Wafer accommodating device and wafer processing equipment
By designing a rotatable turntable and wafer storage device that protects the box body, grabbing and placing on both sides is achieved, solving the problems of low operating efficiency and pollution of existing wafer boxes, and improving the operating efficiency and wafer protection effect of process connections.
Patent Information
- Application Number
- CN202422056978.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-23
- Publication Date
- 2025-07-29
- Estimated Expiration
- 2034-08-23
AI Technical Summary
The existing wafer box structure leads to low operating efficiency, cannot meet the requirements of multiple process connections, and is prone to wafer smoothies and dust pollution.
A wafer storage device is designed, including a rotatable turntable and a detachable protective box body, which can grasp and place both sides through rotation to protect the wafer edges and meet the requirements of multiple process wiring operations.
Improve the operating efficiency of wafer boxes, avoid the need to replace wafer boxes, and reduce the risk of wafer surface contamination.
Smart Images
Figure CN223162540U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer boxes, and more specifically, to a wafer accommodating device and a wafer processing equipment. Background Art
[0002] With the rapid development of the semiconductor industry, in the manufacturing process of wafer-level packaging, a lithography process is required. The lithography process is to coat a resist solution on a wafer substrate and then use a photomask for exposure and development to form a required resist pattern. Among them, the wafer needs to be accurately grasped and placed by a robotic arm, and the wafer usually needs to be accommodated by a wafer box.
[0003] In the conventional technology, the wafer box adopts a single-opening operation structure, and the placement position of the wafer box is fixed. The robotic arm can only grasp and place from a single opening. When multiple process connection operations are adopted, its operation requirements cannot be met, and the wafer box needs to be transferred to the next process station separately, resulting in low operation efficiency and the need for more turnover of the wafer box to meet its operation requirements. Summary of the Utility Model
[0004] The objectives of the present utility model include, for example, providing a wafer accommodating device and a wafer processing equipment, which can realize grasping and placing on both sides through a rotating method, can meet the requirements of multiple process connection operations, thereby avoiding replacing the wafer box and improving the operation efficiency.
[0005] The embodiments of the present utility model can be implemented as follows:
[0006] In a first aspect, the present utility model provides a wafer accommodating device, including:
[0007] A base;
[0008] A turntable, rotatably arranged on the base;
[0009] A placement box body, arranged in the middle of the turntable, and a plurality of placement slots for placing the middle part of the wafer are arranged on the placement box body;
[0010] A protection box body, detachably arranged on the turntable and used to rotate synchronously with the turntable, and spliced on one side of the placement box body to protect the edge area of the wafer.
[0011] In an optional embodiment, a receiving groove is arranged on the base, the shape of the receiving groove is adapted to the turntable, and the turntable can be rotatably accommodated in the receiving groove.
[0012] In an alternative embodiment, a rotating shaft is further provided at the center of the receiving groove, a rotating hole is provided at the center of the turntable, and the rotating shaft is assembled in the rotating hole.
[0013] In an alternative embodiment, the depth of the receiving groove is the same as the thickness of the turntable, so that the turntable is flush with the top surface of the base.
[0014] In an alternative embodiment, the two ends of the placement card slot are arc-shaped.
[0015] In an alternative embodiment, a plurality of wafer card slots are provided on one side of the protective box body close to the placement box body, and the plurality of wafer card slots correspond to the plurality of placement card slots one by one and are used to accommodate one side edge area of the wafer.
[0016] In an alternative embodiment, positioning posts are provided on the turntable, positioning holes are provided on the bottom side of the protective box body, and the positioning posts are correspondingly assembled in the positioning holes.
[0017] In an alternative embodiment, a positioning groove is provided on one side edge of the protective box body close to the placement box body, positioning steps are provided on both side edges of the placement box body, and the positioning steps are correspondingly assembled in the positioning groove to limit the protective box body and the placement box body to each other.
[0018] In an alternative embodiment, a driving member is further provided on the bottom side of the base, and the driving member is in transmission connection with the turntable for driving the turntable to rotate.
[0019] In a second aspect, the present utility model provides a wafer processing device, including a first machine table, a second machine table, and a wafer accommodating device according to any one of the foregoing embodiments. The first machine table and the second machine table are respectively provided at both ends of the base, and the placement box body is used to face the first machine table or the second machine table respectively under the drive of the turntable.
[0020] The beneficial effects of the embodiments of the present utility model include, for example:
[0021] The wafer accommodating device and the wafer processing equipment provided by the embodiments of the present utility model rotatably arrange a turntable on a base, a placement box body is arranged in the middle of the turntable, and a plurality of placement card slots for placing the middle part of the wafer are arranged on the placement box body. The protection box body is detachably arranged on the turntable and can rotate synchronously with the turntable, and the protection box body is spliced on one side of the placement box body to protect the edge area of the wafer. Compared with the prior art, the present utility model arranges a rotatable turntable, and arranges the placement box body in the middle of the turntable. The wafer can be placed in the placement box body, and at the same time, protection is realized through the protection box body to expose a single-sided opening. Since the turntable can drive the placement box body and the protection box body to rotate, two-side grasping and placement can be realized by rotating, which can meet the requirements of multiple process connection operations, thereby avoiding replacing the wafer cassette and improving the operation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present utility model, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.
[0023] Figure 1 It is a schematic structural view of the wafer accommodating device provided by the embodiment of the present utility model from the first perspective;
[0024] Figure 2 It is a first exploded structural view of the wafer accommodating device provided by the embodiment of the present utility model;
[0025] Figure 3 It is a second exploded structural view of the wafer accommodating device provided by the embodiment of the present utility model;
[0026] Figure 4 It is a schematic structural view of the placement box body provided by the embodiment of the present utility model;
[0027] Figure 5 It is a schematic structural view of the placement box body provided by the embodiment of the present utility model from the second perspective;
[0028] Figure 6 For Figure 5 Partial enlarged view of VI in
[0029] Reference numerals: 100 - wafer accommodating device; 110 - base; 111 - accommodating groove; 113 - rotating shaft; 130 - turntable; 131 - rotating hole; 133 - positioning post; 150 - placement box body; 151 - placement card slot; 153 - positioning step; 170 - protection box body; 171 - wafer card slot; 173 - positioning hole; 175 - positioning groove. Detailed implementation manners
[0030] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some but not all of the embodiments of the present utility model. The components of the embodiments of the present utility model usually described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.
[0031] Therefore, the following detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the claimed present utility model, but merely represents selected embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts fall within the scope of protection of the present utility model.
[0032] It should be noted that: like reference numerals and letters denote like items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.
[0033] In the description of the present utility model, it should be noted that if terms such as "upper", "lower", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, or the orientations or positional relationships in which the utility model product is habitually placed during use, it is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model.
[0034] In addition, terms such as "first", "second", etc. are only used for descriptive distinction and cannot be understood as indicating or implying relative importance.
[0035] As disclosed in the background art, existing wafer cassettes are usually provided with a single-sided opening and are set at a fixed position. Therefore, the robotic arm can only pick and place from a single opening. When multiple process connection operations are adopted, their operation requirements cannot be met, and the wafer cassette needs to be transferred to the next process station separately, resulting in low operation efficiency and the need for more turnover of the wafer cassette to meet its operation requirements. Further, existing wafer cassettes also have a structure with double-sided openings. However, on the one hand, the load-bearing effect on wafers of this structure is limited, and the phenomenon of wafer slipping is likely to occur. On the other hand, it is difficult to protect the edges of wafers with double-sided openings, increasing the risk of dust falling and contaminating the wafer surface.
[0036] To solve the above problems, the embodiments of the present utility model provide a wafer accommodating device and a wafer processing equipment. It should be noted that, without conflict, the features in the embodiments of the present utility model can be combined with each other.
[0037] Please refer to Figures 1 to 6 , this embodiment provides a wafer accommodating device 100, which can realize grasping and placing on both sides through a rotating manner, can meet the requirements of multiple process connection operations, thereby avoiding replacing the wafer cassette and improving the operation efficiency. At the same time, it can protect the edge of the wafer and reduce the risk of dust falling and contaminating the wafer surface.
[0038] The wafer accommodating device 100 provided in this embodiment includes a base 110, a turntable 130, a placement box body 150, and a protection box body 170. The turntable 130 is rotatably arranged on the base 110; the placement box body 150 is arranged in the middle of the turntable 130, and a plurality of placement slots 151 for placing the middle part of the wafer are arranged on the placement box body 150; the protection box body 170 is detachably arranged on the turntable 130 and is used to rotate synchronously with the turntable 130, and the protection box body 170 is spliced on one side of the placement box body 150 to protect the edge area of the wafer.
[0039] In this embodiment, the placement box body 150 has an open structure on both sides. The protection box body 170 is spliced on one side of the placement box body 150. The wafer can be taken out and put in from the other side of the placement box body 150, and the protection box body 170 can protect one side edge of the wafer and reduce the probability of dust falling and contamination. The turntable 130 can rotate independently or under the action of an external force, thereby driving the placement box body 150 and the protection box body 170 to rotate synchronously, changing the opening direction for taking and placing the wafer, that is, grasping and placing the wafers on both sides can be realized through a rotating manner, which can meet the requirements of multiple process connection operations, thereby avoiding replacing the wafer cassette and improving the operation efficiency.
[0040] In this embodiment, a receiving groove 111 is arranged on the base 110. The shape of the receiving groove 111 is adapted to the turntable 130, and the turntable 130 is rotatably accommodated in the receiving groove 111. Specifically, both the receiving groove 111 and the turntable 130 are circular and concentrically arranged, and the size of the receiving groove 111 is slightly larger than the size of the turntable 130, so that the turntable 130 can rotate freely in the receiving groove 111. The base 110 is rectangular, which is convenient for it to be placed and fixed on an external machine or production line.
[0041] In this embodiment, a rotating shaft 113 is further provided at the center of the receiving groove 111, and a rotating hole 131 is provided at the center of the rotating disk 130. The rotating shaft 113 is assembled into the rotating hole 131. Specifically, the rotating shaft 113 is a fixed protruding shaft structure, and the height of the rotating shaft 113 is the same as the thickness of the rotating disk 130, so that the rotating shaft 113 does not protrude from the rotating disk 130, thereby preventing the rotating shaft 113 from affecting the normal placement of the placement box 150.
[0042] It should be noted that, in this embodiment, the rotating shaft 113 is a fixed shaft structure, and the rotating hole 131 of the turntable 130 is movably assembled with the rotating shaft 113, so that the turntable 130 can rotate freely around the rotating shaft 113. In actual use, the turntable 130 can be moved by an external robotic arm or a lever to achieve synchronous rotation of the placement box body 150 and the protection box body 170.
[0043] In other preferred embodiments of the present invention, a driving member (not shown) may be further provided on the bottom side of the base 110, which is in transmission connection with the turntable 130, thereby driving the turntable 130 to rotate. Specifically, the driving member may be a motor, in which case the rotating shaft 113 may be a movable shaft, and the rotating shaft 113 is interference-fitted into the rotating hole 131 of the rotating shaft 113. The rotating shaft 113 is connected to the output shaft of the motor and can rotate under the drive of the motor, thereby driving the turntable 130 to rotate.
[0044] In this embodiment, the depth of the receiving groove 111 is the same as the thickness of the turntable 130, so that the turntable 130 is flush with the top surface of the base 110. Specifically, the top surface of the turntable 130 is flush with the top surface of the base 110, so that the turntable 130 does not protrude from the base 110, thereby preventing the turntable 130 from protruding too high and causing the robot arm to collide with the side wall of the turntable 130.
[0045] In this embodiment, the edges of both ends of the placement slot 151 are in an arc shape. Specifically, both ends of the placement slot 151 are in an arc shape, thereby forming a circular notch, which can support the wafer and facilitate the placement or removal of the wafer.
[0046] Furthermore, a plurality of wafer retaining slots 171 are provided on one side of the protective box 170, adjacent to the placement box 150. These slots 171 correspond one-to-one with the placement slots 151 and are used to accommodate the edge region of a wafer. Specifically, the wafer retaining slots 171 are arc-shaped, conforming to the shape of one edge of the wafer. This allows for better processing and protection.
[0047] In this embodiment, a positioning post 133 is provided on the turntable 130, and a positioning hole 173 is provided on the bottom side of the protective box body 170. The positioning post 133 is correspondingly assembled in the positioning hole 173. Specifically, the positioning post 133 is eccentrically arranged with the rotating hole 131, and the protective box body 170 is fixed on the positioning post 133 through the positioning hole 173, so that the protective box body 170 can be kept fixed during the rotation of the turntable 130.
[0048] In this embodiment, a positioning groove 175 is provided on one side edge of the protective box body 170 close to the placement box body 150, and positioning steps 153 are provided on both side edges of the placement box body 150. The positioning steps 153 are correspondingly assembled in the positioning groove 175 to limit the protective box body 170 and the placement box body 150 to each other. Specifically, the positioning groove 175 and the positioning steps 153 can cooperate with each other, and they can have a certain tight fitting force. For example, the interference fit method is adopted to fix the protective box body 170 and the placement box body 150, ensuring integrity, and at the same time, disassembly can also be realized, which is convenient for placing and taking out the wafers from different sides.
[0049] The embodiment of the present invention also provides a wafer processing device, including a first machine platform, a second machine platform and the aforementioned wafer accommodating device 100. The wafer accommodating device 100 includes a turntable 130, a placement box body 150 and a protective box body 170. The turntable 130 is rotatably arranged on the base 110; the placement box body 150 is arranged in the middle of the turntable 130, and a plurality of placement slots 151 for placing the middle part of the wafer are provided on the placement box body 150; the protective box body 170 is detachably arranged on the turntable 130 and is used to rotate synchronously with the turntable 130, and the protective box body 170 is spliced on one side of the placement box body 150 to protect the edge area of the wafer. The first machine platform and the second machine platform are respectively arranged at both ends of the base 110, and the placement box body 150 is used to face the first machine platform or the second machine platform respectively under the drive of the turntable 130.
[0050] Among them, the first machine platform and the second machine platform are respectively machine platforms for other different processes. Here is an example: the placement box body 150 first opens towards the first machine platform under the drive of the turntable 130, which is convenient for the wafer after the previous process to be placed into the placement box body 150 by the robotic arm. Then the placement base can rotate under the drive of the turntable 130 and open towards the second machine platform, which is convenient for the robotic arm to take out the wafer and put it into the second machine platform.
[0051] In summary, for the wafer accommodating device 100 and the wafer processing equipment provided in this embodiment, the turntable 130 is rotatably arranged on the base 110, the placement box body 150 is arranged in the middle of the turntable 130, and a plurality of placement slots 151 for placing the middle part of the wafer are arranged on the placement box body 150. The protection box body 170 is detachably arranged on the turntable 130 and can rotate synchronously with the turntable 130. The protection box body 170 is spliced on one side of the placement box body 150 and can protect the edge area of the wafer. Compared with the prior art, the present utility model sets a rotatable turntable 130, and arranges the placement box body 150 in the middle of the turntable 130. The wafer can be placed in the placement box body 150, and at the same time, protection is achieved through the protection box body 170 to expose a single-sided opening. Since the turntable 130 can drive the placement box body 150 and the protection box body 170 to rotate, two-side grasping and placement can be realized by rotating, which can meet the requirements of multiple process connection operations, thus avoiding the replacement of the wafer cassette and improving the operation efficiency.
[0052] The above is only the specific implementation manner of the present utility model, but the protection scope of the present utility model is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present utility model should be covered by the protection scope of the present utility model. Therefore, the protection scope of the present utility model should be subject to the protection scope of the claims.
Claims
1. A wafer accommodating device, characterized in that, Comprising: A base; A turntable rotatably arranged on the base; A placement box body arranged in the middle of the turntable, and a plurality of placement card slots for placing the middle part of the wafer are arranged on the placement box body; A protection box body detachably arranged on the turntable and used for rotating synchronously with the turntable, and the protection box body is spliced on one side of the placement box body for protecting the edge area of the wafer.
2. The wafer accommodating device according to claim 1, characterized in that, An accommodation groove is arranged on the base, and the shape of the accommodation groove is adapted to the turntable, and the turntable can be rotatably accommodated in the accommodation groove.
3. The wafer accommodating device according to claim 2, wherein, A rotating shaft is further arranged at the center of the accommodation groove, a rotating hole is arranged at the center of the turntable, and the rotating shaft is assembled in the rotating hole.
4. The wafer accommodating device according to claim 2, characterized in that, The depth of the accommodation groove is the same as the thickness of the turntable, so that the turntable is flush with the top surface of the base.
5. The wafer accommodating device according to claim 1, characterized in that, The two end edges of the placement card slot are arc-shaped.
6. The wafer accommodating device according to claim 5, wherein A plurality of wafer card slots are arranged on the side of the protection box body close to the placement box body, and the plurality of wafer card slots correspond to the plurality of placement card slots one by one and are used for accommodating one side edge area of the wafer.
7. The wafer accommodating device according to claim 1, characterized in that, A positioning post is arranged on the turntable, a positioning hole is arranged on the bottom side of the protection box body, and the positioning post is correspondingly assembled in the positioning hole.
8. The wafer accommodating device according to claim 7, wherein A positioning groove is arranged on the side edge of the protection box body close to the placement box body, and positioning steps are arranged on both side edges of the placement box body, and the positioning steps are correspondingly assembled in the positioning groove to limit the protection box body and the placement box body to each other.
9. The wafer accommodating device according to claim 1, wherein A driving member is further arranged on the bottom side of the base, and the driving member is in transmission connection with the turntable for driving the turntable to rotate.
10. A wafer processing apparatus, characterized in that, Comprising a first machine platform, a second machine platform and the wafer accommodating device according to any one of claims 1-9, the first machine platform and the second machine platform are respectively arranged at both ends of the base, and the placement box body is used for facing the first machine platform or the second machine platform respectively under the drive of the turntable.