Heat conduction enhancing device for spaceflight load

Abstract

The utility model relates to a heat conduction enhancing device for spaceflight load, which comprises a case, a heat conduction enhancing plate and a load single-machine function module, an accommodating cavity is arranged in the case, and the heat conduction enhancing plate and the load single-machine function module are arranged in the accommodating cavity; the heat conduction reinforcing plate comprises a first surface and a second surface which are opposite, reinforcing ribs protruding outwards are arranged on the first surface, the second surface is connected with the load single-machine function module, and the heat conduction reinforcing plate is used for conducting heat generated by the load single-machine function module. The heat conduction and heat dissipation effects of the spaceflight load single machine can be improved, and the overall weight of the spaceflight load single machine is reduced.

Description

Technical Field

[0001] The utility model mainly relates to the technical field of heat conduction of aerospace payloads, and particularly relates to a heat conduction enhancement device for aerospace payloads. Background Art

[0002] In the aerospace field, the heat dissipation of payload single units is one of the keys to ensuring the stable operation of equipment. Common heat dissipation methods include fluid pipeline circulation heat dissipation and high-performance thermal control coatings. Although these methods can effectively improve the heat dissipation effect on the outer surface of the payload single unit, it is difficult to solve the problem that the heat conduction capacity from the internal heat source of the single unit to the installation surface is limited. For the internal heat dissipation of the payload single unit, a heat pipe is often used as the cold plate of the functional module to enhance heat conduction, or an expensive graphene heat conduction belt is used for local heat dissipation of high heat consumption chips. With the continuous improvement of the functional complexity and performance requirements of aerospace payload equipment, these traditional internal heat dissipation solutions are difficult to meet the thermal design requirements of aerospace payloads.

[0003] Specifically, traditional heat dissipation methods such as heat pipes or graphene heat conduction belts have insufficient heat dissipation efficiency when facing the heat dissipation requirements of high heat consumption and high-power concentrated heat sources, resulting in the heat accumulated inside the payload single unit being difficult to effectively transfer to the top or bottom heat dissipation surfaces, which may affect the normal operation of the equipment. At present, some new heat dissipation technologies have been introduced, but the manufacturing processes of the new heat dissipation technologies are generally complex, the costs are high, and the versatility for different payload single units is not good. Although the introduction of the new heat dissipation technologies has improved the heat dissipation ability to a certain extent, it is often accompanied by a significant increase in the overall weight of the payload single unit, and it is impossible to meet the requirements of heat conduction and heat dissipation and weight reduction of the aerospace payload single unit at the same time. Summary of the Utility Model

[0004] The technical problem to be solved by this application is to provide a heat conduction enhancement device for aerospace payloads, which can improve the heat conduction and heat dissipation effect of the aerospace payload single unit and reduce the overall weight of the aerospace payload single unit.

[0005] The technical solution adopted by this application to solve the above technical problem is a heat conduction enhancement device for aerospace payloads, including a chassis, a heat conduction enhancement plate, and a payload single unit functional module. An accommodation cavity is arranged inside the chassis, and the heat conduction enhancement plate and the payload single unit functional module are arranged in the accommodation cavity; the heat conduction enhancement plate includes a first surface and a second surface opposite to each other. Reinforcing ribs protruding outward are arranged on the first surface, and the second surface is connected to the payload single unit functional module. The heat conduction enhancement plate is used for conducting the heat generated by the payload single unit functional module.

[0006] In an embodiment of this application, the chassis includes a top cover, a bottom plate, and side plates, and the top cover, the bottom plate, and the side plates jointly enclose the accommodation cavity.

[0007] In an embodiment of the present application, a first heat conduction slot is provided on the inner surface of the top cover, and a second heat conduction slot is provided on the inner surface of the bottom plate. The first heat conduction slots and the second heat conduction slots correspond to each other one by one. The first end of the heat conduction enhancement plate is connected to the first heat conduction slot, and the second end of the heat conduction enhancement plate is connected to the second heat conduction slot.

[0008] In an embodiment of the present application, a first positioning hole is provided on the first end, and a second positioning hole is provided on the second end. The first end is connected to the first heat conduction slot through the first positioning hole and a screw, and the second end is connected to the second heat conduction slot through the second positioning hole and a screw.

[0009] In an embodiment of the present application, a first heat conduction plate is provided on the first end, and a second heat conduction plate is provided on the second end. The first heat conduction plate is connected to the first heat conduction slot, and the second heat conduction plate is connected to the second heat conduction slot.

[0010] In an embodiment of the present application, the load single - machine function module includes a module cold plate, a circuit board, and a locking member. The module cold plate is respectively connected to the circuit board and the heat conduction enhancement plate. The module cold plate is used to conduct the heat generated by the circuit board. The load single - machine function module is connected to the inner surface of the chassis through the locking member.

[0011] In an embodiment of the present application, a heat conduction boss facing the circuit board is provided on the module cold plate, and the module cold plate is connected to the circuit board through the heat conduction boss.

[0012] In an embodiment of the present application, the heat conduction enhancement device further includes a heat conduction pad disposed between the second surface and the load single - machine function module. The second surface is connected to the load single - machine function module through the heat conduction pad.

[0013] In an embodiment of the present application, a heat pipe is provided on the outer surface of the chassis, and a heat conduction material is coated on the heat pipe.

[0014] In an embodiment of the present application, the preparation material of the heat conduction enhancement plate includes aluminum alloy and / or graphene.

[0015] The technical solution of the present application effectively reduces the heat transfer thermal resistance and expands the heat conduction path by setting the heat conduction enhancement plate; by arranging structural reinforcing ribs on the heat conduction enhancement plate, the strength and stiffness of the heat conduction enhancement plate can be improved, and the mechanical stability of the overall heat conduction enhancement device can be ensured; by arranging the heat conduction enhancement plate and the load single - machine function module in the accommodation cavity of the chassis, it does not occupy extra space of the load single - machine, and a lightweight heat conduction material can be used to prepare the heat conduction enhancement plate. Thus, under the conditions of limited space and total weight limit, the heat conduction enhancement device can improve the heat conduction and heat dissipation effect of the space - borne load single - machine and reduce the overall weight of the space - borne load single - machine.

[0016] The heat conduction enhancement device of the present application is equivalent to a novel heat conduction enhancement structure applicable to a single unit of a spaceborne payload, solving the heat dissipation problem of a single unit of a high-power heat dissipation load under the boundary conditions of orbital high-temperature thermal control. The manufacturing process of the heat conduction enhancement device is simple and the cost is low. It can be applied to different single units of loads and can meet the heat dissipation requirements of high heat dissipation and high-power concentrated heat sources. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] To make the above objects, features, and advantages of the present application more obvious and understandable, the following detailed description of the specific embodiments of the present application is provided in conjunction with the accompanying drawings, wherein:

[0018] Figure 1 is a schematic diagram of the overall structure of a heat conduction enhancement device for a spaceborne payload according to an embodiment of the present application;

[0019] Figure 2 is a schematic diagram of removing the functional module of the single unit of the load from the heat conduction enhancement device according to an embodiment of the present application;

[0020] Figure 3 is a schematic diagram of the installation of the heat conduction enhancement plate and the functional module of the single unit of the load according to an embodiment of the present application;

[0021] Figure 4 is a front view schematic diagram of the heat conduction enhancement plate according to an embodiment of the present application;

[0022] Figure 5 is a back view schematic diagram of the heat conduction enhancement plate according to an embodiment of the present application.

[0023] Description of the reference numerals in the specific embodiments:

[0024] 1. Side plate; 10. Threaded hole; 11. Reinforcing rib; 12. First surface; 13. Second surface; 101. First heat conduction plate; 102. Second heat conduction plate; 1000. Heat conduction enhancement device; 1010. Chassis; 1011. Accommodation cavity; 1020. Functional module of the single unit of the load; 2. Bottom plate; 3. Top cover; 4. Module cold plate; 5. Locking member; 6. Heat conduction enhancement plate; 61. First end; 62. Second end; 7. Circuit board; 81. First positioning hole; 82. Second positioning hole; 91. First heat conduction slot; 92. Second heat conduction slot. SPECIFIC EMBODIMENTS

[0025] To make the above objects, features, and advantages of the present application more obvious and understandable, the following detailed description of the specific embodiments of the present application is provided in conjunction with the accompanying drawings.

[0026] In the following description, many specific details are set forth in order to provide a thorough understanding of the present application. However, the present application may be implemented in other ways different from those described herein. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0027] As shown in this application and the claims, unless the context clearly indicates otherwise, words such as "a", "an", "one", and / or "the" are not specifically singular and may also include the plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of the steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements.

[0028] In the description of this application, it should be understood that the orientation or positional relationship indicated by orientation words such as "front, back, top, bottom, left, right", "horizontal, vertical, perpendicular, horizontal", and "top, bottom", etc. is usually based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing this application and simplifying the description. Without contrary instructions, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the protection scope of this application; the orientation words "inside, outside" refer to the inside and outside relative to the contour of each component itself.

[0029] For the convenience of description, spatial relative terms such as "above...", "over...", "on the upper surface of...", "above" can be used here to describe the spatial positional relationship between a device or feature shown in the figure and other devices or features. It should be understood that the spatial relative terms are intended to include different orientations in use or operation in addition to the orientation described in the figure for the device. For example, if the device in the drawing is inverted, the device described as "above other devices or structures" or "over other devices or structures" will then be positioned as "below other devices or structures" or "under other devices or structures". Thus, the exemplary term "above..." can include both the orientations of "above..." and "below...". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and corresponding interpretations are made for the spatial relative descriptions used here.

[0030] In addition, it should be noted that using words such as "first", "second", etc. to limit components is only for the convenience of differentiating the corresponding components. Without additional statements, the above words have no special meaning. Therefore, it cannot be understood as a limitation on the protection scope of this application. In addition, although the terms used in this application are selected from well-known and commonly used terms, some of the terms mentioned in the specification of this application may be selected by the applicant according to his or her judgment, and their detailed meanings are described in the relevant parts of this description. In addition, it is required to understand this application not only through the actual terms used but also through the meaning implied by each term.

[0031] Hereinafter, embodiments of the present application will be described based on the accompanying drawings. However, the embodiments shown below are examples of a heat conduction enhancement device for spaceborne payloads for embodying the technical idea of the present application, and the heat conduction enhancement device for spaceborne payloads of the present application is not limited to the following content.

[0032] However, the dimensions, positional relationships, etc. of the components shown in the respective drawings are sometimes exaggerated for clarity of explanation. Furthermore, in the following description, for the same names and symbols, the same or homogeneous components are denoted, and their detailed descriptions are appropriately omitted. Furthermore, each element constituting the present application may be configured such that a plurality of elements are constituted by the same component, so that one component is used in place of a plurality of elements, and conversely, the functions of one component may be shared by a plurality of components. In addition, the content described in a part of the embodiments and implementation manners can also be applied to other embodiments, implementation manners, etc. In addition, in this specification, "upper" is not limited to the case where it is formed in contact with the upper surface, and also includes the case where it is formed separately above, and is also used in the sense that an intervening layer exists between layers.

[0033] The present application provides a heat conduction enhancement device for spaceborne payloads, which can be applied to the heat dissipation scenario of a single spaceborne payload unit with high power heat consumption.

[0034] Figure 1 It is a schematic diagram of the overall structure of a heat conduction enhancement device for spaceborne payloads according to an embodiment of the present application. Figure 2 It is a schematic diagram of the heat conduction enhancement device removing the payload unit function module in an embodiment of the present application. Refer to Figure 1 and Figure 2 As shown in, the heat conduction enhancement device 1000 for spaceborne payloads in this embodiment includes: a chassis 1010, a heat conduction enhancement plate 6, and a payload unit function module 1020. An accommodation cavity 1011 is provided inside the chassis 1010, and the heat conduction enhancement plate 6 and the payload unit function module 1020 are arranged in the accommodation cavity 1011; the heat conduction enhancement plate 6 includes opposite first surface 12 and second surface 13, and reinforcing ribs 11 protruding outward are arranged on the first surface 12, and the second surface 13 is connected to the payload unit function module 1020. The heat conduction enhancement plate 6 is used to conduct the heat generated by the payload unit function module 1020.

[0035] Exemplarily, the heat conduction enhancement plate 6 is equivalent to a heat pipe vapor chamber and can play a role in conducting heat. The reinforcing ribs 11 on the first surface 12 of the heat conduction enhancement plate 6 can improve the structural stiffness of the heat conduction enhancement plate 6 and increase the heat conduction capacity to a certain extent. The reinforcing ribs 11 can be set as a hollow or groove structure, so as to achieve the weight reduction effect of a single aerospace payload unit. The second surface 13 of the heat conduction enhancement plate 6 is equivalent to a heat conduction surface and is in direct or indirect contact with the payload single unit functional module 1020, thereby conducting the heat generated by the payload single unit functional module 1020. In practical applications, the second surface 13 can be processed so that its roughness accuracy is better than Ra1.6, where Ra represents the arithmetic mean roughness.

[0036] The technical solution of the present application effectively reduces the heat transfer thermal resistance and expands the heat conduction path by setting the heat conduction enhancement plate 6; by arranging the structural reinforcing ribs 11 on the heat conduction enhancement plate 6, the strength and stiffness of the heat conduction enhancement plate 6 can be improved, and the mechanical stability of the overall heat conduction enhancement device 1000 can be ensured; by arranging the heat conduction enhancement plate 6 and the payload single unit functional module 1020 in the accommodation cavity 1011 of the chassis 1010, it does not occupy additional space of the payload single unit, and a lightweight heat conduction material can be used to prepare the heat conduction enhancement plate 6. Therefore, under the conditions of limited space and total weight limitation, the heat conduction enhancement device 1000 can improve the heat conduction and heat dissipation effect of the aerospace payload single unit and reduce the overall weight of the aerospace payload single unit.

[0037] The heat conduction enhancement device 1000 of the present application is equivalent to a novel heat conduction enhancement structure applicable to an aerospace payload single unit, and solves the heat dissipation problem of a high-power heat consumption payload single unit under the orbital high-temperature thermal control boundary conditions. The manufacturing process of the heat conduction enhancement device 1000 is simple and the cost is low. It can be applicable to different payload single units and can meet the heat dissipation requirements of high heat consumption and high-power concentrated heat sources.

[0038] Continue to refer to Figure 1 and Figure 2 As shown, in some embodiments, the chassis 1010 includes a top cover 3, a bottom plate 2 and side plates 1, and the top cover 3, the bottom plate 2 and the side plates 1 together enclose an accommodation cavity 1011. Exemplarily, Figure 2 the accommodation cavity 1011 shown in [reference] includes a plurality of accommodation areas, and each accommodation area can be used to install the payload single unit functional module 1020 and the heat conduction enhancement plate 6. As Figure 1 shown, a plurality of payload single unit functional modules 1020 and a plurality of heat conduction enhancement plates 6 are installed in the chassis 1010. Threaded holes 10 are provided on the side plates 1, and the side plates 1 are connected to the bottom plate 2 and the top cover 3 by M4 countersunk head screws to form a payload single unit box body. The bottom plate 2 can be used as the main heat dissipation surface of the payload single unit and is in heat conduction contact with the spacecraft platform, and the outer surface of the top cover 3 can be used as another heat dissipation surface of the payload single unit.

[0039] Figure 3This is a schematic diagram of the installation of a heat conduction enhancement plate and a load single-machine function module in an embodiment of the present application. Refer to Figure 2 and Figure 3 As shown, in some embodiments, a first heat conduction slot 91 is provided on the inner surface of the top cover 3, and a second heat conduction slot 92 is provided on the inner surface of the bottom plate 2. The first heat conduction slot 91 and the second heat conduction slot 92 correspond one by one. The first end 61 (i.e., the top end) of the heat conduction enhancement plate 6 is connected to the first heat conduction slot 91, and the second end 62 (i.e., the bottom end) of the heat conduction enhancement plate 6 is connected to the second heat conduction slot 92.

[0040] Exemplarily, the load single-machine function module 1020 includes a module cold plate 4. The module cold plate 4 can be configured as an air cooler, a liquid cooler, or other forms of coolers, and the present application does not limit this. In the present application, the heat conduction enhancement plate 6 is assembled and inserted into the first heat conduction slot 91 and the second heat conduction slot 92 and abuts against the module cold plate 4. Positioning holes are provided at the top end and the bottom end of the heat conduction enhancement plate 6 for fixing to the chassis 1010 by screws. Such a setting increases the stability of the internal structure of the load single machine and can leave a higher safety margin for vibration and shock tests.

[0041] Refer to Figure 3 As shown, in some embodiments, a first positioning hole 81 is provided on the first end 61, and a second positioning hole 82 is provided on the second end 62. The first end 61 is connected to the first heat conduction slot 91 through the first positioning hole 81 and a screw, and the second end 62 is connected to the second heat conduction slot 92 through the second positioning hole 82 and a screw. Exemplarily, Figure 3 shows 3 first positioning holes 81 and 3 second positioning holes 82. The specifications of the positioning holes can be set as φ5 through holes, and the present application does not limit the number and specifications of the positioning holes.

[0042] Figure 4 This is a front view schematic diagram of the heat conduction enhancement plate in an embodiment of the present application. Refer to Figure 3 and Figure 4 As shown, in some embodiments, a first heat conduction plate 101 is provided on the first end 61, and a second heat conduction plate 102 is provided on the second end 62. The first heat conduction plate 101 is connected to the first heat conduction slot 91, and the second heat conduction plate 102 is connected to the second heat conduction slot 92. Exemplarily, the first heat conduction plate 101 and the second heat conduction plate 102 are equivalent to heat conduction surfaces. The heat conduction surfaces are in direct or indirect contact with the heat conduction slots, and the heat conduction surfaces can be processed to have a roughness accuracy better than Ra1.6. The cross-sectional area of the first heat conduction plate 101 is the same as the cross-sectional area of the first heat conduction slot 91, and the cross-sectional area of the second heat conduction plate 102 is the same as the cross-sectional area of the second heat conduction slot 92.

[0043] Exemplarily, during the process of installing the heat conduction enhancement plate 6 into the chassis 1010, heat-conducting silicone grease can be evenly coated on the first heat conduction plate 101 and the second heat conduction plate 102. The preferred thickness of the heat-conducting silicone grease is 0.1 mm to 0.3 mm. "mm" represents millimeter. The heat conduction enhancement plate 6 is fixed to the second heat conduction slot 92 of the bottom plate 2 and the first heat conduction slot 91 of the top cover 3 through M4 countersunk screws via φ5 positioning holes.

[0044] Reference Figure 3 As shown, in some embodiments, the payload single-machine function module 1020 includes a module cold plate 4, a circuit board 7, and a locking member 5. The module cold plate 4 is respectively connected to the circuit board 7 and the heat conduction enhancement plate 6. The module cold plate 4 is used to conduct the heat generated by the circuit board 7. The payload single-machine function module 1020 is connected to the inner surface of the chassis 1010 through the locking member 5. Exemplarily, the circuit board 7 can be set as a PCBA (Printed Circuit Board Assembly) circuit board, and the locking member 5 can be set as a locking strip. The locking member 5 plays a role in positioning and fixing the payload single-machine function module 1020. Locking members 5 can be respectively arranged at the top and bottom of each payload single-machine function module 1020, and the payload single-machine function module 1020 is installed and fixed to the chassis 1010 through the locking members 5.

[0045] Figure 5 is a schematic diagram of the back of the heat conduction enhancement plate in an embodiment of the present application. Exemplarily, reference Figure 3 and Figure 5 As shown, the second surface 13 of the heat conduction enhancement plate 6 can be used as a heat conduction surface and be in direct contact or indirect contact with the module cold plate 4. Direct contact means dry contact, and indirect contact means contact through a heat conduction pad. The direct contact or indirect contact method can be selected according to the heat dissipation requirements of different payload single-machines, and the present application does not make any restrictions. In the present application, the heat conduction enhancement plate 6 and the module cold plate 4 are set to be in close contact, and the two are connected through a high-precision smooth heat conduction surface. This structure shares the heat dissipation pressure of the module cold plate 4 and can conduct part of the heat from the top and bottom of the heat conduction enhancement plate 6 to the top cover 3 and the bottom plate 2 of the chassis 1010, thereby realizing enhanced heat transfer of high-power payload single-machines.

[0046] Reference Figure 3As shown, in some embodiments, the heat conduction enhancement device 1000 further includes a heat conduction pad (not shown), which is disposed between the second surface 13 and the load single - machine function module 1020. The second surface 13 is connected to the load single - machine function module 1020 through the heat conduction pad. Exemplarily, this setting method is equivalent to an indirect contact method. Exemplarily, such a setting can effectively fill the possible small gaps or uneven surfaces between the second surface 13 and the load single - machine function module 1020, thereby reducing the contact thermal resistance and improving the heat transfer efficiency. The heat conduction pad also has a certain buffering and shock - absorbing effect, which helps to protect the load single - machine function module 1020 from external impacts and vibrations, enhancing the stability and reliability of the entire heat conduction enhancement device 1000.

[0047] In some embodiments, a heat conduction boss (not shown) is provided on the module cold plate 4 facing the circuit board 7. The module cold plate 4 is connected to the circuit board 7 through the heat conduction boss. Exemplarily, such a setting can enhance the heat conduction efficiency between the module cold plate 4 and the circuit board 7. Using the heat conduction boss as a bridge for heat transfer increases the contact area between the module cold plate 4 and heat - generating components (such as chips, resistors, etc.), thereby reducing the contact thermal resistance.

[0048] Reference Figure 1 As shown, in some embodiments, heat pipes (not shown) are provided on the outer surface of the chassis 1010, and heat - conducting materials are coated on the heat pipes. Exemplarily, the outer surface of the top cover 3 can be used as another heat - dissipating surface of the load single - machine. Heat pipes, such as micro - channel heat pipes, loop heat pipes or phase - change material heat pipes, etc., are provided on the outer surface of the top cover 3, and thermal grease is coated on the heat pipes to achieve enhanced heat transfer.

[0049] Reference Figure 4 As shown, in some embodiments, the preparation material of the heat conduction enhancement plate 6 includes aluminum alloy and / or graphene. Exemplarily, the main structure of the heat conduction enhancement plate 6 can be selected as aluminum alloy, or a graphene heat - pipe plate or a micro - channel heat - pipe plate with higher heat conduction ability can be selected.

[0050] The following introduces the heat - dissipation path of the heat conduction enhancement device 1000 of the present application.

[0051] Reference Figure 3As shown, exemplarily, the heat generated by components such as chips is conducted to the module cold plate 4 of the payload single-machine function module 1020 via the PCBA circuit board 7 or via the heat-conducting boss. Subsequently, part of the heat is conducted to the top cover 3 of the chassis 1010 and the bottom plate 2 of the chassis 1010 through the heat-conducting surfaces at the top and bottom of the module cold plate 4 respectively. Another part of the heat is conducted to the heat-conducting enhancement plate 6 through direct or indirect contact between the outer surface of the module cold plate 4 and the second surface 13 of the heat-conducting enhancement plate 6. Finally, part of the heat is conducted to the top cover 3 of the chassis 1010 and the bottom plate 2 of the chassis 1010 through the heat-conducting surfaces (the first heat-conducting plate 101 and the second heat-conducting plate 102) at the top and bottom of the heat-conducting enhancement plate 6, thus realizing overall enhanced heat transfer. The heat transfer process of this application is the internal heat transfer of the payload single machine, and the magnitude of thermal radiation is very low, so it can be ignored.

[0052] The heat-conducting enhancement device 1000 of this application can produce the following technical effects:

[0053] (1) The heat-conducting enhancement plate 6 is in close contact with the module cold plate 4, and the two are connected through a high-precision smooth heat-conducting surface. This structure shares the heat dissipation pressure of the module cold plate 4, and conducts part of the heat from the top and bottom of the heat-conducting enhancement plate 6 to the top cover 3 and the bottom plate 2 of the chassis 1010, realizing enhanced heat transfer of the high-power payload single machine.

[0054] (2) The first surface 12 of the heat-conducting enhancement plate 6 is provided with reinforcing ribs 11. This design improves the structural stiffness and increases the heat-conducting ability to a certain extent, making an important contribution to the weight reduction design of the aerospace payload single machine.

[0055] (3) The heat-conducting enhancement plate 6 is assembled and inserted into the heat-conducting card slot and abuts against the module cold plate 4. The top and bottom of the heat-conducting enhancement plate 6 are provided with positioning holes to be fixed to the chassis 1010. Such a setting increases the stability of the internal structure of the payload single machine, and at the same time can leave a higher safety margin for vibration and shock tests.

[0056] Although some currently considered useful utility model embodiments are discussed through various examples in the above disclosure, it should be understood that such details only serve the purpose of illustration. The appended claims are not limited to the disclosed embodiments. On the contrary, the claims are intended to cover all modifications and equivalent combinations that conform to the essence and scope of the embodiments of this application. For example, although the system components described above can be implemented by hardware devices, they can also be implemented only through software solutions, such as installing the described system on existing servers or mobile devices.

[0057] Similarly, it should be noted that, in order to simplify the description disclosed in this application and thus help the understanding of one or more utility model embodiments, in the foregoing description of the embodiments of this application, sometimes multiple features are incorporated into one embodiment, drawing or description thereof. However, this disclosure method does not mean that the features required by the subject matter of this application are more than those mentioned in the claims. In fact, the features of the embodiments are less than all the features of the single embodiments disclosed above.

[0058] In some embodiments, numbers are used to describe components and the quantity of attributes. It should be understood that such numbers used for the description of embodiments are modified by the modifiers "about", "approximate" or "substantially" in some examples. Unless otherwise stated, "about", "approximate" or "substantially" indicate that the said numbers allow a variation of ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, and such approximate values may change according to the characteristics required by individual embodiments. In some embodiments, the numerical parameters should consider the specified significant digits and adopt the method of retaining the general number of digits. Although the numerical ranges and parameters used in some embodiments of this application to confirm the breadth of their scope are approximate values, in specific embodiments, such numerical settings are as precise as possible within the feasible range.

[0059] Although this application has been described with reference to the current specific embodiments, those of ordinary skill in the art in this technical field should recognize that the above embodiments are only used to illustrate this application, and various equivalent changes or substitutions can be made without departing from the spirit of this application. Therefore, as long as the changes and modifications to the above embodiments are within the scope of the spirit of this application, they will fall within the scope of the claims of this application.

Claims

1. A thermal conductivity enhancement device for a space payload, characterized in that, It includes a chassis, a heat conduction enhancement plate and a load single-unit function module. An accommodation cavity is provided inside the chassis, and the heat conduction enhancement plate and the load single-unit function module are arranged in the accommodation cavity; the heat conduction enhancement plate includes opposite first and second surfaces, reinforcing ribs protruding outward are arranged on the first surface, the second surface is connected to the load single-unit function module, and the heat conduction enhancement plate is used for conducting the heat generated by the load single-unit function module.

2. The heat conduction enhancement device according to claim 1, wherein The chassis includes a top cover, a bottom plate and side plates, and the top cover, the bottom plate and the side plates jointly enclose the accommodation cavity.

3. The heat conduction enhancement device according to claim 2, wherein A first heat conduction slot is provided on the inner surface of the top cover, a second heat conduction slot is provided on the inner surface of the bottom plate, the first heat conduction slot and the second heat conduction slot correspond one by one, the first end of the heat conduction enhancement plate is connected to the first heat conduction slot, and the second end of the heat conduction enhancement plate is connected to the second heat conduction slot.

4. The heat conduction enhancing device according to claim 3, characterized in that, A first positioning hole is provided on the first end, a second positioning hole is provided on the second end, the first end is connected to the first heat conduction slot through the first positioning hole and a screw, and the second end is connected to the second heat conduction slot through the second positioning hole and a screw.

5. The heat conduction enhancing device according to claim 3, characterized in that, A first heat conduction plate is provided on the first end, a second heat conduction plate is provided on the second end, the first heat conduction plate is connected to the first heat conduction slot, and the second heat conduction plate is connected to the second heat conduction slot.

6. The heat conduction enhancing device according to claim 1, wherein, The load single-unit function module includes a module cold plate, a circuit board and a locking member. The module cold plate is respectively connected to the circuit board and the heat conduction enhancement plate. The module cold plate is used for conducting the heat generated by the circuit board, and the load single-unit function module is connected to the inner surface of the chassis through the locking member.

7. The heat conduction enhancement device according to claim 6, wherein Heat conduction protrusions facing the circuit board are provided on the module cold plate, and the module cold plate is connected to the circuit board through the heat conduction protrusions.

8. The heat conduction enhancement device according to claim 1, wherein It further includes a heat conduction pad, which is arranged between the second surface and the load single-unit function module, and the second surface is connected to the load single-unit function module through the heat conduction pad.

9. The heat conduction enhancement device according to claim 1, wherein Heat pipes are provided on the outer surface of the chassis, and heat conduction materials are coated on the heat pipes.

10. The heat conduction enhancement device according to claim 1, wherein The preparation material of the heat conduction enhancement plate includes aluminum alloy and / or graphene.

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