Integrally-formed brazing tool for microelectronic packaging shell

Abstract

The utility model discloses a microelectronic packaging shell integral forming brazing tool which comprises a brazing bottom plate, a lead frame pressing plate and a replaceable frame pressing cover, a tube shell body positioning groove is formed in the brazing bottom plate, the tube shell body positioning groove comprises a lead frame positioning groove, a sinking groove is formed in the lead frame positioning groove, and the replaceable frame pressing cover is arranged in the sinking groove. The sinking groove forms a ceramic substrate positioning groove; the bottom face of the lead frame pressing plate extends downwards to form a pressing plate boss, and the lead frame pressing plate is further provided with a hole fixing through hole used for limiting the kovar frame. And the bottom surface of the replaceable frame gland extends downwards to form a gland boss. According to the brazing tool for integrally forming the microelectronic packaging shell, after the brazing bottom plate and the lead frame pressing plate which are determined in position are respectively positioned, the welding positions of the tube shell main body and the kovar frame are more accurate, the stability is better, and the condition of displacement does not exist in the carrying and moving process.

Description

Technical Field

[0001] The utility model relates to the technical field of microelectronic packaging equipment, in particular to a brazing tooling for integrally forming a microelectronic packaging shell. Background Art

[0002] With the development of electronic products towards miniaturization, integration, multi-function, high frequency and high reliability, etc., the closely related electronic packaging technology has also been driven to develop. The materials used in the mainstream packaging on the market at present are nothing but metal, ceramic and plastic. Among them, ceramic packaging occupies a certain market with excellent reliability. Taking high-temperature co-fired ceramic as an example, it is to directly print electronic paste on the alumina ceramic green body, and after lamination and debinding, it is sintered into one body at a high temperature of about 1600 °C to form a ceramic substrate. The ceramic substrate is extremely stable in terms of electrical, thermal and mechanical properties, and in addition, it has advantages such as good corrosion resistance, high mechanical strength, small thermal expansion coefficient and high thermal conductivity. After the ceramic substrate is fixed to the lead frame, it is brazed and welded with other kovar metal fittings, and then a relatively reliable packaging shell product can be made.

[0003] The process of brazing the kovar metal fittings and the ceramic substrate not only requires a high temperature above 800 °C and a hydrogen atmosphere, but also needs to ensure the stability of the welded parts during the dynamic process in the furnace. The position deviation between the kovar metal fittings and the lead frame will directly affect the welding result. When brazing the existing kovar metal fittings and the ceramic substrate, usually the kovar metal fittings and the ceramic substrate are manually positioned first, and then the positioned kovar metal fittings and the ceramic substrate are placed in the furnace for brazing. For the existing positioning method, on the one hand, it is time-consuming and laborious for workers to position, with low efficiency, not suitable for large-scale production, and the accuracy of manual positioning is poor; on the other hand, during the process of placing the positioned kovar metal fittings and the lead frame in the furnace and during the brazing process in the furnace, the kovar metal fittings and the ceramic substrate lack limit, and there is a situation of displacement, and its stability is also poor. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a brazing tooling for integrally forming a microelectronic packaging shell.

[0005] The technical solution for realizing the purpose of the utility model is: a brazing tooling for integrally forming a microelectronic packaging shell, which is used to position the shell during the brazing process. The shell includes a shell body and a kovar frame. The shell body includes a ceramic substrate and a lead frame. The lead frame is fixed to the ceramic substrate and extends out from the side of the ceramic substrate;

[0006] The integrated brazing tooling for the microelectronic packaging housing includes a brazing bottom plate, a lead frame pressing plate, and a replaceable frame pressing cover. A housing body positioning groove is formed on the brazing bottom plate. The housing body positioning groove includes a lead frame positioning groove for limiting the lead frame. A sinking groove is formed in the lead frame positioning groove, and the sinking groove forms a ceramic substrate positioning groove for limiting the ceramic substrate. A pressing plate boss extends downward from the bottom surface of the lead frame pressing plate. The pressing plate bosses correspond to the lead frame positioning grooves of the housing body positioning groove one by one. The pressing plate bosses extend into the corresponding lead frame positioning grooves and are buckled with the lead frame positioning grooves. A positioning hole through hole for limiting the kovar frame is also formed on the lead frame pressing plate. A pressing cover boss extends downward from the bottom surface of the replaceable frame pressing cover. The pressing cover bosses correspond to the positioning hole through holes one by one. The pressing cover bosses extend into the corresponding positioning hole through holes and are buckled with the positioning hole through holes.

[0007] Further, the depth of the ceramic substrate positioning groove is H1, the distance between the lead frame and the bottom surface of the ceramic substrate is H2, and the relationship between H1 and H2 satisfies H1≥H2. Preferably, the relationship between H1 and H2 satisfies H1 = H2. In this setting, the ceramic substrate under the lead frame can be completely placed in the ceramic substrate positioning groove, and the lead frame can be attached to the bottom of the lead frame positioning groove. Compared with the structure where the lead frame is higher than the bottom of the lead frame positioning groove, when the lead frame is attached to the bottom of the lead frame positioning groove and limited by the bottom of the lead frame positioning groove, the structure of the lead frame can be more stable during high-temperature brazing.

[0008] Further, the depth of the lead frame positioning groove is H3, the thickness of the lead frame is H4, and the thickness of the pressing plate boss is H5. The relationship between H3, H4, and H5 satisfies H5≥(H3 - H4). In this setting, the bottom surface of the pressing plate boss can press the lead frame. In addition to the horizontal limitation of the lead frame positioning groove, the pressing of the pressing plate boss can also perform vertical limitation on the lead frame. The accuracy and stability of the lead frame positioning during brazing are both higher, and the pressing of the pressing plate boss can also increase the brazing firmness.

[0009] Further, the depth of the positioning hole through hole is H6, the thickness of the kovar frame is H7, and the relationship between H6 and H7 satisfies H6 > H7. This setting is for the positioning hole through hole to have the condition of limiting the kovar frame and the pressing cover boss when the pressing plate boss directly pulls and contacts the lead frame for pressing.

[0010] Further, the thickness of the gland boss is H8, and the distance from the upper surface of the ceramic substrate to the top of the fixed hole through-hole is H9. The relationship among H7, H8, and H9 satisfies H8 ≥ (H9 - H7). Under this setting, the bottom surface of the gland boss can press against the kovar frame. In addition to the horizontal limitation of the fixed hole through-hole, the pressing of the gland boss can also perform vertical limitation on the kovar frame. During brazing, the accuracy and stability of the positioning of the kovar frame are higher, and the pressing of the gland boss can also increase the brazing firmness.

[0011] Further, a first relief groove is provided on the edge of the lead frame positioning groove. The provision of the first relief groove facilitates the smooth placement of the lead frame into the lead frame positioning groove, preventing the lead frame from being unable to be smoothly placed into the lead frame positioning groove due to the influence of burrs on the edge of the lead frame.

[0012] Further, a second relief groove is provided at the corner of the ceramic substrate positioning groove. The provision of the second relief groove facilitates the smooth placement of the ceramic substrate into the ceramic substrate positioning groove, preventing the ceramic substrate from being unable to be smoothly placed into the ceramic substrate positioning groove due to the influence of burrs on the edge of the ceramic substrate.

[0013] Further, a third relief groove is provided at the corner of the fixed hole through-hole. The provision of the third relief groove facilitates the smooth placement of the kovar frame gland into the fixed hole through-hole, preventing the kovar frame gland from being unable to be smoothly placed into the fixed hole through-hole due to the influence of burrs on the corner of the kovar frame gland.

[0014] Further, a fourth relief groove is provided on the edge of the fixed hole through-hole. The provision of the third relief groove facilitates the smooth placement of the kovar frame gland into the fixed hole through-hole, preventing the kovar frame gland from being unable to be smoothly placed into the fixed hole through-hole due to the influence of burrs on the edge of the kovar frame gland.

[0015] Further, a foolproof identification hole is also provided in the lead frame positioning groove. The two sides of the lead frame are usually not completely identical. The provision of the foolproof identification hole serves as a mark to prevent the misalignment of the lead frame placed in the lead frame.

[0016] Further, chamfers are provided on both the pressing plate boss and the gland boss. The provision of the chamfers facilitates the insertion for buckling.

[0017] Further, the number of the shell body positioning grooves is several. After several shell body positioning grooves are located on the same brazing bottom plate, the working efficiency is higher when the lead frame pressing plate and the kovar frame gland are buckled for brazing.

[0018] Furthermore, a demolding through hole is opened downward in the ceramic substrate positioning groove. The integrated molding brazing tooling for the microelectronic packaging housing further includes a disassembly base. A top column is provided on the disassembly base, and the top columns correspond to the demolding through holes one by one. The height of the top column is H10, and the depth of the demolding through hole is H11. The relationship between H10 and H11 satisfies H10 > H11. After brazing is completed, the replaceable frame pressing cover and the lead frame pressing plate are removed in sequence. Then, the soldered shell is taken out from the shell body positioning groove. When taking out the soldered shell from the shell body positioning groove, the top column is inserted into the demolding through hole to jack up the shell, facilitating the demolding of the shell.

[0019] For the integrated molding brazing tooling of the microelectronic packaging housing of the present utility model, by providing the shell body positioning groove including the lead frame positioning groove and the ceramic substrate positioning groove on the brazing bottom plate, after the shell body of the shell is placed in the shell body positioning groove on the brazing bottom plate, the ceramic substrate positioning groove and the lead frame positioning groove can respectively position the ceramic substrate and the lead frame one by one. At the same time, by providing the pressing plate boss on the lead frame pressing plate, so that the pressing plate boss extends into the corresponding lead frame positioning groove and is buckled with the lead frame positioning groove, after positioning can be achieved, the positioning through hole is provided on the lead frame pressing plate. After the kovar frame is placed in the positioning through hole, the lead frame pressing plate can position the kovar frame. After being respectively positioned by the brazing bottom plate and the lead frame pressing plate with determined positions, the welding positions of the shell body and the kovar frame are more accurate. Compared with manual positioning, the positioning of the present utility model has better stability, and there is no displacement during the handling and moving process, and the final welding quality is also more stable and better.

[0020] For the integrated molding brazing tooling of the microelectronic packaging housing of the present utility model, when the brazing bottom plate and the lead frame pressing plate respectively position the shell body and the kovar frame to be welded in the shell, the lead frame positioning groove is not only used to limit the lead frame, but also used to be buckled with the pressing plate boss to position the lead frame pressing plate. Compared with two grooves that simultaneously limit the lead frame and the lead frame pressing plate, the lead frame positioning groove can make the structure setting simpler.

[0021] The brazing tooling for integrally forming the microelectronic packaging housing of the present utility model, in addition to the brazing bottom plate and the lead frame pressing plate that respectively position the shell body and the kovar frame, also sets the kovar frame pressing cover. After the kovar frame pressing cover and the lead frame pressing plate are buckled, the kovar frame in the fixed hole through hole can be restricted, preventing the kovar frame from falling out of the fixed hole through hole during the handling and moving process. While facilitating the handling and moving, it can also prevent foreign objects from falling into the fixed hole through hole during the welding process, greatly ensuring the welding quality.

[0022] The brazing tooling for integrally forming the microelectronic packaging housing of the present utility model, the pressing plate boss extends into the lead frame positioning groove. While buckling and limiting with the lead frame positioning groove, the pressing plate boss extending into the lead frame positioning groove can also press the lead frame in the lead frame positioning groove to perform vertical limiting on the lead frame. Similarly, the pressing cover boss extends into the fixed hole through hole. While buckling and limiting with the fixed hole through hole, the pressing cover boss extending into the fixed hole through hole can also press the kovar frame in the fixed hole through hole to perform vertical limiting. The position stability of the lead frame and the kovar frame with vertical limiting is better. In particular, after being subjected to the pressing force of the pressing cover boss, the brazing firmness of the kovar frame is also higher. Description of the Drawings

[0023] Figure 1 It is a schematic structural diagram of the shell during the brazing process of the brazing tooling for integrally forming the microelectronic packaging housing of the present utility model;

[0024] Figure 2 It is a schematic structural diagram of the brazing tooling for integrally forming the microelectronic packaging housing of the present utility model;

[0025] Figure 3 It is a three-dimensional structural schematic diagram of the brazing bottom plate of the brazing tooling for integrally forming the microelectronic packaging housing of the present utility model;

[0026] Figure 4 is Figure 3 A sectional structural schematic diagram along line A - A;

[0027] Figure 5 It is a bottom view structural schematic diagram of the lead frame pressing plate of the brazing tooling for integrally forming the microelectronic packaging housing of the present utility model;

[0028] Figure 6 is Figure 5 A sectional structural schematic diagram along line B - B;

[0029] Figure 7 It is a three-dimensional structural schematic diagram of the kovar frame pressing cover of the brazing tooling for integrally forming the microelectronic packaging housing of the present utility model;

[0030] Figure 8 The front view structural schematic diagram of the replaceable frame pressing cover of the integral molding brazing tooling for the microelectronic packaging housing of the present utility model;

[0031] Figure 9 The front view structural schematic diagram of the disassembly base of the integral molding brazing tooling for the microelectronic packaging housing of the present utility model;

[0032] Figure 10 The sectional view structural schematic diagram along the A-A line during brazing of the integral molding brazing tooling for the microelectronic packaging housing of the present utility model; Figure 3 in the middle;

[0033] Figure 11 is Figure 10 partial structural schematic diagram;

[0034] Figure 12 The structural schematic diagram of the integral molding brazing tooling for the microelectronic packaging housing of the present utility model after brazing and disassembling the lead frame pressing plate and the replaceable frame pressing cover;

[0035] Figure 13 The sectional view structural schematic diagram of the integral molding brazing tooling for the microelectronic packaging housing of the present utility model after brazing, inserting the disassembly base into the brazing bottom plate and ejecting the package shell; Specific embodiments

[0036] The following describes in detail the preferred embodiments of the integral molding brazing tooling for the microelectronic packaging housing of the present utility model with reference to the accompanying drawings.

[0037] As Figures 1 to 13 shown, an integral molding brazing tooling for a microelectronic packaging housing is used to position the package shell 100 during the brazing process. The package shell 100 includes a package shell body 101 and a kovar frame 102. The package shell body 101 includes a ceramic substrate 1011 and a lead frame 1012. The lead frame 1012 is fixed to the ceramic substrate 1011 and extends from the side of the ceramic substrate 1011;

[0038] The one-piece formed soldering tooling for the microelectronic packaging housing includes a soldering bottom plate 1, a lead frame pressing plate 2, and a replaceable frame pressing cover 3. A shell body positioning groove 11 is formed on the soldering bottom plate 1. The shell body positioning groove 11 includes a lead frame positioning groove 111 for limiting the lead frame 1012. A sinking groove is formed in the lead frame positioning groove 111, and the sinking groove forms a ceramic substrate positioning groove 112 for limiting the ceramic substrate 1011. A pressing plate boss 21 extends downward from the bottom surface of the lead frame pressing plate 2. The pressing plate boss 21 corresponds to the lead frame positioning groove 111 of the shell body positioning groove 11 one by one. The pressing plate boss 21 extends into the corresponding lead frame positioning groove 111 and is buckled with the lead frame positioning groove 111. A fixing hole through hole 22 for limiting the kovar frame 102 is also formed on the lead frame pressing plate 2. A pressing cover boss 31 extends downward from the bottom surface of the replaceable frame pressing cover 3. The pressing cover boss 31 corresponds to the fixing hole through hole 22 one by one. The pressing cover boss 31 extends into the corresponding fixing hole through hole 22 and is buckled with the fixing hole through hole 22.

[0039] For the one-piece formed soldering tooling of the microelectronic packaging housing of the present utility model, the shell body positioning groove 11 on the soldering bottom plate 1 is used to limit the shell body 101. Among them, the width dimension of the lead frame positioning groove 111 is consistent with the width dimension of the lead frame 1012 for limiting the lead frame 1012. The width dimension of the ceramic substrate positioning groove 112 is consistent with the width dimension of the ceramic substrate 1011 for limiting the ceramic substrate 1011. A pressing plate boss 21 extends downward from the bottom surface of the lead frame pressing plate 2. The width dimension of the pressing plate boss 21 is consistent with the width dimension of the lead frame positioning groove 111. After the pressing plate boss 21 extends into the lead frame positioning groove 111, under the limiting relationship between the pressing plate boss 21 and the lead frame positioning groove 111, the lead frame pressing plate 2 and the soldering bottom plate 1 are positioned and buckled. The width dimension of the fixing hole through hole 22 on the lead frame pressing plate 2 is consistent with the width dimension of the kovar frame 102 for limiting the kovar frame 102. A pressing cover boss 31 extends downward from the bottom surface of the replaceable frame pressing cover 3. The width dimension of the pressing cover boss 31 is consistent with the width dimension of the fixing hole through hole 22. After the pressing cover boss 31 extends into the fixing hole through hole 22, under the limiting relationship between the pressing cover boss 31 and the fixing hole through hole 22, the replaceable frame pressing cover 3 and the lead frame pressing plate 2 are positioned and buckled. The positioned replaceable frame pressing cover 3 is used to prevent the kovar frame 102 from falling out of the fixing hole through hole 22 during the handling and moving process.

[0040] The brazing tooling for integrally forming the microelectronic packaging housing of the present utility model, during operation, places the housing body 101 of the housing 100 in the housing body positioning groove 11 on the brazing base plate 1. Among them, the ceramic substrate 1011 is located in the ceramic substrate positioning groove 112, and the lead frame 1012 is located in the lead frame positioning groove 111; then, the press plate boss 21 extends into the lead frame positioning groove 111 to fasten the lead frame press plate 2 and the brazing base plate 1, and the kovar frame 102 is placed in the fixed hole through hole 22; afterwards, the press cover boss 31 extends into the fixed hole through hole 22 to fasten the kovar frame press cover 3 and the lead frame press plate 2, completing the positioning of the housing 100. After the housing 100 is positioned, the brazing base plate 1 is placed in a furnace for brazing. After brazing, the kovar frame press cover 3 and the lead frame press plate 2 are successively removed, and the brazed housing 100 can be taken out from the housing body positioning groove 11 on the brazing base plate 1.

[0041] The brazing tooling for integrally forming the microelectronic packaging housing of the present utility model, by arranging the housing body positioning groove 11 including the lead frame positioning groove 111 and the ceramic substrate positioning groove 112 on the brazing base plate 1, after the housing body 101 of the housing 100 is placed in the housing body positioning groove 11 on the brazing base plate 1, the ceramic substrate positioning groove 112 and the lead frame positioning groove 111 can respectively position the ceramic substrate 1011 and the lead frame 1012 in a one-to-one correspondence. At the same time, by arranging the press plate boss 21 on the lead frame press plate 2, the press plate boss 21 extends into the corresponding lead frame positioning groove 111 and is fastened to the lead frame positioning groove 111. In the case of achieving positioning, the fixed hole through hole 22 is arranged on the lead frame press plate 2, and after the kovar frame 102 is placed in the fixed hole through hole 22, the lead frame press plate 2 can achieve positioning of the kovar frame 102. After the brazing base plate 1 and the lead frame press plate 2 with determined positions are respectively positioned, the welding positions of the housing body 101 and the kovar frame 102 are more accurate. Compared with manual positioning, the positioning of the present utility model has better stability, there is no displacement during the handling and moving process, and the final welding quality is also more stable and better.

[0042] The brazing tooling for integrally forming the microelectronic packaging housing of the present utility model, when positioning the housing body 101 and the kovar frame 102 to be welded in the housing 100 through the brazing bottom plate 1 and the lead frame pressing plate 2 respectively, the lead frame positioning groove 111 is not only used for limiting the lead frame 1012, but also used for engaging with the pressing plate boss 21 to position the lead frame pressing plate 2. Compared with two grooves, the lead frame positioning groove 111 that limits the lead frame 1012 and the lead frame pressing plate 2 simultaneously can make the structure setting simpler.

[0043] The brazing tooling for integrally forming the microelectronic packaging housing of the present utility model, in addition to the brazing bottom plate 1 and the lead frame pressing plate 2 that respectively position the housing body 101 and the kovar frame 102, also sets the kovar frame pressing cover 3. After the kovar frame pressing cover 3 and the lead frame pressing plate 2 are engaged, the kovar frame 102 in the positioning through hole 22 can be restricted, preventing the kovar frame 102 from falling out of the positioning through hole 22 during the handling and moving process. While facilitating the handling and moving, it can also prevent foreign objects from falling into the positioning through hole 22 during the welding process, greatly ensuring the welding quality.

[0044] The brazing tooling for integrally forming the microelectronic packaging housing of the present utility model, when the pressing plate boss 21 extends into the lead frame positioning groove 111 and engages and limits with the lead frame positioning groove 111, the pressing plate boss 21 extending into the lead frame positioning groove 111 can also press the lead frame 1012 in the lead frame positioning groove 111 to perform vertical limiting on the lead frame 1012. Similarly, the pressing cover boss 31 extends into the positioning through hole 22. When engaging and limiting with the positioning through hole 22, the pressing cover boss 31 extending into the positioning through hole 22 can also press the kovar frame 102 in the positioning through hole 22 to perform vertical limiting. The position stability of the lead frame 1012 and the kovar frame 102 with vertical limiting is better. In particular, after being subjected to the pressing force of the pressing cover boss 31, the brazing firmness of the kovar frame 102 is also higher.

[0045] The brazing tooling for integrally forming the microelectronic packaging housing of the present utility model. Preferably, the depth of the ceramic substrate positioning groove 112 is H1, the distance between the lead frame 1012 and the bottom surface of the ceramic substrate 1011 is H2, and the relationship between H1 and H2 satisfies H1≥H2. Preferably, the relationship between H1 and H2 satisfies H1 = H2. Under this setting, the ceramic substrate 1011 below the lead frame 1012 can be completely placed in the ceramic substrate positioning groove 112, and the lead frame 1012 can be attached to the bottom of the lead frame positioning groove 111. Compared with the structure where the lead frame 1012 is higher than the bottom of the lead frame positioning groove 111, when the lead frame 1012 is attached to the bottom of the lead frame positioning groove 111 and limited by the bottom of the lead frame positioning groove 111, the structure of the lead frame 1012 can be more stable during high-temperature brazing.

[0046] The brazing tooling for integrally forming the microelectronic packaging housing of the present utility model. Preferably, the depth of the lead frame positioning groove 111 is H3, the thickness of the lead frame 1012 is H4, and the thickness of the pressing plate boss 21 is H5. The relationship among H3, H4, and H5 satisfies H5≥(H3 - H4). Under this setting, the bottom surface of the pressing plate boss 21 can press the lead frame 1012. In addition to the horizontal limitation of the lead frame positioning groove 111, the pressing of the pressing plate boss 21 can also perform vertical limitation on the lead frame 1012. During brazing, the positioning accuracy and stability of the lead frame 1012 are both higher, and the pressing of the pressing plate boss 21 can also increase the brazing firmness.

[0047] The brazing tooling for integrally forming the microelectronic packaging housing of the present utility model. Preferably, the depth of the fixed hole through-hole 22 is H6, and the thickness of the kovar frame 102 is H7. The relationship between H6 and H7 satisfies H6 > H7. This setting is for the fixed hole through-hole 22 to have the condition of limiting the kovar frame 102 and the pressing cover boss 31 when the pressing plate boss 21 directly pulls and touches the lead frame 1012 for pressing.

[0048] The brazing tooling for integrally forming the microelectronic packaging housing of the present utility model. Preferably, the thickness of the pressing cover boss 31 is H8, and the distance from the upper surface of the ceramic substrate 1011 to the top of the fixed hole through-hole 22 is H9. The relationship among H7, H8, and H9 satisfies H8≥(H9 - H7). Under this setting, the bottom surface of the pressing cover boss 31 can press the kovar frame 102. In addition to the horizontal limitation of the fixed hole through-hole 22, the pressing of the pressing cover boss 31 can also perform vertical limitation on the kovar frame 102. During brazing, the positioning accuracy and stability of the kovar frame 102 are both higher, and the pressing of the pressing cover boss 31 can also increase the brazing firmness.

[0049] The brazing tooling for integrally molding the microelectronic packaging housing of the present utility model. Preferably, a first relief groove 1111 is provided on the edge of the lead frame positioning groove 111. The provision of the first relief groove 1111 facilitates the smooth placement of the lead frame 1012 into the lead frame positioning groove 111, preventing the edge of the lead frame 1012 from being affected by burrs and causing the lead frame 1012 to be unable to be smoothly placed into the lead frame positioning groove 111.

[0050] The brazing tooling for integrally molding the microelectronic packaging housing of the present utility model. Preferably, a second relief groove 1121 is provided at the corner of the ceramic substrate positioning groove 112. The provision of the second relief groove 1121 facilitates the smooth placement of the ceramic substrate 1011 into the ceramic substrate positioning groove 112, preventing the edge of the ceramic substrate 1011 from being affected by burrs and causing the ceramic substrate 1011 to be unable to be smoothly placed into the ceramic substrate positioning groove 112.

[0051] The brazing tooling for integrally molding the microelectronic packaging housing of the present utility model. Preferably, a third relief groove 221 is provided at the corner of the fixed-hole through hole 22. The provision of the third relief groove 221 facilitates the smooth placement of the replaceable frame cover 3 into the fixed-hole through hole 22, preventing the corner of the replaceable frame cover 3 from being affected by burrs and causing the replaceable frame cover 3 to be unable to be smoothly placed into the fixed-hole through hole 22.

[0052] The brazing tooling for integrally molding the microelectronic packaging housing of the present utility model. Preferably, a fourth relief groove 222 is provided on the edge of the fixed-hole through hole 22. The provision of the third relief groove 221 facilitates the smooth placement of the replaceable frame cover 3 into the fixed-hole through hole 22, preventing the edge of the replaceable frame cover 3 from being affected by burrs and causing the replaceable frame cover 3 to be unable to be smoothly placed into the fixed-hole through hole 22.

[0053] The brazing tooling for integrally molding the microelectronic packaging housing of the present utility model. Preferably, a foolproof identification hole 1112 is further provided in the lead frame positioning groove 111. The two sides of the lead frame 1012 are usually not completely the same. The provision of the foolproof identification hole 1112 serves as a mark to prevent the misalignment of the lead frame 1012 placed into the lead frame 1012.

[0054] The brazing tooling for integrally molding the microelectronic packaging housing of the present utility model. Preferably, the pressing plate boss 21 and the pressing cover boss 31 are both provided with chamfers. The provision of the chamfers facilitates the insertion for buckling.

[0055] The brazing tooling for integrally forming the microelectronic packaging housing of the present utility model. Preferably, the number of the tube housing body positioning grooves 11 is several. After several of the tube housing body positioning grooves 11 are located on the same brazing bottom plate 1, when the lead frame pressing plate 2 and the frame-replaceable pressing cover 3 are buckled for brazing, the working efficiency is higher.

[0056] The brazing tooling for integrally forming the microelectronic packaging housing of the present utility model. Preferably, a demolding through hole 12 is opened downward in the ceramic substrate positioning groove 112. The brazing tooling for integrally forming the microelectronic packaging housing further includes a disassembly base 4. A top column 41 is provided on the disassembly base 4. The top column 41 corresponds to the demolding through hole 12 one by one. The height of the top column 41 is H10, and the depth of the demolding through hole 12 is H11. The relationship between H10 and H11 satisfies H10 > H11. After brazing is completed, the frame-replaceable pressing cover 3 and the lead frame pressing plate 2 are sequentially removed. Then, the brazed tube housing 100 is taken out from the tube housing body positioning groove 11. When the brazed tube housing 100 is taken out from the tube housing body positioning groove 11, the top column 41 is inserted into the demolding through hole 12 to jack up the tube housing 100, facilitating the demolding of the tube housing 100.

[0057] The above are only the embodiments of the present utility model, and do not limit the patent scope of the present utility model accordingly. Any equivalent process transformation made by using the content of the specification of the present utility model, or directly or indirectly applied in other related technical fields, shall be similarly included in the patent protection scope of the present utility model.

Claims

1. A microelectronic packaging housing integrally formed brazing tooling for positioning the shell during the brazing process. The shell includes a shell body and a kovar frame. The shell body includes a ceramic substrate and a lead frame. The lead frame is fixed to the ceramic substrate and extends out from the side of the ceramic substrate. It is characterized in that: It includes a brazing bottom plate, a lead frame pressing plate, and a kovar frame pressing cover. The brazing bottom plate is provided with a shell body positioning groove. The shell body positioning groove includes a lead frame positioning groove for limiting the lead frame. A sinking groove is provided in the lead frame positioning groove, and the sinking groove forms a ceramic substrate positioning groove for limiting the ceramic substrate. A pressing plate boss extends downward from the bottom surface of the lead frame pressing plate. The pressing plate bosses correspond to the lead frame positioning grooves of the shell body positioning groove one by one. The pressing plate bosses extend into the corresponding lead frame positioning grooves and are engaged with the lead frame positioning grooves. The lead frame pressing plate is also provided with positioning holes for limiting the kovar frame. A pressing cover boss extends downward from the bottom surface of the kovar frame pressing cover. The pressing cover bosses correspond to the positioning holes one by one. The pressing cover bosses extend into the corresponding positioning holes and are engaged with the positioning holes.

2. The integrated brazing tooling for the microelectronic packaging housing according to claim 1, characterized in that: The depth of the ceramic substrate positioning groove is H1, the distance between the lead frame and the bottom surface of the ceramic substrate is H2, and the relationship between H1 and H2 satisfies H1≥H2.

3. The integrated brazing tooling for the microelectronic packaging housing according to claim 1, wherein: The depth of the lead frame positioning groove is H3, the thickness of the lead frame is H4, and the thickness of the pressing plate boss is H5. The relationship between H3, H4, and H5 satisfies H5≥(H3 - H4).

4. The one-piece brazing tooling for the microelectronic packaging housing according to claim 1, characterized in that: The depth of the positioning hole is H6, the thickness of the kovar frame is H7, and the relationship between H6 and H7 satisfies H6 > H7.

5. The brazing tooling for integrally molding the microelectronic packaging housing according to claim 4, characterized in that: The thickness of the pressing cover boss is H8, and the distance from the upper surface of the ceramic substrate to the top of the positioning hole is H9. The relationship between H7, H8, and H9 satisfies H8≥(H9 - H7).

6. The one-piece brazing tooling for the microelectronic packaging housing according to claim 1, characterized in that: A first relief groove is provided outward from the edge of the lead frame positioning groove; a second relief groove is provided outward from the corner of the ceramic substrate positioning groove.

7. The integrated brazing tooling for the microelectronic packaging housing according to claim 1, wherein: A third relief groove is provided outward from the corner of the positioning hole; a fourth relief groove is provided outward from the edge of the positioning hole.

8. The integrated brazing tooling for the microelectronic packaging housing according to claim 1, wherein: An anti-fooling identification hole is also provided in the lead frame positioning groove.

9. The one-piece brazing tooling for the microelectronic packaging housing according to claim 1, wherein: The number of the shell body positioning grooves is several.

10. The one-piece brazing tooling for a microelectronic packaging housing according to claim 1, wherein: A demolding through hole is provided downward in the ceramic substrate positioning groove. The microelectronic packaging housing integrally formed brazing tooling further includes a disassembly base. A top column is provided on the disassembly base. The top columns correspond to the demolding through holes one by one. The height of the top column is H10, and the depth of the demolding through hole is H11. The relationship between H10 and H11 satisfies H10 > H11.

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