Leveling alignment device

Abstract

The utility model discloses a leveling and aligning device, which belongs to the technical field of display panel production and comprises an upper-layer adjusting mechanism and a lower-layer adjusting mechanism. The lower-layer adjusting mechanism comprises a lower-layer adjusting plate, a sliding plate is placed on the lower-layer adjusting plate, a theta-axis displacement table is arranged on the sliding plate, and a first product is adsorbed to the side, facing the upper-layer adjusting plate, of the theta-axis displacement table. A second product is adsorbed on one side, facing the lower adsorption plate, of the upper adjusting plate; a leveling structure and an X-Y-theta axis adjusting mechanism are arranged between the lower-layer adjusting plate and the upper-layer adjusting plate; an upper product and a lower product can be leveled through the leveling structure, adjustment in the X-axis direction, the Y-axis direction and the theta-axis direction can be achieved through the X-axis adjusting structure, the Y-axis adjusting structure and the theta-axis adjusting structure, and therefore accurate alignment of the upper product and the lower product is achieved, the position is stable and reliable, and follow-up mass welding machining is facilitated.

Description

Technical Field

[0001] The utility model belongs to the technical field of display panel production, and particularly relates to a leveling and alignment device. Background Art

[0002] With the iteration of display technologies over the years, LED display has entered the era of "smaller pitch", such as below 0.3 mm, and "smaller LED crystals", such as Micro LED particles with a size of 20 microns.

[0003] In the production process of LED display panels, chips on a wafer need to be soldered onto a substrate through mass soldering technology. To obtain better soldering effects, after aligning the positions of the wafer and the substrate, a certain pressure needs to be applied, and then the chips on the wafer are soldered onto the substrate under the action of a laser, thus realizing the process route of mass soldering. Currently, automated equipment for mass soldering has not been mass-produced on the market, and basically all are in the research and development and manual proofing stages. Therefore, an up-and-down leveling and alignment device for mass soldering is particularly important. Summary of the Utility Model

[0004] In view of one or more of the above-mentioned defects or improvement requirements in the prior art, the utility model provides a leveling and alignment device to realize the leveling and alignment of upper and lower products.

[0005] To achieve the above object, the utility model provides a leveling and alignment device, which includes an upper adjustment mechanism and a lower adjustment mechanism;

[0006] The lower adjustment mechanism includes a lower adjustment plate, on which a sliding plate is placed. A θ-axis displacement stage is provided on the sliding plate, and a first product is adsorbed on one side of the θ-axis displacement stage facing the upper adjustment plate. The upper adjustment mechanism includes an upper adjustment plate, and a second product is adsorbed on one side of the upper adjustment plate facing the lower adsorption plate;

[0007] A leveling structure is provided between the lower adjustment plate and the upper adjustment plate, and the leveling structure can adjust the levelness of the upper adjustment plate relative to the lower adjustment plate;

[0008] An XYθ-axis adjustment mechanism is further provided between the lower adjustment plate and the upper adjustment plate; the XYθ-axis adjustment mechanism includes an X-axis adjustment structure, a Y-axis adjustment structure, and a θ-axis adjustment structure; the X-axis adjustment structure and the Y-axis adjustment structure are respectively a driving component and a compression spring component oppositely arranged on both sides of the sliding plate in the X-axis direction and the Y-axis direction; the θ-axis adjustment structure includes an adjustment knob provided on the side of the θ-axis displacement stage to realize its rotation.

[0009] As a further improvement of the present utility model, the driving assembly includes an adjusting knob and a knob mounting seat. The knob mounting seat is fixedly installed on the lower adjusting plate, and the adjusting knob penetrates through the knob mounting seat;

[0010] The compression spring assembly includes a compression spring fixing plate, a compression spring, and a compression spring cover plate; the compression spring fixing plate is fixedly installed on the lower adjusting plate, and the compression spring fixing plates and the knob mounting seats in the X-axis direction and the Y-axis direction are respectively located on opposite sides of the sliding plate; at least a part of the compression spring cover plate is located between the compression spring fixing plate and the sliding plate. One end of the compression spring is installed on the compression spring fixing plate, and the other end is connected to the compression spring cover plate located between the compression spring fixing plate and the sliding plate.

[0011] As a further improvement of the present utility model, a top block is provided between the knob mounting seat and the sliding plate, and the top block is movably placed on the lower adjusting plate.

[0012] As a further improvement of the present utility model, the adjusting knob has an adjusting rod, the adjusting rod penetrates through the knob mounting seat and is threadedly connected to the knob mounting seat, and the end of the adjusting rod away from the top block has a rotating part.

[0013] As a further improvement of the present utility model, the compression spring cover plate is L-shaped, its horizontal part covers above the compression spring, and the vertical part is located between the compression spring fixing plate and the sliding plate; one end of the compression spring is connected to the compression spring fixing plate, and the other end is connected to the vertical part of the compression spring cover plate.

[0014] As a further improvement of the present utility model, the adjusting knobs provided on the side of the θ-axis displacement stage include a coarse adjustment knob and a fine adjustment knob;

[0015] The coarse adjustment knob is the θ knob provided on the side of the θ-axis displacement stage; the fine adjustment knob includes an adapter plate and a θ adjusting knob. The adapter plate is connected to the side of the θ-axis displacement stage, and the θ adjusting knobs are respectively arranged on both sides of the adapter plate through mounting blocks, and the mounting blocks are fixed to the side of the sliding plate.

[0016] As a further improvement of the present utility model, the leveling structure includes a leveling seat and a leveling screw. The leveling seat is installed on the lower adjusting plate, a card slot is provided on the leveling seat, the leveling screw is threadedly connected to the upper adjusting plate, one end of the leveling screw passes through the upper adjusting plate and is clamped in the card slot, and a rotating part is provided at the other end of the leveling screw.

[0017] As a further improvement of the present utility model, a first magnet is provided on one side of the lower adjusting plate facing the upper adjusting plate, and a second magnet with the opposite magnetism to the first magnet is provided on the side of the upper adjusting plate facing the lower adjusting plate corresponding to the first magnet.

[0018] As a further improvement of the present utility model, the first magnet is arranged on a magnet mounting seat, and the magnet mounting seat is mounted on a corresponding leveling seat; a threaded hole is provided on the leveling seat, and a screw rod is provided at the bottom of the magnet mounting seat; and / or,

[0019] The magnet mounting seat is mounted on the lower adjusting plate.

[0020] As a further improvement of the present utility model, at least three groups of leveling structures are provided between the lower adjusting plate and the upper adjusting plate; and / or,

[0021] At least three groups of the first magnets on the lower adjusting plate and the second magnets on the upper adjusting plate are provided.

[0022] Generally speaking, compared with the prior art by the above technical solution conceived by the present utility model, the following beneficial effects are obtained:

[0023] (1) For the leveling and alignment device of the present utility model, the leveling structure can adjust the levelness of the upper adjusting plate relative to the lower adjusting plate, making the second product parallel to the first product. The X-axis adjusting structure, Y-axis adjusting structure and θ-axis adjusting structure can realize the adjustment of the first product in the X-axis direction, Y-axis direction and θ-axis direction, so that the first product and the second product are accurately aligned, and the position is stable and reliable, which is convenient for subsequent mass soldering processing.

[0024] (2) For the leveling and alignment device of the present utility model, through the magnets with opposite magnetic properties correspondingly arranged on the upper adjusting mechanism and the lower adjusting mechanism, a certain pressure can be applied to the upper and lower products after alignment is completed, improving the stability of subsequent soldering.

[0025] (3) For the leveling and alignment device of the present utility model, by adjusting the distance between the upper and lower magnets, the magnitude of the pressure between the first product and the second product can be flexibly adjusted to meet different process requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the overall structure of the leveling and alignment device according to an embodiment of the present utility model;

[0027] Figure 2 It is a schematic diagram of the structure of the lower adjusting mechanism involved in the leveling and alignment device according to an embodiment of the present utility model;

[0028] Figure 3 It is a schematic diagram of the structure of the upper adjusting mechanism involved in the leveling and alignment device according to an embodiment of the present utility model.

[0029] In all the drawings, the same reference numerals denote the same technical features, specifically: 1. Lower adjusting plate; 2. Upper adjusting plate; 3. Leveling base; 4. Magnet mounting base; 5. First magnet; 6. Card slot; 7. Sliding plate; 8. θ-axis displacement stage; 9. Lower adsorption plate; 10. First product; 11. Adjusting knob; 12. Knob mounting base; 13. Top block; 14. Compression spring fixing plate; 15. Compression spring; 16. Compression spring cover plate; 17. θ-knob; 18. Adapter plate; 19. θ-adjusting knob; 20. Adjusting rod; 21. Second magnet; 22. Second product. Detailed implementation mode

[0030] In order to make the objectives, technical solutions and advantages of the present utility model clearer, the present utility model will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model. In addition, the technical features involved in the various embodiments of the present utility model described below can be combined with each other as long as they do not conflict with each other.

[0031] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

[0032] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present utility model, "a plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0033] In the present utility model, unless otherwise clearly stipulated and defined, terms such as "installation", "connection", "linkage", "fixation", etc. shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral body; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0034] In the present utility model, unless otherwise clearly stipulated and defined, the first feature being "above" or "below" the second feature can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over", and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath", and "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0035] As a preferred embodiment of the present utility model, as Figures 1 to 3 shown, a leveling and alignment device is provided, which includes an upper layer adjustment mechanism and a lower layer adjustment mechanism. The lower layer adjustment mechanism includes a lower layer adjustment plate 1, and a first product 10 is adsorbed on one side of the lower layer adjustment plate 1 facing the upper layer adjustment plate 2. The upper layer adjustment mechanism includes an upper layer adjustment plate 2, and a second product 22 is adsorbed on one side of the upper layer adjustment plate 2 facing the lower adsorption plate 1. To achieve the upper and lower leveling and alignment of the first product and the second product, a leveling structure and an XYθ axis adjustment structure are provided between the lower layer adjustment plate 1 and the upper layer adjustment plate 2. Through the leveling structure, the levelness of the upper layer adjustment plate 2 relative to the lower layer adjustment plate 1 can be adjusted, so that the second product 22 is parallel to the first product 10, and through the XYθ axis adjustment structure, the precise alignment of the upper and lower two products can be further achieved.

[0036] In a preferred embodiment, the first product 10 is a substrate, and the second product 22 is a wafer.

[0037] As Figure 2 and 3 shown, specifically, a sliding plate 7 is placed in the middle of the lower layer adjustment plate 1, that is, the sliding plate 7 is not fixed; a θ axis displacement stage 8 is provided on the sliding plate 7, and a lower layer adsorption plate 9 for adsorbing the first product 10 is provided on the θ axis displacement stage 8. The upper layer adjustment plate 2 can be directly used as an upper layer adsorption plate to adsorb the second product 22, or of course, an upper layer adsorption plate can be additionally provided at the bottom of the upper layer adjustment plate 2 to adsorb the second product 22.

[0038] In a preferred embodiment, the XYθ axis adjustment structure is provided on the lower adjustment plate 1. The XYθ axis adjustment mechanism includes an X-axis adjustment structure, a Y-axis adjustment structure, and a θ-axis adjustment structure. The X-axis adjustment structure and the Y-axis adjustment structure respectively include a driving component and a compression spring component oppositely arranged on both sides of the sliding plate 7 in the X-axis direction and the Y-axis direction. Through the cooperation of the driving component and the compression spring component, the first product 10 on the sliding plate 7 is adjusted in the X-axis direction and the Y-axis direction to align it with the second product 22 on the upper adjustment plate 2.

[0039] The driving component includes an adjustment knob 11 and a knob mounting seat 12. The knob mounting seat 12 is fixedly installed on the lower adjustment plate 1, and the adjustment knob 11 penetrates through the knob mounting seat 12. The compression spring component includes a compression spring fixing plate 14, a compression spring 15, and a compression spring cover plate 16. The compression spring fixing plate 14 is fixedly installed on the lower adjustment plate 1, and the compression spring fixing plates 14 and the knob mounting seats 12 in the X-axis direction and the Y-axis direction are respectively located on opposite sides of the sliding plate 7. At least a part of the compression spring cover plate 16 is located between the compression spring fixing plate 14 and the sliding plate 7. One end of the compression spring 15 is installed on the compression spring fixing plate 14, and the other end is connected to the compression spring cover plate 16 located between the compression spring fixing plate and the sliding plate.

[0040] By rotating the adjustment knob 11, the sliding plate 7 can be pushed to move towards the compression spring component opposite to the adjustment knob 11, so that the compression spring cover plate 16 moves towards the compression spring fixing plate 14. At this time, the compression spring 15 is compressed. And by rotating the adjustment knob 11 in the opposite direction, the adjustment knob 11 can be made to move away from the sliding plate 7. At this time, the compression spring 15 gradually returns to its initial state, causing the sliding plate 7 to move in a direction away from the compression spring component.

[0041] Further preferably, a top block 13 is provided between the knob mounting seat 12 and the sliding plate 7, and the top block 13 is movably placed on the lower adjustment plate 1. By rotating the adjustment knob 11, one end of the adjustment knob 11 abuts against the top block 13 and pushes the top block 13 towards the sliding plate 7. When the top block 13 abuts against the sliding plate 7, continuing to rotate the adjustment knob 11 in the same direction can cause the sliding plate 7 to move towards the compression spring component opposite to the adjustment knob 11. Similarly, by rotating the adjustment knob 11 in the opposite direction, the adjustment knob 11 can be made to move away from the sliding plate 7. At this time, the compression spring 15 gradually returns to its initial state, causing the sliding plate 7 and the top block 13 to move in a direction away from the compression spring component.

[0042] The utility model increases the contact area with the sliding plate 7 by arranging a top block 13 between the knob mounting seat 12 and the sliding plate 7. On the one hand, it can avoid the skew of the adjustment in this direction position due to the too small contact area when the adjustment knob 11 directly contacts the sliding plate 7. On the other hand, it can play a guiding role in the position adjustment in another direction. Through the cooperation of the driving component and the compression spring component, when the sliding plate 7 is clamped by a group of driving components and compression spring components in one direction, it can play a guiding role in the position adjustment of the sliding plate 7 in another direction. For example, when adjusting in the X-axis direction, the setting of the top block 13 can make the sliding plate 7 not skew as much as possible in the X-axis direction, and when adjusting in the Y-axis direction, the sliding plate 7 is clamped between the top block 13 in the X-axis direction and the compression spring cover plate 16, playing a guiding role in the Y-axis direction adjustment.

[0043] More specifically, the adjustment knob 11 has an adjustment rod that passes through the knob mounting seat 12 and is threadedly connected to the knob mounting seat 12. The adjustment rod can be directly threadedly connected to the through hole on the knob mounting seat 12, or a nut can be separately provided on the side wall of the knob mounting seat 12 away from the top block 13. The adjustment rod is rotationally connected to the nut and passes through the knob mounting seat 12. The end of the adjustment rod away from the top block 13 has a rotating part. The end face of the adjustment rod near the end away from the top block 13 can be a spherical surface or a flat surface, which is not limited here. The compression spring cover plate 16 is L-shaped. Its horizontal part covers above the compression spring 15, and its vertical part is located between the compression spring fixing plate 14 and the sliding plate 7. One end of the compression spring 15 is connected to the compression spring fixing plate 14, and the other end is connected to the vertical part of the compression spring cover plate 16.

[0044] When adjusting in the X-axis direction or the Y-axis direction, rotate the rotating part to make the adjustment rod rotate, so that the adjustment rod gradually extends out of the rotating mounting seat 12 and presses against the top block 13. Continue to rotate the rotating part, and the adjustment rod drives the top block 13 to move forward, so that the sliding plate 7 in front of the top block 13 moves forward. During the movement, the other side of the sliding plate 7 will gradually press against the compression spring cover plate 16 and push the compression spring cover plate 16 forward, so that the compression spring 15 is compressed; when it is necessary to adjust in the opposite direction, rotate the rotating part in the opposite direction, so that the adjustment rod gradually retracts into the knob mounting seat 12. At this time, the compression spring 15 gradually returns to its initial state, so that the compression spring cover plate 16 gradually moves backward, pushing the sliding plate 7 and the top block 13 to gradually move backward.

[0045] In a preferred embodiment, the θ-axis adjustment structure includes a coarse adjustment knob and a fine adjustment knob provided on the side of the θ-axis displacement stage 8. Specifically, the coarse adjustment knob is the θ knob 17 provided on the side of the θ-axis displacement stage 8; the fine adjustment knob includes an adapter plate 18 and a θ adjustment knob 19. Among them, the adapter plate 18 is connected to the side of the θ-axis displacement stage 8, and the θ adjustment knobs 19 are respectively arranged on both sides of the adapter plate 18 through mounting blocks, and the mounting blocks are fixed to the side of the sliding plate 7. When adjusting in the θ-axis direction, first perform coarse adjustment by manually rotating the θ knob 17, and then perform fine adjustment by the θ adjustment knob 19. During fine adjustment, by rotating the θ adjustment knobs 19 on both sides of the adapter plate 18 to push the adapter plate, the θ-axis displacement stage 8 is rotated clockwise or counterclockwise in the θ-axis direction.

[0046] It should be noted that the present utility model does not specifically limit the shapes of the lower adjustment plate 1 and the upper adjustment plate 2.

[0047] In a preferred embodiment, the leveling structure includes a leveling seat 3 provided on the lower adjustment plate 1, and further includes a leveling screw 20 passing through the upper adjustment plate 2 and connected to the leveling seat 3. At least three groups of leveling structures are provided between the lower adjustment plate and the upper adjustment plate, that is, there are at least three leveling seats 3 on the lower adjustment plate 1, and the upper adjustment plate 2 is provided with a corresponding number of adjustment holes for the leveling screw 20 to pass through, and the positions of the adjustment holes and the leveling screw 20 are vertically corresponding to the leveling seat 3. By adjusting the leveling screw 20, the parallelism between the upper adjustment plate 2 and the lower adjustment plate 1 can be adjusted, so as to level the first product and the second product, and realize their relative parallelism.

[0048] More specifically, the leveling seat 3 is provided with a card slot 6. One end of the leveling screw 20 passes through the adjustment hole of the upper adjustment plate 2 and is clamped in the card slot 6. The other end of the leveling screw is provided with a rotating part. The leveling screw is threadedly connected to the upper adjustment plate 2. By rotating the rotating part, the leveling screw rotates, so that under the action of the thread, the upper adjustment plate 2 moves vertically to adjust the distance and parallelism between the first product on the upper adjustment plate 2 and the second product on the lower adjustment plate 1. In some embodiments, the leveling screw can be directly threadedly connected to the adjustment hole of the upper adjustment plate 2. In other embodiments, a nut can be additionally provided separately on the top of the upper adjustment plate 2, and the leveling screw is threadedly engaged with the nut to control the vertical movement of the nut and the upper adjustment plate 2 connected to the nut.

[0049] Further preferably, a first magnet 5 is provided on one side of the lower adjustment plate 1 facing the upper adjustment plate 2, and a second magnet 21 with the opposite magnetism to the first magnet 5 is provided on the side of the upper adjustment plate 2 facing the lower adjustment plate 1 corresponding to the first magnet 5. A certain clamping pressure is applied to the first product and the second product through the attraction between the upper and lower magnets, and after the leveling and alignment are completed, the stability of subsequent laser processing is further improved.

[0050] More preferably, the first magnet 5 is provided on the magnet mounting seat 4, and the magnet mounting seat 4 is mounted on the corresponding leveling seat 3, or the magnet mounting seat 4 is separately mounted on the lower adjusting plate 1. More preferably, at least three groups of the first magnets 5 on the lower adjusting plate 1 and the second magnets 21 on the upper adjusting plate 2 are provided, that is, there are at least three positions where the first magnets 5 on the lower adjusting plate 1 are provided. Correspondingly, the bottom of the upper adjusting plate 2 is provided with the same number of second magnets 21, and the setting positions of the second magnets 21 correspond to those of the first magnets 5. At the same time, the polarities of the first magnets 5 and the second magnets 21 are opposite, so as to apply a certain pressure to the first product and the second product.

[0051] More preferably, the leveling seat 3 is provided with threaded holes, and the bottom of the magnet mounting seat 4 is provided with screw rods. By rotating the magnet mounting seat 4, its lifting can be realized, and the magnet 5 mounted on the magnet mounting seat 4 can be driven to move vertically, so as to adjust the relative distance between the first magnet 5 and the second magnet 21, and further realize the adjustment of the clamping pressure of the first product and the second product.

[0052] For the leveling and alignment device of the embodiment of the present utility model, the leveling and alignment process is as follows:

[0053] Place the first product 10 (substrate) on the lower adsorption plate 9 and turn on the adsorption; place the second product 22 (wafer) on the upper adjusting plate 2 and turn on the adsorption;

[0054] Adjust the adjusting rods 20 on the upper adjusting plate 2 to make the second product 22 (wafer) infinitely close to the first product 10 (substrate), and level the two through the three adjusting rods 20. At this time, the second product 22 (wafer) and the first product 10 (substrate) have not come into contact yet;

[0055] Place the whole leveling and alignment device under the microscope, observe whether the corresponding positions of the first product 10 (substrate) and the second product 22 (wafer) are aligned, and respectively adjust in the X-axis, Y-axis and θ-axis directions through the X-axis adjusting structure, Y-axis adjusting structure and θ-axis adjusting structure to align the positions of the first product 10 (substrate) and the second product 22 (wafer);

[0056] After the positions of the first product 10 (substrate) and the second product 22 (wafer) are aligned, adjust the adjusting rods 20 on the upper adjusting plate 2 again to make the second product 22 (wafer) fit with the first product 10 (substrate), and level the two through the three adjusting rods 20; at the same time, observe under the microscope whether the relative positions of the second product 22 (wafer) and the first product 10 (substrate) have shifted;

[0057] After the first product 10 (substrate) and the second product 22 (wafer) are aligned and fitted well, adjust the magnet mounting seat 4 on the lower adjusting plate 1, so as to adjust the distance between the first magnet 5 and the second magnet 21, and apply a certain pressure to the first product 10 (substrate) and the second product 22 (wafer).

[0058] After the above operations are completed, the aligned products together with the leveling and alignment device can be placed on the laser equipment for the subsequent mass soldering process, and the chips on the wafer are soldered to the substrate under the action of the laser.

[0059] Those skilled in the art can easily understand that the above are only the preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A leveling and alignment device, characterized in that, It includes an upper layer adjustment mechanism and a lower layer adjustment mechanism; The lower layer adjustment mechanism includes a lower layer adjustment plate. A sliding plate is placed on the lower layer adjustment plate. A θ-axis displacement stage is provided on the sliding plate. A first product is adsorbed on one side of the θ-axis displacement stage facing the upper layer adjustment plate. The upper layer adjustment mechanism includes an upper layer adjustment plate. A second product is adsorbed on one side of the upper layer adjustment plate facing the lower layer adsorption plate; A leveling structure is provided between the lower layer adjustment plate and the upper layer adjustment plate. The leveling structure can adjust the levelness of the upper layer adjustment plate relative to the lower layer adjustment plate; An XYθ-axis adjustment mechanism is also provided between the lower layer adjustment plate and the upper layer adjustment plate; The XYθ-axis adjustment mechanism includes an X-axis adjustment structure, a Y-axis adjustment structure, and a θ-axis adjustment structure; The X-axis adjustment structure and the Y-axis adjustment structure are respectively a driving component and a compression spring component oppositely arranged on both sides of the sliding plate in the X-axis direction and the Y-axis direction; The θ-axis adjustment structure includes an adjustment knob provided on the side of the θ-axis displacement stage to realize its rotation.

2. The leveling and alignment device according to claim 1, wherein The driving component includes an adjustment knob and a knob mounting seat. The knob mounting seat is fixedly installed on the lower layer adjustment plate. The adjustment knob penetrates through the knob mounting seat; The compression spring component includes a compression spring fixing plate, a compression spring, and a compression spring cover plate; The compression spring fixing plate is fixedly installed on the lower layer adjustment plate. The compression spring fixing plates and the knob mounting seats in the X-axis direction and the Y-axis direction are respectively located on opposite sides of the sliding plate; At least a part of the compression spring cover plate is located between the compression spring fixing plate and the sliding plate. One end of the compression spring is installed on the compression spring fixing plate, and the other end is connected to the compression spring cover plate located between the compression spring fixing plate and the sliding plate.

3. The leveling and alignment device according to claim 2, characterized in that, A top block is provided between the knob mounting seat and the sliding plate. The top block is movably placed on the lower layer adjustment plate.

4. The leveling and alignment device according to claim 2, wherein The adjustment knob has an adjustment rod. The adjustment rod penetrates through the knob mounting seat and is threadedly connected to the knob mounting seat. The end of the adjustment rod away from the top block has a rotating part.

5. The leveling and alignment device according to claim 2, wherein The compression spring cover plate is L-shaped. Its horizontal part covers the compression spring. Its vertical part is located between the compression spring fixing plate and the sliding plate; One end of the compression spring is connected to the compression spring fixing plate, and the other end is connected to the vertical part of the compression spring cover plate.

6. The leveling and alignment device according to any one of claims 1-5, characterized in that, The adjustment knobs provided on the side of the θ-axis displacement stage include a coarse adjustment knob and a fine adjustment knob; The coarse adjustment knob is a θ knob provided on the side of the θ-axis displacement stage; The fine adjustment knob includes an adapter plate and a θ adjustment knob. The adapter plate is connected to the side of the θ-axis displacement stage. The θ adjustment knobs are respectively arranged on both sides of the adapter plate through mounting blocks. The mounting blocks are fixed to the side of the sliding plate.

7. The leveling and alignment device according to any one of claims 1-5, characterized in that The leveling structure includes a leveling seat and a leveling screw. The leveling seat is installed on the lower layer adjustment plate. A card slot is provided on the leveling seat. The leveling screw is threadedly connected to the upper layer adjustment plate. One end of the leveling screw passes through the upper layer adjustment plate and is clamped in the card slot. A rotating part is provided at the other end of the leveling screw.

8. The leveling and alignment device according to any one of claims 1-5, characterized in that, A first magnet is provided on one side of the lower layer adjustment plate facing the upper layer adjustment plate. A second magnet with a magnetic property opposite to that of the first magnet is provided on one side of the upper layer adjustment plate facing the lower layer adjustment plate corresponding to the first magnet.

9. The leveling and alignment device according to claim 8, wherein, The first magnet is disposed on a magnet mounting base, and the magnet mounting base is mounted on a corresponding leveling base; threaded holes are provided on the leveling base, and a screw rod is provided at the bottom of the magnet mounting base; and / or, The magnet mounting base is mounted on the lower adjusting plate.

10. The leveling and alignment device according to claim 8, characterized in that, At least three groups of leveling structures are provided between the lower adjusting plate and the upper adjusting plate; and / or, At least three groups of the first magnets on the lower adjusting plate and the second magnets on the upper adjusting plate are provided.

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