Semiconductor wafer bearing table

Abstract

The utility model discloses a semiconductor wafer bearing table, relates to the technical field of semiconductor manufacturing, and solves the technical problems that when a chuck rotary table of an existing semiconductor wafer bearing table rotates, the chuck rotary table has large frictional resistance, and rotation precision and straightening precision are easily affected. The wafer bearing table comprises a rotary table and a supporting structure, the rotary table is arranged above the supporting structure, and one end of the rotary table penetrates through the supporting structure and is movably connected with a linear rotary bearing on the supporting structure; the rotary table is used for bearing and adsorbing a wafer and driving the wafer to be detected; the supporting structure is used for adsorbing and supporting the rotary table or supporting the rotary table in an air floatation mode. According to the utility model, the rotary table is supported in an air floatation manner through the supporting structure, so that the frictional resistance of the supporting structure to the rotary table during rotation of the rotary table is reduced, and the rotation precision of the rotary table is improved, thereby improving the straightening precision of wafers.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a semiconductor wafer carrier. Background Art

[0002] A wafer refers to a silicon wafer used for fabricating silicon semiconductor integrated circuits. Since its shape is circular, it is called a wafer. Various circuit element structures can be processed and fabricated on the silicon wafer, thus becoming a semiconductor product with specific electrical functions. During the manufacturing process of the wafer, in order to ensure its production quality, it needs to be inspected. During the inspection process, the wafer needs to be placed on a chuck turntable, and the chuck turntable rotates through a small angle along with the rotation mechanism to straighten the wafer.

[0003] In the existing semiconductor wafer carrier, the chuck turntable is usually vacuum - adsorbed on a fixed structure, and then the semiconductor wafer is vacuum - adsorbed by the chuck turntable to realize the installation and placement of the semiconductor wafer. When the semiconductor wafer carrier is working, the chuck turntable is adjusted from a non - rotating state to a rotating state to straighten the semiconductor wafer. When the chuck turntable is in the non - rotating state, the chuck turntable is vacuum - adsorbed on the fixed structure and locked in place; when the chuck turntable is in the rotating state, the vacuum adsorption force between the chuck turntable and the fixed structure is disconnected to unlock the chuck turntable, and the chuck turntable is driven to rotate through a small angle, and the semiconductor wafer vacuum - adsorbed on the chuck turntable moves synchronously to straighten the semiconductor wafer. However, when the chuck turntable performs a rotating action, due to its own weight, there is a large frictional resistance between the chuck turntable and the support structure during rotation, which affects the rotation accuracy and straightening accuracy, and also causes wear of the workpiece, affecting the service life.

[0004] In the process of realizing the present utility model, the applicant found that there are at least the following problems in the prior art:

[0005] When the chuck turntable of the existing semiconductor wafer carrier rotates, there is a large frictional resistance, which easily affects the rotation accuracy and straightening accuracy. Summary of the Utility Model

[0006] The purpose of the present utility model is to provide a semiconductor wafer carrier to solve the technical problem that when the chuck turntable of the existing semiconductor wafer carrier rotates, there is a large frictional resistance, which easily affects the rotation accuracy and straightening accuracy. The preferred technical solutions provided by the present utility model can produce many technical effects, which will be elaborated below.

[0007] To achieve the above - mentioned purpose, the present utility model provides the following technical solutions:

[0008] A semiconductor wafer carrier provided by the utility model comprises a turntable and a support structure. The turntable is arranged above the support structure, and one end of the turntable penetrates through the support structure and is movably connected with a linear rotary bearing on the support structure. The turntable is used for carrying and adsorbing wafers and driving the wafers for detection. The support structure is used for adsorbing and supporting the turntable or providing aerostatic support for the turntable.

[0009] Optionally, the support structure comprises an air pipe and a support plate. The air pipe is fixed on the side surface of the support plate. One end of the air pipe is an access port, and the other end of the air pipe is communicated with the working chamber of the support plate. The air pipe can access positive pressure or negative pressure through the access port and transmit the accessed positive pressure or negative pressure to the working chamber.

[0010] Optionally, air vent holes are arranged on the cavity surface of the working chamber. The air vent holes are used for conducting the external air path and the working chamber.

[0011] Optionally, a switching structure is further included. The support structure is connected with a gas supply assembly through the switching structure. The gas supply assembly comprises an aerostatic structure and a vacuum pump. The switching structure is used for controlling the support structure to be connected to the aerostatic structure or the vacuum pump.

[0012] Optionally, the switching structure is a solenoid valve.

[0013] Optionally, when the support structure is connected to the aerostatic structure, the aerostatic structure is used for providing positive pressure, and the air vent holes on the support structure are used for making the turntable have aerostatic force, so that the turntable can drive the wafer to rotate by a preset angle.

[0014] Optionally, when the support structure is connected to the vacuum pump, the vacuum pump is used for providing negative pressure, and the air vent holes on the support structure are used for adsorbing and fixing the turntable.

[0015] Optionally, the support structure further comprises a fixing plate. The support plate is arranged on the fixing plate. The support plate and the fixing plate are of an integral structure or a detachable structure.

[0016] Optionally, the turntable comprises a rotating pillar, and the rotating pillar is fixed in the middle of the first surface of the turntable. The rotating pillar and the linear rotary bearing fixed on the support structure are mutually matched and correspondingly arranged. The linear rotary bearing is used for the central positioning and rotary support of the turntable.

[0017] Optionally, the structure of the support plate is an annular structure. The through hole in the middle of the support plate corresponds to the rotating pillar. The rotating pillar passes through the through hole and is movably connected with the linear rotary bearing.

[0018] Implementing one of the technical solutions of the present utility model has the following advantages or beneficial effects:

[0019] The present utility model performs aerostatic support on the turntable through a support structure, reduces the frictional resistance generated by the support structure on the turntable during the rotation of the turntable, improves the rotation accuracy of the turntable, and thus improves the straightening accuracy of the wafer. Description of the Drawings

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings. In the drawings:

[0021] Figure 1 is a cross-sectional view of an embodiment of the present utility model;

[0022] Figure 2 is a perspective view of the support plate of an embodiment of the present utility model;

[0023] Figure 3 is a schematic diagram of the gas circuit of an embodiment of the present utility model.

[0024] In the figure: 1, turntable; 11, rotating pillar; 2, support structure; 21, air pipe; 211, access port; 22, support plate; 221, acting chamber; 222, ventilation hole; 223, through hole; 23, linear rotary bearing; 3, switching structure; 4, aerostatic structure; 5, vacuum pump. Detailed Embodiments

[0025] In order to make the purpose, technical solutions and advantages of the present utility model clearer, the various exemplary embodiments to be described below will refer to the corresponding drawings, which form a part of the exemplary embodiments and describe various exemplary embodiments that may be adopted to implement the present utility model. Unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. It should be understood that they are only examples of processes, methods and devices, etc. consistent with some aspects of the present utility model as detailed in the appended claims. Other embodiments may also be used, or structural and functional modifications may be made to the embodiments listed herein without departing from the scope and essence of the present utility model.

[0026] In the description of the present utility model, it should be understood that the terms "center", "longitudinal direction", "lateral direction", etc. indicate the orientation or positional relationship based on the drawings shown, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying the specific orientation that the indicated element must have, the specific orientation structure and operation. The terms "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. The meaning of the term "plurality" is two or more. The terms "connected" and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, an integral connection, a mechanical connection, an electrical connection, a communication connection, a direct connection, an indirect connection through an intermediate medium, and can be the internal communication of two elements or the interaction relationship between two elements. The term "and / or" includes any and all combinations of one or more of the related listed items. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0027] In order to illustrate the technical solutions described in the present utility model, the following will be described through specific embodiments, and only the parts related to the embodiments of the present utility model are shown.

[0028] Embodiment 1:

[0029] As shown in Figure 1 the present utility model provides a semiconductor wafer carrier stage, including a turntable 1 and a support structure 2. The turntable 1 is arranged above the support structure 2, and one end of the turntable 1 penetrates through the support structure 2 and is movably connected to the linear rotary bearing 23 on the support structure 2. The turntable 1 is used to carry and adsorb wafers and drive the wafers for inspection. The support structure 2 is used to adsorb and support the turntable 1 or pneumatically support the turntable 1. Specifically, the support structure 2 supports the turntable 1, and both the turntable 1 and the support structure 2 are movably connected to ensure that the turntable 1 can rotate. When the support structure 2 adsorbs and supports the turntable 1, the wafers fixed on the turntable 1 can be positioned and inspected. When the support structure 2 pneumatically supports the turntable 1, the turntable 1 can rotate, and the turntable 1 can drive the wafers to rotate synchronously to straighten the wafers, facilitating the all-round inspection of the wafers. The support structure 2 of the present application is a suction cup.

[0030] The present utility model pneumatically supports the turntable 1 through the support structure 2, reduces the frictional resistance generated by the support structure 2 on the turntable 1 when the turntable 1 rotates, improves the rotation accuracy of the turntable 1, and thus improves the straightening accuracy of the wafers.

[0031] As an optional implementation manner, as shown in Figure 2As shown in the figure, the support structure 2 includes an air pipe 21 and a support plate 22. The air pipe 21 is fixed to the side of the support plate 22. One end of the air pipe 21 is an access port 211, and the other end of the air pipe 21 is communicated with the working chamber 221 of the support plate 22. The air pipe 21 can access positive pressure or negative pressure through the access port 211 and transmit the accessed positive pressure or negative pressure to the working chamber 221. Specifically, the air pipe 21 matches the side of the support plate 22 to ensure that the air pipe 21 can be tightly fixed to the side of the support plate 22, reducing the volume of the semiconductor wafer carrier stage. One end of the air pipe 21 is the access port 211. Through the access port 211, positive pressure or negative pressure can be accessed and transmitted to the working chamber 221 of the support plate 22 through the other end of the air pipe 21. The support plate 22 is provided with a plurality of working chambers 221. The plurality of working chambers 221 are connected end to end in sequence to ensure that the positive pressure or negative pressure transmitted into the working chamber 221 by the air pipe 21 can flow into each working chamber 221. The plurality of working chambers 221 are evenly distributed on the support plate 22 to ensure the stability of the support plate 22 for supporting the turntable 1.

[0032] As an optional implementation manner, as Figure 2 shown, ventilation holes 222 are provided on the cavity surface of the working chamber 221. The ventilation holes 222 are used to conduct the external air path and the working chamber 221. Specifically, ventilation holes 222 are provided on the cavity surface of each working chamber 221. The ventilation holes 222 can release the gas in the working chamber 221 into the external air path, and vacuum adsorb or positively pressure air-float the turntable 1 through the external air path.

[0033] As an optional implementation manner, as Figure 3 shown, a switching structure 3 is further included. The support structure 2 is connected to the air supply assembly through the switching structure 3. The air supply assembly includes an air-floating structure 4 and a vacuum pump 5. The switching structure 3 is used to control the support structure 2 to connect to the air-floating structure 4 or the vacuum pump 5. Specifically, the air pipe 21 of the support structure 2 is connected to the air-floating structure 4 and the vacuum pump 5 through the switching structure 3. The switching structure 3 is used to switch the air pipe 21 to connect to the air-floating structure 4 or the vacuum pump 5, so as to adjust the state of the support structure 2 for supporting the turntable 1. The air-floating structure 4 is used to provide positive pressure, and the vacuum pump 5 is used to provide negative pressure.

[0034] As an optional implementation manner, the switching structure 3 is a solenoid valve. Specifically, the solenoid valve is preferably a normally closed two-position three-way solenoid valve. Through the solenoid valve, the on-off between the air-floating structure 4 and the vacuum pump 5 and the air pipe 21 can be controlled, so as to adjust the state of the support structure 2 for air-floating or adsorbing and supporting the turntable 1.

[0035] As an alternative embodiment, when the support structure 2 is connected to the air-floating structure 4, the air-floating structure 4 is used to provide positive pressure, and the air vent holes 222 on the support structure 2 are used to cause the turntable 1 to have air floating, so that the turntable 1 can drive the wafer to rotate by a preset angle. Specifically, when the solenoid valve is connected to the air-floating structure 4, the air-floating structure 4 can transmit positive pressure to the air pipe 21 and transmit positive pressure to the turntable 1 through the air vent holes 222, so that the turntable 1 arranged above the support structure 2 has air floating, facilitating the turntable 1 to drive the wafer to rotate synchronously by a preset angle under the drive of the driving member, thereby adjusting the angle of the wafer. The support structure 2 air-floatingly supports the turntable 1, reducing the frictional force generated by the support structure 2 on the turntable 1 when the turntable 1 rotates, thereby reducing the wear of the workpiece and the influence of the frictional force on the rotation accuracy.

[0036] As an alternative embodiment, when the support structure 2 is connected to the vacuum pump 5, the vacuum pump 5 is used to provide negative pressure, and the air vent holes 222 on the support structure 2 are used to adsorb and fix the turntable 1. Specifically, when the solenoid valve is connected to the vacuum pump 5, the vacuum pump 5 can transmit vacuum to the air pipe 21 and generate negative pressure through the vacuum to adsorb and fix the turntable 1 arranged above the support structure 2, thereby realizing the positioning and fixing of the turntable 1 and the wafer on the turntable 1, facilitating the detection of the wafer.

[0037] As an alternative embodiment, as Figure 2 shown, the support structure 2 further includes a fixing plate, and the support plate 22 is arranged on the fixing plate. The support plate 22 and the fixing plate are an integral structure or a detachable structure. As Figure 1 shown, the support plate 22 and the fixing plate are an integral structure, which is convenient for the production, processing and assembly of the semiconductor wafer carrier. When the support plate 22 and the fixing plate are a detachable structure, a plurality of mounting holes can be provided at the corresponding positions of the support plate 22 and the fixing plate, and the support plate 22 can be stably fixed on the fixing plate through the cooperation of the mounting holes and fixing members (such as fixing members such as screws, screws and bolts). The support plate 22 and the fixing plate being a detachable structure is convenient for replacing worn parts and can reduce costs.

[0038] As an alternative embodiment, as Figure 1As shown in the figure, the turntable 1 includes a rotating support column 11. The rotating support column 11 is fixed in the middle of the first surface of the turntable 1. The rotating support column 11 is matched and correspondingly arranged with a linear rotary bearing 23 fixed on the support structure 2. The linear rotary bearing 23 is used for the central positioning and rotary support of the turntable 1. Specifically, the rotating support column 11 is fixed on the first surface of the turntable 1, the linear rotary bearing 23 is fixed on the support structure 2, and the rotating support column 11 corresponds to the linear rotary bearing 23. The rotating support column 11 passes through the support structure 2 and is movably connected to the matched linear rotary bearing 23, enabling the turntable 1 to rotate around the center of the linear rotary bearing 23. The turntable 1 is rotationally positioned through the rotating support column 11, and the linear rotary bearing 23 is used for the rotary support of the turntable 1.

[0039] As an alternative embodiment, as Figure 2 shown in the figure, the structure of the support plate 22 is an annular structure. The through hole 223 in the middle of the support plate 22 corresponds to the rotating support column 11. The rotating support column 11 passes through the through hole 223 and is movably connected to the linear rotary bearing 23. Specifically, the annular structure can be an annular structure such as a circular ring or a rectangular ring, and the support plate 22 can be set according to actual needs. Setting the support plate 22 as an annular structure facilitates the rotating support column 11 of the turntable 1 above the support plate 22 to pass through the through hole 223 in the middle of the annular structure and be movably connected to the linear rotary bearing 23 fixed below the support structure 2. When the support structure 2 pneumatically supports the turntable 1, through the mutual cooperation of the rotating support column 11 and the linear rotary bearing 23, the turntable 1 rotates driven by the motor and the lead screw.

[0040] The embodiment is only a special case and does not indicate that the present utility model has only such an implementation manner.

[0041] The above are only the preferred embodiments of the present utility model. Those skilled in the art know that without departing from the spirit and scope of the present utility model, various changes or equivalent replacements can be made to these features and embodiments. Additionally, under the teaching of the present utility model, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of the present utility model. Therefore, the present utility model is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application belong to the protection scope of the present utility model.

Claims

1. A semiconductor wafer susceptor, characterized in that, It includes a turntable (1) and a support structure (2). The turntable (1) is arranged above the support structure (2), and one end of the turntable (1) penetrates through the support structure (2) and is movably connected to a linear rotary bearing (23) on the support structure (2); the turntable (1) is used to carry and adsorb a wafer and drive the wafer for detection; the support structure (2) is used to adsorb and support the turntable (1) or pneumatically support the turntable (1).

2. The semiconductor wafer susceptor according to claim 1, wherein The support structure (2) includes an air pipe (21) and a support plate (22). The air pipe (21) is fixed to the side of the support plate (22); one end of the air pipe (21) is an access port (211), and the other end of the air pipe (21) is communicated with an action cavity (221) of the support plate (22). The air pipe (21) can access positive pressure or negative pressure through the access port (211) and transmit the accessed positive pressure or negative pressure to the action cavity (221).

3. The semiconductor wafer susceptor according to claim 2, wherein, Vent holes (222) are provided on the cavity surface of the action cavity (221), and the vent holes (222) are used to conduct the external air path and the action cavity (221).

4. The semiconductor wafer susceptor according to claim 3, wherein, It further includes a switching structure (3). The support structure (2) is connected to a gas supply assembly through the switching structure (3). The gas supply assembly includes a pneumatic structure (4) and a vacuum pump (5). The switching structure (3) is used to control the support structure (2) to connect to the pneumatic structure (4) or connect to the vacuum pump (5).

5. The semiconductor wafer susceptor according to claim 4, wherein, The switching structure (3) is a solenoid valve.

6. The semiconductor wafer susceptor according to claim 4, wherein When the support structure (2) is connected to the pneumatic structure (4), the pneumatic structure (4) is used to provide positive pressure, and the vent holes (222) on the support structure (2) are used to make the turntable (1) pneumatically float, so that the turntable (1) can drive the wafer to rotate by a preset angle.

7. The semiconductor wafer susceptor according to claim 4, wherein When the support structure (2) is connected to the vacuum pump (5), the vacuum pump (5) is used to provide negative pressure, and the vent holes (222) on the support structure (2) are used to adsorb and fix the turntable (1).

8. The semiconductor wafer susceptor according to claim 2, wherein, The support structure (2) further includes a fixing plate. The support plate (22) is arranged on the fixing plate, and the support plate (22) and the fixing plate are of an integral structure or a detachable structure.

9. The semiconductor wafer susceptor according to claim 2, wherein, The turntable (1) includes a rotating pillar (11). The rotating pillar (11) is fixed in the middle of the first surface of the turntable (1); the rotating pillar (11) and the linear rotary bearing (23) fixed on the support structure (2) are mutually matched and correspondingly arranged. The linear rotary bearing (23) is used for the central positioning and rotary support of the turntable (1).

10. The semiconductor wafer carrier according to claim 9, wherein, The structure of the support plate (22) is an annular structure. A through hole (223) in the middle of the support plate (22) corresponds to the rotating pillar (11). The rotating pillar (11) passes through the through hole (223) and is movably connected to the linear rotary bearing (23).

Images