Circuit board assembly and battery pack adapter

Abstract

The utility model discloses a circuit board assembly and a battery pack adapter, the circuit board assembly comprises a substrate, a component and a heat dissipation assembly, the substrate comprises a first side surface and a second side surface which are opposite to each other, the component is arranged on the first side surface of the substrate, and the component comprises a power component used for controlling power; the heat dissipation assembly comprises a first heat dissipation piece and a second heat dissipation piece, the first heat dissipation piece is arranged on the first side surface of the substrate and is in heat conduction connection with at least part of the power components, the second heat dissipation piece is arranged on the second side surface of the substrate and is in heat conduction connection with the bonding pad of the substrate, and the shape of the second heat dissipation piece is roughly matched with that of the second side surface. The circuit board assembly provided by the utility model is good in heat dissipation effect.

Description

Technical Field

[0001] The utility model belongs to the technical field of adapter heat dissipation, and particularly relates to a circuit board assembly and a battery pack adapter. Background Art

[0002] The design of the battery pack adapter of the power tool needs to take into account the advantages of large charging power, small volume, light weight, and easy to carry. However, in order to achieve the above design objectives, problems such as difficult layout of circuit board components of the adapter, difficult heat dissipation, and easy overheating are caused. Moreover, due to the very compact structure of the battery pack adapter and relatively small internal space, the performance is often sacrificed.

[0003] Therefore, it is necessary to improve the existing technology to overcome the defects in the existing technology. Summary of the Utility Model

[0004] Therefore, the technical problem to be solved by the utility model is the poor heat dissipation of the circuit board in the existing technology.

[0005] To solve the above technical problem, the utility model provides a circuit board assembly, including:

[0006] A substrate, including a first side surface and a second side surface opposite to each other;

[0007] Components, arranged on the first side surface of the substrate, and the components include power components for controlling power;

[0008] A heat dissipation assembly, including a first heat dissipation member and a second heat dissipation member, the first heat dissipation member is arranged on the first side surface of the substrate and is thermally connected to at least part of the power components, the second heat dissipation member is arranged on the second side surface of the substrate and is thermally connected to the pads of the substrate, and the shape of the second heat dissipation member is substantially matched with the second side surface.

[0009] In one embodiment, the power components include five groups of components, the height of three groups of components is greater than the height of the remaining two groups of components, the remaining two groups of components are arranged at intervals between the three groups of components, and the first heat dissipation member is arranged on the remaining two groups of components.

[0010] In one embodiment, the remaining two groups of components include MOS transistors, the three groups of components include capacitors and / or inductors, the first heat dissipation member is fixedly arranged on the upper surface of the MOS transistors, and the capacitors and / or inductors are arranged adjacent to the first heat dissipation member; the heat dissipation assembly further includes a thermal conductive adhesive, and the thermal conductive adhesive is thermally connected to the capacitor and the first heat dissipation member and / or the thermal conductive adhesive is thermally connected to the inductor and the first heat dissipation member.

[0011] In one embodiment, the five groups of components are arranged in a line in sequence. One of the three groups of components is located at the middle position of the line, and the other two of the three groups of components are respectively located at both ends of the line. The number of the first heat dissipation components is two, and the two first heat dissipation components are respectively arranged on the remaining two groups of components.

[0012] In one embodiment, the first heat dissipation component includes a plurality of spaced-apart extended heat dissipation fins.

[0013] In one embodiment, the second heat dissipation component is configured as a plate-shaped heat dissipation fin, and the plate-shaped heat dissipation fin is welded to the pad of the substrate.

[0014] In one embodiment, the substrate further includes a soldering position for soldering a wire. The plate-shaped heat dissipation fin includes a notch opposite to the soldering position, and the wire passes through the notch and is soldered to the soldering position.

[0015] In one embodiment, except for the notch, the outer edge of the plate-shaped heat dissipation fin is flush with the outer edge of the substrate.

[0016] In one embodiment, the first heat dissipation component and / or the second heat dissipation component is made of aluminum.

[0017] In addition, the present invention further provides a battery pack adapter, including:

[0018] A housing and the circuit board assembly provided in any of the above embodiments, and the circuit board assembly is disposed in a receiving cavity of the housing;

[0019] A battery pack interface is disposed on an outer side surface of the housing for attaching a battery pack. The battery pack interface includes an electrode seat, and the substrate is electrically connected to the electrode seat.

[0020] The technical solution provided by the present invention has the following advantages:

[0021] For the circuit board assembly and the battery pack adapter provided by the present invention, the components are disposed on a first side surface of the substrate. The first heat dissipation component is thermally connected to at least part of the power components. The second heat dissipation component is disposed on a second side surface of the substrate and is thermally connected to the pad of the substrate. Heat dissipation components are provided on both sides of the substrate. The first heat dissipation component is thermally connected to the mainly heat-generating power components, which can enhance the heat dissipation effect of the mainly heat-generating components. At the same time, on the other side surface of the substrate, the second heat dissipation component is welded to the pad, and the second heat dissipation component substantially matches the second side surface, which can increase the heat conduction contact surface, thereby improving the heat dissipation effect. Description of the Drawings

[0022] To more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required for description in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0023] Figure 1 Schematic perspective view of the circuit board assembly provided by the embodiment of the present utility model;

[0024] Figure 2 Schematic top view of the circuit board assembly provided by the embodiment of the present utility model;

[0025] Figure 3 Schematic perspective view of the circuit board assembly provided by another embodiment of the present utility model;

[0026] Figure 4 Schematic perspective view of the battery pack adapter using the circuit board assembly provided by this embodiment;

[0027] Figure 5 Schematic internal structure view of the battery pack adapter provided by the embodiment of the present utility model;

[0028] Figure 6 For Figure 5 Schematic perspective view of another angle of the internal structure of the battery pack adapter shown. Detailed implementation manners

[0029] The following will clearly and completely describe the technical solutions of the present utility model in conjunction with the drawings. Obviously, the described embodiments are some embodiments of the present utility model, rather than all embodiments. Hereinafter, the present utility model will be described in detail with reference to the drawings and in conjunction with the embodiments. It should be noted that, without conflict, the embodiments and features in the embodiments of the present utility model can be combined with each other.

[0030] It should be noted that the terms "first", "second", etc. in the description and claims of the present utility model and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily need to be used to describe a specific order or sequence.

[0031] In the present utility model, unless otherwise stated, the orientation terms such as "upper", "lower", "top", "bottom" are usually in the direction shown in the drawings, or in the vertical, perpendicular or gravitational direction of the component itself; similarly, for the sake of easy understanding and description, "inner" and "outer" refer to the inner and outer of the contour of each component itself, but the above orientation terms do not limit the present utility model.

[0032] Embodiment 1

[0033] This embodiment provides a circuit board assembly, which is applied to a battery pack adapter. Figure 1 This is a three-dimensional structural diagram of a circuit board assembly provided in an embodiment of the utility model. Figure 2 This is a top view of the circuit board assembly provided by the embodiment of the utility model. Figure 1 and Figure 2 The circuit board assembly 30 includes a substrate 31, components 32 and a heat dissipation assembly.

[0034] The substrate 31 is in the shape of a flat plate as a whole, and includes a first side surface 311 and a second side surface 313 opposite to each other. The components 32 are arranged on the first side surface 311 of the substrate 31. The components 32 include power components for controlling power. Since power components usually have large operating power and volume, they generate large amounts of heat and are the main components that need to be cooled.

[0035] The heat dissipation assembly is used to improve the heat dissipation effect of the circuit board assembly 30. The heat dissipation assembly includes a first heat dissipation member 41 and a second heat dissipation member 42. The first heat dissipation member 41 is arranged on the first side surface 311 of the substrate 31, and is thermally connected to some or all power components to enhance the heat dissipation efficiency of the power components. The second heat dissipation member 42 is arranged on the second side surface 313 of the substrate 31, and is thermally connected to the pad of the substrate 31. The shape of the second heat dissipation member 42 is roughly matched with the second side surface 313, which can increase the heat dissipation surface and improve the heat dissipation efficiency.

[0036] It should be noted that the first heat sink disposed on the first side surface is understood to mean that the first heat sink can be directly disposed on the first side surface and connected to the substrate, or there can be an intervening structure, and the heat sink can be thermally connected to the first side surface through the intervening structure. Similarly, the second heat sink disposed on the second side surface is understood to mean that the second heat sink can be directly disposed on the second side surface and connected to the substrate, or there can be an intervening structure, and the heat sink can be thermally connected to the pad on the second side surface through the intervening structure.

[0037] The first heat sink 41 is thermally connected to the power component, which helps to dissipate heat from the power component. The second heat sink 42 is attached to the second side surface 313 and welded to the pad on the second side surface, thereby achieving fixation and thermal conductivity between the second heat sink and the substrate.

[0038] In a preferred embodiment, all components 32 are arranged on the first side surface 311, and no components are arranged on the second side surface 313, which can remain relatively flat, facilitate the second heat sink 42 to fit with the second side surface, ensure a larger contact area, reduce the gap, and improve the heat transfer efficiency.

[0039] It should be understood that the shape of the second heat sink 42 substantially matches the second side surface 313 means that the shape of the second heat sink 42 is similar to that of the second side surface 313, and the outer contour dimensions of the second side surface 313 and the second heat sink 42 are substantially the same.

[0040] For example, if the second side surface 313 is substantially rectangular, then the outer contour shape of the second heat sink 42 is also substantially rectangular, and the length and width dimensions of both are substantially the same. If the second side surface 313 is substantially square, then the outer contour shape of the second heat sink 42 is also substantially square, and the side lengths of both are substantially the same. If the second side surface 313 is substantially circular, then the outer contour shape of the second heat sink 42 is also substantially circular, and the diameters of both are substantially the same.

[0041] In a specific embodiment, please refer to Figure 1 and Figure 2 , the substrate 31 is substantially a rectangular plate. Correspondingly, the shape of the second heat sink 42 is also a rectangular plate matching the shape of the substrate 31. The outer edge of the second heat sink 42 does not exceed the outer edge of the substrate 31. Preferably, the outer edge of the second heat sink 42 is arranged substantially flush with the outer edge of the substrate. A notch may be left on the outer edge of the second heat sink 42 to expose a part of the second side surface for facilitating electrical connection with a wire. In this embodiment, while improving the heat dissipation efficiency, the second heat sink does not increase the outer contour size of the circuit board assembly, and basically does not increase the size of the housing for accommodating the circuit board assembly.

[0042] It should be noted that the above-mentioned shapes being "substantially" the same means that the main lines of the outer contours are the same, but local notch and other contour structures are not excluded.

[0043] For the circuit board assembly provided in this embodiment, components are arranged on the first side surface of the substrate. The first heat sink is thermally connected to at least some of the power components. The second heat sink is arranged on the second side surface of the substrate and is thermally connected to the pads of the substrate. Heat sinks are arranged on both sides of the substrate. The first heat sink is thermally connected to the mainly heat-generating power components, which can enhance the heat dissipation effect of the mainly heat-generating components. At the same time, on the other side surface of the substrate, the second heat sink is soldered to the pads, and the second heat sink substantially matches the second side surface, which can increase the heat conduction contact surface, thereby improving the heat dissipation effect.

[0044] In a specific embodiment, please refer to Figure 1, according to the arrangement relationship, the power components include five groups of components arranged in sequence, where the height of three groups of components (323, 325) is greater than the height of the remaining two groups of components 321. The remaining two groups of components 321 are arranged at intervals between the three groups of components (323, 325). For the purpose of easy explanation, in the arrangement order, the five groups of components are defined to occupy the first position, the second position, the third position, the fourth position and the fifth position in sequence, where the three groups of components are respectively arranged at the first position, the third position and the fifth position, and the remaining two groups of components are respectively arranged at the second position and the fourth position. The first heat sink 41 is arranged on the remaining two groups of components 321. The height of the power heat sink 41 is lower than or equal to the maximum height of the three groups of components (323, 325). Since three groups of components are higher than the remaining two groups of components, the power heat sink is arranged on the remaining two groups of components with lower height, adjacent to the three groups of higher components, and does not exceed the maximum height of the three groups of components, which is beneficial to enhancing the overall heat dissipation effect of the power components and maintaining a lower overall height of the circuit board assembly.

[0045] In a specific embodiment, please refer to Figure 1 and Figure 2 As shown, the five groups of components are arranged in a straight line in sequence, corresponding to the first position, the second position, the third position, the fourth position and the fifth position in a straight line arrangement. One of the three groups of components is located in the middle position of the straight line, that is, the third position, and the other two of the three groups of components are respectively located at both ends of the straight line, that is, the first position and the fifth position. The number of the first heat sinks 41 is two, and the two first heat sinks 41 are respectively arranged on the remaining two groups of components, respectively located at the second position and the fourth position. In this way, the heat of the five groups of components arranged in a straight line is dispersed, which is beneficial to improving the efficiency of heat exchange with the outside world, reducing the mutual heat influence between the five groups of components, and having a better heat dissipation effect.

[0046] In this embodiment, the five groups of components are arranged in sequence along the length direction of the substrate 31. Specifically, the outer contour of the substrate 31 is rectangular, and the five groups of components are arranged in sequence along the direction parallel to the length side of the substrate 31.

[0047] In a specific embodiment, the remaining two groups of components 321 include MOS transistors, and the three groups of components include capacitors 323 or inductors 325, or both can be included. Exemplarily, MOS transistors are arranged at both the second position and the fourth position, capacitors 323 are arranged at the first position and the fifth position, and an inductor 325 is arranged at the third position. The MOS transistors are mounted on the first side surface 311, the first heat sink 41 is fixedly arranged on the upper surface of the MOS transistors, and the capacitors 323 and the inductor 325 are adjacent to the first heat sink 41, and the overall heat dissipation effect is better. In this embodiment, the first heat sink 41 is adhered to the upper surface of the MOS transistors. It is preferably adhered with a thermal conductive adhesive, which can enhance the heat transfer efficiency between the first heat sink 41 and the MOS transistors.

[0048] Please refer to Figure 1 and Figure 2 , component 32 includes an electrical socket 326, and the electrical socket 326 is disposed on the first side surface 311 of the substrate 31 for plugging into an external connector. Preferably, the electrical socket 326 is disposed near one end of the five groups of power components. The arrangement of the entire components is more regular.

[0049] Furthermore, in order to enhance the heat transfer efficiency and improve the heat dissipation effect, the first heat sink 41 is thermally connected to three of the adjacent components by using thermal conductive adhesive, thereby enhancing the heat dissipation effect of these three components. Specifically, in an embodiment where the three components include capacitors and inductors, both the capacitor 323 and the inductor 325 are thermally connected to the first heat sink 41 by using thermal conductive adhesive. In an embodiment where the three components include capacitors or inductors, the capacitor 323 is thermally connected to the first heat sink 41 by using thermal conductive adhesive, or the inductor 325 is thermally connected to the first heat sink 41 by using thermal conductive adhesive.

[0050] In order to enhance the heat dissipation effect of the power components, in one embodiment, please refer to Figure 1 , the first heat sink includes a plurality of spaced-apart extended heat sinks. Specifically, the extended heat sinks are in the shape of thin sheets, and the plurality of extended heat sinks are arranged in parallel, with a gap between adjacent extended heat sinks. The extension plane of each extended heat sink is substantially perpendicular to the first side surface 311, and the same side of all the extended heat sinks are connected to each other, and the connected part is adhered to the MOS transistor. The extended heat sinks increase the heat contact area, which is beneficial to improving the heat dissipation effect.

[0051] In order to increase the heat dissipation area and suppress the overall volume of the circuit board assembly, in a specific embodiment, the second heat sink 42 is configured as a plate-shaped heat sink. The plate-shaped heat sink is attached to the second side surface 313 and welded to the pads of the substrate 31. In this way, the plate-shaped heat sink expands the heat dissipation area on the second side of the circuit board assembly, and the thickness increase of the circuit board is small, which has little impact on the size of the housing for accommodating the circuit board assembly.

[0052] In order to facilitate the operation or connection to the substrate 31 from the second side surface, the plate-shaped heat sink includes a notch at the outer edge, and a partial area of the second side surface 313 of the substrate 31 is exposed through the notch. Specifically, please refer to Figure 1 , the substrate 31 further includes a soldering position 315 for soldering wires. The soldering position 315 is disposed near the outer edge of the substrate 31. The notch includes a soldering position notch opposite to the soldering position 315, and the wire passes through the soldering position notch and is soldered to the soldering position 315.

[0053] The notch can also include other types of notches. In another embodiment, please refer to Figure 3, the substrate 31a includes two notches, namely the first notch 420a and the second notch 423a. Among them, the first notch 420a is opposite to the welding position 315 and is used for a wire to pass through and be welded to the welding position 315. Therefore, the first notch 420a can also be called the welding position notch. The second notch 423a is opposite to the installation position of the electrical socket 326, facilitating the installation of the electrical socket 326. Therefore, the second notch 423a can also be called the installation notch. Of course, other types of notches can also be provided on the substrate 31a, which will not be listed one by one here.

[0054] In addition to the necessary functional notches, to ensure the heat dissipation effect and reduce the impact of the setting of the plate-shaped heat sink on the overall volume of the circuit board assembly. Preferably, except for the notches, the outer edge of the plate-shaped heat sink is flush with the outer edge of the substrate 31(31a). That is to say, the plate-shaped heat sink does not increase the width and length of the substrate, but only slightly increases the thickness of the circuit board assembly, ensuring the compactness of the overall volume of the circuit board assembly.

[0055] To improve the heat dissipation efficiency and maintain a relatively light weight, in one embodiment, one or both of the first heat dissipation member 41 and the second heat dissipation member 42 are made of aluminum. Aluminum metal has good thermal conductivity and a relatively small density, which can improve the heat dissipation effect and at the same time suppress the weight of the whole machine.

[0056] Embodiment 2

[0057] The present utility model also provides a battery pack adapter, including the circuit board assembly described in any of the above embodiments. Figure 4 FIG. is a schematic perspective view of a battery pack adapter using the circuit board assembly provided in this embodiment. Figure 5 FIG. is a schematic internal structure view of the battery pack adapter provided by the embodiment of the present utility model. Figure 6 For Figure 5 a schematic perspective view of another angle of the internal structure of the battery pack adapter shown.

[0058] This embodiment is described by taking the circuit board assembly 30 as an example. Of course, the battery pack adapter provided in this embodiment can also use the circuit board assembly provided by other contents of Embodiment 1.

[0059] Please refer to Figure 4 and Figure 5 shown. The battery pack adapter includes a housing 10 and a circuit board assembly 30. Among them, the circuit board assembly 30 is disposed in the receiving cavity of the housing. For the structure and components of the circuit board assembly, please refer to the part of Embodiment 1. The same structures are denoted by the same reference numerals and will not be described again here.

[0060] In this embodiment, the housing 10 is designed with a semi-shell structure, including a first semi-shell 15 and a second semi-shell 16. The first semi-shell 15 and the second semi-shell 16 are joined together along the width direction of the housing 10. After the first semi-shell 15 and the second semi-shell 16 are joined together, a receiving cavity is formed inside. The structures of the first semi-shell 15 and the second semi-shell 16 are substantially the same and are substantially symmetric about the mating surface.

[0061] A battery pack interface 20 is provided on the housing 10, which is located on the outer surface of the housing 10. The battery pack interface is used for detachably plugging into a battery pack (not shown). Specifically, please refer to Figure 4 As shown, the battery pack interface includes an electrode seat 22 and an opening provided opposite to the electrode seat 22. The substrate 31 is electrically connected to the electrode seat 22. The opening is an open port formed on one side of the housing 10, and the opening is used for the battery pack to pass through to plug into the electrode seat 22.

[0062] The battery pack interface attaches the battery pack in a sliding manner. Specifically, the battery pack interface 20 includes two parallel slide rails 24. The slide rails 24 are provided at the bottom of the housing 10 and extend along the length direction of the housing 10. Correspondingly, two matching chutes are provided on the battery pack, and the lengths of the chutes are substantially the same as those of the slide rails 24. Align the two slide rails 24 with the chutes on the battery pack and apply a thrust along the direction of the slide rails, so that the battery pack can be inserted into the battery pack interface 20 along the slide rails and dock with the electrode seat 22, realizing the sliding plugging of the battery pack and the battery pack adapter.

[0063] Please refer to Figure 5 and Figure 6 , when the circuit board assembly is received in the receiving cavity, the second heat dissipation member 42 is located on the side close to the battery pack interface 20, and the component 32 is located on the other side opposite to the battery pack interface 20. Preferably, the board surface (the first side surface 311 and the second side surface 313) of the substrate 31 is parallel to the two slide rails 24. More preferably, the length direction of the substrate 31 is parallel to the extending direction of the two slide rails 24. In this way, the volume of the battery pack adapter is more compact.

[0064] Specifically, a support structure 13 is provided on the inner wall of the housing 10 for supporting and positioning the circuit board assembly 30 in the receiving cavity. The support structure 13 can specifically be support ribs provided on the inner wall of the housing 10, and the circuit board assembly is arranged on the support ribs. The support ribs can include a first side support rib that is in limit fit with the first side surface of the substrate 31 and a second side support rib that is in limit fit with the outer surface of the second heat dissipation member 42. The support ribs support and position the circuit board assembly 30 in the housing 10 from both sides, and no additional fastening structure is required, making the assembly simpler.

[0065] Obviously, the above-described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, those of ordinary skill in the art can make other different forms of changes or modifications without making creative efforts, and all of them should fall within the scope of protection of the present utility model.

Claims

1. A circuit board assembly, characterized in that, Comprising: A substrate, including opposite first and second side surfaces; Components, disposed on the first side surface of the substrate, the components including power components for controlling power; A heat dissipation assembly, including a first heat dissipation member and a second heat dissipation member, the first heat dissipation member being disposed on the first side surface of the substrate and thermally connected to at least part of the power components, the second heat dissipation member being disposed on the second side surface of the substrate and thermally connected to the pads of the substrate, the shape of the second heat dissipation member being substantially matched with the second side surface.

2. The circuit board assembly according to claim 1, wherein, The power components include five groups of components, wherein the height of three groups of components is greater than that of the remaining two groups of components, the remaining two groups of components being spaced apart and disposed between the three groups of components, and the first heat dissipation member being disposed on the remaining two groups of components.

3. The circuit board assembly according to claim 2, wherein The remaining two groups of components include MOS transistors, the three groups of components include capacitors and / or inductors, the first heat dissipation member is fixedly disposed on the upper surface of the MOS transistors, and the capacitors and / or inductors are disposed adjacent to the first heat dissipation member; the heat dissipation assembly further includes a thermal conductive adhesive, the thermal conductive adhesive being thermally connected to the capacitor and the first heat dissipation member and / or the thermal conductive adhesive being thermally connected to the inductor and the first heat dissipation member.

4. The circuit board assembly according to claim 2, characterized in that, The five groups of components are arranged in a line in sequence, one of the three groups of components is located at the middle position of the line, and the other two of the three groups of components are respectively located at the two end positions of the line, and the number of the first heat dissipation members is two, and the two first heat dissipation members are respectively disposed on the remaining two groups of components.

5. The circuit board assembly according to claim 1, characterized in that, The first heat dissipation member includes a plurality of spaced-apart extended heat dissipation fins.

6. The circuit board assembly according to claim 1, characterized in that, The second heat dissipation member is configured as a plate-shaped heat dissipation fin, and the plate-shaped heat dissipation fin is welded to the pads of the substrate.

7. The circuit board assembly according to claim 6, characterized in that, The substrate further includes welding positions for welding wires, the plate-shaped heat dissipation fin includes a notch opposite to the welding positions, and the wires pass through the notch and are welded to the welding positions.

8. The circuit board assembly according to claim 7, wherein, Except for the notch, the outer edge of the plate-shaped heat dissipation fin is flush with the outer edge of the substrate.

9. The circuit board assembly according to claim 1, wherein The first heat dissipation member and / or the second heat dissipation member is made of aluminum.

10. A battery pack adapter, characterized in that, Comprising: A housing and the circuit board assembly according to any one of claims 1-9, the circuit board assembly being disposed in a receiving cavity of the housing; A battery pack interface, disposed on an outer side surface of the housing for attaching a battery pack, the battery pack interface including an electrode base, and the substrate being electrically connected to the electrode base.

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