High-power communication terminal heat dissipation device based on liquid cooling

Abstract

The utility model discloses a high-power communication terminal heat dissipation device based on liquid cooling, which belongs to the field of communication device heat dissipation, and comprises a case shell, a processing module, a VC cavity temperature equalizing plate, a liquid cooling circulating pump, a radiator, a fan assembly and a liquid cooling flow channel system, the liquid cooling circulating pump does work to enable a cooling liquid medium to circularly flow in the flow channel system in a reciprocating mode, and the flow channel system in the radiator and the VC cavity temperature equalizing plate can be designed and arranged according to the specific conditions of a project. Compared with a traditional communication terminal, the high-heat-flux heat dissipation requirement of a highly integrated circuit module can be met, the terminal can be made into a fully-closed case, mold prevention, moisture prevention and salt mist prevention of the whole machine are achieved, and the requirements for high power, unit miniaturization and unit standardization of the communication terminal are met.

Description

Technical Field

[0001] The present invention relates to a heat dissipation device for high-power communication terminals based on liquid cooling, and particularly to the heat dissipation technology for standard rack-mounted units of high-power communication base station servers in harsh environments. Background Art

[0002] With the rapid development of communication technology, from 2G to the current commercial promotion of 5G, the overall heat consumption of communication terminals is increasing, and the environment where communication terminals are located is becoming more and more harsh as the national communication infrastructure expands from laboratories to deserts, and then to coastal and ocean areas. Generally speaking, communication base stations are all outdoors. Although communication terminals can be rack-mounted in computer rooms or outdoor cabinets, they will definitely be affected by the surrounding harsh environment. Most of the internal components of communication terminals are relatively fragile, and the equipment requires high reliability and long-term stability. In such a situation, it is necessary to ensure effective heat dissipation of the module while meeting the size requirements of specific communication terminals. Therefore, communication terminals are usually disassembled into multiple units for combined use, or the rack-mounted units are made into 2U / 4U / 6U, which is not space-saving enough in the cabinet, and even requires several cabinets to coordinate to achieve the established functions. If this continues, the overall floor area of the base station will increase, the total power consumption of the base station will also be relatively large, and splitting into multiple units will increase the failure rate of the entire system. There is an urgent need to integrate and integrate various communication modules, integrate relevant main data processing chips in one unit, and reduce the data links between the outside of the units. Such a highly integrated unit will result in a very high heat flux density, and the heat dissipation requirement needs to be solved urgently. Summary of the Invention

[0003] Aiming at the above problems, the purpose of the present invention is to provide a heat dissipation device for high-power communication terminals based on liquid cooling.

[0004] To achieve the above purpose, the technical solution adopted by the present invention is as follows: A heat dissipation device for high-power communication terminals based on liquid cooling, including a chassis housing, a processing module, a VC chamber heat pipe, a liquid cooling circulation pump, a radiator, a fan assembly, a hose, and a chassis top cover; the chassis top cover is fixedly connected to the chassis housing, the processing module, the VC chamber heat pipe, and the liquid cooling circulation pump are arranged inside the chassis housing, and the processing module is placed flat below the VC chamber heat pipe; the radiator is arranged on a radiator bracket, the fan assembly is arranged on the radiator, and then the whole is installed in the rear panel area of the chassis housing; the hose connects the liquid cooling circulation pump, the radiator, and the VC chamber heat pipe in series to form a liquid cooling circulation system, and a power supply module is also arranged inside the chassis housing to provide stable power for the terminal heat dissipation device.

[0005] As a preferred embodiment of the present invention, the VC chamber heat pipe is internally designed with a heat pipe VC chamber and a liquid cooling flow channel, and the area of the heat pipe VC chamber above the liquid cooling flow channel is the cold end of the VC chamber.

[0006] As a preferred embodiment of the present invention, a heat conductive pad is provided between the processing module and the VC chamber heat pipe, and the heat conductive pad is disposed above the chips that need to dissipate heat in the processing module.

[0007] As a preferred embodiment of the present invention, the interior of the VC chamber of the heat pipe is a vacuum-sealed space, and a liquid working medium with a set volume is filled in the VC chamber of the heat pipe. The volume of the liquid working medium does not exceed 70% of the vacuum-sealed space.

[0008] As a preferred embodiment of the present invention, a plurality of liquid cooling microchannels and heat exchange fins are designed inside the cold radiator. The liquid cooling microchannels are filled with a coolant medium, and the number of the liquid cooling microchannels can be flexibly set according to requirements.

[0009] As a preferred embodiment of the present invention, the fan assembly is composed of a plurality of axial fans. When the fans work, the air in the surrounding environment of the chassis enters the air duct of the cold radiator through the ventilation holes of the cold radiator bracket, absorbs the heat of the coolant medium in the liquid cooling microchannels of the cold radiator, and the heated hot air then passes through the axial fans and returns to the surrounding environment.

[0010] The working principle of the high-power communication terminal heat dissipation device based on liquid cooling of the present invention is as follows: Heat is generated by the chips on the processing module. A very small part of the heat is transferred to the PCB board below the chips through heat conduction and finally exchanged with the surrounding environment; most of the chip heat is conducted to the VC chamber heat pipe through the heat conductive silicone pad. These heats are quickly diffused to the cold end based on the working mechanism of the VC chamber heat pipe, and then are taken away by the coolant medium in the liquid cooling channel below the cold end of the VC chamber heat pipe. The coolant medium with heat flows into the microchannels of the cold radiator and is exchanged with the surrounding environment through air cooling.

[0011] The coolant medium is injected into the liquid cooling circulation system from port A under the action of the liquid cooling circulation pump. The coolant medium flows into the liquid cooling channels in the VC chamber heat pipe. The coolant medium takes away the heat at the cold end of the VC chamber heat pipe. The coolant medium flows into the microchannels of the cold radiator along the liquid cooling circulation system. The coolant medium is cooled by air cooling by the fan assembly, and the cooled coolant then flows back to the liquid cooling circulation pump from port B, thus realizing the reciprocating circulation of the coolant in the liquid cooling channel system. In this way, the heat of the processing module is continuously and stably exchanged with the surrounding environment.

[0012] The working mechanism of the VC chamber heat pipe used in the present invention: The inside of the VC chamber of the heat pipe is a vacuum-sealed space, and a certain volume of liquid working medium (not exceeding 70% of the volume of the vacuum-sealed space) is filled into this space. The heat of the chip is conducted to the VC chamber heat pipe through a thermal conductive silicone pad. This heat causes the liquid working medium near the chip position inside the VC chamber of the heat pipe to boil instantaneously. The vaporized gaseous working medium molecules move violently and diffuse, quickly spreading the heat absorbed from the chip conduction throughout the entire VC chamber of the heat pipe. When the gaseous working medium encounters the cold end of the VC chamber of the heat pipe, it quickly condenses and aggregates into liquid working medium. This liquid working medium is acted upon by a special capillary structure inside the VC chamber to the vicinity of the heating chip and is vaporized and diffused again. The liquid working medium and the gaseous working medium are converted back and forth inside the VC chamber, realizing the heat diffusion and transfer of the heating chip.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: It can not only meet the heat dissipation requirements of high heat flux density in highly integrated circuit modules, but also the terminal can be made into a fully enclosed chassis to achieve anti-mold, anti-humidity, and anti-salt spray for the whole machine, meeting the requirements of high power, unit miniaturization, and unit standardization of communication terminals. Brief Description of the Drawings

[0014] Figure 1 It is a schematic diagram of the overall structure of the liquid-cooled high-power communication terminal heat dissipation device based on the present invention.

[0015] Figure 2 It is an exploded structure schematic diagram of the liquid-cooled high-power communication terminal heat dissipation device based on the present invention.

[0016] Figure 3 It is a schematic diagram of the VC chamber heat pipe structure in the liquid-cooled high-power communication terminal heat dissipation device based on the present invention.

[0017] Figure 4 It is a schematic diagram of the cold row structure in the liquid-cooled high-power communication terminal heat dissipation device based on the present invention.

[0018] Figure 5 It is a schematic diagram of the liquid-cooled flow channel in the liquid-cooled high-power communication terminal heat dissipation device based on the present invention.

[0019] Figure 6 It is a cross-sectional view of the working mechanism of the VC chamber of the heat pipe in the liquid-cooled high-power communication terminal heat dissipation device based on the present invention.

[0020] Figure 7 It is a schematic diagram of the external air flow of the liquid-cooled high-power communication terminal heat dissipation device based on the present invention.

[0021] Figure 8 It is a thermal simulation temperature contour map of the liquid-cooled high-power communication terminal heat dissipation device based on the present invention.

[0022] Reference Signs:

[0023] 1 - Chassis housing, 2 - Liquid cooling circulation pump, 3 - Radiator bracket, 4 - Radiator, 5 - Fan assembly, 6 - Hose, 7 - VC chamber heat spreader, 8 - Chassis top cover, 9 - Processing module, 31 - Heat spreader VC chamber, 32 - Liquid cooling flow channel, 41 - Liquid cooling micro-channel, 42 - Heat exchange fins, 71 - VC chamber heat spreader housing. Detailed implementation manner

[0024] The following further clarifies the technical solution of the present invention in conjunction with the accompanying drawings and specific implementation manners. It should be understood that the following specific implementation manners are only used to illustrate the present invention and not to limit the scope of the present invention.

[0025] As Figure 1 , Figure 2 shown, a high-power communication terminal heat dissipation device based on liquid cooling, the processing module 9 is placed flat under the VC chamber heat spreader 7, and then the whole is installed in the chassis housing 1, and the liquid cooling circulation pump 2 is also installed in the chassis housing 1. The fan assembly 5 and the radiator 4 are installed on the radiator bracket 3, and then the whole is installed in the rear panel area of the chassis housing 1. Then use the hose 6 (Teflon hose) to connect the liquid cooling circulation pump 2, the radiator 4 and the VC chamber heat spreader 7 in series to form a liquid cooling circulation system, and finally close the chassis top cover 8. A heat conducting pad is provided between the processing module 9 and the VC chamber heat spreader 7, and the heat conducting pad is arranged above the chips that need to dissipate heat in the processing module 9. A power module is also provided in the chassis housing 1 to provide stable power for the terminal heat dissipation device.

[0026] As Figure 3 shown, the VC chamber heat spreader 7 is internally designed with a heat spreader VC chamber 31 and a liquid cooling flow channel 32, and the area of the heat spreader VC chamber 32 above the liquid cooling flow channel 32 is the cold end of the VC chamber.

[0027] As Figure 4 shown, the radiator 4 is internally designed with a liquid cooling micro-channel 41 and heat exchange fins 42, and the liquid cooling micro-channel 41 is filled with a coolant medium, and the liquid cooling micro-channel 41 can be designed and arranged according to project requirements.

[0028] As Figure 5 shown, the liquid cooling circulation pump 2 injects the coolant medium from port A, flows to the liquid cooling flow channel inside the VC chamber heat spreader 7, absorbs the heat in the VC chamber and heats up, and then flows to the micro-channel of the radiator 4 along the arrow. Due to the air-cooling effect of the fan assembly 5 outside the chassis, the heat absorbed by the coolant medium from the VC chamber is exchanged to the surrounding environment. The cooled coolant medium flows into the liquid cooling circulation pump 2 from port B along the arrow, and then flows out from port A, and circulates repeatedly.

[0029] As Figure 6As shown in the figure, inside the VC chamber at room temperature is a vacuum-sealed space. Inside the vapor chamber VC chamber 31 of the vapor chamber, a certain volume of liquid working medium is filled (not exceeding 70% of the volume of the vacuum-sealed space). Due to the vacuum environment, the boiling point of the filled liquid working medium is relatively low, and it can boil by absorbing very little heat. The heat-generating chip above the PCB generates heat, which is conducted through heat conduction to the thermal conductive silicone pad and then to the outer shell 71 of the vapor chamber of the vapor chamber. The liquid working medium in the vapor chamber VC chamber 31 absorbs heat and vaporizes in the illustrated 'vaporization zone'. The vaporized liquid working medium molecules move violently and diffuse, quickly spreading the heat conducted from the chip throughout the entire vapor chamber VC chamber 31. Since the vapor chamber of the vapor chamber 7 in the present invention is designed with a liquid cooling flow channel, and the temperature of the coolant medium in the flow channel is relatively low, these continuous coolant media continuously take away the heat in the vapor chamber VC chamber 31, causing a 'condensation zone' to form in the vapor chamber VC chamber 31. When the gaseous working medium encounters the 'condensation zone' of the vapor chamber VC chamber 31, it quickly condenses and gathers into liquid working medium, and these liquid working media are then transported to the vicinity of the heat-generating chip by the special capillary structure in the vapor chamber VC chamber 31 and vaporized and diffused again. The liquid working medium and the gaseous working medium are cyclically transformed in the vapor chamber VC chamber 31 to achieve the heat diffusion and transfer of the heat-generating chip.

[0030] As Figure 7 shown, the fan assembly 5 consists of several axial fans. When the fans work, the air in the surrounding environment of the chassis enters the air duct of the cold radiator 4 through the ventilation holes of the cold radiator bracket 3, absorbs the heat of the coolant medium in the microchannels of the cold radiator 4, and the heated hot air then passes through the axial fans and returns to the surrounding environment.

[0031] In this embodiment, as Figure 8 shown, the thermal simulation temperature cloud map of the whole machine.

[0032] The technical means disclosed in the solution of the present invention are not limited to the technical means disclosed in the above embodiments, but also include the technical solutions composed of any combination of the above technical features. For those of ordinary skill in the art of this technology, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements are also regarded as the protection scope of the present invention.

Claims

1. A high-power communication terminal heat dissipation device based on liquid cooling, characterized in that: It includes a chassis housing (1), a processing module (9), a VC chamber heat pipe (7), a liquid cooling circulation pump (2), a radiator (4), a fan assembly (5), a hose (6), and a chassis top cover (8); the chassis top cover (8) is fixedly connected to the chassis housing (1), the processing module (9), the VC chamber heat pipe (7), and the liquid cooling circulation pump (2) are arranged inside the chassis housing (1), and the processing module (9) is placed flat below the VC chamber heat pipe (7); the radiator (4) is arranged on a radiator bracket (3), the fan assembly (5) is arranged on the radiator (4), and then the whole is installed in the rear panel area of the chassis housing (1); the hose (6) connects the liquid cooling circulation pump (2), the radiator (4), and the VC chamber heat pipe (7) in series to form a liquid cooling circulation system, and a power supply module is also arranged inside the chassis housing (1) to provide stable power for the terminal heat dissipation device.

2. The high-power communication terminal heat dissipation device based on liquid cooling according to claim 1, wherein: The VC chamber heat pipe (7) is internally designed with a heat pipe VC chamber (31) and a liquid cooling flow channel (32), and the area of the heat pipe VC chamber (31) above the liquid cooling flow channel (32) is the cold end of the VC chamber.

3. The high-power communication terminal heat dissipation device based on liquid cooling according to claim 1, wherein: A heat conduction pad is arranged between the processing module (9) and the VC chamber heat pipe (7), and the heat conduction pad is arranged above the chips that need to dissipate heat in the processing module (9).

4. The high-power communication terminal heat dissipation device based on liquid cooling according to claim 2, wherein: The interior of the heat pipe VC chamber (31) is a vacuum-sealed space, and a set volume of liquid working medium is filled inside the heat pipe VC chamber (31), and the volume of the liquid working medium does not exceed 70% of the vacuum-sealed space.

5. The high-power communication terminal heat dissipation device based on liquid cooling according to claim 1, wherein: The radiator (4) is internally designed with a plurality of liquid cooling micro-channels (41) and heat exchange fins (42), the liquid cooling micro-channels (41) are filled with a coolant medium, and the number of the liquid cooling micro-channels (41) can be flexibly set according to requirements.

6. The high-power communication terminal heat dissipation device based on liquid cooling according to claim 4, wherein: The fan assembly (5) is composed of several axial fans. When the fans work, the air in the surrounding environment of the chassis enters the air duct of the radiator (4) from the ventilation holes of the radiator bracket (3), absorbs the heat of the coolant medium in the liquid cooling micro-channels (41) of the radiator (4), and the heated hot air then passes through the axial fans and returns to the surrounding environment.

7. The high-power communication terminal heat dissipation device based on liquid cooling according to claim 1, wherein: The hose (6) is a Teflon hose.

8. The high-power communication terminal heat dissipation device based on liquid cooling according to claim 1, wherein: The liquid cooling circulation pump (2) injects the coolant medium from the inlet of the hose (6), flows to the liquid cooling flow channel (32) inside the VC chamber heat sink (7), absorbs the heat in the VC chamber and then heats up, and then flows through the pipeline to the liquid cooling micro-channel (41) of the radiator (4). Due to the air cooling effect of the fan assembly (5) outside the chassis, the heat absorbed by the coolant medium from the VC chamber is exchanged to the surrounding environment. The cooled coolant medium flows into the liquid cooling circulation pump (2) from the outlet of the hose (6) along the pipeline, and then flows out from the inlet, repeating the cycle.

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