Multifunctional control LED matrix steaming oven display module

Abstract

The utility model relates to the field of multifunctional control LED matrix display modules, in particular to a multifunctional control LED matrix steam oven display module which comprises an MCU circuit, an LED array and drive circuit, a touch control interface, a power supply communication interface, an LDO voltage reduction circuit, a GR gesture module, a PIR human body induction module, an RTC clock module and a Bluetooth audio module. The LED array and driving circuit, the touch interface, the power supply communication interface, the LDO step-down circuit, the GR gesture module, the PIR human body induction module, the RTC clock module and the audio module are all electrically connected with the MCU circuit, and the LDO step-down circuit supplies power to the GR gesture module and the PIR human body induction module.

Description

Technical Field

[0001] The utility model relates to the field of multifunctional control LED matrix display modules, in particular to a multifunctional control LED matrix steam oven display module. Background Technique

[0002] As a kitchen appliance often used in people's lives, the steam oven combines traditional baking functions, steam cooking technology and automation programs, and can meet the cooking needs of different foods. However, the existing digital tube steam ovens are relatively single in display function and interaction method, and can only display a small amount of information on the screen and can only be controlled by buttons or knobs, which is very inconvenient to use. Content of the Utility Model

[0003] The purpose of the utility model is to provide a multifunctional control LED matrix steam oven display module to solve the problems in the prior art.

[0004] To achieve the above purpose, the utility model provides the following technical solutions:

[0005] A multifunctional control LED matrix steam oven display module includes an MCU circuit, an LED array and a driving circuit, a touch interface, a power communication interface, an LDO buck circuit, a GR gesture module, a PIR human body sensing module, an RTC clock module and a Bluetooth audio module. The MCU circuit is electrically connected to the LED array and the driving circuit, the touch interface, the power communication interface, the LDO buck circuit, the GR gesture module, the PIR human body sensing module, the RTC clock module and the Bluetooth audio module. The LDO buck circuit is electrically connected to the GR gesture module and the PIR human body sensing module.

[0006] Further, the MCU circuit includes a single-chip microcomputer SH79F6481AP, a capacitor C13, a capacitor C4, a capacitor C5, a voltage stabilizing diode D14, a resistor R20 and an interface CON3. The 12th pin of the single-chip microcomputer SH79F6481AP, the first pin of the interface CON3, the capacitor C5, the capacitor C4 and the first end of the voltage stabilizing diode D14 are connected to VCC5V. The capacitor C5, the capacitor C4, the 4th pin of the interface CON3, the second end of the resistor R20 and the second end of the voltage stabilizing diode D14 are grounded. The capacitor C5, the capacitor C4 and the voltage stabilizing diode D14 are connected in parallel. The first end of the capacitor C13 is connected to the 6th pin of the single-chip microcomputer SH79F6481AP, and the second end of the capacitor C13 is connected in parallel to the 7th pin of the single-chip microcomputer SH79F6481AP and grounded. The first end of the resistor R20 is connected to the 3rd pin of the interface CON3.

[0007] Further, the touch interface includes register 1, chip register 2, resistor R21, resistor R22, resistor R23, resistor R24, resistor R25, resistor R26, resistor R27, resistor R28, resistor R29, resistor R30, resistor R31, resistor R32, resistor R33, resistor R34, and resistor R35;

[0008] Chip register 1, resistor R21, resistor R22, resistor R23, resistor R24, resistor R25, resistor R26, resistor R27, and resistor R28 form touch interface 1. The first pin of chip register 1 is grounded, the 10th - 12th pins of chip register 1 are grounded in parallel, and the 2nd - 9th pins of chip register 1 are connected to the 44th pin, the 1st - 5th pins, and the 8th pin of the MCU circuit in sequence. Resistors R21, R22, R23, R24, R25, R26, R27, and R28 are located on the lines connecting the 2nd - 9th pins of chip register 1 to the MCU circuit in sequence;

[0009] Chip register 2, resistor R29, resistor R30, resistor R31, resistor R32, resistor R33, resistor R34, and resistor R35 form touch interface 2. The first pin of chip register 2 is grounded, the 10th - 12th pins of chip register 2 are grounded in parallel, and the 2nd - 8th pins of chip register 2 are connected to the 27th - 34th pins of the MCU circuit in sequence. Resistors R29, R30, R31, R32, R33, R34, and R35 are arranged in sequence and are located on the lines connecting the 2nd - 8th pins of chip register 2 to the MCU circuit respectively.

[0010] Furthermore, the GR gesture module includes a chip PAJ7620U2, a capacitor C66, a capacitor C67, a resistor R121, a resistor R122, a resistor R123, a resistor R124 and a resistor R125. The second pin of the chip PAJ7620U2 is connected to the 40th pin of the microcontroller SH79F6481AP, the fifth pin of the chip PAJ7620U2 is connected to the 39th pin of the microcontroller SH79F6481AP, and the third pin of the chip PAJ7620U2 is connected to the The resistor R122 is located on the line connecting the 2nd pin of the chip PAJ7620U2 and the 40th pin of the microcontroller SH79F6481AP. The resistor R124 is located on the line connecting the 5th pin of the chip PAJ7620U2 and the 39th pin of the microcontroller SH79F6481AP. The resistor R125 is located on the line connecting the 3rd pin of the chip PAJ7620U2 and the 9th pin of the microcontroller SH79F6481AP. The first ends of resistors 121 and 123 are connected to VCC5V, the second end of resistor 121 is located on the line connecting the 2nd pin of chip PAJ7620U2 and the 40th pin of microcontroller SH79F6481AP, the second end of resistor 123 is located on the line connecting the 5th pin of chip PAJ7620U2 and the 39th pin of microcontroller SH79F6481AP, the first ends of capacitors C66 and C67 are grounded, and the second end of capacitor C66 is located on the chip PAJ76 The second pin of PAJ7620U2 is connected to the 40th pin of the microcontroller SH79F6481AP. The second end of capacitor C67 is located on the line connecting the 5th pin of chip PAJ7620U2 and the 39th pin of the microcontroller SH79F6481AP. The 1st and 12th pins of chip PAJ7620U2 are connected to VCC3V3, the 11th pin of chip PAJ7620U2 is connected to VLED, and the 6th and 10th pins of chip PAJ7620U2 are connected to ground in parallel.

[0011] Further, the RTC clock module includes the chip INS58563, crystal oscillator Y1, capacitors C21, C22, C23, C24, C76, C77, resistors R103, R104, R105, R106 and R120. The 3rd pin of the chip INS58563 is connected to the 11th pin of the single-chip microcomputer SH79F6481AP. The 5th pin of the chip INS58563 is connected to the 37th pin of the single-chip microcomputer SH79F6481AP. The 6th pin of the chip INS58563 is connected to the 36th pin of the single-chip microcomputer SH79F6481AP. The 4th pin of the chip INS58563, and the first ends of capacitors C21, C22, C23 and C24 are grounded. The 8th pin of the chip INS58563 is connected to VCC5V. The first end of the crystal oscillator Y1 is connected to the 1st pin of the chip INS58563, and the second end of the crystal oscillator Y1 is connected to the 2nd pin of the chip INS58563. The second end of the capacitor C21 is connected between the first end of the crystal oscillator Y1 and the 1st pin of the chip INS58563. The second end of the capacitor C22 is connected between the second end of the crystal oscillator Y1 and the 2nd pin of the chip INS58563. The second ends of the capacitors C23 and C24 are connected between the 8th pin of the chip INS58563 and VCC5V. The resistor R105 is located on the line between the 6th pin of the chip INS58563 and the 36th pin of the single-chip microcomputer SH79F6481AP. The resistor R106 is located on the line between the 5th pin of the chip INS58563 and the 37th pin of the single-chip microcomputer SH79F6481AP. The resistor R120 is located on the line between the 3rd pin of the chip INS58563 and the 11th pin of the single-chip microcomputer SH79F6481AP. The first ends of the resistors R103 and R104 are connected to VCC5V. The second end of the resistor R103 is connected to the line between the 6th pin of the chip INS58563 and the 36th pin of the single-chip microcomputer SH79F6481AP. The second end of the resistor R104 is connected to the line between the 5th pin of the chip INS58563 and the 37th pin of the single-chip microcomputer SH79F6481AP. The first ends of the capacitors C76 and C77 are grounded. The second end of the capacitor C76 is connected to the line between the 5th pin of the chip INS58563 and the 37th pin of the single-chip microcomputer SH79F6481AP. The second end of the capacitor C77 is connected to the line between the 6th pin of the chip INS58563 and the 36th pin of the single-chip microcomputer SH79F6481AP.

[0012] Further, the LED array and the driving circuit include four AIP33624 driving chips, zener diodes D5, D6, D7, D8, NPN transistors Q3, Q4, Q5, Q6, capacitors C6, C7, C8, C9, C10, C11, C12, C14, C68, C69, C70, C71, C72, C73, C74, C75, resistors R36, R37, R38, R39, R40, R41, R42, R43, R44, R45, R46, R47, R48, R49, R50, R51, R52, R53, R54, R55, R56, R57, R58, R59, R60, R61, R62, R63, R64, R65, R66, R67, R68, R69, R70, R71 and a number of light-emitting diodes;

[0013] One AIP33624 driving chip, zener diode D5, capacitors C6, C7, C68, C69, resistors R36, R37, R38 and R39 form the U5 driving circuit. The 6th pin of the AIP33624 driving chip, zener diode D5, capacitors C6, C7, resistors R38 and R39 are connected to VCC5V at their first ends. The first ends of capacitors C68, C69 and the second ends of zener diode D5, capacitors C6, C7 are grounded. Zener diode D5, capacitors C6, C7 are in parallel. The second ends of capacitors C68, resistor R38 and resistor R36 are connected to the SDA line of the U5 driving circuit. The second ends of resistor R39, capacitor C69 and resistor R37 are connected to the SCL line of the U5 driving circuit;

[0014] An AIP33624 driver chip, a Zener diode D6, a capacitor C8, a capacitor C9, a capacitor C70, a capacitor C71, a resistor R40, a resistor R41, a resistor R42, and a resistor R43 constitute a U6 driver circuit. Pin 6 of the AIP33624 driver chip, the Zener diode D6, the capacitor C8, the capacitor C9, the resistor R42, and the first end of the resistor R43 are connected to VCC5V. The first end of the capacitor C70, the capacitor C71, and the second end of the Zener diode D6, the capacitor C8, and the capacitor C9 are grounded. The Zener diode D6, the capacitor C8, and the capacitor C9 are connected in parallel. The second end of the capacitor C70, the resistor R42, and the resistor R40 are connected to the SDA line of the U6 driver circuit. The second end of the resistor R43, the capacitor C71, and the resistor R41 are connected to the SCL line of the U6 driver circuit.

[0015] An AIP33624 driver chip, a Zener diode D7, a capacitor C10, a capacitor C11, a capacitor C72, a capacitor C73, a resistor R48, a resistor R49, a resistor R50, and a resistor R51 constitute a U7 driver circuit. Pin 6 of the AIP33624 driver chip, the Zener diode D7, the capacitor C10, the capacitor C11, the resistor R50, and the first end of the resistor R51 are connected to VCC5V, the first end of the capacitor C72, the capacitor C73, and the second end of the Zener diode D7, the capacitor C10, and the capacitor C11 are grounded, the Zener diode D7, the capacitor C10, and the capacitor C11 are connected in parallel, the second end of the capacitor C72, the resistor R50, and the resistor R48 are connected to the SDA line of the U7 driver circuit, and the second end of the resistor R51, the capacitor C73, and the resistor R49 are connected to the SCL line of the U7 driver circuit.

[0016] An AIP33624 driver chip, a Zener diode D8, a capacitor C12, a capacitor C14, a capacitor C74, a capacitor C75, a resistor R44, a resistor R45, a resistor R46, and a resistor R47 constitute a U8 driver circuit. Pin 6 of the AIP33624 driver chip, the Zener diode D8, the capacitor C12, the capacitor C14, the resistor R46, and the first end of the resistor R47 are connected to VCC5V, the first end of the capacitor C74, the capacitor C75 and the second end of the Zener diode D8, the capacitor C12, and the capacitor C14 are grounded, the Zener diode D8, the capacitor C12, and the capacitor C14 are connected in parallel, the second end of the capacitor C74, the resistor R46, and the resistor R44 are connected to the SDA line of the U8 driver circuit, and the second end of the resistor R47, the capacitor C75, and the resistor R45 are connected to the SCL line of the U8 driver circuit.

[0017] The resistor R52, resistor R53, resistor R60, resistor R61, resistor R62, NPN transistor Q3 and light-emitting diodes form the P1 circuit. The first end of the resistor R52 is connected to the 19th pin of the single-chip microcomputer SH79F6481AP, the second end of the resistor R52 is connected to the base of the NPN transistor Q3, the resistor R53 is located between the base and the emitter of the NPN transistor Q3, the emitter of the NPN transistor Q3 is grounded, thirty light-emitting diodes are arranged in three series-connected groups, each group includes ten light-emitting diodes, the cathodes of the light-emitting diodes are all connected to the collector of the NPN transistor Q3, and each group of light-emitting diodes is respectively connected in series with the resistor R60, resistor R61 and resistor R62 in sequence and then connected to VCC5V;

[0018] The resistor R54, resistor R55, resistor R63, resistor R64, resistor R65, NPN transistor Q4 and light-emitting diodes form the P2 circuit. The first end of the resistor R54 is connected to the 22nd pin of the single-chip microcomputer SH79F6481AP, the second end of the resistor R54 is connected to the base of the NPN transistor Q4, the resistor R55 is located between the base and the emitter of the NPN transistor Q4, the emitter of the NPN transistor Q4 is grounded, thirty light-emitting diodes are arranged in three series-connected groups, each group includes ten light-emitting diodes, the cathodes of the light-emitting diodes are all connected to the collector of the NPN transistor Q4, and each group of light-emitting diodes is respectively connected in series with the resistor R63, resistor R64 and resistor R65 in sequence and then connected to VCC5V;

[0019] The resistor R56, resistor R57, resistor R66, resistor R67, resistor R68, NPN transistor Q5 and light-emitting diodes form the P3 circuit. The first end of the resistor R56 is connected to the 35th pin of the single-chip microcomputer SH79F6481AP, the second end of the resistor R56 is connected to the base of the NPN transistor Q5, the resistor R57 is located between the base and the emitter of the NPN transistor Q3, the emitter of the NPN transistor Q5 is grounded, thirty light-emitting diodes are arranged in three series-connected groups, each group includes ten light-emitting diodes, the cathodes of the light-emitting diodes are all connected to the collector of the NPN transistor Q5, and each group of light-emitting diodes is respectively connected in series with the resistor R66, resistor R67 and resistor R68 in sequence and then connected to VCC5V;

[0020] The resistor R58, resistor R59, resistor R69, resistor R70, resistor R71, NPN transistor Q6 and light-emitting diode form the SWE circuit. The first end of the resistor R58 is connected to the 18th pin of the single-chip microcomputer SH79F6481AP, the second end of the resistor R58 is connected to the base of the NPN transistor Q6, the resistor R59 is located between the base and the emitter of the NPN transistor Q6, the emitter of the NPN transistor Q6 is grounded, thirty light-emitting diodes are arranged in three series-connected groups, each group includes ten light-emitting diodes, the negative electrodes of the light-emitting diodes are all connected to the collector of the NPN transistor Q6, and each group of light-emitting diodes is respectively connected in series with the resistor R69, resistor R70 and resistor R71 in sequence and then connected to VCC5V;

[0021] The positive electrodes of several light-emitting diodes in the same row are connected to the same SEG interface, the negative electrodes of several light-emitting diodes in the same column are connected to the same GRID interface, at most ten rows and eight columns of light-emitting diodes form an LED array, and four LED arrays are electrically connected to the AIP33624 driving chip respectively;

[0022] Each light-emitting diode passes through the formula:

[0023]

[0024] where I LED is the current flowing through the light-emitting diode, VCC is the input voltage, V CE is the voltage drop between the collector and the emitter, R C is the current-limiting resistor on the collector;

[0025] Carry out constant current control.

[0026] Furthermore, the power supply communication interface includes an interface CON1, a voltage regulator diode D1, a Zener diode D2, a voltage regulator diode D3, a voltage regulator diode D4, a capacitor C1, a capacitor C2, a capacitor C20, a capacitor C64, a capacitor C65, a resistor R16, a resistor R17, a resistor R18 and a resistor R19, the second pin of the interface CON1, the voltage regulator diode D1, the Zener diode D2, the capacitor C1, the capacitor C2, the capacitor C20, the resistor R18 and the first end of the resistor R19 are connected to VCC5V, the first pin of the interface CON1, the voltage regulator diode D3, the voltage regulator diode D4, the capacitor C64, and the first end of the capacitor C65 are grounded, and the interface CO Pin 3 of N1 is connected to pin 16 of the microcontroller SH79F6481AP, pin 4 of interface CON1 is connected to pin 15 of the microcontroller SH79F6481AP, voltage regulator diode D1, Zener diode D2, capacitor C1, capacitor C2, and capacitor C20 are connected in parallel between VCC5V and GND, the second ends of resistor R16 and resistor R18 are located on the line between pin 4 of interface CON1 and pin 15 of the microcontroller SH79F6481AP, and the second ends of resistor R17 and resistor R19 are located on the line between pin 3 of interface CON1 and pin 16 of the microcontroller SH79F6481AP.

[0027] Furthermore, the PIR human body sensing module includes a chip BM412, a resistor R100, a resistor R101, a resistor R102, a capacitor C19, a capacitor C57, and a capacitor C58. The fourth pin of the chip BM412 is connected to the 43rd pin of the microcontroller SH79F6481AP, the third pin of the chip BM412, the capacitor C57, the capacitor C58 and the first end of the resistor R101 are connected to Vcc3V3, the first pin of the chip BM412, the capacitor C57, the capacitor C58, the capacitor C19 and the second end of the resistor R102 are grounded, the capacitor C19 and the resistor R102 are connected in parallel, and the first ends of the capacitor C19 and the resistor R102 are connected to the second end of the resistor R101. The second pin of the chip BM412 is connected to the first end of the capacitor C19, the resistor R102 and the second end of the resistor R101.

[0028] Furthermore, the LDO step-down circuit includes two voltage regulators AMS1117-3.3, capacitor C15, capacitor C16, capacitor C17, capacitor C18, capacitor C59, capacitor C60, capacitor C61, capacitor C62, Zener diode D9 and Zener diode D15;

[0029] A voltage regulator AMS1117-3.3, capacitors C15, C16, C17, C18, and Zener diode D9 form a step-down circuit U2; capacitors C15 and C16 are connected in parallel between VCC5V and GND, capacitor C17 is connected in parallel between output pins 2 and 4 of the voltage regulator AMS1117-3.3 and GND, capacitor C18 is connected in parallel between VLED and GND, and Zener diode D9 is connected between the output of the voltage regulator AMS1117-3.3 and VLED;

[0030] A voltage regulator AMS1117-3.3, capacitors C59, C60, C61, C62, and a Zener diode D15 form a step-down circuit U12; capacitors C59 and C60 are connected in parallel between VCC5V and GND, capacitor C61 is connected in parallel between output pins 2 and 4 of the voltage regulator AMS1117-3.3 and GND, capacitor C62 is connected in parallel between VLED and GND, and Zener diode D15 is connected between the output of the voltage regulator AMS1117-3.3 and VLED.

[0031] Furthermore, the Bluetooth audio module includes a chip VB6824, a chip CS8679E, a DM interface, a DP interface, an ANT antenna, a capacitor C25, a capacitor C26, a capacitor C27, a capacitor C28, a capacitor C29, a capacitor C30, a capacitor C31, a capacitor C33, a capacitor C34, a capacitor C35, a capacitor C36, a capacitor C37, a capacitor C38, a capacitor C39, a capacitor C40, a capacitor C41, a capacitor C42, a capacitor C43, a capacitor C44, a capacitor C45, a capacitor C46, a capacitor C47, a capacitor C48, a capacitor C49, a capacitor C50, a capacitor C51, a capacitor C52, a capacitor C53, a capacitor C54, Capacitor C55, capacitor C56, resistor R107, resistor R108, resistor R109, resistor R110, resistor R111, resistor R112, resistor R113, resistor R114, resistor R115, resistor R116, resistor R117, resistor R118, resistor R119, resistor R200, crystal oscillator Y2, PMOS tube JMTL2301C, NPN transistor MMBT3904, interface CON4, interface CON5, interface CON6, inductor L1, inductor L2, inductor L3, inductor L4, Zener diode D10, Zener diode D11, Zener diode D12, Zener diode D13;

[0032] The upper end of crystal oscillator Y2 is connected to the first end of capacitor C28, and the lower end of crystal oscillator Y2 is connected to the first end of capacitor C27. The second ends of capacitor C27, capacitor C28, and the left end of crystal oscillator Y2 are connected in parallel to ground, and the right end of crystal oscillator Y2 is grounded. The node formed by connecting the upper end of crystal oscillator Y2 and the first end of capacitor C28 is the BT-OSCO terminal, and the BT-OSCO terminal is connected to the 24th pin of chip VB6824. The node formed by connecting the lower end of crystal oscillator Y2 and the first end of capacitor C27 is the BT-OSCI terminal, and the BT-OSCI terminal is connected to the 23rd pin of chip VB6824;

[0033] The first end of resistor R109 is connected to the first end of capacitor C29, and the formed node is the BT-RF terminal. The BT-RF terminal is connected to the 21st pin of chip VB6824. The second end of resistor R109 is grounded. The second end of capacitor C29 and the first end of resistor R110 are connected to the first end of antenna ANT, and the second end of resistor R110 and the second end of antenna ANT are grounded;

[0034] The first end of resistor R113 is connected to the 38th pin of microcontroller SH79F6481AP. The second end of resistor R113 and the first end of resistor R114 are connected to the base of NPN transistor MMBT3904. The second end of resistor R114 and the emitter of NPN transistor MMBT3904 are grounded. The collector of NPN transistor MMBT3904 is connected to the gate of PMOS transistor JMTL2301C and the first ends of resistor R112 and capacitor C33. The second end of resistor R112, the second end of resistor R111, and the source of PMOS transistor JMTL2301C are connected to VDD5V. The first end of resistor R111, the second end of capacitor C33, and the drain of PMOS transistor JMTL2301C are connected to +5V voltage;

[0035] The first pin of interface CON4 is connected to the 5th pin of chip VB6824. The second pin of interface CON4 is connected to GND. The third and fourth pins of interface CON4 are connected in parallel to ground. Capacitor C34 is connected in parallel between the 6th pin of chip VB6824 and GND. Capacitor C35 is connected in parallel between the 5th pin of chip VB6824 and GND;

[0036] The first pin of chip VB6824 is connected to the DM interface, the second pin of chip VB6824 is connected to the DP interface, the fifth pin of chip VB6824 is connected to the second end of capacitor C35, the sixth pin of chip VB6824 is connected to the second end of capacitor C34, the seventh and ninth pins of chip VB6824 are grounded through capacitor C25 and capacitor C26 respectively, the eighth pin of chip VB6824 is connected to the twelfth pin of chip CS8679E, the tenth pin of chip VB6824 is connected to the eleventh pin of chip CS8679E, the eleventh pin of chip VB6824 is connected to the fifteenth pin of chip CS8679E, the fourteenth pin of chip VB6824 is connected to the forty-second pin of microcontroller SH79F6481AP through resistor R107, the fifteenth pin of chip VB6824 is connected to the forty-first pin of microcontroller SH79F6481AP through resistor R108, the eighteenth pin of chip VB6824 is grounded through capacitor C30, the nineteenth pin of chip VB6824 is grounded through capacitor C31, and the twenty-second pin of chip VB6824 is grounded;

[0037] The first end of inductor L1 is the 2OUT- port, the second end of inductor L1 is the 2VOP port, the first end of inductor L2 is the 2OUT+ port, the second end of inductor L2 is the 2VON port, capacitor C51 is connected between the 2OUT+ port and the 2OUT- port, capacitor C52 and zener diode D10 are connected between the 2VOP port and GND, the 2VOP port is connected to the first pin of interface CON5, capacitor C53 and zener diode D11 are connected between the 2VON port and GND, the 2VOP port is connected to the second pin of interface CON5, and the third and fourth pins of interface CON5 are connected in parallel to GND;

[0038] The first end of inductor L3 is the 1OUT- port, the second end of inductor L3 is the 1VOP port, the first end of inductor L4 is the 1OUT+ port, the second end of inductor L4 is the 1VON port, capacitor C54 is connected between the 1OUT+ port and the 1OUT- port, capacitor C55 and zener diode D12 are connected between the 1VOP port and GND, the 1VOP port is connected to the first pin of interface CON6, capacitor C56 and zener diode D13 are connected between the 1VON port and GND, the 1VOP port is connected to the second pin of interface CON6, and the third and fourth pins of interface CON6 are connected in parallel to GND;

[0039] The first pin of chip CS8679E is connected to the 1OUT+ port via capacitor C38. The second pin of chip CS8679E is directly connected to the 1OUT+ port. The third pin of chip CS8679E is connected to the 1OUT- port via capacitor C39. The fourth pin of chip CS8679E is directly connected to the 1OUT- port. The fifth pin of chip CS8679E is directly connected to the 2OUT- port. The sixth pin of chip CS8679E is connected to the 2OUT- port via capacitor C36. The seventh pin of chip CS8679E is directly connected to the 2OUT+ port. The eighth pin of chip CS8679E is connected to the 2OUT+ port via capacitor C37. The seventeenth pin of chip CS8679E is connected to GND. The ninth pin of chip CS8679E is connected to VDD5V. Capacitors C48, C49, and C50 are connected in parallel between GND and VDD5V. The tenth pin of chip CS8679E is connected to the seventeenth pin of microcontroller SH79F6481AP via resistor R119. The eleventh pin of chip CS8679E is connected to the tenth pin of chip VB6824 via resistor R118 and capacitor C47. The twelfth pin of chip CS8679E is connected to the eighth pin of chip VB6824 via resistor R117 and capacitor C46. The thirteenth pin of chip CS8679E is grounded via capacitor C43. The fourteenth pin of chip CS8679E is connected to the eighth pin of chip VB6824 via resistor R116, capacitor C15, and resistor R200. The fifteenth pin of chip CS8679E is connected to the eleventh pin of chip VB6824 via resistor R115 and capacitor C44. The sixteenth pin of chip CS8679E is connected to VDD5V. Capacitors C40, C41, and C42 are connected in parallel between VDD5V and GND.

[0040] Compared with the prior art, the beneficial effects of the present utility model are as follows: The present utility model uses LED patch lights instead of TFT liquid crystal displays, utilizes the 256-level brightness adjustment of AIP33624 single point, and designs three modules that can respectively control the lighting and extinguishing of the function display area of the steam oven in three ways, making the cost of the steam oven lower, the control methods and display function types more, and the operation simpler, providing a steam oven product with intelligent control, which greatly improves the cooking experience of consumers. Brief Description of the Drawings

[0041] Figure 1 It is a schematic diagram of the MCU circuit structure of a multifunctional control LED matrix steam oven display module of the present utility model;

[0042] Figure 2 It is a schematic diagram of the GR gesture module structure of a multifunctional control LED matrix steam oven display module of the present utility model;

[0043] Figure 3Schematic diagram of the RTC clock module of a multi-functional control LED matrix steam oven display module of the present utility model;

[0044] Figure 4 Schematic diagram of the LED driving structure part of a multi-functional control LED matrix steam oven display module of the present utility model Figure 1 ;

[0045] Figure 5 Schematic diagram of the LED driving structure part of a multi-functional control LED matrix steam oven display module of the present utility model Figure 2 ;

[0046] Figure 6 Schematic diagram of the LED driving structure part of a multi-functional control LED matrix steam oven display module of the present utility model Figure 3 ;

[0047] Figure 7 Schematic diagram of the LED driving structure part of a multi-functional control LED matrix steam oven display module of the present utility model Figure 4 ;

[0048] Figure 8 Schematic diagram of the LED array structure part of a multi-functional control LED matrix steam oven display module of the present utility model Figure 1 ;

[0049] Figure 9 Schematic diagram of the LED array structure part of a multi-functional control LED matrix steam oven display module of the present utility model Figure 2 ;

[0050] Figure 10 Schematic diagram of the LED array structure part of a multi-functional control LED matrix steam oven display module of the present utility model Figure 3 ;

[0051] Figure 11 Schematic diagram of the LED array structure part of a multi-functional control LED matrix steam oven display module of the present utility model Figure 4 ;

[0052] Figure 12 Schematic diagram of the power communication interface structure of a multi-functional control LED matrix steam oven display module of the present utility model;

[0053] Figure 13 Schematic diagram of the PIR human body sensing module of a multi-functional control LED matrix steam oven display module of the present utility model;

[0054] Figure 14 Schematic diagram of the time setting of the PIR human body sensing module of a multi-functional control LED matrix steam oven display module of the present utility model;

[0055] Figure 15 Schematic diagram of the sensing angle of the PIR human body sensing module for a multifunctional control LED matrix steam oven display module of the present utility model;

[0056] Figure 16 Schematic diagram of the LDO buck circuit structure for a multifunctional control LED matrix steam oven display module of the present utility model;

[0057] Figure 17 Partial schematic diagram of the structure of the Bluetooth audio module for a multifunctional control LED matrix steam oven display module of the present utility model Figure 1 ;

[0058] Figure 18 Partial schematic diagram of the structure of the Bluetooth audio module for a multifunctional control LED matrix steam oven display module of the present utility model Figure 2 ;

[0059] Figure 19 Partial schematic diagram of the structure of the Bluetooth audio module for a multifunctional control LED matrix steam oven display module of the present utility model Figure 3 ;

[0060] Figure 20 Partial schematic diagram of the structure of the Bluetooth audio module for a multifunctional control LED matrix steam oven display module of the present utility model Figure 4 ;

[0061] Figure 21 Partial schematic diagram of the structure of the Bluetooth audio module for a multifunctional control LED matrix steam oven display module of the present utility model Figure 5 。 Detailed implementation manners

[0062] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0063] Please refer to Figures 1 to 21, in the embodiment of the present utility model, a multifunctional control LED matrix steam oven display module includes an MCU circuit, an LED array and a driving circuit, a touch interface, a power communication interface, an LDO buck circuit, a GR gesture module, a PIR human body sensing module, an RTC clock module and a Bluetooth audio module. The MCU circuit is electrically connected to the LED array and the driving circuit, the touch interface, the power communication interface, the LDO buck circuit, the GR gesture module, the PIR human body sensing module, the RTC clock module and the Bluetooth audio module. The LDO buck circuit is electrically connected to the GR gesture module and the PIR human body sensing module.

[0064] The MCU circuit uses a single-chip microcomputer of an enhanced 8051 microcontroller integrating 24-channel touch button input and PWM from Winbond, namely SH79F6481AP, as the CPU of the display module, which is used to communicate with the host and control the LED array and the driving circuit, the touch interface, the power communication interface, the LDO buck circuit, the GR gesture module, the PIR human body sensing module, the RTC clock module and the Bluetooth audio module;

[0065] After the LED driving circuit is powered on, through the relevant control pins P4.4, P4.5, P3.6, P3.7, P3.2, P3.3, P3.0 and P3.1 of SH79F6481AP, they are divided into four groups of analog IICs in pairs, respectively controlling four Zhongwei Aixin AIP33624 driving chips, namely U5, U6, U7 and U8. This chip drives the LED lamp cores through the time-division multiplexing of SEG and GRID, and the scanning frequency is not less than 100 kHz. The overall synchronization can perform 32-level constant current regulation, and each lamp core can support 256-level brightness adjustment, significantly improving the display effect;

[0066] The LED array is connected to the P2.0, P3.4, P3.7 and P4.0 pins of the chip SH79F6481AP. Different display effects can be achieved through the PWM register. At the same time, an NPN triode of a current-type device is used for switching, so that each lamp can perform constant current control;

[0067] The touch interface is connected to the P1.0~P1.7, P0.1~P0.6, P5.0 pins of the chip SH79F6481AP. Through the chip register, software is used to achieve the desired touch effect. By selecting an appropriate capacitance value, the C13 capacitor of the P0.7 port can be adjusted, which can improve the touch feel and prevent false touches;

[0068] The power supply ASM1117-3.3 in the LDO circuit mainly supplies power to the GR gesture module and the PIR human body sensing module. The maximum output current of this power supply chip can reach about 1 A, meeting the power supply requirements of the GR gesture module and the PIR human body sensing module. The other chip modules all use a voltage of 5 V at the input end;

[0069] The GR gesture module uses the PAJ7620U2 infrared sensor module from WeSnow Electronics. This module integrates an optical array sensor and communicates by setting an analog I2C signal through the relevant control pins of the MCU chip SH79F6481AP. It uses a professional gesture algorithm program to implement complex gestures and supports the recognition of gestures such as up, down, left, right, forward, backward, clockwise rotation, counterclockwise rotation, and waving. The effective detection distance is 5 - 15 cm. For more accurate recognition rate and faster recognition speed, high-precision resistors are used for all the resistors in this module;

[0070] In the GR gesture module, INT is the interrupt pin, or the output pin for the GR gesture module recognition. The INT pin is connected to the pin of the internal microcontroller and is used to notify the microcontroller chip that a gesture has been detected. When the microcontroller chip detects a gesture, it will convert the signal into a level based on this gesture signal and output it from INT;

[0071] The PIR human body induction module uses the BM412 infrared sensor module from Senba. This module integrates a digital intelligent control circuit and a human body detection sensitive element in a pyroelectric infrared sensor within an electromagnetic shielding cover. The human body detection sensitive element couples the sensed human body movement signal to the digital intelligent integrated circuit chip through a very high impedance differential input circuit. The digital intelligent integrated circuit converts the signal into a digital signal. When the PIR signal exceeds the selected digital threshold, a timed REL level output will be generated and given to the control of the P0.0 pin of the MCU chip SH79F6481AP, thereby realizing the control of external devices. The high-level output time of REL is determined by the pin level applied to TIME. If multiple trigger signals are generated during the REL high-level period, as long as a new trigger signal is detected, the time of REL will be reset and then re-timed;

[0072] According to the selected timing time, use the calculation frequency formula in the chip specification:

[0073]

[0074] where T D is the timing time and f is the frequency;

[0075] First, calculate the frequency, and then use the resonance frequency formula of RC:

[0076]

[0077] Calculate the capacitance value;

[0078] The effective detection distance of the PIR human body sensing module is 5 to 20 cm, the horizontal detection angle of view can reach 120 degrees, the vertical detection angle of view can reach 100 degrees, and it has strong anti-interference ability;

[0079] The RTC clock module uses the low-power clock chip INS58563 from Dapu, and uses the analog IIC signal to communicate through the P2.1, P2.2, and P5.3 pins of the MCU chip SH79F6481AP. It uses a professional time algorithm program to achieve precise time control of external devices, and the time accuracy error within 2 to 3 seconds within 24 hours. In order to improve accuracy, the RTC clock module circuit uses high-precision devices.

[0080] The Bluetooth audio module uses the VB6824, a high-performance 32-bit RISC core audio processor from Huazhen Electronics. The software uses Huazhen's fifth-generation speech recognition algorithm and speech noise reduction algorithm, which can provide smart devices with voice control and voice interaction capabilities in far-field environments and steady-state noise environments. The hardware can recognize the user's speech content and voice commands to complete device control operations, and complete full voice interaction with the operator through voice broadcast, bringing a simple and fast user experience.

[0081] The VB6824 chip captures sound signals through an external microphone or other audio input device. The signal is first filtered to remove impurities through the filter capacitor connected in parallel next to the MIC and MIC-BIAS pins of the VB6824 chip. The signal then enters the chip through the MIC and MIC-BIAS pins and is converted into an electrical signal. The chip VB6824 processes the collected electrical signal again, such as filtering, noise reduction, and compression, to improve voice quality and reduce storage requirements. The processed voice signal is stored in a specific format within the chip or transmitted to the MCU chip SH79F6481A through the BT-TX pin. The MCU chip SH79F6481AP receives the sent instructions through the BT-TXD pin. According to the uploaded instructions, it executes the corresponding operation and sends the executed instructions back to the chip VB6824 through the BT-RXD pin. The chip VB6824 receives the feedback instructions through the BT-TX pin and reads the voice data of the corresponding instructions from the internal memory and converts them into analog signals.

[0082] The analog signal is transmitted to the CS8579 chip through the DACL and DACR pins of the VB6824 chip, and then enters the chip through the INPL and INPR pins of the CS8579 chip. The CS8579 chip amplifies the audio signal by 40 times the gain and then restores the amplified analog audio signal to sound through the external speakers or other audio output devices connected to the left and right channels. The CTRL pin of the CS8579 chip outputs high and low levels through the IO port of the MCU chip SH79F6481AP to determine the operating mode of the chip in different states.

[0083] To prevent the chip VB6824 from sometimes failing to perform a software reset, it is not directly connected to an external voltage. Instead, a power switch circuit is formed by combining the PMOS type JMTL2301C and the NPN type MMBT3904 to reset the chip VB6824.

[0084] The power supply communication interface circuit forms a simulated serial communication IIC through the P4.2 and P4.3 pins of the chip SH79F6481AP, realizing two-way communication between the display board and the main board. When the main board acts as the host and the display board acts as the slave, the chip SH79F6481AP replies to the instructions to be executed by the display board; when the display board acts as the host and the main board acts as the slave, the chip SH79F6481AP executes the commands sent by the display board. In conjunction with the appropriate capacitor in the serial communication, the oscillation burrs in the signal can be filtered out to improve the signal quality.

[0085] The working principle of the utility model is as follows: the main control chip SH79F6481AP is connected to the external capacitive touch color film button through the touch interface; when the user clicks the touch color film button, a signal is sent to the main control chip SH79F6481AP, and the chip SH79F6481AP recognizes the content clicked and sends a corresponding instruction to the LED driver chip AIP33624 through the analog IIC, so that it controls the light emitting diode corresponding to the pressed area. At the same time, the main control chip SH79F6481AP controls the functional operation of the mainboard components through the analog IIC.

[0086] When someone approaches and is within the detection range of the PIR human body sensing module, the human body detection sensitive element in the PIR human body sensing module couples the sensed human movement signal to the digital intelligent integrated circuit chip through a very high impedance differential input circuit. The digital intelligent integrated circuit converts the signal into a digital signal and transmits it to the chip SH79F6481AP through the REL pin of the PIR module. The signal is then transmitted to the inside of the chip through its P0.0 pin. The chip SH79F6481AP sends the corresponding content instructions to the LED driver chip AIP33624 through the analog IIC based on the transmitted content, allowing it to display the corresponding screen content.

[0087] When used in conjunction with the PIR human body sensing module, the infrared sensor inside the PIR human body sensing module will read the motion information of the hand to recognize gestures, and then convert the gesture information into an electrical signal output in IIC protocol, and transmit it to the chip SH79F6481AP through the IIC interface. After receiving the electrical signal, the chip SH79F6481AP sends corresponding content instructions to the LED driver chip AIP33624 through simulated IIC to control the lighting and extinguishing of the light-emitting diodes in the corresponding area; at the same time, the main control chip SH79F6481AP controls the functional operation of the motherboard devices through simulated IIC;

[0088] When used in conjunction with the Bluetooth audio module, the main control chip SH79F6481AP captures sound signals through an external microphone or other audio input devices. The filtering capacitor connected in parallel beside the MIC and MIC-BIAS pins of the chip VB6824 first filters the signals to remove impurities in the signals, and then enters the chip through the MIC and MIC-BIAS pins and converts them into electrical signals;

[0089] The chip VB6824 will filter, denoise, and compress the collected electrical signals internally to improve the voice quality and reduce the storage requirements. The processed voice signals are stored in the chip in a specific format or establish two-way communication with the chip SH79F6481AP through the BT-TX and BT-RX pins. Then, the chip SH79F6481AP sends corresponding content instructions to the LED driver chip AIP33624 through simulated IIC to control the lighting and extinguishing of the light-emitting diodes in the corresponding area; at the same time, the main control chip SH79F6481AP controls the functional operation of the motherboard devices through simulated IIC, executes the corresponding operations and at the same time sends data back to the chip VB6824 through the BT-RXD pin for the instructions that have started to be executed, and receives the feedback instructions through the BT-TX pin. The chip VB6824 will read the voice data of the corresponding instructions from the internal memory, convert it into an analog signal, and then transmit it to the chip CS8579 through the DACL and DACR pins of the chip VB6824, and enter the chip CS8579 through the INPL and INPR pins. The chip will amplify the audio signal by 40 times, and then output the amplified analog audio signal from the left and right channels to an external speaker or other audio output devices;

[0090] When a certain function requires time, the chip SH79F6481AP will transmit the required time signal to the RTC clock chip through simulated IIC. The clock chip INS58563 generates a clock signal through an external crystal oscillator, and then transmits it back to the chip SH79F6481AP through simulated IIC.

[0091] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above-mentioned exemplary embodiments, and the present utility model can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present utility model. Any reference signs in the claims should not be construed as limiting the claims involved.

Claims

1. A multifunctional control LED matrix steam oven display module, characterized in that, The module includes an MCU circuit, an LED array and a driving circuit, a touch interface, a power communication interface, an LDO step-down circuit, a GR gesture module, a PIR human body sensing module, an RTC clock module, and a Bluetooth audio module. The MCU circuit is electrically connected to the LED array and the driving circuit, the touch interface, the power communication interface, the LDO step-down circuit, the GR gesture module, the PIR human body sensing module, the RTC clock module, and the Bluetooth audio module. The LDO step-down circuit is electrically connected to the GR gesture module and the PIR human body sensing module.

2. The multifunctional control LED matrix steam oven display module according to claim 1, wherein, The MCU circuit includes a single-chip microcomputer SH79F6481AP, a capacitor C13, a capacitor C4, a capacitor C5, a zener diode D14, a resistor R20, and an interface CON3. The 12th pin of the single-chip microcomputer SH79F6481AP, the first pin of the interface CON3, the first ends of the capacitor C5, the capacitor C4, and the zener diode D14 are connected to VCC5V. The capacitor C5, the capacitor C4, the 4th pin of the interface CON3, the second end of the resistor R20, and the second end of the zener diode D14 are grounded. The capacitor C5, the capacitor C4, and the zener diode D14 are connected in parallel. The first end of the capacitor C13 is connected to the 6th pin of the single-chip microcomputer SH79F6481AP. The second end of the capacitor C13 is connected in parallel to the 7th pin of the single-chip microcomputer SH79F6481AP and grounded. The first end of the resistor R20 is connected to the 3rd pin of the interface CON3.

3. A multifunctional control LED matrix steam oven display module according to claim 1, characterized in that The touch interface includes a register 1, a chip register 2, resistors R21, R22, R23, R24, R25, R26, R27, R28, R29, R30, R31, R32, R33, R34, and R35. The chip register 1, resistors R21, R22, R23, R24, R25, R26, R27, and R28 form a touch interface 1. The 1st pin of the chip register 1 is grounded. The 10th to 12th pins of the chip register 1 are connected in parallel and grounded. The 2nd to 9th pins of the chip register 1 are sequentially connected to the 44th pin, the 1st to 5th pins, and the 8th pin of the MCU circuit. The resistors R21, R22, R23, R24, R25, R26, R27, and R28 are respectively located on the lines connecting the 2nd to 9th pins of the chip register 1 to the MCU circuit in sequence. The chip register 2, resistor R29, resistor R30, resistor R31, resistor R32, resistor R33, resistor R34, and resistor R35 form a touch interface 2. The first pin of the chip register 2 is grounded, the 10th to 12th pins of the chip register 2 are grounded in parallel, the 2nd to 8th pins of the chip register 2 are sequentially connected to the 27th to 34th pins of the MCU circuit, and the resistor R29, resistor R30, resistor R31, resistor R32, resistor R33, resistor R34, and resistor R35 are arranged in sequence and are respectively located on the lines connecting the 2nd to 8th pins of the chip register 2 to the MCU circuit.

4. A multifunctional control LED matrix steam oven display module according to claim 2, characterized in that The GR gesture module includes the chip PAJ7620U2, capacitor C66, capacitor C67, resistor R121, resistor R122, resistor R123, resistor R124, and resistor R125. The second pin of the chip PAJ7620U2 is connected to the 40th pin of the single-chip microcomputer SH79F6481AP, the fifth pin of the chip PAJ7620U2 is connected to the 39th pin of the single-chip microcomputer SH79F6481AP, the third pin of the chip PAJ7620U2 is connected to the 9th pin of the single-chip microcomputer SH79F6481AP. The resistor R122 is located on the line connecting the second pin of the chip PAJ7620U2 to the 40th pin of the single-chip microcomputer SH79F6481AP, the resistor R124 is located on the line connecting the fifth pin of the chip PAJ7620U2 to the 39th pin of the single-chip microcomputer SH79F6481AP, the R125 is located on the line connecting the third pin of the chip PAJ7620U2 to the 9th pin of the single-chip microcomputer SH79F6481AP. The first ends of the resistor 121 and resistor 123 are connected to VCC5V. The second end of the resistor 121 is located on the line connecting the second pin of the chip PAJ7620U2 to the 40th pin of the single-chip microcomputer SH79F6481AP, the second end of the resistor 123 is located on the line connecting the fifth pin of the chip PAJ7620U2 to the 39th pin of the single-chip microcomputer SH79F6481AP. The first ends of the capacitor C66 and capacitor C67 are grounded. The second end of the capacitor C66 is located on the line connecting the second pin of the chip PAJ7620U2 to the 40th pin of the single-chip microcomputer SH79F6481AP, the second end of the capacitor C67 is located on the line connecting the fifth pin of the chip PAJ7620U2 to the 39th pin of the single-chip microcomputer SH79F6481AP. The first and 12th pins of the chip PAJ7620U2 are connected to VCC3V3, the 11th pin of the chip PAJ7620U2 is connected to VLED, and the 6th and 10th pins of the chip PAJ7620U2 are grounded in parallel.

5. The multifunctional control LED matrix steam oven display module according to claim 2, characterized in that The RTC clock module includes the chip INS58563, crystal oscillator Y1, capacitors C21, C22, C23, C24, C76, C77, resistors R103, R104, R105, R106, and R120. The third pin of the chip INS58563 is connected to the 11th pin of the single-chip microcomputer SH79F6481AP. The fifth pin of the chip INS58563 is connected to the 37th pin of the single-chip microcomputer SH79F6481AP. The sixth pin of the chip INS58563 is connected to the 36th pin of the single-chip microcomputer SH79F6481AP. The first ends of the fourth pin of the chip INS58563, capacitor C21, capacitor C22, capacitor C23, and capacitor C24 are grounded. The eighth pin of the chip INS58563 is connected to VCC5V. The first end of the crystal oscillator Y1 is connected to the first pin of the chip INS58563. The second end of the crystal oscillator Y1 is connected to the second pin of the chip INS58563. The second end of the capacitor C21 is connected between the first end of the crystal oscillator Y1 and the first pin of the chip INS58563. The second end of the capacitor C22 is connected between the second end of the crystal oscillator Y1 and the second pin of the chip INS58563. The second ends of the capacitor C23 and capacitor C24 are connected between the eighth pin of the chip INS58563 and VCC5V. The resistor R105 is located on the line between the sixth pin of the chip INS58563 and the 36th pin of the single-chip microcomputer SH79F6481AP. The resistor R106 is located on the line between the fifth pin of the chip INS58563 and the 37th pin of the single-chip microcomputer SH79F6481AP. The resistor R120 is located on the line between the third pin of the chip INS58563 and the 11th pin of the single-chip microcomputer SH79F6481AP. The first ends of the resistor R103 and resistor R104 are connected to VCC5V. The second end of the resistor R103 is connected to the line between the sixth pin of the chip INS58563 and the 36th pin of the single-chip microcomputer SH79F6481AP. The second end of the resistor R104 is connected to the line between the fifth pin of the chip INS58563 and the 37th pin of the single-chip microcomputer SH79F6481AP. The first ends of the capacitor C76 and capacitor C77 are grounded. The second end of the capacitor C76 is connected to the line between the fifth pin of the chip INS58563 and the 37th pin of the single-chip microcomputer SH79F6481AP. The second end of the capacitor C77 is connected to the line between the sixth pin of the chip INS58563 and the 36th pin of the single-chip microcomputer SH79F6481AP.

6. A multifunctional control LED matrix steam oven display module according to claim 2, characterized in that The LED array and the driving circuit include four AIP33624 driving chips, zener diodes D5, D6, D7, D8, NPN transistors Q3, Q4, Q5, Q6, capacitors C6, C7, C8, C9, C10, C11, C12, C14, C68, C69, C70, C71, C72, C73, C74, C75, resistors R36, R37, R38, R39, R40, R41, R42, R43, R44, R45, R46, R47, R48, R49, R50, R51, R52, R53, R54, R55, R56, R57, R58, R59, R60, R61, R62, R63, R64, R65, R66, R67, R68, R69, R70, R71, R72, R73, R74, R75, R76, R77, R78, R79, R80, R81, R82, R83, R84, R85, R86, R87, R88, R89, R90, R91, R92, R93, R94, R95, R96, R97, R98, R99, R100, R101, R102, R103, R104, R105, R106, R107, R108, R109, R110, R111, R112, R113, R114, R115, R116, R117, R118, R119, R120, R121, R122, R123, R124, R125, R126, R127, R128, R129, R130, R131, R132, R133, R134, R135, R136, R137, R138, R139, R140, R141, R142, R143, R144, R145, R146, R147, R148, R149, R150, R151, R152, R153, R154, R155, R156, R157, R158, R159, R160, R161, R162, R163, R164, R165, R166, R167, R168, R169, R170, R171, R172, R173, R174, R175, R176, R177, R178, R179, R180, R181, R182, R183, R184, R185, R186, R187, R188, R189, R190, R191, R192, R193, R194, R195, R196, R197, R198, R199, R200, R201, R202, R203, R204, R205, R206, R207, R208, R209, R210, R211, R212, R213, R214, R215, R216, R217, R218, R219, R220, R221, R222, R223, R224, R225, R226, R227, R228, R229, R230, R231, R232, R233, R234, R235, R236, R237, R238, R239, R240, R241, R242, R243, R244, R245, R246, R247, R248, R249, R250, R251, R252, R253, R254, R255, R256, R257, R258, R259, R260, R261, R262, R263, R264, R265, R266, R267, R268, R269, R270, R271, R272, R273, R274, R275, R276, R277, R278, R279, R280, R281, R282, R283, R284, R285, R286, R287, R288, R289, R290, R291, R292, R293, R294, R295, R296, R297, R298, R299, R300, R301, R302, R303, R304, R305, R306, R307, R308, R309, R310, R311, R312, R313, R314, R315, R316, R317, R318, R319, R320, R321, R322, R323, R324, R325, R326, R327, R328, R329, R330, R331, R332, R333, R334, R335, R336, R337, R338, R339, R340, R341, R342, R343, R344, R345, R346, R347, R348, R349, R350, R351, R352, R353, R354, R355, R356, R357, R358, R359, R360, R361, R362, R363, R364, R365, R366, R367, R368, R369, R370, R371, R372, R373, R374, R375, R376, R377, R378, R379, R380, R381, R382, R383, R384, R385, R386, R387, R388, R389, R390, R391, R392, R393, R394, R395, R396, R397, R398, R399, R400, R401, R402, R403, R404, R405, R406, R407, R408, R409, R410, R411, R412, R413, R414, R415, R416, R417, R418, R419, R420, R421, R422, R423, R424, R425, R426, R427, R428, R429, R430, R431, R432, R433, R434, R435, R436, R437, R438, R439, R440, R441, R442, R443, R444, R445, R446, R447, R448, R449, R450, R451, R452, R453, R454, R455, R456, R457, R458, R459, R460, R461, R462, R463, R464, R465, R466, R467, R468, R469, R470, R471, R472, R473, R474, R475, R476, R477, R478, R479, R480, R481, R482, R483, R484, R485, R486, R487, R488, R489, R490, R491, R492, R493, R494, R495, R496, R497, R498, R499, R500, R501, R502, R503, R504, R505, R506, R507, R508, R509, R510, R511, R512, R513, R514, R515, R516, R517, R518, R519, R520, R521, R522, R523, R524, R525, R526, R527, R528, R529, R530, R531, R532, R533, R534, R535, R536, R537, R538, R539, R540, R541, R542, R543, R544, R545, R546, R547, R548, R549, R550, R551, R552, R553, R554, R555, R556, R557, R558, R559, R560, R561, R562, R563, R564, R565, R566, R567, R568, R569, R570, R571, R572, R573, R574, R575, R576, R577, R578, R579, R580, R581, R582, R583, R584, R585, R586, R587, R588, R589, R590, R591, R592, R593, R594, R595, R596, R597, R598, R599, R600, R601, R602, R603, R604, R605, R606, R607, R608, R609, R610, R611, R612, R613, R614, R615, R616, R617, R618, R619, R620, R621, R622, R623, R624, R625, R626, R627, R628, R629, R630, R631, R632, R633, R634, R635, R636, R637, R638, R639, R640, R641, R642, R643, R644, R645, R646, R647, R648, R649, R650, R651, R652, R653, R654, R655, R656, R657, R658, R659, R660, R661, R662, R663, R664, R665, R666, R667, R668, R669, R670, R671, R672, R673, R674, R675, R676, R677, R678, R679, R680, R681, R682, R683, R684, R685, R686, R687, R688, R689, R690, R691, R692, R693, R694, R695, R696, R697, R698, R699, R700, R701, R702, R703, R704, R705, R706, R707, R708, R709, R710, R711, R712, R713, R714, R715, R716, R717, R718, R719, R720, R721, R722, R723, R724, R725, R726, R727, R728, R729, R730, R731, R732, R733, R734, R735, R736, R737, R738, R739, R740, R741, R742, R743, R744, R745, R746, R747, R748, R749, R750, R751, R752, R753, R754, R755, R756, R757, R758, R759, R760, R761, R762, R763, R764, R765, R766, R767, R768, R769, R770, R771, R772, R773, R774, R775, R776, R777, R778, R779, R780, R781, R782, R783, R784, R785, R786, R787, R788, R789, R790, R791, R792, R793, R794, R795, R796, R797, R798, R799, R800, R801, R802, R ​ ​ An AIP33624 driver chip, a zener diode D7, a capacitor C10, a capacitor C11, a capacitor C72, a capacitor C73, a resistor R48, a resistor R49, a resistor R50, and a resistor R51 form a U7 drive circuit. The first ends of the 6th pin of the AIP33624 driver chip, the zener diode D7, the capacitor C10, the capacitor C11, the resistor R50, and the resistor R51 are connected to VCC5V. The first ends of the capacitor C72 and the capacitor C73 and the second ends of the zener diode D7, the capacitor C10, and the capacitor C11 are grounded. The zener diode D7, the capacitor C10, and the capacitor C11 are connected in parallel. The second ends of the capacitor C72 and the resistor R50 and the resistor R48 are connected to the SDA line of the U7 drive circuit. The second ends of the resistor R51, the capacitor C73, and the resistor R49 are connected to the SCL line of the U7 drive circuit; An AIP33624 driver chip, a zener diode D8, a capacitor C12, a capacitor C14, a capacitor C74, a capacitor C75, a resistor R44, a resistor R45, a resistor R46, and a resistor R47 form a U8 drive circuit. The first ends of the 6th pin of the AIP33624 driver chip, the zener diode D8, the capacitor C12, the capacitor C14, the resistor R46, and the resistor R47 are connected to VCC5V. The first ends of the capacitor C74 and the capacitor C75 and the second ends of the zener diode D8, the capacitor C12, and the capacitor C14 are grounded. The zener diode D8, the capacitor C12, and the capacitor C14 are connected in parallel. The second ends of the capacitor C74 and the resistor R46 and the resistor R44 are connected to the SDA line of the U8 drive circuit. The second ends of the resistor R47, the capacitor C75, and the resistor R45 are connected to the SCL line of the U8 drive circuit; The resistor R52, the resistor R53, the resistor R60, the resistor R61, the resistor R62, an NPN transistor Q3, and a light-emitting diode form a P1 circuit. The first end of the resistor R52 is connected to the 19th pin of the single-chip microcomputer SH79F6481AP. The second end of the resistor R52 is connected to the base of the NPN transistor Q3. The resistor R53 is located between the base and the emitter of the NPN transistor Q3. The emitter of the NPN transistor Q3 is grounded. Thirty of the light-emitting diodes are arranged in three series-connected groups, and each group includes ten light-emitting diodes. The cathodes of the light-emitting diodes are all connected to the collector of the NPN transistor Q3. Each group of the light-emitting diodes is respectively connected in series with the resistor R60, the resistor R61, and the resistor R62 in sequence and then connected to VCC5V; The resistor R54, resistor R55, resistor R63, resistor R64, resistor R65, NPN transistor Q4 and light-emitting diode form the P2 circuit. The first end of the resistor R54 is connected to the 22nd pin of the single-chip microcomputer SH79F6481AP. The second end of the resistor R54 is connected to the base of the NPN transistor Q4. The resistor R55 is located between the base and the emitter of the NPN transistor Q4. The emitter of the NPN transistor Q4 is grounded. Thirty of the light-emitting diodes are arranged in three series-connected groups, each group including ten light-emitting diodes. The cathodes of the light-emitting diodes are all connected to the collector of the NPN transistor Q4. Each group of the light-emitting diodes is respectively connected in series with the resistor R63, resistor R64 and resistor R65 in sequence and then connected to VCC5V; The resistor R56, resistor R57, resistor R66, resistor R67, resistor R68, NPN transistor Q5 and light-emitting diode form the P3 circuit. The first end of the resistor R56 is connected to the 35th pin of the single-chip microcomputer SH79F6481AP. The second end of the resistor R56 is connected to the base of the NPN transistor Q5. The resistor R57 is located between the base and the emitter of the NPN transistor Q3. The emitter of the NPN transistor Q5 is grounded. Thirty of the light-emitting diodes are arranged in three series-connected groups, each group including ten light-emitting diodes. The cathodes of the light-emitting diodes are all connected to the collector of the NPN transistor Q5. Each group of the light-emitting diodes is respectively connected in series with the resistor R66, resistor R67 and resistor R68 in sequence and then connected to VCC5V; The resistor R58, resistor R59, resistor R69, resistor R70, resistor R71, NPN transistor Q6 and light-emitting diode form the SWE circuit. The first end of the resistor R58 is connected to the 18th pin of the single-chip microcomputer SH79F6481AP. The second end of the resistor R58 is connected to the base of the NPN transistor Q6. The resistor R59 is located between the base and the emitter of the NPN transistor Q6. The emitter of the NPN transistor Q6 is grounded. Thirty of the light-emitting diodes are arranged in three series-connected groups, each group including ten light-emitting diodes. The cathodes of the light-emitting diodes are all connected to the collector of the NPN transistor Q6. Each group of the light-emitting diodes is respectively connected in series with the resistor R69, resistor R70 and resistor R71 in sequence and then connected to VCC5V; The anodes of several light-emitting diodes in the same row are connected to the same SEG interface, and the cathodes of several light-emitting diodes in the same column are connected to the same GRID interface. The light-emitting diodes of up to ten rows and eight columns form an LED array. Four of the LED arrays are respectively electrically connected to the AIP33624 driving chip; Each light-emitting diode is controlled by the formula: Where I LED is the current flowing through the light-emitting diode, VCC is the input voltage, V CE is the voltage drop between the collector and the emitter, and R C is the current-limiting resistor on the collector; for constant current control.

7. A multifunctional control LED matrix steam oven display module according to claim 2, characterized in that The power supply communication interface includes interface CON1, voltage stabilizing diode D1, Zener diode D2, voltage stabilizing diode D3, voltage stabilizing diode D4, capacitor C1, capacitor C2, capacitor C20, capacitor C64, capacitor C65, resistor R16, resistor R17, resistor R18, and resistor R19. The second pin of interface CON1, the first ends of voltage stabilizing diode D1, Zener diode D2, capacitor C1, capacitor C2, capacitor C20, resistor R18, and resistor R19 are connected to VCC5V. The first pin of interface CON1, the first ends of voltage stabilizing diode D3, voltage stabilizing diode D4, capacitor C64, and capacitor C65 are grounded. The third pin of interface CON1 is connected to the 16th pin of the single-chip microcomputer SH79F6481AP. The fourth pin of interface CON1 is connected to the 15th pin of the single-chip microcomputer SH79F6481AP. The voltage stabilizing diode D1, Zener diode D2, capacitor C1, capacitor C2, and capacitor C20 are connected in parallel between VCC5V and GND. The second ends of resistor R16 and resistor R18 are located on the line between the fourth pin of interface CON1 and the 15th pin of the single-chip microcomputer SH79F6481AP. The second ends of resistor R17 and resistor R19 are located on the line between the third pin of interface CON1 and the 16th pin of the single-chip microcomputer SH79F6481AP.

8. A multifunctional control LED matrix steam oven display module according to claim 2, characterized in that The PIR human body sensing module includes chip BM412, resistor R100, resistor R101, resistor R102, capacitor C19, capacitor C57, and capacitor C58. The fourth pin of chip BM412 is connected to the 43rd pin of the single-chip microcomputer SH79F6481AP. The third pin of chip BM412, the first ends of capacitor C57, capacitor C58, and resistor R101 are connected to Vcc3V3. The first pin of chip BM412, the second ends of capacitor C57, capacitor C58, capacitor C19, and resistor R102 are grounded. Capacitor C19 and resistor R102 are connected in parallel and the first ends of capacitor C19 and resistor R102 are connected to the second end of resistor R101. The second pin of chip BM412 is connected to the first ends of capacitor C19 and resistor R102 and the second end of resistor R101.

9. The multifunctional control LED matrix steam oven display module according to claim 1, characterized in that The LDO buck circuit includes two voltage regulators AMS1117-3.3, capacitor C15, capacitor C16, capacitor C17, capacitor C18, capacitor C59, capacitor C60, capacitor C61, capacitor C62, Zener diode D9, and Zener diode D15; A step-down circuit U2 is composed of a voltage regulator AMS1117-3.3, a capacitor C15, a capacitor C16, a capacitor C17, a capacitor C18, and a Zener diode D9; the capacitors C15 and C16 are connected in parallel between VCC5V and GND, the capacitor C17 is connected in parallel between the output pins 2 and 4 of the voltage regulator AMS1117-3.3 and GND, the capacitor C18 is connected in parallel between VLED and GND, and the Zener diode D9 is connected between the output of the voltage regulator AMS1117-3.3 and VLED; A step-down circuit U12 is composed of a voltage regulator AMS1117-3.3, a capacitor C59, a capacitor C60, a capacitor C61, a capacitor C62, and a Zener diode D15; the capacitors C59 and C60 are connected in parallel between VCC5V and GND, the capacitor C61 is connected in parallel between the output pins 2 and 4 of the voltage regulator AMS1117-3.3 and GND, the capacitor C62 is connected in parallel between VLED and GND, and the Zener diode D15 is connected between the output of the voltage regulator AMS1117-3.3 and VLED.

10. The multifunctional control LED matrix steam oven display module according to claim 2, wherein The Bluetooth audio module includes a chip VB6824, a chip CS8679E, a DM interface, a DP interface, an ANT antenna, capacitors C25, C26, C27, C28, C29, C30, C31, C33, C34, C35, C36, C37, C38, C39, C40, C41, C42, C43, C44, C45, C46, C47, C48, C49, C50, C51, C52, C53, C54, C55, C56, resistors R107, R108, R109, R110, R111, R112, R113, R114, R115, R116, R117, R118, R119, R200, a crystal oscillator Y2, a PMOS transistor JMTL2301C, an NPN bipolar transistor MMBT3904, interfaces CON4, CON5, CON6, inductors L1, L2, L3, L4, Zener diodes D10, D11, D12, D13; The upper end of the crystal oscillator Y2 is connected to the first end of the capacitor C28, the lower end of the crystal oscillator Y2 is connected to the first end of the capacitor C27, the second ends of the capacitors C27 and C28 and the left end of the crystal oscillator Y2 are connected in parallel to ground, the right end of the crystal oscillator Y2 is grounded, the node formed by the connection of the upper end of the crystal oscillator Y2 and the first end of the capacitor C28 is the BT-OSCO terminal, the BT-OSCO terminal is connected to the 24th pin of the chip VB6824, the node formed by the connection of the lower end of the crystal oscillator Y2 and the first end of the capacitor C27 is the BT-OSCI terminal, and the BT-OSCI terminal is connected to the 23rd pin of the chip VB6824; The first end of the resistor R109 is connected to the first end of the capacitor C29, and the formed node is the BT-RF terminal. The BT-RF terminal is connected to the 21st pin of the chip VB6824. The second end of the resistor R109 is grounded. The second end of the capacitor C29 and the first end of the resistor R110 are connected to the first end of the antenna ANT. The second end of the resistor R110 and the second end of the antenna ANT are grounded; The first end of the resistor R113 is connected to the 38th pin of the single-chip microcomputer SH79F6481AP. The second end of the resistor R113 and the first end of the resistor R114 are connected to the base of the NPN transistor MMBT3904. The second end of the resistor R114 and the emitter of the NPN transistor MMBT3904 are grounded. The collector of the NPN transistor MMBT3904 is connected to the gate of the PMOS transistor JMTL2301C and the first ends of the resistor R112 and the capacitor C33. The second end of the resistor R112, the second end of the resistor R111 and the source of the PMOS transistor JMTL2301C are connected to VDD5V. The first end of the resistor R111, the second end of the capacitor C33 and the drain of the PMOS transistor JMTL2301C are connected to the +5V voltage; The first pin of the interface CON4 is connected to the 5th pin of the chip VB6824. The second pin of the interface CON4 is connected to GND. The third and fourth pins of the interface CON4 are connected in parallel to ground. The capacitor C34 is connected in parallel between the 6th pin of the chip VB6824 and GND. The capacitor C35 is connected in parallel between the 5th pin of the chip VB6824 and GND; The first pin of the chip VB6824 is connected to the DM interface, the second pin of the chip VB6824 is connected to the DP interface, the fifth pin of the chip VB6824 is connected to the second end of the capacitor C35, the sixth pin of the chip VB6824 is connected to the second end of the capacitor C34, the seventh and ninth pins of the chip VB6824 are grounded through the capacitors C25 and C26 respectively, the eighth pin of the chip VB6824 is connected to the twelfth pin of the chip CS8679E, the tenth pin of the chip VB6824 is connected to the eleventh pin of the chip CS8679E, the eleventh pin of the chip VB6824 is connected to the fifteenth pin of the chip CS8679E, the fourteenth pin of the chip VB6824 is connected to the forty-second pin of the single-chip microcomputer SH79F6481AP through the resistor R107, the fifteenth pin of the chip VB6824 is connected to the forty-first pin of the single-chip microcomputer SH79F6481AP through the resistor R108, the eighteenth pin of the chip VB6824 is grounded through the capacitor C30, the nineteenth pin of the chip VB6824 is grounded through the capacitor C31, and the twenty-second pin of the chip VB6824 is grounded; The first end of the inductor L1 is the 2OUT- port, the second end of the inductor L1 is the 2VOP port, the first end of the inductor L2 is the 2OUT+ port, the second end of the inductor L2 is the 2VON port, the capacitor C51 is connected between the 2OUT+ port and the 2OUT- port, the capacitor C52 and the zener diode D10 are connected between the 2VOP port and GND, the 2VOP port is connected to the first pin of the interface CON5, the capacitor C53 and the zener diode D11 are connected between the 2VON port and GND, the 2VOP port is connected to the second pin of the interface CON5, and the third and fourth pins of the interface CON5 are connected in parallel to GND; The first end of the inductor L3 is the 1OUT- port, the second end of the inductor L3 is the 1VOP port, the first end of the inductor L4 is the 1OUT+ port, the second end of the inductor L4 is the 1VON port, the capacitor C54 is connected between the 1OUT+ port and the 1OUT- port, the capacitor C55 and the zener diode D12 are connected between the 1VOP port and GND, the 1VOP port is connected to the first pin of the interface CON6, the capacitor C56 and the zener diode D13 are connected between the 1VON port and GND, the 1VOP port is connected to the second pin of the interface CON6, and the third and fourth pins of the interface CON6 are connected in parallel to GND; The first pin of the chip CS8679E is connected to the 1OUT+ port through the capacitor C38, the second pin of the chip CS8679E is directly connected to the 1OUT+ port, the third pin of the chip CS8679E is connected to the 1OUT- port through the capacitor C39, the fourth pin of the chip CS8679E is directly connected to the 1OUT- port, the fifth pin of the chip CS8679E is directly connected to the 2OUT- port, the sixth pin of the chip CS8679E is connected to the 2OUT- port through the capacitor C36, the seventh pin of the chip CS8679E is directly connected to the 2OUT+ port, the eighth pin of the chip CS8679E is connected to the 2OUT+ port through the capacitor C37, the seventeenth pin of the chip CS8679E is connected to GND, the ninth pin of the chip CS8679E is connected to VDD5V, the capacitors C48, C49 and C50 are connected in parallel between GND and VDD5V, the tenth pin of the chip CS8679E is connected to the seventeenth pin of the single-chip microcomputer SH79F6481AP through the resistor R119, the eleventh pin of the chip CS8679E is connected to the tenth pin of the chip VB6824 through the resistor R118 and the capacitor C47, the twelfth pin of the chip CS8679E is connected to the eighth pin of the chip VB6824 through the resistor R117 and the capacitor C46, the thirteenth pin of the chip CS8679E is grounded through the capacitor C43, the fourteenth pin of the chip CS8679E is connected to the eighth pin of the chip VB6824 through the resistor R116, the capacitor C15 and the resistor R200, the fifteenth pin of the chip CS8679E is connected to the eleventh pin of the chip VB6824 through the resistor R115 and the capacitor C44, the sixteenth pin of the chip CS8679E is connected to VDD5V, and the capacitors C40, C41 and C42 are connected in parallel between VDD5V and GND.

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