Novel packaging structure of module

Abstract

The utility model discloses a novel packaging structure of a module, which is characterized in that a PCB step strip is designed, the front / rear end face of the PCB step strip is uniformly provided with a plurality of via holes communicated with double-sided bonding pads, and the PCB step strip is welded between a module body and a mainboard body, so that the inner space of the module body and the mainboard body is heightened, and the thickness of the module body is increased. More components can be welded on the module body with the same area, so that the occupied area of the mainboard body is small, the integration level of the mainboard body is higher, and the comprehensive cost of the mainboard body is reduced; meanwhile, the space spacing distance between the bottom-layer wiring of the module and the top-layer wiring of the mainboard is increased, so that the interference among signals, especially high-frequency signals, is greatly reduced, and the signals are more stable; through hole communication design of the double-sided pads of the PCB step strip facilitates in and out of wires, the welding process between the module body and the mainboard body is simple, and the PCB step strip is suitable for batch production.

Description

Technical Field

[0001] The utility model relates to the design and manufacture of communication modules, and particularly to the packaging structure between a module and a main board. Background Art

[0002] In current electronic products, various modules are widely used, such as optical modules, power modules, voice modules, wifi modules, etc.; these modules need to be packaged together with the main board, playing roles in aspects such as installing, fixing, protecting chips, and enhancing electrothermal performance. There are vias provided to facilitate the entry and exit of wires of connecting plates at different levels, so as to realize the connection between internal chips and external circuits. At the same time, the packaged modules are also more convenient for installation and transportation.

[0003] In the current technology, in the packaging form between a module and a main board, most adopt the stamp hole packaging form. This stamp hole packaging method has many advantages, such as not occupying space and being suitable for mass production, etc., thus being widely used; but there are also defects: after the module is welded to the main board, the internal empty height is very small, so that many components cannot be placed at the bottom of the module, otherwise it cannot be welded to the main board, directly leading to two major problems:

[0004] 1. The required module area is large, and when welded to the main board, it occupies a large area of the main board, increasing the cost of the main board;

[0005] 2. The space interval distance between the bottom layer wiring of the module and the top layer wiring of the main board is fixed and uncontrollable. Its interval distance belongs to the thickness of the insulating layer in the micron range, and signal interference will occur, especially between high-frequency signals, and interference often occurs;

[0006] Therefore, in the existing technology, the packaging form between the module and the main board needs to be improved. Summary of the Invention

[0007] The utility model aims to provide a new packaging structure for a module to solve the defects in the background art.

[0008] The utility model is realized through the following technical solutions.

[0009] A new packaging structure for a module includes a module body and a main board body. Solder pads are provided at the corresponding packaging positions of the module body and the main board body; a PCB step bar is provided. A plurality of symmetric double-sided solder pads are evenly provided on the front / back end faces of the PCB step bar. The double-sided solder pads on one end face of the PCB step bar are welded to the solder pads in the packaging position of the module body, and the double-sided solder pads on the other end face are welded to the solder pads in the packaging position of the main board body. The double-sided solder pads adopt a via communication design to facilitate the entry and exit of wires, so as to realize the welding of the module body and the main board body into a whole through the PCB step bar to complete the packaging.

[0010] As a preferred solution: the number of the PCB stepped strips (30) is multiple.

[0011] As a preferred solution: the height of the PCB stepped strip (30) is not limited.

[0012] As a preferred solution: the number of the double-sided pads provided on the PCB stepped strip is the same as the number of the pads at the packaging positions of the module body and the main board body.

[0013] The beneficial effects of the present utility model are as follows: a PCB stepped strip is designed, and a plurality of double-sided pads with via-connected design are evenly arranged on the front and / or back surfaces of the PCB stepped strip and are welded to the pads at the packaging positions between the module body and the main board body, so that the internal space between the module body and the main board body is increased, more components can be welded on the module body with the same area, the area of the module body is small, the area occupied on the main board body is small, the integration degree of the main board body is higher, and the comprehensive cost of the main board body is reduced; meanwhile, the space interval between the bottom layer traces of the module and the top layer traces of the main board is increased, and the interference between signals, especially high-frequency signals, is greatly reduced, and the signals are more stable. The via-connected design of the pcb stepped strip facilitates the entry and exit of wires, the process is simple, and it is suitable for mass production. Description of the Drawings

[0014] Figure 1 It is a corresponding view of the front and rear end faces of the PCB stepped strip of the present utility model;

[0015] Figure 2 It is a schematic diagram of the completion of welding of the module body and the main board body of the present utility model;

[0016] Figure 3 It is a schematic diagram of welding of the PCB stepped strip and the module body of the present utility model.

[0017] Wherein; 10-module body, 10-a-module body packaging position, 10-b-module body packaging position pad, 20-main board body, 20-a-main board body packaging position, 20-b-main board body packaging position pad, 30-PCB stepped strip, 31-double-sided pad, 32-via. Detailed Embodiments

[0018] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0019] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present utility model are only used to explain the relative positional relationship and movement conditions between components in a certain specific posture (as shown in the attached drawings). If the specific posture changes, the directional indications will also change accordingly.

[0020] Refer to Figures 1 - 3 , a new packaging structure for a module, including a module body (10) and a main board body (20). Solder pads (b) are provided at the corresponding packaging positions (a) of the module body (10) and the main board body (20); a PCB step bar (30) is provided. A plurality of symmetric double-sided solder pads (31) are evenly provided on the front / back end faces of the PCB step bar (30). The double-sided solder pads (31) on one end face of the PCB step bar (30) are soldered to the solder pads (10-b) in the packaging position (10-a) of the module body (10), and the double-sided solder pads (31) on the other end face are soldered to the solder pads (20-b) in the packaging position (20-a) of the main board body (20). The double-sided solder pads (31) adopt a via connection design to facilitate the entry and exit of wires, thereby realizing the soldering of the module body (10) and the main board body (20) into a whole to complete the packaging.

[0021] In the present utility model: A PCB step bar is soldered between the solder pads at the packaging positions of the module body and the main board body, increasing the internal space of the module body and the main board body, exchanging space for plane. More components can be soldered on the module body with the same area, making the integration degree of the main board body higher;

[0022] The internal space height between the module body and the main board body can be made controllable by designing the height of the PCB step bar. The space interval distance between the bottom layer wiring of the module body and the top layer wiring of the main board can reach the millimeter level (the thickness of the PCB board), and the interference is smaller, especially in high-frequency signals, with more significant advantages;

[0023] The PCB step bar is inexpensive, the area of the main board body is reduced, and the comprehensive cost is lowered.

[0024] In the present utility model, the soldering process of the PCB step bar is simple:

[0025] 1. Solder the double-sided solder pads with via connection design on the front / back end faces of the PCB step bar respectively;

[0026] 2. Solder the double-sided solder pads on any one end face to the solder pads at the packaging position of the module body, and solder other components in the module body;

[0027] 3. Solder the solder pads at the packaging position of the main board body to the double-sided solder pads on the other end face of the PCB step bar to complete the packaging.

[0028] In the present utility model, the number of the PCB step bars is multiple, and the number and shape of the PCB step bars can be set according to the different outer shapes of the module body, such as a module body with an irregular shape.

[0029] The above-described are only the preferred embodiments of the present utility model, and the above specific embodiments are not limitations on the present utility model. Within the scope of the technical concept of the present utility model, various deformations and modifications can occur. Any retouching, modification or equivalent replacement made by those of ordinary skill in the art according to the above description shall fall within the scope protected by the present utility model.

Claims

1. A new packaging structure for a module, comprising a module body (10) and a main board body (20), and pads (b) are provided on the corresponding packaging positions (a) of the module body (10) and the main board body (20); characterized in that: A PCB step bar (30) is provided. A plurality of symmetric double-sided pads (31) are evenly arranged on the front / back end faces of the PCB step bar (30). The double-sided pads (31) on one end face of the PCB step bar (30) are welded to the pads (10-b) in the packaging position (10-a) of the module body (10), and the double-sided pads (31) on the other end face are welded to the pads (20-b) in the packaging position (20-a) of the main board body (20). The double-sided pads (31) adopt a via connection design, which is convenient for the access of wires, so as to realize the welding of the module body (10) and the main board body (20) into a whole through the PCB step bar (30) to complete the packaging.

2. The novel packaging structure of a module according to claim 1, characterized in that: The number of the PCB step bars (30) is multiple.

3. The novel packaging structure of a module according to claim 1, characterized in that: The height of the PCB step bar (30) is not limited.

4. The novel packaging structure of a module according to claim 1, wherein: The number of the double-sided pads (31) arranged on the PCB step bar (30) is the same as the number of the pads at the packaging positions of the module body (10) and the main board body (20).

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