Temperature-sensitive sheet IC (integrated circuit) positioning device of temperature-sensitive printer

Abstract

The utility model belongs to the technical field of thermo-sensitive sheet processing, and particularly discloses a thermo-sensitive sheet IC positioning device of a thermo-sensitive printer, which comprises a mounting seat and a disc fixing support, the disc fixing support is mounted at the center of the front end of the top of the mounting seat, and a vacuum disc is mounted in the top end of the disc fixing support. An air hole is formed in the top of the vacuum disc, and a thermosensitive chip is placed on the surface of the vacuum disc. According to the thermosensitive piece IC positioning device of the thermosensitive printer, the air holes are formed in the top of the vacuum disc, the vacuum mechanism is installed at the bottom of the disc fixing support, after an external mechanical arm grabs a thermosensitive chip, negative pressure suction force can be generated in the vacuum disc, and the thermosensitive chip is adsorbed to the surface of the vacuum disc through the multiple sets of air holes; whether the position of the chip is adjusted by the IC positioning scraper or the chip is taken by the manipulator subsequently, the thermosensitive chip can be ensured to be positioned on the vacuum disc, and the problem that the thermosensitive chip is easy to deviate is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of thermal sheet processing, and particularly relates to an IC positioning device for a thermal sheet of a thermal printer. Background Technique

[0002] IC is the English abbreviation of integrated circuit, which is an object with semiconductor materials such as circuits installed on a small board. A thermistor is a type of temperature sensor, and the internal resistance value will increase as the surrounding temperature rises. Therefore, such objects are required for thermal printers to control the temperature inside the device in real time to ensure the printing effect.

[0003] In order to ensure the accuracy of the thermal sheet during processing, an IC positioning device is needed to assist the thermal sheet. However, most of the previous positioning devices use robotic arms to clamp and adjust the orientation. The suspended arm rods may shake, causing the position of the thermal sheet to deviate. During transportation, there is also a risk that the thermal sheet may fall off the robotic arm.

[0004] Now, a new type of IC positioning device for a thermal sheet of a thermal printer is proposed to solve the above problems. Content of the Utility Model

[0005] The purpose of the utility model is to provide an IC positioning device for a thermal sheet of a thermal printer to solve the problem that the thermal sheet is prone to deviation proposed in the above background technique.

[0006] To achieve the above purpose, the utility model provides the following technical solution: an IC positioning device for a thermal sheet of a thermal printer, including a mounting base and a disc fixing bracket. The front center of the top of the mounting base is provided with a disc fixing bracket, and a vacuum disc is installed inside the top of the disc fixing bracket. Air holes are arranged on the top of the vacuum disc, and a thermal chip is placed on the surface of the vacuum disc. An IC storage box is installed on the left side of the front end of the top of the mounting base, and an optical fiber sensor is assembled between the IC storage box and the disc fixing bracket.

[0007] Preferably, the vacuum disc can generate negative pressure suction, and the air holes can adsorb the thermal chip.

[0008] Preferably, horizontal stoppers are respectively fixed on the right and left sides of the top of the mounting base. Lower-layer steel rails are respectively fixed between the front and back of the two sides of the center of the top of the mounting base, and an electric slide plate I is assembled above the lower-layer steel rails. Longitudinal stoppers are respectively installed at the front and back ends of the top of the electric slide plate I. Upper-layer steel rails are horizontally fixed on both sides of the center of the top of the electric slide plate I, and an electric slide plate II is assembled on the top of the upper-layer steel rails.

[0009] Preferably, the electric slide plate I can move back and forth along the lower-layer steel rails, and the electric slide plate II can move left and right along the upper-layer steel rails.

[0010] Preferably, an IC positioning scraper is attached to the center of the second front end of the electric skateboard, and a pull groove is provided on the right side of the IC positioning scraper. A screw hole is provided behind the IC positioning scraper, and a screw is threadedly connected in the screw hole.

[0011] Preferably, the screw is embedded between the IC positioning scraper and the second electric skateboard, and the clamping block is clamped on the second electric skateboard.

[0012] Compared with the prior art, the beneficial effects of the present invention are: the thermal printer thermal IC positioning device not only prevents the thermal sheet from falling, realizes the correct position of the thermal sheet, but also makes the sheet easy to install and remove;

[0013] (1) By setting air holes on the top of the vacuum disc and installing a vacuum mechanism at the bottom of the disc fixing bracket, after the external robot grabs the thermal chip, negative pressure suction will be generated inside the vacuum disc, and the thermal chip will be adsorbed on the surface of the vacuum disc through multiple sets of air holes. Whether the IC positioning scraper adjusts the chip position or the subsequent robot picks it up, it will ensure that the thermal chip is located on the vacuum disc, preventing the thermal chip from falling during the displacement process;

[0014] (2) By assembling an electric slide plate 1 above the lower rail and an electric slide plate 2 on the top of the upper rail, the horizontal blocks on both sides of the top of the mounting seat will limit the electric slide plate 1 from sliding forward and backward along the lower rail, while the longitudinal blocks will limit the electric slide plate 2 from sliding left and right along the upper rail. The IC positioning scraper is controlled from the X-axis and Y-axis lines to move and regularize the thermal chip, and the thermal chip will not leave the vacuum table;

[0015] (3) By attaching an IC positioning scraper to the center of the front end of the electric skateboard 2, attaching the IC positioning scraper to the front end of the electric skateboard 2, screwing the screws in the four sets of screw holes to reinforce it, and using the block attached to the corners of the front end of the electric skateboard 2 to fix the IC positioning scraper on the electric skateboard 2, use the right-side groove to adjust the position of the thermal chip on the surface of the vacuum disc, and can also assemble scrapers of different specifications according to the size of the thermal chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the front three-dimensional structure of the utility model;

[0017] Figure 2 For the utility model Figure 1 A schematic diagram of the partially enlarged structure at center A;

[0018] Figure 3 This is a schematic diagram of the front three-dimensional structure of the mounting base of the utility model;

[0019] Figure 4 This is the front orthographic three-dimensional structural schematic diagram of the IC positioning scraper of the present utility model.

[0020] In the figure: 1. Mounting seat; 2. Horizontal stop block; 3. Electric slide plate 1; 4. Upper layer steel rail; 5. Electric slide plate 2; 6. Lower layer steel rail; 7. Disc fixing bracket; 8. IC positioning scraper; 9. IC storage box; 10. Fiber optic sensor; 11. Vacuum disc; 12. Longitudinal stop block; 13. Thermal chip; 14. Air hole; 15. Screw hole; 16. Poking groove; 17. Clamping block; 18. Screw. Specific embodiments

[0021] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0022] Example 1: Please refer to Figures 1-4 , a thermal chip IC positioning device for a thermal printer, including a mounting seat 1 and a disc fixing bracket 7. A disc fixing bracket 7 is installed at the center of the front end of the top of the mounting seat 1, and a vacuum disc 11 is installed inside the top end of the disc fixing bracket 7. An air hole 14 is provided at the top of the vacuum disc 11. A thermal chip 13 is placed on the surface of the vacuum disc 11. An IC storage box 9 is installed on the left side of the front end of the top of the mounting seat 1, and a fiber optic sensor 10 is assembled between the IC storage box 9 and the disc fixing bracket 7;

[0023] The vacuum disc 11 can generate negative pressure suction, and the air hole 14 can adsorb the thermal chip 13;

[0024] Specifically, as shown in Figure 1 and Figure 2 , a vacuum mechanism is installed at the bottom of the disc fixing bracket 7. After the external manipulator grabs the thermal chip 13, negative pressure suction will be generated inside the vacuum disc 11, and the thermal chip 13 will be adsorbed on the surface of the vacuum disc 11 through multiple air holes 14. Whether the IC positioning scraper 8 adjusts the chip position or the subsequent manipulator takes it, it will ensure that the thermal chip 13 is located above the vacuum disc 11.

[0025] Example 2: Transverse stoppers 2 are respectively fixed to the right and left sides of the top of the mounting base 1. Lower-layer steel rails 6 are respectively fixed between the front and back on both sides of the center of the top of the mounting base 1. An electric skateboard 3 is assembled above the lower-layer steel rails 6. Longitudinal stoppers 12 are respectively installed at the front and rear ends of the top of the electric skateboard 3. Upper-layer steel rails 4 are horizontally fixed to both sides of the center of the top of the electric skateboard 3. An electric skateboard 5 is assembled on the top of the upper-layer steel rails 4. The electric skateboard 3 can move back and forth along the lower-layer steel rails 6, and the electric skateboard 5 can move left and right along the upper-layer steel rails 4;

[0026] Specifically, as Figure 1 and Figure 3 shown, an electric skateboard 5 is assembled on the top of the upper-layer steel rails 4. The transverse stoppers 2 on both sides of the top of the mounting base 1 will limit the electric skateboard 3 from sliding back and forth along the lower-layer steel rails 6, while the longitudinal stoppers 12 will limit the electric skateboard 5 from sliding left and right along the upper-layer steel rails 4, and control the movement and alignment of the IC positioning scraper 8 along the two lines of the X-axis and Y-axis to regularize the thermal chip 13.

[0027] Example 3: The center of the front end of the electric skateboard 5 is attached with an IC positioning scraper 8. A dial groove 16 is arranged on the right side of the IC positioning scraper 8. A screw hole 15 is arranged behind the IC positioning scraper 8. A screw 18 is threadedly connected in the screw hole 15. The screw 18 is embedded between the IC positioning scraper 8 and the electric skateboard 5, and a clamping block 17 is clamped on the electric skateboard 5;

[0028] Specifically, as Figure 1 and Figure 4 shown, attach the IC positioning scraper 8 to the front end of the electric skateboard 5, screw in the screws 18 in the four groups of screw holes 15 for reinforcement, and cooperate with the clamping block 17 attached to the front end edges of the electric skateboard 5 to fix the IC positioning scraper 8 on the electric skateboard 5, and use the dial groove 16 on the right to adjust the position of the thermal chip 13 on the surface of the vacuum disc 11.

[0029] Working principle: When the utility model is in use, the IC positioning scraper 8 is pre-fitted to the front end of the second electric skateboard 5, and screws 18 are screwed into the four groups of screw holes 15 for reinforcement. Cooperating with the clamping blocks 17 fitted at the front end corners of the second electric skateboard 5, the IC positioning scraper 8 is fixed on the second electric skateboard 5. The position of the thermal chip 13 is adjusted on the surface of the vacuum disc 11 using the slot 16 on the right side. Since a vacuum mechanism is installed at the bottom of the disc fixing bracket 7, after the external manipulator grabs the thermal chip 13, negative pressure suction will be generated inside the vacuum disc 11, and the thermal chip 13 will be adsorbed on the surface of the vacuum disc 11 through multiple groups of air holes 14. Whether it is the adjustment of the chip position by the IC positioning scraper 8 or the subsequent taking by the manipulator, it will ensure that the thermal chip 13 is located above the vacuum disc 11, avoiding the fall of the thermal chip 13 during the displacement process. The second electric skateboard 5 is assembled on the top of the upper rail 4. The transverse blocks 2 on both sides of the top of the mounting base 1 will limit the front and back sliding of the first electric skateboard 3 along the lower rail 6, while the longitudinal block 12 will limit the left and right sliding of the second electric skateboard 5 along the upper rail 4. The IC positioning scraper 8 is moved and the thermal chip 13 is aligned by controlling along these two lines of the X-axis and Y-axis.

[0030] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present utility model. Any reference signs in the claims should not be regarded as limiting the claimed rights.

Claims

1. A thermal printer thermal film IC positioning device, comprising a mounting base (1) and a disc fixing bracket (7), characterized in that: At the center of the front end of the top of the mounting base (1), a disc fixing bracket (7) is installed, and inside the top end of the disc fixing bracket (7), a vacuum disc (11) is installed. An air hole (14) is provided at the top of the vacuum disc (11). A thermal chip (13) is placed on the surface of the vacuum disc (11). On the left side of the front end of the top of the mounting base (1), an IC storage box (9) is installed, and an optical fiber sensor (10) is assembled between the IC storage box (9) and the disc fixing bracket (7).

2. The thermal printer thermal film IC positioning device according to claim 1, characterized in that: The vacuum disc (11) can generate negative pressure suction, and the air hole (14) can adsorb the thermal chip (13).

3. A thermal printer thermal film IC positioning device according to claim 1, characterized in that: On the right and left sides of the top of the mounting base (1), transverse blocks (2) are respectively fixed. Between the front and back of both sides at the center of the top of the mounting base (1), lower-layer steel rails (6) are respectively fixed, and an electric skateboard one (3) is assembled above the lower-layer steel rails (6). Longitudinal blocks (12) are respectively installed at the front and rear ends of the top of the electric skateboard one (3). On both sides of the center of the top of the electric skateboard one (3), upper-layer steel rails (4) are horizontally fixed respectively, and an electric skateboard two (5) is assembled on the top of the upper-layer steel rails (4).

4. A thermal printer thermal film IC positioning device according to claim 3, characterized in that: The electric skateboard one (3) can move back and forth along the lower-layer steel rails (6), and the electric skateboard two (5) can move left and right along the upper-layer steel rails (4).

5. A thermal printer thermal film IC positioning device according to claim 3, characterized in that: At the center of the front end of the electric skateboard two (5), an IC positioning scraper (8) is attached. A dial groove (16) is provided on the right side of the IC positioning scraper (8). A screw hole (15) is provided behind the IC positioning scraper (8), and a screw (18) is threadedly connected in the screw hole (15).

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