or equal to one third of the thickness of the back film assembly and less than or equal to one half of the thickness of the back film assembly.

5. The display module according to any one of claims 1-3, characterized in that, The thickness of the heat dissipation layer is less than or equal to 50 μm.

6. The display module according to any one of claims 1-3, characterized in that, The heat dissipation layer is a metal layer.

7. The display module according to any one of claims 1-3, characterized in that, The protective support layer is a polyethylene terephthalate layer.

8. The display module according to any one of claims 1-3, characterized in that, The heat dissipation layer is located on a side of the protective support layer facing the display panel; or, the heat dissipation layer is located on a side of the protective support layer facing away from the display panel.

9. The display module according to any one of claims 1-3, characterized in that, Also includes: A first adhesive layer, wherein the first adhesive layer is located between the heat dissipation layer and the protective support layer.

10. The display module according to claim 9, wherein, It also includes a second adhesive layer, which is located on a side of the back film assembly facing the display panel.

11. The display module according to claim 10, wherein The first adhesive layer is a pressure-sensitive adhesive layer, and / or the second adhesive layer is a pressure-sensitive adhesive layer.

12. The display module according to claim 11, wherein The thickness of the first adhesive layer and / or the second adhesive layer is greater than or equal to 5 μm and less than or equal to 15 μm.

13. The display module according to claim 11, wherein The thickness of the back film assembly is greater than or equal to 70 μm and less than or equal to 120 μm.

14. The display module according to claim 1, wherein, The display module is a flexible display module.

15. The display module according to claim 1, wherein Also includes: A polarizer is located on the display side of the display panel.

16. The display module according to claim 15, characterized in that, Also includes; A light-transmitting cover plate is located on a side of the polarizer away from the display panel, and the light-transmitting cover plate is bonded to the polarizer by transparent optical adhesive.

17. The display module according to claim 16, wherein The light-transmitting cover plate is a 3D cover plate.

18. An electronic device, characterized in that, include: First middle frame; A display module, wherein the display module is arranged in the first middle frame, and the display module is the display module according to any one of claims 1-17.

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