Wafer conveying mechanism of groove type machine

Abstract

The utility model discloses a groove type machine wafer transmission mechanism, and specifically relates to the wafer transmission technology field, the groove type machine wafer transmission mechanism comprises a mounting plate, a moving strip and an electric telescopic rod, one side edge of the mounting plate is horizontally and fixedly connected with the moving strip, and two sides of the top center of the mounting plate are vertically and fixedly connected with a lifting plate; an electric telescopic rod is arranged on the side, close to the lifting plate, of the moving strip, a horizontal plate is arranged on the side, away from the electric telescopic rod, of the lifting plate, a moving block is slidably connected to the side wall of the horizontal plate, and a containing frame is arranged at the bottom of the moving block. A rotating lead screw is arranged in the moving strip for moving in a penetrating mode, an adjusting sliding block is connected to the outer wall of the rotating lead screw through threads, the adjusting sliding block and the interior of the moving strip slide mutually, and the adjusting sliding block and the outer wall of the electric telescopic rod are fixed mutually. The wafer cleaning device has the advantages that the wafer can be conveniently conveyed, the cleaning position of the wafer can be conveniently adjusted, the wafer is prevented from being inserted into the cleaning tank to be clamped, and chemical pollution is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer transfer, in particular to a wafer transfer mechanism for a trough machine. Background Art

[0002] At present, the mainstream transfer robotic arms of trough-type wafer etching and cleaning equipment in the domestic semiconductor market have strong limitations. The traditional transfer method uses multiple arms, and there is a common transfer slot between two adjacent arms.

[0003] However, in actual use, due to the presence of multiple robotic arms, one end of the robotic arm is easily blocked by other robotic arms during movement, so it is impossible to accurately place wafers into a certain liquid tank, nor can the functions of reversing and overtaking the robotic arm be realized. Therefore, a mechanism that is convenient for clamping and conveying is needed. At the same time, in the traditional clamping and picking process, the clamping mechanism needs to be placed in the cleaning pool, and then the clamping mechanism is used to pick up the placement rack. During the operation process, the clamping mechanism will be repeatedly placed in and taken out of the corresponding cleaning pool, which is likely to cause chemical pollution and create more uncertainties. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a wafer transfer mechanism for a trough machine, which solves the problems that the transportation of multiple robotic arms in the existing robotic arms is easy to be blocked and the repeated clamping from the cleaning pool is easy to cause chemical pollution.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A wafer transfer mechanism for a trough machine, including a mounting plate, a moving strip and an electric telescopic rod. A moving strip is horizontally and fixedly connected to one side edge of the mounting plate. Lifting plates are vertically and fixedly connected to both sides of the center of the top of the mounting plate. An electric telescopic rod is arranged on one side of the moving strip close to the lifting plate. A horizontal plate is arranged on the side of the lifting plate away from the electric telescopic rod. A moving block is slidably connected to the side wall of the horizontal plate. A placement rack is arranged at the bottom of the moving block;

[0006] A rotating lead screw is arranged through the inside of the moving strip for movement, and an adjusting slider is threadedly connected to the outer wall of the rotating lead screw. The adjusting slider slides inside the moving strip, and the adjusting slider is fixedly connected to the outer wall of the electric telescopic rod;

[0007] Lifting blocks are fixedly connected to the sides of the horizontal plate close to the inside of the lifting plate for lifting. The lifting blocks slide with the lifting plate. A lifting lead screw is arranged through the inside of the lifting plate. The center inside the lifting block is threadedly connected to the lifting lead screw;

[0008] A supporting plate is clamped at the bottom of the placement rack for placing wafers. A rotating rod is arranged through the inside of the moving block. The outer wall of the bottom end of the rotating rod passes through the inside of the supporting plate and is threadedly connected thereto.

[0009] Preferably, the bottom of the electric telescopic rod is slidably connected to the mounting plate. A connecting plate is fixed to the top extending end of the electric telescopic rod. The top of the connecting plate is inclined towards the horizontal plate to form an L shape. A clamping module is installed at a position on the side wall of the connecting plate close to the supporting plate.

[0010] Preferably, a groove is formed inside the horizontal plate on the side close to the moving block, and one end of the moving block is slidably connected to the inside of the groove. A horizontal lead screw is disposed through the inside of the groove. The horizontal lead screw is threadedly connected to the inside of the moving block through mutual penetration. Driving motors are installed at one ends of both the lifting lead screw and the horizontal lead screw.

[0011] Preferably, a driving motor is installed at the position corresponding to the rotating rod on the top of the moving block. The power output end of the driving motor is fixed to the rotating rod. A fixed rod is fixedly installed at one end of the bottom of the moving block close to the supporting plate.

[0012] Preferably, the inside of the supporting plate is slidably connected through the fixed rod, and the outer wall of the rotating rod is connected to the supporting plate through a thread.

[0013] Preferably, the mounting plate is L-shaped. A sliding groove corresponding to the sliding of the electric telescopic rod is formed on the top of the mounting plate. A plurality of cleaning grooves are fixedly installed at positions corresponding to the supporting plate on the surface of the mounting plate. A cleaning liquid is provided inside the cleaning grooves.

[0014] In the above technical solution, the technical effects and advantages provided by the present utility model are as follows:

[0015] 1. Rotating the lead screw rotates, thereby driving the adjusting slider to move inside the moving strip. Then the adjusting slider drives the electric telescopic rod to move, so that the electric telescopic rod drives the clamping module at the top to move. At the same time, since there is only one electric telescopic rod, the electric telescopic rod can be conveniently adjusted and moved along the moving strip on the side wall of the entire mounting plate, so as to conveniently drive the clamping module to different positions without obstruction. At the same time, when clamping is required, the electric telescopic rod can be conveniently retracted, and the clamping module can be driven to move downward through the connecting plate, so as to realize its corresponding approach to the placing rack at the bottom, facilitating the clamping module to clamp the placing rack.

[0016] 2. The rotation of the lifting screw rod drives the lifting block to slide along the lifting plate, thereby driving the horizontal plate to rise, causing the moving block to move towards the top. At this time, the supporting plate can be driven to move towards the top by the rotating rod, and then the placement rack can be taken out of the cleaning tank. The driving motor can also be started to drive the rotating rod to rotate, further driving the supporting plate to move towards the top along the fixed rod, and then driving the placement rack to rise. During clamping, the clamping module corresponds to and squeezes the two sides of the placement rack to achieve clamping. At the same time, since the placement rack is separated from the inside of the cleaning tank, when the clamping module clamps, it does not need to be inserted into the cleaning tank, thus effectively avoiding chemical contamination. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required to be used in the embodiments. Obviously, the drawings described below are only some embodiments recorded in the present utility model. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings.

[0018] Figure 1 Schematic diagram of the present utility model;

[0019] Figure 2 Front view of the present utility model;

[0020] Figure 3 Side view of the present utility model;

[0021] Figure 4 External structure schematic diagram of the moving block of the present utility model;

[0022] Figure 5 Connection structure schematic diagram of the moving bar and the electric telescopic rod of the present utility model.

[0023] Explanation of reference numerals in the drawings:

[0024] 1. Mounting plate; 101. Cleaning tank; 2. Moving bar; 201. Rotating screw rod; 202. Adjusting slider; 3. Electric telescopic rod; 301. Connecting plate; 302. Clamping module; 4. Lifting plate; 401. Lifting screw rod; 5. Horizontal plate; 501. Horizontal screw rod; 502. Lifting block; 6. Moving block; 601. Rotating rod; 602. Driving motor; 603. Fixed rod; 7. Placement rack; 701. Supporting plate. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0025] In order to enable those skilled in the art to better understand the technical solutions of the present utility model, the following will further introduce the present utility model in detail in conjunction with the drawings.

[0026] The present utility model provides as Figures 1-5A slot - type machine wafer transfer mechanism shown in the figure includes a mounting plate 1, a moving strip 2, and an electric telescopic rod 3. A moving strip 2 is horizontally and fixedly connected to one side of the mounting plate 1. On both sides of the center of the top of the mounting plate 1, lifting plates 4 are vertically and fixedly connected. An electric telescopic rod 3 is arranged on the side of the moving strip 2 close to the lifting plate 4. A horizontal plate 5 is arranged on the side of the lifting plate 4 away from the electric telescopic rod 3. A moving block 6 is slidably connected to the side wall of the horizontal plate 5, and a placement rack 7 is arranged at the bottom of the moving block 6. Inside the moving strip 2 for movement, a rotating lead screw 201 is penetrated. The outer wall of the rotating lead screw 201 is thread - connected with an adjusting slider 202. The adjusting slider 202 slides inside the moving strip 2, and the adjusting slider 202 is fixedly connected to the outer wall of the electric telescopic rod 3.

[0027] As Figure 2 、 Figure 4 shown, on the side of the horizontal plate 5 close to the inside of the lifting plate 4 for lifting, lifting blocks 502 are fixedly connected. The lifting blocks 502 slide with the lifting plate 4. A lifting lead screw 401 is penetrated inside the lifting plate 4. The center of the inside of the lifting block 502 is rotatably connected with the lifting lead screw 401. Starting the rotation of the lifting lead screw 401, the rotation of the lifting lead screw 401 drives the lifting block 502 to slide along the lifting plate 4, and then drives the horizontal plate 5 to rise.

[0028] As Figure 1 、 Figure 4 shown, a support plate 701 is clamped at the bottom of the placement rack 7 for placing wafers. A rotating rod 601 is penetrated inside the moving block 6. The outer wall of the bottom end of the rotating rod 601 penetrates inside the support plate 701 and is rotatably connected to it.

[0029] As Figure 3 、 Figure 5 shown, the bottom of the electric telescopic rod 3 is slidably connected to the mounting plate 1. The top extending end of the electric telescopic rod 3 is fixed with a connecting plate 301. The top of the connecting plate 301 is inclined to the side of the horizontal plate 5 in an L - shape. A clamping module 302 is installed at a position on the side wall of the connecting plate 301 close to the placement rack 7. When clamping is required, it is convenient to contract the electric telescopic rod 3, and the connecting plate 301 can be driven to descend, driving the clamping module 302 to move downward, so as to realize its corresponding approach to the placement rack 7 at the bottom, facilitating the clamping module to clamp the placement rack.

[0030] As Figure 2 、 Figure 4As shown in the figure, a groove is provided inside the horizontal plate 5 near one side of the moving block 6, and one end of the moving block 6 slides inside the groove. A horizontal lead screw 501 is disposed through the inside of the groove. The horizontal lead screw 501 penetrates through the inside of the moving block 6 and is connected by a thread. Driving motors are installed at one end of each of the lifting lead screw 401 and the horizontal lead screw 501, facilitating driving the rotation of the horizontal lead screw 501. Further, the rotation of the horizontal lead screw 501 drives the movement of the moving block 6. Through the fixed rod 603, the position of the supporting plate 701 is driven, and further, the position of the placement rack 7 in the cleaning tank 101 is adjusted.

[0031] As Figure 3 , Figure 4 shown in the figure, a driving motor 602 is installed at the corresponding position of the top of the moving block 6 and the rotating rod 601. The power output end of the driving motor 602 is fixed to the rotating rod 601. A fixed rod 603 is fixedly installed at one end of the bottom of the moving block 6 near the supporting plate 701. The inside of the supporting plate 701 is slidably connected through the fixed rod 603. The outer wall of the rotating rod 601 is rotationally connected through the supporting plate 701 by a thread. The rotating rod 601 is driven to rotate, and further drives the supporting plate 701 to move further upward along the fixed rod 603, and further drives the lifting of the placement rack 7. During clamping, the clamping module 302 is correspondingly pressed against both sides of the placement rack 7 to achieve clamping.

[0032] As Figure 1 , Figure 2 shown in the figure, the mounting plate 1 is L-shaped. A sliding groove corresponding to the sliding of the electric telescopic rod 3 is provided at the top of the mounting plate 1. A plurality of cleaning tanks 101 are fixedly installed at the corresponding positions of the surface of the mounting plate 1 and the supporting plate 701. A cleaning liquid is provided inside the cleaning tank 101, and the wafer is cleaned by the cleaning liquid.

[0033] When cleaning, place the wafer on the placement rack 7. Start the drive motor 602 to drive the rotating rod 601 to rotate, so that the placement rack 7 moves into the cleaning tank 101. It can also drive the horizontal lead screw 501 to rotate, and then the rotation of the horizontal lead screw 501 drives the moving block 6 to move. Through the fixed rod 603, the position of the supporting plate 701 is driven, and then the position of the placement rack 7 in the cleaning tank 101 is adjusted. It can conveniently drive the rotating lead screw 201 to rotate through external equipment, and then drive the adjusting slider 202 to move inside the moving strip 2. Then the adjusting slider 202 drives the electric telescopic rod 3 to move, so that the electric telescopic rod 3 drives the clamping module 302 at the top to move through the connecting plate 301. At the same time, since there is only one electric telescopic rod 3 on the top of the mounting plate 1, the electric telescopic rod 3 can conveniently adjust and move along the moving strip 2 on the side wall of the entire mounting plate 1, and then conveniently drive the clamping module 302 to different positions without obstruction. At the same time, when clamping is required, the electric telescopic rod 3 can be conveniently contracted, and the clamping module 302 can be driven to move downward through the connecting plate 301, so as to realize its corresponding approach to the placement rack 7 at the bottom, facilitating clamping.

[0034] When performing the clamping operation, it can conveniently drive the lifting lead screw 401 to rotate, and then the rotation of the lifting lead screw 401 drives the lifting block 502 to slide along the lifting plate 4, and then drives the horizontal plate 5 to rise, so that the moving block 6 moves upward accordingly. At this time, the supporting plate 701 can be driven to move upward through the rotating rod 601, and then the placement rack 7 is taken out of the cleaning tank 101. The drive motor 602 can also be started, so that the rotating rod 601 is driven to rotate, and then the supporting plate 701 is further driven to move upward along the fixed rod 603, and then the placement rack 7 is driven to rise. When clamping, the clamping module 302 is correspondingly pressed against both sides of the placement rack 7 to achieve clamping. At the same time, since the placement rack 7 is separated from the inside of the cleaning tank 101, when the clamping module 302 clamps, it does not need to be inserted into the cleaning tank 101, thus effectively avoiding chemical contamination.

[0035] Only some exemplary embodiments of the present invention are described by way of illustration above. Undoubtedly, for those of ordinary skill in the art, without departing from the spirit and scope of the present invention, the described embodiments can be modified in various different ways. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of the claims of the present invention.

Claims

1. A slot machine wafer transfer mechanism, comprising a mounting plate (1), a moving strip (2) and an electric telescopic rod (3), characterized in that: One side of the mounting plate (1) is horizontally and fixedly connected with a moving strip (2). On both sides of the center of the top end of the mounting plate (1), lifting plates (4) are vertically and fixedly connected. On one side of the moving strip (2) close to the lifting plate (4), an electric telescopic rod (3) is arranged. On one side of the lifting plate (4) away from the electric telescopic rod (3), a horizontal plate (5) is arranged. A moving block (6) is slidably connected to the side wall of the horizontal plate (5). A placement rack (7) is arranged at the bottom of the moving block (6); A rotating lead screw (201) is arranged through the inside of the moving strip (2) for moving. The outer wall of the rotating lead screw (201) is threadedly connected with an adjusting slider (202). The adjusting slider (202) slides inside the moving strip (2), and the adjusting slider (202) is fixedly connected to the outer wall of the electric telescopic rod (3); On one side of the horizontal plate (5) close to the inside of the lifting plate (4) for lifting, lifting blocks (502) are fixedly connected. The lifting blocks (502) slide with the lifting plate (4). A lifting lead screw (401) is arranged through the inside of the lifting plate (4). The center inside the lifting block (502) is threadedly connected with the lifting lead screw (401); A supporting plate (701) is clamped at the bottom of the placement rack (7) for placing wafers. A rotating rod (601) is arranged through the inside of the moving block (6). The outer wall of the bottom end of the rotating rod (601) penetrates through the inside of the supporting plate (701) and is rotatably connected thereto.

2. The slot machine wafer transfer mechanism according to claim 1, characterized in that: The bottom of the electric telescopic rod (3) is slidably connected with the mounting plate (1). The top end of the electric telescopic rod (3) is fixed with a connecting plate (301). The top of the connecting plate (301) is inclined towards the horizontal plate (5) and is L-shaped. A clamping module (302) is installed at a position on the side wall of the connecting plate (301) close to the supporting plate (701).

3. The slot-type machine wafer transfer mechanism according to claim 1, wherein: A groove is formed inside the horizontal plate (5) close to the moving block (6). One end of the moving block (6) slides inside the groove. A horizontal lead screw (501) is arranged through the inside of the groove. The horizontal lead screw (501) penetrates through the inside of the moving block (6) and is threadedly connected thereto. Driving motors are installed at one ends of the lifting lead screw (401) and the horizontal lead screw (501).

4. The slot machine wafer transfer mechanism according to claim 1, characterized in that: A driving motor (602) is installed at a position on the top of the moving block (6) corresponding to the rotating rod (601). The power output end of the driving motor (602) is fixedly connected to the rotating rod (601). A fixing rod (603) is fixedly installed at one end of the bottom of the moving block (6) close to the supporting plate (701).

5. The slot machine wafer transfer mechanism according to claim 4, characterized in that: The inside of the supporting plate (701) is slidably connected through the fixing rod (603). The outer wall of the rotating rod (601) is threadedly connected with the supporting plate (701).

6. The slot machine wafer transfer mechanism according to claim 1, characterized in that: The mounting plate (1) is L-shaped. A sliding groove corresponding to the electric telescopic rod (3) is formed on the top of the mounting plate (1). A plurality of cleaning grooves (101) are fixedly installed at positions on the surface of the mounting plate (1) corresponding to the supporting plate (701). Cleaning liquid is arranged inside the cleaning grooves (101).

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